PRODUCT DATASHEET Mira series last update 17/4/2012 Ordering number C12500_MIRA-M Family Type LED Color Diameter Height Style Optic Material Holder Material Fastening Status Mira Lens MT-G Clear 32.4 mm 14.7 mm Round PC Ready FWHM Efficiency cd/lm Gerber File 28 degrees 83 % 2.200 Available FWHM Efficiency cd/lm Gerber File 28 degrees 83 % Available FWHM Efficiency cd/lm Gerber File 38 degrees 80 % 1.400 Available FWHM Efficiency cd/lm Gerber File 44 degrees 82 % Available Ordering number CA12503_MIRA-M Family Type LED Color Diameter Height Style Optic Material Holder Material Fastening Status Mira Assembly MT-G White 35 mm 15.8 mm Round PC PC Tape Ready Ordering number C12501_MIRA-W Family Type LED Color Diameter Height Style Optic Material Holder Material Fastening Status Mira Lens MT-G Clear 32.4 mm 14.7 mm Round PC Ready Ordering number CA12504_MIRA-W Family Type LED Color Diameter Height Style Optic Material Holder Material Fastening Status Mira Assembly MT-G White 35 mm 15.8 mm Round PC PC Tape Ready October 19th 2012 21:21 Copyright Ledil Oy - Subject to change without prior notice - Page 1/3 Ledil Oy Salorankatu 10 24240 SALO Finland http://www.ledil.com email: [email protected] FAX: +358-2-733 8001 PRODUCT DATASHEET Mira series last update 17/4/2012 Ordering number C12502_MIRA-WW Family Type LED Color Diameter Height Style Optic Material Holder Material Fastening Status Mira Lens MT-G Clear 32.4 mm 14.7 mm Round PC Glue Ready FWHM Efficiency cd/lm Gerber File 58 degrees 81 % 0.900 Available FWHM Efficiency cd/lm Gerber File 66 degrees 81 % Available Ordering number CA12505_MIRA-WW Family Type LED Color Diameter Height Style Optic Material Holder Material Fastening Status Mira Assembly MT-G White 35 mm 15.8 mm Round PC PC Tape Ready NOTE: The typical divergence will be changed by different color, chip size and chip position tolerance. The typical total divergence is the full angle measured where the luminous intensity is half of the peak value. October 19th 2012 21:21 Copyright Ledil Oy - Subject to change without prior notice - Page 2/3 Ledil Oy Salorankatu 10 24240 SALO Finland http://www.ledil.com email: [email protected] FAX: +358-2-733 8001 PRODUCT DATASHEET Mira series last update 17/4/2012 GENERAL INFORMATION - Product series especially designed & optimized for MT-G series of LEDs. - Special care taken to make light distribution as uniform as possible. - Lens material optical grade PC with high UV and temperature resistance (120 degrees of Celcius / 248 degrees of Fahrenheit). Allows use of high current and temperature conditions. Please find more information about used materials from below: http://ledil.fi/sites/default/files/Documents/Technical/Material/PC%20Makrolon%202400_2407_2456_2458-UL .pdf - Optic holder molded by high quality PC material (120 dergees of Celcius / 248 degrees of Fahrenheit). - Fastening to heat sink with a PU foam adhesive tape of automotive grade. Please find fastening details by clicking link: http://www.ledil.com/datasheets/DataSheet_TAPE.pdf - Fastening to PCB with appropriate adhesive. By clicking link below you can find Ledil recommended glue options. http://www.ledil.com/datasheets/DataSheet_GLUES.pdf NOTE 1: We advise customer to ensure the suitability and sufficiency of the bond in the end product. For example, mechanical stress, vibration and holes on the surface of the circuit boar weaken the strength of the tape. NOTE 2: Assembly to the surface must be made straight, so the tape bonds constant and balanced with fastening surface. Slanted assembly might cause unbalanced bond to the surface. All surfaces where tape is applied must be clean, dry and free from grease and dirt. If cleaning of PCB surfaces is needed, please follow strictly the cleaning instructions of your LED manufacturer - this is important as cleaning shall under no circumstances damage LEDs or other electronics components on the PCB. Further note that optical components shall not be cleaned with any chemicals - only micro fiber cloth may be used to remove fingerprints or other traces from handling. NOTE 1: We advise customer to ensure the suitability and sufficiency of the bond in the end product. For example, mechanical stress, vibration and holes on the surface of the circuit boar weaken the strength of the glue. NOTE 2: All surfaces where glue is applied must be clean, dry and free from grease and dirt. If cleaning of PCB surfaces is needed, please follow strictly the cleaning instructions of your LED manufacturer -this is important as cleaning shall under no circumstances damage LEDs or other electronics components on the PCB. Further note that optical components shall not be cleaned with any chemicals - only micro fiber cloth may be used to remove fingerprints or other traces from handling. October 19th 2012 21:21 Copyright Ledil Oy - Subject to change without prior notice - Page 3/3 Ledil Oy Salorankatu 10 24240 SALO Finland http://www.ledil.com email: [email protected] FAX: +358-2-733 8001 Relative intensity of C12501_MIRA-W 100% 75% 50% 25% 0% 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 Relative intensity of C12502_MIRA-WW (MT-G) 100% 75% 50% 25% 0% 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 Relative intensity of CA12505_MIRA-WW (MT-G) 100% 75% 50% 25% 0% 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 A C D B 4 4 D Isometric view 2 14.7 Bottom view 3 3 Front view . 32 4 2 2 Dimension D: - C12500_MIRA-M 29,7mm - C12501_MIRA-W 28,4mm - C12502_MIRA-WW 28,4mm Top view Material: PC 1 This drawing is our property. It can't be reproduced or communicated without our written agreement. DRAWN BY DATE CHECKED BY DATE DESIGNED BY DATE mav sn mav D Ledil Oy Salorankatu 10 FIN 24240 SALO Finland DRAWING TITLE Datasheet MIRA lens 02.04.2012 02.04.2012 29.11.2011 SIZE DRAWING NUMBER A4 SCALE 1:1 WEIGHT(g) - REV 1 SHEET A 1/1 1