TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 features applications D D D D D D D D D D D D D D D 10-Bit Resolution 20 MSPS Sampling Analog-to-Digital Converter (ADC) Power Dissipation . . . 107 mW Typ 5-V Single Supply Operation Differential Nonlinearity . . . ±0.5 LSB Typ No Missing Codes Power Down (Standby) Mode Three State Outputs Digital I/Os Compatible With 5-V or 3.3-V Logic Adjustable Reference Input Small Outline Package (SOIC), Super Small Outline Package (SSOP), or Thin Small Outline Package (TSOP) Pin Compatible With the Analog Devices AD876 description Communications Multimedia Digital Video Systems High-Speed DSP Front-End . . . TMS320C6x DB, DW, OR PW PACKAGE (TOP VIEW) AGND DRVDD D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DRGND DGND 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 AVDD AIN CML REFBS REFBF NC REFTF REFTS DGND AGND DVDD STBY OE CLK The TLC876 is a CMOS, low-power, 10-bit, 20 13 16 MSPS analog-to-digital converter (ADC). The 14 15 speed, resolution, and single-supply operation are suited for applications in video, multimedia, NC – No internal connection imaging, high-speed acquisition, and communications. The low-power and single-supply operation satisfy requirements for high-speed portable applications. The speed and resolution ideally suit charge-coupled device (CCD) input systems such as color scanners, digital copiers, electronic still cameras, and camcorders. A multistage pipelined architecture with output error correction logic provides for no missing codes over the full operating temperature range. Force and sense connections to the reference inputs provide a more accurate internal reference voltage to the reference resistor string. A standby mode of operation reduces the power to typically 15 mW. The digital I/O interfaces to either 5-V or 3.3-V logic and the digital output terminals can be placed in a high-impedance state. The format of the output data is straight binary coding. A pipelined multistaged architecture achieves a high sample rate with low power consumption. The TLC876 distributes the conversion over several smaller ADC sub-blocks, refining the conversion with progressively higher accuracy as the device passes the results from stage to stage. This distributed conversion requires a small fraction of the 1023 comparators used in a traditional flash ADC. A sample-and-hold amplifier (SHA) within each of the stages permits the first stage to operate on a new input sample while the second through the fifth stages operate on the four preceding samples. The TLC876C is characterized for operation from 0°C to 70°C, the TLC876I is characterized for operation from –40°C to 85°C, and the TLC876M is characterized for operation over the full military temperature range of –55°C to 125°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 AVAILABLE OPTIONS PACKAGE TA SUPER SMALL OUTLINE (DB) SMALL OUTLINE (DW) TSSOP (PW) 0°C to 70°C TLC876CDB TLC876CDW TLC876CPW –40°C to 85°C TLC876IDB TLC876IDW TLC876IPW –55°C to 125°C — TLC876MDW — functional block diagram AIN SHA† 27 SHA† GAIN SHA† SHA† GAIN GAIN SHA† GAIN ADC ADC DAC 2 ADC ADC DAC 2 ADC DAC 2 DAC 2 2 Correction Logic 10 Output Buffers 12 10 † Sample and hold amplifier 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 (MSB) D9 (LSB) D0 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 equivalent input and output circuits D0–D9 OUTPUT CIRCUIT ALL DIGITAL INPUT CIRCUITS AIN INPUT CIRCUIT DVDD DVDD AVDD DRVDD DRVDD 30 Ω typ AIN 0.5 pF typ CLK D0–D9 0.3 pF DRGND DGND AGND DRGND DGND REFERENCE INPUT CIRCUIT AVDD REFTF 30 AVSS AVDD REFTS Internal Reference Voltage 29 AGND AVDD REFBS 35 Internal Reference Voltage AVSS AVDD REFBF 34 AGND POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 Terminal Functions TERMINAL NAME AGND NO. 1, 19 AIN 27 AVDD CLK 28 CML I/O DESCRIPTION Analog ground I Analog input 5-V analog supply 15 I Clock input 26 O Bypass for an internal bias point. Typically a 0.1 µF capacitor minimum is connected from this terminal to ground. DGND 14, 20 Digital ground DVDD 18 5-V digital supply DRVDD DRGND 2 3.3-V/5-V digital supply. Supply for digital input and output buffers. 