AP.10G.01 Specification Part No. AP.10G.01 Product Name 10mm SMT 14dB Active GPS Patch Antenna With Front End Saw Filter Feature Unique SMT GPS active patch Wide Input Voltage 1.5V to 3.3V Ultra low power consumption RoHS compliant SPE-11-8-100/D/SS | page 1 of 11 1. Introduction The AP.10G.01 one stage 14dB active GPS patch antenna is the smallest SMT GPS high performance embedded antenna currently available in the world. Using extremely sensitive high dielectric constant powder formulation and tight process control the 10mm x 10mm x 4mm patch antenna is accurately tuned to have its frequency band right at 1575.42MHz for GPS systems. A patented SMT structure gives high reliability in integration. With an ultra low power consumption one stage LNA with Saw Filter, this small active patch has the performance of an ordinary active patch, but at only a quarter of the size. This product is suited to small form factor mobile devices such as GPS Smartphones, Personal Location, Medical devices, Telematic devices and Automotive navigation and tracking. Custom gain, connector and cable versions are available. The AP.10G consists of 2 functional blocks – the LNA and also the patch antenna. ANTENNA SAW Filter LNA SPE-11-8-100/D/SS | page 2 of 11 2. Specification 2.1 Patch Antenna Parameter Specification Frequency 1575.42 ± 1.023MHz Gain Typ -10dBic @ Zenith Impedance 50Ω Polarization RHCP Axial Ratio Max 4.0dB @ Zenith Dimension 10mm x 10mm x 4mm (add 7.3mm depth for vertical PCB) 2.2 LNA Parameter Specification Frequency Outer Band Attenuation 1575.42 ± 1.023MHz F0=1575.42MHz F0±30MHz 9dB min. F0±50MHz 14dB min. F0±100MHz Output Impedance 50Ω Output VSWR 2.0 Max Typ. 1dBm Pout at 1dB Gain Compression point 18dB min. LNA Gain, Power Consumption and Noise Figure Voltage LNA Gain (Typ) Power Consumption(mA) Typ Noise Figure Typ Min. 1.5V 18dB 3.5mA 2.6dB Typ. 1.8V 18dB 3.5mA 2.6dB Max. 3.3V 18dB 3.5mA 2.6dB 2.3 Connection Connection SMT via solder pads SPE-11-8-100/D/SS | page 3 of 11 3. LNA Gain and Out Band Rejection @3.0V Tr1 S21 30.00 Log Mag 10.00dB/ Ref -40.00dB (F2 Smo) >1 1.5754200 GHz 18.276 dB 1 20.00 10.00 3 0.000 5 7 1 -10.00 6 -20.00 2 4 -30.00 -40.00 -50.00 -60.00 -70.00 1 Center 1.57542 GHz Cg1 Cg1 Cg1 Cg1 Cg1 Cg1 Cg1 Tr1 Tr1 Tr1 Tr1 Tr1 Tr1 Tr1 S21 S21 S21 S21 S21 S21 S21 >1 2 3 4 5 6 7 IFBW 1 kHz 1.5754200 1.6054200 1.5454200 1.6254200 1.5254200 1.6754200 1.4754200 GHz GHz GHz GHz GHz GHz GHz 18.276 -15.173 6.6195 -12.083 2.2267 - 5.9624 - 0.5270 Span 400 MHz Cor dB dB dB dB dB dB dB SPE-11-8-100/D/SS | page 4 of 11 4. LNA Noise Figure @3.0V Mkr1 1.5754 GHz 2.569 dB 18.100 dB 9.000 NFIG Scale/ 1.000 dB 1 -1.000 40.00 GAIN Scale/ 5.000 dB 1 -10.00 Center 1.57542 GHz BW 4 MHz Tcold 296.50 K Avgs Off Points 11 Att 0/ - - dB Span 3.00 MHz Loss Off Corr 5. Total Specification (through Antenna, LNA) Parameter Specification Frequency 1575.42 ± 1.023MHz Gain 8 ± 4dBic @ 90° Output Impedance 50Ω Polarization RHCP Output VSWR Max 2.0 Operation Temperature -40°C to + 85°C Storage Temperature -40°C to + 85°C Relative Humidity 40% to 95% Input Voltage Min. 1.5V, Typ. 1.8V, Max. 3.3V SPE-11-8-100/D/SS | page 5 of 11 6. Radiation Patterns 6.1 XZ Plane 0 -8 -10 -15 -20 -25 -30 -35 90 270 -40 180 Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) 1 AP.10G XZ 1620.00 -9.20 / 42.00 -11.99 / 147.00 Avg. Gain(dBi) Source Polar. -10.24 RHCP Date 2010/4/25 SPE-11-8-100/D/SS | page 6 of 11 6.2 YZ Plane 0 -8 -10 -15 -20 -25 -30 -35 90 270 -40 180 Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) 1 AP.10G YZ 1620.00 -9.73 / 324.00 -19.18 / 222.00 Avg. Gain(dBi) Source Polar. -12.80 RHCP Date 2010/4/25 SPE-11-8-100/D/SS | page 7 of 11 6.3 XY Plane 0 -8 -10 -15 -20 -25 -30 -35 90 270 -40 180 Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) Avg. Gain(dBi) Source Polar. Date 1 AP.10G XZ 1620.00 -9.20 / 42.00 -11.99 / 147.00 -10.24 RHCP 2010/4/25 2 AP.10G YZ 1620.00 -9.73 / 324.00 -19.18 / 222.00 -12.80 RHCP 2010/4/25 SPE-11-8-100/D/SS | page 8 of 11 Kiwi 2011/9/29 Kiwi 2011/11/9 Sandy 2011/11/16 7. Technical Drawing ALL Initial Design Kiwi 2011/9/29 B F5 Add logo+P/N on the patch Kiwi 2011/11/9 C G3 Amend drawing content Sandy 2011/11/16 AP.10G.01 Top View A B Side View Bottom View PCB Footprint Application Assembly Name Front Side Back Patch (10mm x 10mm x 4.2mm) Material Finish QTY 1 Ceramic Clear 1 2 Shielding Case Tin (SPTE) Tin Plated 1 3 PCB FR4 0.6t Green 1 NOTE: te: 1. Soldered area oldered Area 2. Solder Mask Area (Green) Solder Mask Area(Green) Ground PCB Thickness 0.8mm Clearance Area Area Note: Material Finish Name3. Clearance P/N QTY Shielding Case Area 4. Shielding Case Area 1.Soldered Area 1 Patch (10mmx10mmx4.2mm) AP.10G Ceramic Clear 1 Area to be solder (Pad) 2.Solder Mask Area(Green) 5. Area to be solder (Pad) 2 Shielding Case Tin (SPTE) Tin Plated 1 3 PCB FR4 0.6t Green 1 TW Design Centre s inherent design concepts are property of Taoglas. Not to to third parties without the written consent of Taoglas. 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pad) SPE-11-8-100/D/SS | TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to page 9 of 11 View 2011/9/29 e patch Kiwi 2011/11/9 tent Sandy 2011/11/16 Top View A ALL Initial Design Kiwi B F5 Add logo+P/N on the patch Kiwi C G3 Amend drawing content Sandy AP.10G.01 Kiwi 7.1 PCB Footprint om View B Side View PCB Footprint n Assembly t Back Side Bottom View Ground PCB Thickness 0.8mm Name 0mmx10mmx4.2mm) g Case P/N AP.10G Material Finish Ceramic Clear 1 Tin (SPTE) Tin Plated 1 FR4 0.6t Green 1 Note: 1.Soldered Area 2.Solder Mask Area(Green) 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pad) PCB Footprint Application Assembly print Front TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas. Back Side Ground PCB Thickness 0.8mm Name ss 0.8mm d QTY QTY 1 1 1 Note: 1.Soldered Area 2.Solder Mask Area(Green) 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pad) TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas. 1 Patch (10mmx10mmx4.2mm) 2 3 P/N Finish QTY Ceramic Clear 1 Shielding Case Tin (SPTE) Tin Plated 1 PCB FR4 0.6t Green 1 Name: 1. Soldered Area 2. Solder Mask Area (Green) 3. Clearance Area 4. Shielding Case Area 5. Area to be solder (Pad) AP.10G Material Note: 1.Soldered Area 2.Solder Mask Area(G 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pa TW D This drawing and its inherent design concepts are property be copied or given to third parties without the written cons SPE-11-8-100/D/SS | page 10 of 11 8.0 Packaging on Tape and Reel – 250 pieces per reel 8.Packaged Packaging Each Reel is packaged – Inner Carton Outer Carton contains 5 Reels – 1250 pieces per Carton Packaged on Tape and Reel 250 pieces per reel Each Reel is packaged Inner Carton Outer Carton contains 5 Reels 1250 pieces per Carton Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and SPE-11-8-100/D/SS product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © 2012, Taoglas Ltd. Page 11 of 11 SPE-11-8-100/D/SS | page 11 of 11