REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - lgt 01-06-13 Raymond Monnin B Corrections to table I test conditions and footnote. Editorial changes throughout. drw 04-06-14 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Rick C. Officer STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 http://www.dscc.dla.mil CHECKED BY Charles E. Besore APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE Michael Frye MICROCIRCUIT, LINEAR, WIDEBAND RMS-TO-DC CONVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-01-02 AMSC N/A REVISION LEVEL B SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-89637 9 5962-E311-04 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89637 01 C A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function AD637 Wideband RMS-to-DC converter 01 1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 and as follows: Outline letter C Descriptive designator GDIP1-T14 or CDIP2-T14 Terminals Package style 14 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Positive supply voltage (+VS) .................................................................... Negative supply voltage (-VS).................................................................... Output short circuit duration...................................................................... Storage temperature range....................................................................... Lead temperature (soldering, 10 seconds)............................................... Internal quiescent power dissipation ......................................................... Thermal resistance, junction to case (θJC)................................................ Thermal resistance, junction to ambient (θJA)........................................... Junction temperature (TJ) ......................................................................... +18 V dc -18 V dc Indefinite -65°C to +150°C +300°C 108 mW See MIL-STD-1835 95°C/W +175°C 1.4 Recommended operating conditions. Positive supply voltage (+VS) .................................................................... +15 V dc Negative supply voltage (-VS).................................................................... -15 V dc Ambient operating temperature range (TA)............................................... -55°C to +125°C STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89637 A REVISION LEVEL B SHEET 2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Functional block diagram. The functional block diagram shall be as specified on figure 2. 3.2.3 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89637 A REVISION LEVEL B SHEET 3 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89637 A REVISION LEVEL B SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions +VS = +15 V, -VS = -15 V -55°C ≤ TA ≤+125°C unless otherwise specified Group A subgroups Device type 1 01 Limits Min Total error ET VIN = 0 V to ±10 V 2, 3 Total error versus positive supply ∆ ET ∆ + VS +5.0 V ≤ +VS ≤ +15 V Total error versus negative supply ∆ ET ∆ - VS -5.0 V ≤ -VS ≤ -15 V Unit Max 1/ 1/ 1/ 1, 2, 3 01 ±150 µV/V 1 01 ±300 µV/V ±500 2 DC reversal error ETR VIN = ±2.0 V, TA = +25°C 1 01 ±.25 % of reading 2.0 V fullscale nonlinearity NL1 10 mV ≤ |VIN| ≤ 2.0 V 1 01 ±.04 % of FS ±.06 2, 3 7.0 V fullscale nonlinearity NL2 10 mV ≤ |VIN| ≤ 7.0 V 1 ±.05 01 ±.14 2, 3 Output offset voltage VOSO VIN = GND 1 % of FS ±1.0 01 mV ±6.0 2, 3 ±.07 ∆VOSO ∆T VIN = GND 2, 3 01 VOP RL = 2.0 kΩ 1, 2, 3 01 12 IREF1 TA = 25°C 1 01 5.0 80 µA IREF2 TA = 25°C 1 01 1.0 100 µA Buffer input offset voltage Buffer input current VOS2 TA = 25°C 1 01 ±2.0 mV IIN TA = 25°C 1 01 ±10 nA Denominator input resistance 2/ Denominator input offset voltage 2/ Power supply range RDEN TA = 25°C 4 01 30 kΩ VOS3 TA = 25°C 1 01 ±0.5 mV VS TA = 25°C 1 01 ±18 V Quiescent current IQ VS = ±18 V 1, 2, 3 01 3.0 mA Standby current ISB VCS ≤ 0.2 V, TA = +25°C 1 01 450 µA Output offset voltage temperature coefficient Output voltage swing at RMS OUT IREF0 2/ for 0 dB = 1.0 V rms IREF range 2/ 20 ±3.0 mV/°C V 1/ For subgroup 1, the maximum total error is ±1.0 mV ±0.5% of reading. For subgroup 2 and 3, the maximum total error is ±6.0 mV ±0.7% of reading. Total error represents the maximum deviation of the dc component of the output voltage from the theoretical output value over a specified range of signal amplitude and frequency. It is shown as the sum of a fixed error and a component proportional to the theoretical output (percentage of reading). The fixed error component includes all offset errors and irreducible nonlinearities; the percentage of reading component includes the linear scale-factor error. 2/ If not tested, shall be guaranteed to the limits specified in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89637 A REVISION LEVEL B SHEET 5 Device type 01 Case outline C Terminal number Terminal symbol 1 BUF IN 2 NC 3 COMMON 4 OFFSET NULL 5 CS VREF 6 7 dB 8 CAVG 9 RMS OUT 10 -VS 11 +VS 12 NC 13 VIN 14 BUF OUT NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89637 A REVISION LEVEL B SHEET 6 FIGURE 2. Functional block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89637 A REVISION LEVEL B SHEET 7 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) 1 1*, 2, 3 1, 2, 3, 4** 1 * PDA applies to subgroup 1. ** Subgroups 4, if not tested shall be guaranteed to the limits specified in table I herein. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA = +125°C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89637 A REVISION LEVEL B SHEET 8 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCCVA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89637 A REVISION LEVEL B SHEET 9 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 04-06-14 Approved sources of supply for SMD 5962-89637 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ 5962-8963701CA Vendor CAGE number 24355 Vendor similar PIN 2/ AD637SQ/883B 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 24355 Vendor name and address Analog Devices, Inc. Rt. 1 Industrial Park P.O. Box 9106 Norwood, Ma. 02062 Point of Contact: 804 Woburn Street Wilmington, MA 01887-3462 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.