13 3.3-V/5-V digital ground. Ground for digital input and output buffers. D0 –D9 3 – 12 O Digital data out. D0:LSB, D9:MSB OE 16 I Output enable. When OE = low or NC, the device is in normal operating mode. When OE = high, D0–D9 are high impedance. REFBF 24 I Reference bottom force REFBS 25 I Reference bottom sense REFTF 22 I Reference top force REFTS 21 I Reference top sense STBY 17 I Standby enable. When STBY = low or NC, the device is in normal operating mode. When STBY = high, the device is in standby mode. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, AVDD to AGND, DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 6.5 V Reference voltage input range to AGND, VI(REFTF), VI(REFBF), VI(REFBS), VI(REFTS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V Analog input voltage range to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to DVDD + 0.3 V Digital output voltage range applied from external source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to DVDD Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C Operating free-air temperature range, TA: TLC876C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C TLC876I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C TLC876M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DB 1353 mW DW 1598 mW DERATING FACTOR ABOVE TA = 25°C ‡ TA = 70°C POWER RATING TA = 85°C POWER RATING TA = 125°C POWER RATING 10.82 mW/°C 866 mW 703 mW — 12.78 mW/°C 1023 mW 831 mW 320 mW PW 1207 mW 9.65 mW/°C 772 mW 627 mW — ‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RΘJA). Thermal resistance is not production tested, and values given are for informational purposes only. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 recommended operating conditions analog and reference inputs MIN Reference input voltage (top), VI(REFT) VI(REFB) + 1 0 Reference input voltage (bottom), VI(REFB) Analog input voltage, VI(AIN) 1 NOM MAX UNIT 3.6 4.5 V 1.6 VI(REFT) – 1 V 2 Vpp power supply MIN Supply voltage AVDD † DVDD† NOM MAX 4.5 5.25 4.5 5.25 DRVDD 3 † The voltage difference between AVDD and DVDD terminals cannot exceed 0.5 V to maintain performance specifications. UNIT V 5.25 digital inputs MIN High-level input voltage, VIH Low-level input voltage, VIL DRVDD = 3 V DRVDD = 5 V 2.4 DRVDD = 5.25 V DRVDD = 3 V 4.2 NOM MAX UNIT V 4 0.6 DRVDD = 5 V DRVDD = 5.25 V 1 V 1.05 Clock period, tc (see Figure 1) 50 ns Pulse duration, clock high, tw(CLKH) 23 25 ns Pulse duration, clock low, tw(CLKL) 23 25 ns TLC876C Operating free-air temperature, TA 0 70 TLC876I –40 85 TLC876M –55 125 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 °C 5 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 electrical characteristics at AVDD = DVDD = 5 V, DRVDD = 3.3 V, VI(REFT) = 3.6 V, VI(REFB) = 1.6 V, fCLK = 20 MSPS (unless otherwise noted) power supply PARAMETER IDD Operating supply current PD TEST CONDITIONS AVDD† DVDD† DRVDD MIN Power dissipation PD(STBY) Standby power STBY = High TYP MAX 17 25 mA 2.7 5 mA 25 100 µA mW 107 150 CLK running 45 85 CLK inhibited at VDD or 0 V 15 35 UNIT mW † The voltage difference between AVDD and DVDD terminals cannot exceed 0.5 V to maintain performance specifications. digital logic inputs PARAMETER TEST CONDITIONS MIN IIH IIH High-level input current, STBY, OE DVDD = 5 V High-level input current, all other inputs DVDD = 5 V IIL IIL(CLK) Low-level input current DVDD = 5V –50 Low-level input current, CLK DVDD = 5V –10 Ci Input capacitance TYP MAX UNIT 1.9 mA 10 µA 50 µA 10 µA 5 pF logic outputs PARAMETER VOH High-level output voltage TEST CONDITIONS IOH = 50 µA IOH = 0.5 mA VOL Low-level output voltage IOL = 50 µA IOL = 0.6 mA Co Output capacitance IOZ High-impedance-state output current 6 MIN DRVDD = 3 V DRVDD = 5 V 2.4 DRVDD = 5 V DRVDD = 3.6 V 2.4 TYP MAX V 3.8 0.7 DRVDD = 5.25 V DRVDD = 5.25 V 1.05 –10 • DALLAS, TEXAS 75265 V 0.4 5 POST OFFICE BOX 655303 UNIT pF 10 µA TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 operating characteristics at AVDD = DVDD = 5 V, DRVDD = 3.3 V, VI(REFT) = 3.6 V, VI(REFB) = 1.6 V, fCLK = 20 MSPS (unless otherwise noted) dc accuracy PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Integral nonlinearity (INL) ± 1.5 Differential nonlinearity (DNL) (see Note 1) ± 0.5 Offset error –0.4 %FSR Gain error 0.2 %FSR <± 1 LSB NOTE 1: A differential nonlinearity error of less than ±1 LSB ensures no missing codes. analog input PARAMETER Ci TEST CONDITIONS MIN Input capacitance TYP MAX 5 UNIT pF reference input PARAMETER Rref Reference input resistance Iref Reference input current TEST CONDITIONS MIN TYP 350 500 MAX UNIT Ω 4 mA Reference top offset voltage 35 mV Reference bottom offset voltage 35 mV dynamic performance† PARAMETER TEST CONDITIONS All suffixes All suffixes Eff ti number Effective b off bit bits (ENOB) C and I suffixes M suffix All suffixes All suffixes All suffixes Signal to total harmonic distortion+noise Signal-to-total (S/(THD+N)) C and I suffixes M suffix All suffixes Total harmonic distortion (THD) fI = 3.58 MHz,, TA = Full Range MIN fI = 3.58 MHz, TA = 25°C fI = 3.58 MHz,, TA = Full Range fI = 10 MHz fI = 1 MHz TYP MAX UNIT 8.5 8 8.5 8 8.5 Bit Bits 7.5 fI = 10 MHz fI = 1 MHz fI = 3.58 MHz fI = 10 MHz fI = 3.58 MHz Spurious free dynamic range BW fI = 1 MHz fI = 3.58 MHz, TA = 25°C 8.1 53 50 53 50 53 dB 47 51 –63 –62 –56 dB –61 –64 dB Analog input full-power bandwidth 200 MHz Differential phase 0.5 degrees Differential gain 1% † The voltage difference between AVDD and DVDD cannot exceed 0.5 V to maintain performance specifications. At input clock rise times less than 20 ns, the offset full-scale error increases approximately by a factor of (20/tr)0.5 where tr equals the actual rise time in nanoseconds. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 operating characteristics at AVDD = DVDD = 5 V, DRVDD = 3.3 V, VI(REFT) = 3.6 V, VI(REFB) = 1.6 V, fCLK = 20 MSPS (unless otherwise noted) timing requirements PARAMETER fconv td(o) TEST CONDITIONS MIN Maximum conversion rate (see Note 2) Delay time, output CL = 20 pF td(pipe) Delay time, pipeline, latency td(A) Delay time, aperture 5 20 CL = 20 pF ns Sample N+1 ns 5 15 ns Sample N+2 AIN td(A) td(pipe) tw(CLKH) tw(CLKL) CLK tc td(o) Data N–4 Data N–3 td(o) Data N–2 Data N–1 Data N Figure 1. Timing Diagram OE tdis(DD) D0–D9 ten(HL) Active High Impedance Figure 2. Output Enable to Data Output Timing Diagram STBY Output Data Valid CLK Figure 3. Standby Timing POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ps 15 PARAMETER MEASUREMENT INFORMATION Sample N Clock cycles 5 NOTE 2: The conversion rate can be a minimum of 10 kHz without degradation in specified performance. 8 ns 22 Enable time, OE↓ to valid data UNIT MHz 4 Disable time, OE↑ to Hi-Z D0 – D9 MAX 3.5 Aperture jitter tdis(DD) ten(HL) TYP 20 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 TYPICAL CHARACTERISTICS SIGNAL-TO-NOISE AND DISTORTION vs INPUT FREQUENCY GAIN vs INPUT FREQUENCY 2 SINAD – Signal-to-Noise and Distortion – dB 55 G – Gain – dB 0 –2 –4 –6 –8 –10 1 10 100 fCLK = 20 MSPS AIN = – 0.5 dB 50 45 40 1000 1 10 f – Input Frequency – MHz f – Input Frequency – MHz Figure 4 Figure 5 TOTAL HARMONIC DISTORTION vs INPUT FREQUENCY SIGNAL-TO-NOISE AND DISTORTION vs CLOCK FREQUENCY 60 SINAD – Signal-to-Noise and Distortion – dB THD – Total Harmonic Distortion – dB – 10 – 30 – 50 THD – 70 3 rd 2 nd – 90 1 10 fIN = 3.58 MHz AIN = – 0.5 dB 55 50 45 40 5 f – Input Frequency – MHz Figure 6 10 15 f – Clock Frequency – MHz 20 Figure 7 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 TYPICAL CHARACTERISTICS POWER DISSIPATION vs CLOCK FREQUENCY 150 PD – Power Dissipation – mW 140 130 120 110 100 90 80 0 5 10 15 20 f – Clock Frequency – MHz DNL – Differential Nonlinearity – LSB Figure 8 1 0.8 0.6 0.4 0.2 0 –0.2 –0.4 –0.6 –0.8 –1 0 255 511 Input Code Figure 9. Differential Nonlinearity 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 767 1023 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 INL – Integral Nonlinearity – LSB TYPICAL CHARACTERISTICS 3 2 1 0 –1 –2 –3 0 255 511 767 1023 Input Code Figure 10. Integral Nonlinearity SFDR : –64 dB SNRD : 52 dB SNR : 55 dB THD 2nd : –62 dB 3rd : –72 dB : –69 dB 4th 5th : –68 dB 6th 7th : –71 dB 8th 9th : –70 dB : –71 dB : –70 dB : –80 dB 1 5 6 0 0.5 1 1.5 2 7 2.5 3 3.5 4 4.5 5 4 2 8 9 5.5 6 6.5 7 7.5 8 8.5 3 9 9.5 10 Frequency – MHz Figure 11. FFT Plot of Dynamic Performance POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION definitions of specifications and terminology integral nonlinearity (INL) Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale. The point used as zero occurs 1/2 LSB before the first code transition. The full-scale point is defined as a level 1/2 LSB beyond the last code transition. The deviation is measured from the center of each particular code to the true straight line between these two points. This parameter is sometimes referred to as linearity error. differential nonlinearity (DNL) " An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. A differential nonlinearity error of less than 1 LSB ensures no missing codes. This parameter is sometimes referred to as differential error. offset error The first transition should occur at a level 1/2 LSB above zero. Offset is defined as the deviation of the actual first code transition from that point. gain error The first code transition should occur for an analog value 1/2 LSB above nominal negative full scale (the voltage applied to the REFBF terminal). The last transition should occur for an analog value 1 1/2 LSB below nominal positive full scale (the voltage applied to the REFTF terminal). Gain error is the deviation of the actual difference between the first and last code transitions from the ideal difference between the first and last code transitions. pipeline delay (latency) The number of clock cycles between conversion initiation on an input sample and the corresponding output data being made available. Once the data pipeline is full, new valid output data are provided every clock cycle. reference top/bottom offset Resistance between the reference input and comparator input tap points causes offset errors. These errors can be nulled out by using the force-sense connection as shown in the driving the reference terminals section. driving the analog input Figure 12 shows an equivalent input circuit of the TLC876 sample-and-hold amplifier and it represents an excellent first order approximation. The total equivalent capacitance, CE, is typically less than 5 pF and the input source must be able to charge or discharge this capacitance to 10-bit accuracy in the sample period of one half of a clock cycle. When the switch S1 closes, the input source must charge or discharge the capacitor CE from the voltage already stored on CE (the previously captured sample) to the new voltage. In the worst case, a full-scale voltage step on the input, the input source must provide the charging current through the switch resistance RSW (50 Ω) of S1 and quickly settle (within 1/2 CLK period), and, therefore, the source is driving a low input impedance. However, when the source voltage equals the value previously stored on CE, the hold capacitor requires no input current to maintain the charge and the equivalent input impedance is extremely high. Adding series resistance between the output of the source and the AIN terminal reduces the drive requirements placed on the source, as shown in Figure 13. To maintain the frequency performance outlined in the specifications, the resistor should be limited to 200 Ω minus the source resistance or less. The maximum source resistance, RS, for 10-bit, 1/2 LSB accuracy is given by equation 1. 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION driving the analog input (continued) R S v 2f (1) 1 – R SW (C ln 2048) E (CLK) For f(CLK) = 20 MHz, CE = 10 pF, and RSW = 100 Ω, this equation gives 228 Ω as a maximum value; hence the 200 Ω limit on the total source resistance. For applications with an input clock less than 20 MHz, the size of the series resistor can increase proportionally. Alternatively, adding a shunt capacitor between the AIN terminal and analog ground can lower the ac source impedance. This capacitance value depends on the source resistance and the required signal bandwidth. The input span is determined by the reference voltages (see driving the reference terminals section). TLC876 AIN Driving Source RS Ideal Source S1 RSW VS RS ≤ 200 Ω TLC876 AIN CE VS Figure 13. Sample TLC876 Drive Requirements Figure 12. TLC876 Simplified Equivalent Input For many applications, particularly in single supply operation, ac-coupling offers a convenient way of biasing the analog input signal at the proper signal range. Figure 14 shows a typical configuration for ac-coupling the analog input signal to the TLC876. Maintaining the outlined specifications requires careful selection of the component values. The most important concern is the f–3 dB high-pass corner that is a function of R2, and the parallel combination of C1 and C2. The f–3 dB point can be approximated by equation 2. f *3 dB + 2p 1 (R2) Ceq (2) where Ceq is the parallel combination of C1 and C2. Since C1 is typically a large electrolytic or tantalum capacitor, the impedance becomes inductive at high frequencies. Adding a small ceramic or polystyrene capacitor, C2 of approximately 0.01 µF, which is not inductive within the frequency range of interest, maintains a low impedance. If the minimum expected input signal frequency is 20 kHz, and R2 equals 1 kΩ and R1 equals 50 Ω, the parallel capacitance of C1 and C2 must be a minimum of 0.008 µF to avoid attenuating signals close to 20 kHz. TLC876 C1 R1 AIN VIN R2 C2 + VBIAS – Figure 14. AC-Coupled Inputs POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION driving the analog input (continued) The expanded input circuit shown in Figure 15 aids in understanding the voltage offset generation when using the external input circuit in Figure 14. The ac-coupling capacitors, C1 and C2, integrate the switching transients present at the input of the TLC876 causing a net dc bias current, IB, to flow into the input. The magnitude of this bias current increases with increasing the dc signal level, VB, and also increases with sample frequency. When the sample clock frequency is 20 MHz, the dc bias current is approximately 30 µA† at VBIAS equal to 3 V dc. This bias current causes an offset error of (R1 + R2) x IB at the AIN terminal. Making R2 negligibly small or modifying VBIAS to account for the resultant offset can compensate for this error. Note however that R2 loads the signal driving source, and the value must be sufficient for the application. For example, as shown in Figure 15, when VBIAS is 3 V and the resistor values stated above, the bias current causes a 31.5 mV‡ offset from the 3 V bias, VBIAS, at the AIN terminal. For the TLC876, VBIAS can be as low as 1 V for a 2 V peak-to-peak input signal swing. C1 TLC876 R1 VB VIN AIN RSW IB R2 CE C2 + VBIAS – Figure 15. Bias Current and Offset For systems that require dc-coupling, an op-amp can level-shift a ground-referenced signal to comply with the input requirements of the TLC876. Figure 16 shows an amplifier in an inverting mode with ac signal gain of –1. The dc voltage at the noninverting input of the op-amp controls the amount of dc level shifting. A resistive voltage divider attenuates the REFBF signal and the op-amp then multiplies the attenuated signal by 2. In the case where REFBF = 1.6 V, the dc output level is 2.6 V which is approximately equal to (V(REFTF) – V(REFBF)/2. † IB(AVG) = CE (VB) fCLK ≈ 30 µA, with RSW = 50 Ω, CE = 5 pF, R1 = 50 Ω, and R2 = 1 kΩ ‡ VOFFSET = IB(AVG) (R1 + R2) 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION driving the analog input (continued) RL = 4.99 kΩ VCC 0.1 µF TLC876 NC RIN = 4.99 kΩ 2 2V(PP) 0 V dc 3 kΩ 3 REFBF 7 1 – A† + 6 AIN 5 4 NC 14.7 kΩ † Amplifier A can be an AD817 or AD818 with terminal numbers as shown. The AD817 and AD818 are wide bandwidth single supply op-amps. Figure 16. Bipolar Level Shift driving the reference terminals dc considerations The TLC876 requires an external reference on terminals REFTF and REFBF and a resistor array, nominally 500 Ω, is connected between terminals REFTF and REFBF. A Kelvin connection, using the TLC876 reference sense terminals REFTS and REFBS, minimizes voltage drops caused by external and internal wiring resistance. Figure 17 shows the equivalent input structure for the reference terminals. There is approximately 5 Ω of resistance between both REFTF and REFBF terminals and the reference ladder. If the force-sense connections are not used, the voltage drop across the 5-Ω resistors results in a reduced voltage appearing across the ladder resistance. This reduces the input span of the converter. Applying a slightly larger span between the REFTF and REFBF terminals compensates for this error. Note that the temperature coefficients of the 5-Ω resistors are 1350 ppm. The effects of temperature should be considered when a force-sense reference configuration is not used. 5Ω TLC876 REFTF 10 Ω 5Ω 5Ω 5Ω CLK REFTS RARRAY 500 Ω DAC C (Equivalent) CLK REFBS 10 Ω 5Ω 5Ω 5Ω REFBF 5Ω Figure 17. TLC876 Equivalent Reference Structure POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION dc considerations (continued) The REFTS and REFBS terminals should not be connected in configurations that do not use a force-sense reference. Connecting the force and sense lines together allows current to flow in the sense lines. Any current allowed to flow through these lines must be negligibly small. Current flow causes voltage drops across the resistance in the sense lines. Because the internal DACs tap different points along the sense lines, each DAC would receive a slightly different reference voltage if current were flowing in these lines. To avoid this undesirable condition, leave the sense lines unconnected. Any current allowed to flow through these lines must be negligibly small (< 100 µA). The voltage drop across the internal resistor array (RARRAY) determines the input span. The nominal differential voltage is 2 Vpp. The full-scale input span is given by equation 3. Input Voltage Span = V(REFTS) – V(REFBS) (3) Therefore, a full-scale input span is approximately 2 V when [V(REFTS) – V(REFBS)] = 2 V. The external reference must provide approximately 4 mA for a 2-V drop across the internal resistor array. Figure 18 shows the flexibility in determining both the full-scale span of the analog input and where to center this voltage without degrading the typical performance. 5 4.5 4 REFTF, REFTS 3.5 2 V Span 3 2.5 1 V Span 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 REFBF, REFBS 3 3.5 4 Figure 18. TLC876 Reference Ranges ac considerations The simplified diagram of Figure 17 shows that the reference terminals connect to a capacitor for one half of the clock period. The size of the capacitor is a function of the analog input voltage, therefore producing dynamic impedance changes at the reference inputs. The external reference source must be able to maintain a low impedance over all frequencies of interest to provide the charge required by the capacitance. By supplying the requisite charge, the reference voltages remain relatively constant maintaining specified performance. For some reference configurations, voltage transients are present on the reference lines, especially during the falling edge of CLK. The reference must recover from the transients and settle to the desired level of accuracy prior to the rising edges of CLK. 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION ac considerations (continued) Several useful reference configurations can be used depending on the application, desired level of accuracy, and cost tradeoffs. The simplest configuration, shown in Figure 19, utilizes a resistor divider to generate the reference voltages from the converters analog power supply. The 0.1 µF bypass capacitors reduce high frequency transients. The 10 µF capacitors reduce the impedances at the REFTF and REFBF terminals at lower frequencies; however, as input frequencies approach dc, the capacitors become ineffective, and small voltage deviations appear across the biasing resistors. This reference method maintains 10-bit accuracy for input frequencies above approximately 200 Hz and 8-bit accuracy applications for input frequencies above approximately 50 Hz. TLC876 NC 140 Ω (± 1%) REFTS 4V 5V 10 µF REFTF 0.1 µF 500 Ω 250 Ω (± 1%) 2V REFBF 10 µF 0.1 µF NC REFBS NC – No connect Figure 19. Low Cost Reference Circuit The reference configuration in Figure 19 provides the lowest cost, but the disadvantages include reduced dc power supply rejection and reduced accuracy due to the variability of the internal and external resistors. The force-sense reference connections can eliminate the voltage drops associated with the internal connections to the reference ladder. Figure 20 shows a circuit using a dual, rail-to-rail single-supply operational amplifier. The operational amplifier should provide stable 3.6 V and 1.6 V reference voltages. Each half of the amplifier is compensated to drive 1 µF and 0.1 µF decoupling capacitors at the REFTF and REFBF terminals maintaining stability. The operational amplifiers are connected as voltage followers. By connecting the operational amplifier feedback through the sense connections of the TLC876, the outputs of the operational amplifiers automatically adjust to compensate for the voltage drops that occur within the converter. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 17 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION ac considerations (continued) TLC876 REFTS 5V C3 0.1 µF _ REFTF REFT + C2 0.1 µF REFBS _ C4 0.1 µF REFBF REFB + C1 0.1 µF Figure 20. Kelvin Connection Reference Using an Operational Amplifier With Unlimited Capacitive Load Drive Capability Figure 21 shows a circuit using a dual operational amplifier with unlimited capacitive load drive. The operational amplifier should provide stable 3.6 V and 1.6 V reference voltages for REFTF and REFBF, respectively. The amplifier must be able to maintain stability while driving unlimited capacitive loads, so the 0.1 µF capacitors C1 and C2 can connect directly to the outputs of the operational amplifiers, which reduces high frequency transients. Capacitors C3 and C4 shunt across the internal resistors of the force-sense connections and prevent instability. The stability of any operational amplifier used must be examined closely when driving capacitive loads. TLC876 10 kΩ REFTS 0.1 µF 10 kΩ REFT _ A† + 10 Ω REFTF 1 µF 0.1 µF 10 kΩ REFBS 10 kΩ REFB 0.1 µF _ A† + 10 Ω 1 µF REFBF 0.1 µF † This device is 1/2 of a TLV2442. The TLV2442 is a rail-to-rail output dual operational amplifier. Figure 21. Kelvin Connection Reference Using an Operational Amplifier With Unlimited Capacitive Load Drive Capability 18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION layout and decoupling With high-frequency high-resolution converters, the layout and decoupling of the reference is critical. The actual voltage digitized by the TLC876 is relative to the reference voltages. In Figure 22, for example, the reference return and the bypass capacitors are connected to the shield of the incoming analog signal. Disturbances in the ground of the analog input, that are common mode to the REFTF, REFBF, and AIN terminals because of the common ground, are effectively removed by the TLC876 high common mode rejection. Also, these capacitors should be connected as close to reference terminals as possible. High-frequency noise sources, VN1 and VN2, are shunted to ground by decoupling capacitors. Any voltage drops between the analog input ground and the reference bypassing points are treated as input signals by the converter using the reference inputs. Consequently, the reference decoupling capacitors should be connected to the same physical analog ground point used by the analog input voltage (see the grounding and layout rules section). 4V VN1 REFTF 4V VN2 TLC876 REFBF AIN Figure 22. Recommended Bypassing for the Reference clock input The clock input is buffered internally with an inverter powered from the DRVDD terminal, which accommodates either 5-V or 3.3-V CMOS logic input signal swings with the input threshold for the CLK terminal nominally at DRVDD/2. The internal pipelined architecture operates on both rising and falling edges of the input clock. To minimize duty cycle variations, the recommended logic family to drive the clock input is high-speed or advanced CMOS (HC/HCT, AC/ACT) logic. CMOS logic provides both symmetrical voltage threshold levels and sufficient rise and fall times to support 20 MSPS operation. The power dissipated by the correction logic and output buffers is largely proportional to the clock frequency. Figure 8 illustrates this tradeoff between clock rates and a reduction in power consumption. digital inputs and outputs Each of the digital control inputs, OE and STBY, has an input buffer powered from the DRVDD supply terminal. With DRVDD set to 5 V, all digital inputs readily interface with 5 V CMOS logic. Using lower voltage CMOS logic, DRVDD can be set to 3.3 V, lowering the nominal input threshold of all digital inputs to (3.3 V)/2 = 1.65 V, typically. The digital output format is straight binary. For example, Table 1 shows the output format for voltage levels of V(REFTS) = 4 V and V(REFBS) = 2 V. A low power mode feature is provided such that when STBY is high and the clock is disabled, the static power of the TLC876 drops significantly (see electrical characteristics table). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 19 TLC876M, TLC876I, TLC876C 10-BIT 20 MSPS PARALLEL OUTPUT CMOS ANALOG-TO-DIGITAL CONVERTERS SLAS140E – JULY 1997 – REVISED OCTOBER 2000 PRINCIPLES OF OPERATION digital inputs and outputs (continued) Table 1. Output Data Format DATA AIN VOLTAGE (APPROXIMATE) THREE STATE D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 >4V 0 1 1 1 1 1 1 1 1 1 1 4V 0 1 1 1 1 1 1 1 1 1 1 3V 0 1 0 0 0 0 0 0 0 0 0 2V 0 0 0 0 0 0 0 0 0 0 0 <2V 0 0 0 0 0 0 0 0 0 0 0 X 1 Z Z Z Z Z Z Z Z Z Z grounding and layout rules Proper grounding and layout techniques are essential for achieving optimal performance. The analog and digital grounds on the TLC876 have been separated to optimize the management of return currents in a system. A printed circuit board (PCB) of at least 4 layers employing a ground plane and power planes should be used with the TLC876. The use of ground and power planes offers distinct advantages: D D D Minimizes the loop area encompassed by a signal and its return path Minimizes the impedance associated with ground and power paths The inherent distributed capacitor formed by the power plane, PCB insulation, and ground plane These characteristics produce a reduction of electromagnetic interference (EMI) and an overall improvement in performance. A properly designed layout prevents noise from coupling onto the input signal. Digital signal traces should not run parallel with the input signal traces and should be routed away from the input circuitry. The separate analog and digital grounds should be joined together directly under the TLC876. A solid ground plane under the TLC876 is also acceptable if no significant currents are flowing in that portion of the ground plane under the device. The general rule for mixed signal layouts is that return currents from digital circuitry should not pass through or under critical analog circuitry. The system design should minimize the analog lead-in to reduce potential noise pickup. digital outputs The DRVDD supply terminal powers each of the on-chip buffers for the output bits (D0–D9) and is a separate lead from AVDD or DVDD. The output drivers are sized to drive a variety of logic families, while minimizing the amount of glitch energy generated. A recommended fan-out of one keeps the capacitive load on the output data drivers below the specified 20 pF level. For DRVDD = 5 V, the output signal swing can drive both high-speed CMOS and TTL logic families. For TTL, the on-chip output drivers are designed to support several of the high-speed TTL families (F, AS, S). For applications where the clock rate is below 20 MSPS, other TTL families are appropriate. For interfacing with lower voltage CMOS logic, the TLC876 sustains 20 MSPS operation with DRVDD = 3.3 V. Refer to logic family data sheets for compatibility with the TLC876 digital specifications. 20 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9954001NXD ACTIVE SOIC DW 28 1 Lead/Ball Finish Green (RoHS & no Sb/Br) CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM TLC876CDB OBSOLETE SSOP DB 28 TBD Call TI Call TI TLC876CDBLE OBSOLETE SSOP DB 28 TBD Call TI Call TI TLC876CDBR OBSOLETE SSOP DB 28 TBD Call TI Call TI TLC876CDW OBSOLETE SOIC DW 28 TBD Call TI Call TI TLC876CDWR OBSOLETE SOIC DW 28 TBD Call TI Call TI TLC876CPW OBSOLETE TSSOP PW 28 TBD Call TI Call TI TLC876CPWR OBSOLETE TSSOP PW 28 TBD Call TI Call TI TLC876IDB OBSOLETE SSOP DB 28 TBD Call TI Call TI TLC876IDBLE OBSOLETE SSOP DB 28 TBD Call TI Call TI TLC876IDBR OBSOLETE SSOP DB 28 TBD Call TI Call TI TLC876IDW OBSOLETE SOIC DW 28 TBD Call TI Call TI TLC876IDWR OBSOLETE SOIC DW 28 TBD Call TI Call TI TLC876IPW OBSOLETE TSSOP PW 28 TBD Call TI Call TI TLC876IPWLE OBSOLETE TSSOP PW 28 TBD Call TI Call TI TLC876IPWR OBSOLETE TSSOP PW 28 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated