ETC CM-BF537

Hardware User Manual
CM-BF537 V3.x
Contact
Bluetechnix Mechatronische Systeme GmbH
Waidhausenstraße 3/19
A-1140 Vienna
AUSTRIA/EUROPE
office@bluetechnix.at
http://www.bluetechnix.com
Document No.: 100-1221-3.9
Date: 2012-05-24
CM-BF537_HUM_V3.2.docx
1
Table of Contents
Blackfin® Core Modules ............................................................................................................................................................................ 5
Blackfin® Development Boards ............................................................................................................................................................. 7
1
2
3
Introduction ....................................................................................................................................................................................... 8
1.1
Overview .................................................................................................................................................................................... 8
1.2
Key Features ............................................................................................................................................................................. 9
1.3
Applications.............................................................................................................................................................................. 9
General Description ......................................................................................................................................................................10
2.1
Functional Description .......................................................................................................................................................10
2.2
Boot Mode...............................................................................................................................................................................10
2.3
Memory Map ..........................................................................................................................................................................11
2.3.1
Core Module Memory ...............................................................................................................................................11
2.3.2
Externally Addressable Memory (on connector) ............................................................................................12
Specifications...................................................................................................................................................................................13
3.1
4
5
3.1.1
Operating Conditions ...............................................................................................................................................13
3.1.2
Maximum Ratings.......................................................................................................................................................13
3.1.3
ESD Sensitivity .............................................................................................................................................................14
Connector Description .................................................................................................................................................................15
4.1
Connector X1 .........................................................................................................................................................................15
4.2
Connector X2 .........................................................................................................................................................................16
Application Information ..............................................................................................................................................................18
5.1
Supply Voltage Decoupling .............................................................................................................................................18
5.2
Reset circuit ............................................................................................................................................................................18
5.3
Application Example Schematics ...................................................................................................................................19
5.3.1
6
7
Electrical Specifications......................................................................................................................................................13
RJ45 schematic ............................................................................................................................................................19
5.4
Sample Schematic ................................................................................................................................................................19
5.5
Stand-alone Ethernet based MPEG webcam .............................................................................................................20
Mechanical Outline .......................................................................................................................................................................22
6.1
Top View ..................................................................................................................................................................................22
6.2
Bottom View ...........................................................................................................................................................................22
6.3
Side View .................................................................................................................................................................................23
6.4
Footprint ..................................................................................................................................................................................24
6.5
Connectors ..............................................................................................................................................................................24
Support ..............................................................................................................................................................................................25
7.1
General Support....................................................................................................................................................................25
CM-BF537_HUM_V3.2.docx
2
7.2
Board Support Packages ...................................................................................................................................................25
7.3
Blackfin® Software Support ..............................................................................................................................................25
7.3.1
BLACKSheep® OS ........................................................................................................................................................25
7.3.2
LabVIEW .........................................................................................................................................................................25
7.3.3
uClinux ............................................................................................................................................................................25
Blackfin® Design Services ...................................................................................................................................................25
7.4
7.4.1
8
Upcoming Products and Software Releases ....................................................................................................25
Ordering Information ...................................................................................................................................................................26
8.1
9
Predefined mounting options for CM-BF537 ............................................................................................................26
Dependability ..................................................................................................................................................................................27
9.1
10
MTBF ..........................................................................................................................................................................................27
Product History ..........................................................................................................................................................................28
10.1
Version Information.............................................................................................................................................................28
10.1.1
CM-BF537-C-C-Q25S32F4 (CM-BF537E) ............................................................................................................28
10.1.2
CM-BF537-C-I-Q25S32F4 (CM-BF537E-I) ...........................................................................................................28
10.1.3
CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD) ................................................................................................28
10.2
Anomalies................................................................................................................................................................................29
11
Document Revision History ...................................................................................................................................................30
12
List of Abbreviations ................................................................................................................................................................31
A
List of Figures and Tables............................................................................................................................................................32
CM-BF537_HUM_V3.2.docx
3
© Bluetechnix Mechatronische Systeme GmbH 2012
All Rights Reserved.
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights of technical change reserved.
We hereby disclaim any warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Bluetechnix makes and you receive no warranties or conditions, express, implied, statutory or in any
communication with you. Bluetechnix specifically disclaims any implied warranty of merchantability or fitness for a
particular purpose.
Bluetechnix takes no liability for any damages and errors causing of the usage of this board. The user of this board is
responsible by himself for the functionality of his application. He is allowed to use the board only if he has the
qualification. More information is found in the General Terms and Conditions (AGB).
Information
For further information on technology, delivery terms and conditions and prices please contact Bluetechnix
(http://www.bluetechnix.com).
Warning
Due to technical requirements components may contain dangerous substances.
CM-BF537_HUM_V3.2.docx
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Blackfin® Core Modules
TCM-BF518-C-C-Q25S32F2 (TCM-BF518)
The Tiny Core Module TCM-BF518 is powered by Analog Devices' single core ADSP-BF518 processor; up to
400MHz, 32MB SDRAM, up to 8MB flash. The 2x60 pin expansion connectors are backwards compatible with
other Core Modules.
ACM-BF525C-C-C-Q25S64F4N1024
The Core Module ACM-BF525C is optimized for audio applications and performance. It is based on the high
performance ADSPBF525Cfrom Analog Devices. It addresses 64MByte SDRAM via its 16bit wide SDRAM bus, has
an onboard NOR-flash of 4MByte and a NAND-flash with 1024MByte.
CM-BF527-C-C-Q50S32F8 (CM-BF527)
The Core Module CM-BF527 is powered by Analog Devices' single core ADSP-BF527 processor; key features are
USB OTG 2.0 and Ethernet. The 2x60 pin expansion connectors are backwards compatible with other Core
Modules.
CM-BF533-C-C-Q25S32F2 (CM-BF533)
The Core Module CM-BF533 is powered by Analog Devices' single core ADSP-BF533 processor; up to 600MHz,
32MB SDRAM, 2MB flash, 2x60 pin expansion connectors at a size of 36.5x31.5mm.
TCM-BF537-C-I-Q25S32F8 (TCM-BF537)
The Tiny Core Module TCM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to
500MHz, 32MB SDRAM, 8MB flash, a size of 28x28mm, 2x60 pin expansion connectors, Ball Grid Array or Border
Pads for reflow soldering, industrial temperature range -40°C to +85°C.
CM-BF537-C-C-Q25S32F4 (CM-BF537E)
The Core Module CM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to 600MHz,
32MB SDRAM, 4MB flash, integrated TP10/100 Ethernet physical transceiver, 2x60 pin expansion connectors at a
size of 36.5x31.5mm.
CM-BF537-C-C-Q30S32F4-U (CM-BF537U)
The Core Module CM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to 600MHz,
32MB SDRAM, 4MB flash, integrated USB 2.0 Device, 2x60 pin expansion connectors at a size of 36.5x31.5mm.
CM-BF548-C-C-Q25S64F8 (CM-BF548)
The Core Module CM-BF548 is characterized by its numerous peripheral interfaces, its performance in
combination with its high speed memory interface (DDR). Key features are 533MHz, 64MB DDR SD-RAM
(266MHz), and 8MB flash.
CM-BF561-C-C-Q25S64F8 (CM-BF561)
The Core Module CM-BF561 is powered by Analog Devices' dual core ADSP-BF561 processor; up to 2x 600MHz,
64MB SDRAM, 8MB flash, 2x60 pin expansion connectors at a size of 36.5x31.5mm.
eCM-BF561-C-C-Q25S128F32 (eCM-BF561)
The Core Module CM-BF561 is powered by Analog Devices' dual core ADSP-BF561 processor; up to 2x 600MHz,
128MB SDRAM, 8MB flash, 2x100 pin expansion connectors and a size of 44x33mm.
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Core Module naming information
The idea is to put more Core Module specific technical information into the product name. New Core Module names
will have following technical information covered in their names.
•
Product Family,
•
CPU-Type,
•
Connection-Type,
•
Operating Temperature Range,
•
Crystal Frequency [MHz],
•
RAM [MB],
•
Flash [MB],
•
External Controllers
•
o
Special and/or
o
Former name
That expands of course the name but allows the customer to get the most important Core Module specific
information at the first sight. Have a look at the example below to get an idea of the new Core Module names.
Example CM-BF537-C-C-Q25S32F4 (CM-BF537E)
CM - BF537 - C - C - Q25
S32
F4 -
-
(CM-BF537E)
Product Family
Former name
CM = Core Module
Special
SBC = Single Board Computer
Custom Core Modules or specials
CPU-Type
uC = uclinux
Equals the name of CPU
Extra controllers mounted
Connection-Type
E = Ethernet
A = BGA
U = USB
B = Border pad
Flash [MB]
C = Connector
F = NOR Flash [MB]
S = SSpecial
N = NAND Flash [MB]
Operating Temperature Range
RAM
A = Automotive
(-40° to +125°)
S = SDRAM [MB]
C = Commercial
(0° to +70°)
I = Industry
(-40° to +85°)
Crystal Frequency
Notation: QXX[MHz]
CM-BF537_HUM_V3.2.docx
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Blackfin® Development Boards
ADEV-BF52xC
Feature rich, low cost embedded audio development platform which supports Audio Core Modules (ACM). The
form factor of the ADEV-BF52xC allows easy integration of the board into OEM products. Dedicated interfaces such
as USB2.0, Line In/Out, headphone out and an onboard silicon microphone turn the ADEV-BF52xC into a fullfeatured development platform for most embedded audio applications in commercial areas.
DEV-BF5xxDA-Lite
Get ready to program and debug Bluetechnix Core Modules with this tiny development platform including an USBBased Debug Agent. The DEV-BF5xxDA-Lite is a low cost starter development system including a VDSP++
Evaluation Software License.
DEV-BF548-Lite
Low-cost development board with a socket for Bluetechnix’ CM-BF548 Core Module. Additional interfaces are
available, e.g. an SD-Card, USB and Ethernet.
DEV-BF548DA-Lite
Get ready to program and debug Bluetechnix CM-BF548 Core Module with this tiny development platform
including an USB-Based Debug Agent. The DEV-BF548DA-Lite is a low-cost starter development system including a
VDSP++ Evaluation Software License.
eDEV-BF5xx
Feature rich, low cost rapid development platform which provides all interfaces on dedicated connectors and has all
Core Module pins routed to solder pads which easily can be accessed by the developers. The eDEV-BF5xx supports
the latest debugging interface from Analog Devices - ADI-SADA (Analog Devices Stand Alone Debug Agent).
EVAL-BF5xx
Tiny, low cost embedded platform which supports Bluetechnix powerful Blackfin® based Core Modules. The form
factor (75x75mm) of the EVAL-BF5xx allows easy integration of the board into OEM products. Dedicated interfaces
such as USB2.0, SD-card slot, CAN interface connectors and of course Ethernet, turn the EVAL-BF5xx into a fullfeatured evaluation platform for most embedded applications.
Extender boards
Extender boards (EXT-BF5xx) are expanding the development and evaluation boards by several interfaces and
functionalities. Targeted application areas are: audio/video processing, security and surveillance, Ethernet access,
positioning, automation and control, experimental development and measuring.
Note! Bluetechnix is offering tailored board developments as well.
CM-BF537_HUM_V3.2.docx
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1 Introduction
The Core-Module CM-BF537 is characterized by its field of application, performance and configuration possibility.
The module integrates processor, RAM, flash, external peripheral controllers and power supply at a size of
31.5x36.5mm! It is based at the high performance ADSP-BF537 from Analog Devices. The Core-Module is designed
for commercial and industrial usage (depending on temperature range). It addresses up to 64MByte SDRAM via its
16bit wide SDRAM bus, has an onboard NOR-flash of 4MByte and offers a CAN interface. In addition there is an extra
Ethernet physical transceiver (10/100Mbit) onboard.
1.1
Overview
The current hardware version (see Version Information) of Core Module CM-BF537-C-C-Q25S32F4 (CM-BF537E)
consists of the following components. Parts of mounting options of CM-BF537 are listed in addition.
60 Pin Expansion Connector B
Dynamic
Core Voltage
Control
Low Voltage
Reset
ADSP
BF537
up to
600 MHz
Up to
64MByte
SDRam
Up to
8MByte
Flash
Ethernet
Physical
60 Pin Expansion Connector A
Figure 1-1: Main components of the CM-BF537 Core Module
•
Analog Devices Blackfin Processor BF537
o Industrial version (see chapter 8.1)
 ADSP-BF537SBBCZ-5A (-40° - 85°C)
o
•
SDRAM
o 32MByte SDRAM Version (see chapter 8.1)
 SDRAM Clock up to 133MHz
 MT48LC16M16A2BG-7 (16Mx16, 256Mbit at 3.3 V)
o
•
Commercial version (see chapter 8.1)
 ADSP-BF537SKBCZ-6AV (0° - 70°C)
64MByte SDRAM Version(see chapter 8.1)
 SDRAM Clock up to 143MHz
 IS42S16320B-7BL (8M x16x4, 512Mbit at 3.3 V)
4 MByte of Addressable Flash
o PF48F2000P0ZBQ0 (4Mx16 32Mbit at 3.3 V; default only 4MByte addressable)
CM-BF537_HUM_V3.2.docx
8
o
Additional flash memory can be connected through the expansion board as parallel flash using
asynchronous chip select lines or as an SPI flash.
•
Ethernet Physical Transceiver
o Micrel KSZ8041NLI
•
Low Voltage Reset Circuit
o Resets module if power supply goes below 2.93 V for at least 140 ms
•
Dynamic Core Voltage Control
o Core voltage is adjustable by setting software registers on the Blackfin processor
o Core voltage range: 0.8 – 1.32V
•
Expansion Connector A
o Data Bus
o Address Bus
o Control Signals
o Power Supply
o Ethernet Pins
•
Expansion Connector B
o SPORT0
o JTAG
o UART0/UART1
o CAN
o TWI (I²C compatible)
o SPI
o PPI (Parallel Port Interface)
o GPIO’s
1.2
Key Features
•
•
•
•
1.3
The CM-BF537 is very compact and measures only 36.5x31.5mm
Allows quick prototyping of product that comes very close to the final design
Reduces development costs, faster time to market
Very cost effective for small and medium volumes
Applications
•
•
•
•
•
•
•
•
•
•
•
•
Robotics
Video security
Video surveillance
Industrial distributed control
Industrial factory automation
Remote monitoring devices
Point-of-sale terminals
VoIP
Biometrics/security
Instrumentation
Medical appliances
Consumer appliances
CM-BF537_HUM_V3.2.docx
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2 General Description
2.1
Functional Description
Mem. Control, Boot Mode, JTAG, Ethernet
Dynamic
Core Voltage
Control
Low Voltage
Reset
Clock
Clock-out
16 Bit Data Bus
ADSP
BF537
up to
600MHz
Up to
64MByte
SDRam
4MByte
Flash
Data & Address Bus
3V3 Power , Reset
Ethernet
Physical
20 Bit Address Bus
PPI, SPORT0, UART1, UART2, SPI, TWI, CAN, GPIO
Figure 2-1: Detailed block diagram
Figure 2-1 shows a detailed block diagram of the CM-BF537. Other than the SDRAM control pins the CM-BF537 has
all other pins of the Blackfin processor on its two main 60 pin connectors.
A special feature of the Core Module CM-BF537 is the on-board physical Ethernet transceiver from Micrel
(KSZ8041NLI).
Dynamic voltage control allows reducing power consumption to a minimum adjusting the core voltage and the
clock frequency dynamically in accordance to the required processing power. A low voltage reset circuit guarantees
a power on reset and resets the system when the input voltage drops below 2.93V.
2.2
Boot Mode
By default the boot mode = 000 (BMODE2 = low, BMODE1 = low, BMODE0 = low). All BMODE pins have internal pull
down resistors.
Connect BMODE0 to Vcc and leave BMODE1, BMODE2 pins open for boot mode 001 equals to 8 or 16 bit
PROM/FLASH boot mode, this is the default boot mode of BLACKSheep® OS. See Blackfin Datasheets or
Eval/DevBoard manuals for more details.
CM-BF537_HUM_V3.2.docx
10
2.3
2.3.1
Memory Map
Core Module Memory
Memory Type
FLASH Bank0
(PF4 Flag low)
FLASH Bank1
(PF4 Flag high)
FLASH Bank2
(PF5 Flag low)*
FLASH Bank3
(PF5 Flag high)*
SD-RAM32
Start Address
0x20000000
End Address
0x201FFFFF
Size
2MB
0x20000000
0x201FFFFF
2MB
0x20000000
0x201FFFFF
2MB
0x20000000
0x201FFFFF
2MB
0x00000000
0x01FFFFFF
32MB
SD-RAM64
0x00000000
0x1FFFFFFF
64MB
Comment
1/8 of 16MB Micron Flash,
PF48F3000P0ZBQ
1/8 of 16MB Micron Flash,
PF48F3000P0ZBQ
1/8 of 16MB Micron Flash,
PF48F3000P0ZBQ
1/8 of 16MB Micron Flash,
PF48F3000P0ZBQ
16Bit Bus, Micron
MT48LC16M16A2FG
16Bit Bus, ISSI
IS42S16320B-7BL
Table 2-1: Memory map
The maximum amount of addressable memory by a single asynchronous memory bank is 2MByte. In order to be
able to use more than 2MByte on a single bank 2 GPIOs are used to select which 2MB section of flash is active in the
memory window of the Blackfin processor. This frees up the remaining banks for the user.
The maximum amount of memory addressable by the processor is 8MByte.
*) PF5 is routed by default to the connector of the Core Module. Nevertheless this pin can be used to select bank2/3
of the flash memory. To realize this, the 0Ω resistor R18 must be removed and a 0Ω resistor R19 must be soldered to
the Core Module. In this case PF5 is routed to the flash memory instead to the connector!
Figure 2-2: Assembly drawing top view
CM-BF537_HUM_V3.2.docx
11
2.3.2
Externally Addressable Memory (on connector)
The Blackfins External Bus Interface (EBI) allows connecting devices via an asynchronous memory interface.
AMS Line
nAMS2
nAMS3
Start Address
0x20200000
0x20300000
End Address
0x202FFFFF
0x203FFFFF
Max. Size
1MB
1MB
Table 2-2: Externally addressable memory
CM-BF537_HUM_V3.2.docx
12
3 Specifications
3.1
Electrical Specifications
3.1.1
Operating Conditions
Symbol
VIN
I3V33)
VOH
VOL
IIH
IOZ
IDEEPSLEEP
ISLEEP
IIDLE
ITYP
IHIBERNATE1)
IRTC
fCCLK 2)
Parameter
Input supply voltage
3.3V current
High level output voltage
Low level output voltage
IO input current
Three state leakage current
VIN current in deep sleep mode
VIN current in sleep mode
VIN current in idle mode
VIN current in with core running at 400 MHz
VIN current in hibernate state at 400 MHz
VRTC current
Core clock frequency
Min
3.0
2.8
-
Typical
3.3
350
16
19.5
24
138
20
-
Max
3.6
0.5
10
10
70
600
Unit
V
mA
V
V
µA
µA
mA
mA
mA
mA
mA
µA
MHz
Table 3-1: Electrical characteristics
1)
VDDINT=1.10V @ TJ=25°C
2)
Commercial grade
3)
Average load @ 25°C ambient temperature
3.1.2
Maximum Ratings
Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage
to the device. These are stress ratings only. Operation of the device at these or any other conditions greater than
those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Symbol
VIO
VIN
IOH /IOL
TAMB
TSTO
TSLD
φAMB
Parameter
Input or output voltage
Input supply voltage
Current per pin
Ambient temperature
Storage temperature
Solder temperature for 10 seconds
Relative ambient humidity
Min
-0.5
3.0
0
-40
-55
Max
3.6
5.5
10
85
150
260
90
Unit
V
V
mA
°C
°C
°C
%
Table 3-2: Absolute maximum ratings
CM-BF537_HUM_V3.2.docx
13
3.1.3
ESD Sensitivity
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge
without detection. Although this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions
should be taken to avoid performance degradation or loss of functionality.
CM-BF537_HUM_V3.2.docx
14
4 Connector Description
4.1
Connector X1
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
Signal Name
RSCLK0 / TACLK2
DR0PRI / TACLK4
TSCLK0 / TACLK1
DT0PRI / SSEL2
CLKBUF
SDA
PF4 / TMR5 / SSEL6: MO1*
NC: MO2, MO3*
PF5 / TMR4 / SSEL5: MO1, MO2*
NC: MO3*
Vin 3V3
Vin 3V3
PG0 / PPI1D0
PG2 / PPI1D2
PG4 / PPI1D4
PG6 / PPI1D6
PG8 / PPI1D8 / DR1SEC
PG10 / PPI1D10 / RSCLK1
PG12 / PPI1D12 / DR1PRI
PG14 / PPI1D14 / TFS1
PPI1SY3 / PF7 / TMR2
PPI1SY1 / PF9 / TMR0
PPI1SY1 / PF9 / TMR0
PF3 / Rx1 / TMR6 / TACI6
PF1 / DMAR1 / TACI1 / Rx0
PF11 / MOSI
PF13 / SCK
BMODE0
GND
TCK
TDI
TRST
EMU
TMS
TDO
BMODE2
N.C.
BMODE1
PF12 / MISO
PF0 / DMAR0 / Tx0
PF14 / SPI_SS
PF2 / Tx1 / TMR7
PPI1Clk / PF15 / TMRCLK
PPI1Sy2 / PF8 / TMR1
PG15 / PPI1D15 / DT1PRI
PG13 / PPI1D13 / TSCLK1
PG11 / PPI1D11 / RFS1
CM-BF537_HUM_V3.2.docx
Type
I/O
I
I/O
O
O
I/O
I/O
Function
25MHz buffered clock output
I/O
PWR
PWR
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I - 10k pull down
PWR
I - 10k pull up
I - 10k pull up
I - 4k7 pull down
O
I - 10k pull up
O
I - 10k pull down
I - 10k pull down
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
3V3 +-10% 500mA peak for supply
3V3 +-10% 500mA peak for supply
NC
15
Pin No.
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Signal Name
PG9 / PPI1D9 / DT1SEC
PG7 / PPI1D7
PG5 / PPI1D5
PG3 / PPI1D3
PG1 / PPI1D1
GND
GND
PF5 / TMR4 / SSEL5: MO1, MO2*
NC: MO3*
PF6 / TMR3 / SSEL4
PF10 / SSEL1
SCL
DT0SEC / SSEL7 / CANTx
TFS0 / SSEL3
DR0SEC / TACI0 /
RFS0 / TACLK3
Type
I/O
I/O
I/O
I/O
I/O
PWR
PWR
I/O
Function
I/O
I/O
I/O
O
I/O
I
I/O
Table 4-1: Connector description X1
* For mount option details see chapter 8.1.
Note 1: Pin 8 and 53 as well as pin 20 and 21 are identical.
Note 2: Please mind the mounted pull up and pull down resistors on the Core Module.
4.2
Connector X2
Pin No.
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
Signal Name
A1
A3
A5
A7
A9
A11
A13
A15
A17
A19
ABE1/SDQM1
LED_ACT
GND
RX+
RXADRY
BG
CLK_OUT
GND
AMS3
AWE
NMI
D0
D2
D4
CM-BF537_HUM_V3.2.docx
Type
O
O
O
O
O
O
O
O
O
O
O
O
I – 47R pull up to 3V3
I – 47R pull up to 3V3
I - 10k pull up
O
O
PWR
O
O
I - 10k pull up
I/O
I/O
I/O
Function
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Indicates Ethernet activity
AGND use as GND for Ethernet
Ethernet receive +
Ethernet receive -
CLKOUT Pin of Blackfin
Data Bus
Data Bus
Data Bus
16
Pin No.
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
Signal Name
D6
D8
D10
D12
D14
D15
D13
D11
D9
D7
D5
D3
D1
RESET
AOE
ARE
AMS2
VDD-RTC
BGH
BR
VA33
Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I – see chapter 5.2
O
O
O
PWR
O
I - 10k pull up
PWR
107
108
109
110
TXTX+
NC
LED_SPEED
O - 47R pull up to 3V3
O - 47R pull up to 3V3
111
112
113
114
115
116
117
118
119
120
ABE0/SDQM0
A18
A16
A14
A12
A10
A8
A6
A4
A2
O
O
O
O
O
O
O
O
O
O
O
Function
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Ethernet
transformer
reference
Ethernet transmit Ethernet transmit +
voltage
Full duplex LED, High = Full duplex
active, Low = inactive
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Table 4-2: Connector description X2
Note: Please mind the mounted pull up and pull down resistors on the Core Module.
CM-BF537_HUM_V3.2.docx
17
5 Application Information
5.1
Supply Voltage Decoupling
For a better stability we recommend to add a 100nF capacitor for each power supply pin and a 47uF tantalum
capacitor to the VIN voltage rail next to the module.
5.2
Reset circuit
The reset of the flash and the processor are connected to a power monitoring IC. The output can be used as power
on reset for external devices, see Figure 5-1.
Figure 5-1: Schematic of reset circuit on the Core Module
CM-BF537_HUM_V3.2.docx
18
5.3
5.3.1
Application Example Schematics
RJ45 schematic
Figure 5-2: Schematic for RJ45 Connection
Designator
X1
C1
R8, R9
V1, V2
Value
Type
RJLBC-060TC1
10uF
220R
USBLC6-2P6
Description
RJ45 with transformer 1:1
Capacitor
Resistor
TSV-Diode
Quantity
1
1
2
2
Table 5-1: Parts List RJ45
5.4
Sample Schematic
In this minimum configuration the CM-BF537 is used as a high performance network connected processor module.
CM-BF537_HUM_V3.2.docx
19
Figure 5-3: Configuration with Ethernet and JTAG Connector
Designator
C1, C2, C4
C3, C5
CM1
X1
X2
X3
R3
R8, R9
S1
U1
Value
1uF
10uF
Type
DC-8
RJLBC-060TC1
4k7
220R
ADP3338
Description
Capacitor
Capacitor
CM-BF537
Power connector DC-8
RJ45 with transformer
Header, 7-Pin, dual row
Resistor
Resistor
Switch
Low dropout regulator
Quantity
3
1
1
1
1
1
1
2
1
1
Table 5-2: Bill of Material of sample circuit
5.5
Stand-alone Ethernet based MPEG webcam
The CM-BF537 module can be used as a stand-alone module for a camera system requiring only power supply and
the direct attachment of a compatible video camera. An extender board including a camera is available at
Bluetechnix (EXT-BF5xx-CAM).
CM-BF537_HUM_V3.2.docx
20
Figure 5-4: Stand-alone Ethernet based MPEG webcam
Designator
C3, C4, C5, C6, C8
C7, C9
Cam1
CM1
DS1
X1
X2
R1,R3
R7, R8, R9
S1, S2
U1
Value
1uF
10uF
Type
ADP3338
Description
Capacitor
Capacitor
Camera module
CM-BF537
SMD LED
Power connector DC-8
RJ45 with transformer
Resistor
Resistor
Switch
Low dropout regulator
Quantity
6
1
1
1
1
1
1
3
2
1
1
XC6204B252MR
XC6204B182MR
XC6204 high speed LDO
XC6204 high speed LDO
1
1
OV7660FSx
green
DC-8
HFJ11-2250E
10k
220R
U2
U3
Table 5-3: Bill of Materials of a Stand-alone Ethernet based MPEG Webcam
Have a look at our DEV-BF5xxDA-lite schematics, which can be found at
http://www.bluetechnix.com/goto/dev-bf5xxda-lite to get application examples.
CM-BF537_HUM_V3.2.docx
21
6 Mechanical Outline
6.1
Top View
Figure 6-1 shows the bottom view of the CM-BF537. All dimensions are given in millimeters.
Figure 6-1: Mechanical outline (top view)
6.2
Bottom View
Figure 6-2 shows the bottom view of the CM-BF537. All dimensions are given in millimeters.
CM-BF537_HUM_V3.2.docx
22
Figure 6-2: Mechanical outline and Bottom Connectors (Top View)
6.3
Side View
Figure 6-3 shows the side view of the CM-BF537. All dimensions are given in millimeters.
31.0
36.0
2.0
1.1
2.45
24.5
5.7
5.7
Figure 6-3: Side view with mounted connectors
The total minimum mounting height including receptacle at the motherboard is 6.1mm.
CM-BF537_HUM_V3.2.docx
23
6.4
Footprint
h1
Hole1
Hole2
Hole1
Hole2
h2
Figure 6-4: Recommended footprint for the Core Module (top view)
The footprint of the CM-BF537 is available on request. The used connectors can be found in Table 6-1. For detailed
dimensions of the connectors please see the datasheet from the manufacturer’s website.
6.5
Connectors
The Core Module features a Hirose 0.6mm pitch connectors. The base board has to use the complementary
connector.
Board
Core Module
Base board
Designator
X1, X2
X1, X2
Manufacturer
Hirose
Hirose
Manufacturer Part No.
FX8-60P-SV
FX8-60S-SV
Table 6-1: Core Module connector types
CM-BF537_HUM_V3.2.docx
24
7 Support
7.1
General Support
General support for products can be found at Bluetechnix’ support site https://support.bluetechnix.at/wiki
7.2
Board Support Packages
Board
support
packages
and
software
only https://support.bluetechnix.at/software/
7.3
7.3.1
downloads
are
for
registered
customers
Blackfin® Software Support
BLACKSheep® OS
BLACKSheep® OS stands for a powerfully and multithreaded real-time operating system (RTOS) originally designed
for digital signal processing application development on Analog Devices Blackfin® embedded processors. This highperformance OS is based on the reliable and stable real-time VDK kernel from Analog Devices that comes with
VDSP++ IDE. Of course BLACKSheep® OS is fully supported by all Bluetechnix Core-Modules and development
hardware.
7.3.2
LabVIEW
You can get LabVIEW embedded
AG http://www.schmid-engineering.ch.
7.3.3
support
for Bluetechnix Core
Modules
by Schmid-Engineering
uClinux
You can get uClinux support (boot loader and uClinux) for Bluetechnix Core Modules at http://blackfin.uClinux.org.
7.4
Blackfin® Design Services
Based on more than seven years of experience with Blackfin, Bluetechnix offers development assistance as well as
custom design services and software development.
7.4.1
Upcoming Products and Software Releases
Keep up to date with all
at http://www.bluetechnix.com.
CM-BF537_HUM_V3.2.docx
product
changes,
releases
and
software
updates
of
Bluetechnix
25
8 Ordering Information
CM - BF537 - C - C/I - Q25
S32/64
F4 -
-
(CM-BF537E)
Product Family
Former name
CM = Core Module
Special
SBC = Single Board Computer
Custom Core Modules or specials
CPU-Type
uC = uclinux
Equals the name of CPU
Extra controllers mounted
Connection-Type
E = Ethernet
A = BGA
U = USB
B = Border pad
Flash [MB]
C = Connector
F = NOR Flash [MB]
S = Special
N = NAND Flash [MB]
Operating Temperature Range
RAM
A = Automotive
S = SDRAM [MB]
C = Commercial
I = Industry
Crystal Frequency
Notation: QXX[MHz]
8.1
Predefined mounting options for CM-BF537
Article Number
100-1221-3
100-1229-3
100-1273-3
Name
CM-BF537-C-C-Q25S32F4 (CM-BF537E)
CM-BF537-C-I-Q25S32F4 (CM-BF537E-I)
CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD)
Temperature Range
Commercial
Industrial
Commercial
Table 8-1: Ordering information
NOTE:
Custom Core Modules are available on request! Please contact Bluetechnix (office@bluetechnix.com) if
you are interested in custom Core Modules.
The mount options of the Core Module CM-BF537 are shown in Table 8-2.
Mount Option
MO1
MO2
MO3
Flash
2MB
4MB
8MB
Comment
PF4 available on pin 7 on connector X1
default
PF5 not available on connector X1
Table 8-2: Mount options
CM-BF537_HUM_V3.2.docx
26
9 Dependability
9.1
MTBF
Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results,
because MTBF numbers just represent a statistical approximation of how long a set of devices should last before
failure. Nevertheless, we can calculate an MTBF of the Core Module using the bill of material. We take all the
components into account. The PCB and solder connections are excluded from this estimation. For test conditions
we assume an ambient temperature of 30°C of all Core Module components except the Blackfin® processor (80°C)
and the memories (70°C). We use the MTBF Calculator from ALD (http://www.aldservice.com/) and use the reliability
prediction MIL-217F2 Part Stress standard.
This method resulted in a MTBF of 439232 hours for the CM-BF537E.
CM-BF537_HUM_V3.2.docx
27
10 Product History
10.1 Version Information
10.1.1 CM-BF537-C-C-Q25S32F4 (CM-BF537E)
Version
3.0.1
3.0.2
3.0.3
3.2.1
Component
Type
Processor
ADSP-BF537KBCZ-6AV (Rev 0.3)
RAM
MT48LC16M16A2BG-75IT:D
Flash
PF48F2000P0ZBQ0
ETH-Physical
KSZ8041
Processor
ADSP-BF537KBCZ-6AV (Rev 0.3)
RAM
IS42S16160D-7BL
Flash
PF48F2000P0ZBQ0
ETH-Physical
KSZ8041
Processor
ADSP-BF537KBCZ-6AV (Rev 0.3)
RAM
IS42S16160D-7BL
Flash
PF48F3000P0ZBQ0A
ETH-Physical
KSZ8041
Processor
ADSP-BF537KBCZ-6AV (Rev 0.3)
MT48LC16M16A2BG-75IT:D
RAM
PF48F3000P0ZBQE
Flash
KSZ8041
ETH-Physical
Table 10-1: Overview CM-BF537-C-C-Q25S32F4 product changes
10.1.2 CM-BF537-C-I-Q25S32F4 (CM-BF537E-I)
Version
3.0.1
3.0.2
3.2.1
Component
Type
Processor
ADSP-BF537BBCZ-5A (Rev 0.2)
RAM
MT48LC16M16A2BG-75IT:D
Flash
PF48F2000P0ZBQ0
ETH-Physical
KSZ8041
Processor
ADSP-BF537BBCZ-5A (Rev 0.3)
MT48LC16M16A2BG-75IT:D
RAM
Flash
PF48F2000P0ZBQ0
ETH-Physical
KSZ8041
Processor
ADSP-BF537BBCZ-5A (Rev 0.3)
RAM
MT48LC16M16A2BG-75IT:D
Flash
PF48F3000P0ZBQE
ETH-Physical
KSZ8041
Table 10-2: Overview CM-BF537-C-I-Q25S32F4 product changes
10.1.3 CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD)
Version
3.2.1
Component
Processor
RAM
Flash
Type
ADSP-BF537KBCZ-6AV (Rev 0.3)
IS42S16320B-7BL
PF48F3000P0ZBQE
KSZ8041
Table 10-3: Overview CM-BF537-C-C-Q25S64F4 product changes
CM-BF537_HUM_V3.2.docx
28
10.2 Anomalies
Version
3.2
3.0
Date
2011 04 27
2010 10 12
CM-BF537_HUM_V3.2.docx
Description
No anomalies reported yet.
No anomalies reported yet.
Table 10-4: Overview product anomalies
29
11 Document Revision History
Version
9
8
Date
2012 05 24
2012 02 07
7
6
5
4
2011 11 14
2011 10 18
2011 09 06
2011 04 27
3
2
1
2010-02-02
2009-11-05
2009-08-31
CM-BF537_HUM_V3.2.docx
Document Revision
Description of Pin 78 and Pin 5 of Core Module corrected
Dependability added
Memory table update, description for PF5 added
Pin out and connector description corrected
Table 3-1: Electrical characteristics update
Pin out and connector description corrected
Updated HUM to current design. Added industrial version and 64MByte version to
this HUM.
Redesign of Manual
Picture 3-7, 6-1, 6-2, Table 6-1, 6-2 updated
First release V1.0 of the document copied from CM-BF537 V1.2 and updated to
Revision 3.0
Table 11-1: Revision history
30
12 List of Abbreviations
Abbreviation
ADI
AI
AMS
AO
CM
DC
DSP
eCM
EBI
ESD
GPIO
I
I²C
I/O
ISM
LDO
MTBF
NC
NFC
O
OS
PPI
PWR
RTOS
RFU
SADA
SD
SoC
SPI
SPM
SPORT
TFT
TISM
TSC
UART
USB
USBOTG
ZIF
Description
Analog Devices Inc.
Analog Input
Asynchronous Memory Select
Analog Output
Core Module
Direct Current
Digital Signal Processor
Enhanced Core Module
External Bus Interface
Electrostatic Discharge
General Purpose Input Output
Input
Inter-Integrated Circuit
Input/Output
Image Sensor Module
Low Drop-Out regulator
Mean Time Between Failure
Not Connected
NAND Flash Controller
Output
Operating System
Parallel Peripheral Interface
Power
Real-Time Operating System
Reserved for Future Use
Stand Alone Debug Agent
Secure Digital
System on Chip
Serial Peripheral Interface
Speech Processing Module
Serial Port
Thin-Film Transistor
Tiny Image Sensor Module
Touch Screen Controller
Universal Asynchronous Receiver Transmitter
Universal Serial Bus
USB On The Go
Zero Insertion Force
Table 12-1: List of abbreviations
CM-BF537_HUM_V3.2.docx
31
A
List of Figures and Tables
Figures
Figure 1-1: Main components of the CM-BF537 Core Module ...............................................................................................................8
Figure 2-1: Detailed block diagram................................................................................................................................................................ 10
Figure 2-2: Assenbly drowing top view ........................................................................................................................................................ 11
Figure 5-1: Schematic of reset circuit on the Core Module .................................................................................................................. 18
Figure 5-2: Schematic for RJ45 Connection ................................................................................................................................................ 19
Figure 5-3: Configuration with Ethernet and JTAG Connector ........................................................................................................... 20
Figure 5-4: Stand-alone Ethernet based MPEG webcam....................................................................................................................... 21
Figure 6-1: Mechanical outline (top view) ................................................................................................................................................... 22
Figure 6-2: Mechanical outline and Bottom Connectors (Top View) ................................................................................................ 23
Figure 6-3: Side view with mounted connectors ...................................................................................................................................... 23
Figure 6-4: Recommended footprint for the Core Module (top view) ............................................................................................. 24
Tables
Table 2-1: Memory map...................................................................................................................................................................................... 11
Table 2-2: Externally addressable memory ................................................................................................................................................. 12
Table 3-1: Electrical characteristics ................................................................................................................................................................ 13
Table 3-2: Absolute maximum ratings.......................................................................................................................................................... 13
Table 4-1: Connector description X1 ............................................................................................................................................................. 16
Table 4-2: Connector description X2 ............................................................................................................................................................. 17
Table 5-1: Parts List RJ45 .................................................................................................................................................................................... 19
Table 5-2: Bill of Material of sample circuit ................................................................................................................................................. 20
Table 5-3: Bill of Materials of a Stand-alone Ethernet based MPEG Webcam ............................................................................... 21
Table 6-1: Core Module connector types..................................................................................................................................................... 24
Table 8-1: Ordering information ..................................................................................................................................................................... 26
Table 8-2: Mount options................................................................................................................................................................................... 26
Table 10-1: Overview CM-BF537-C-C-Q25S32F4 product changes................................................................................................... 28
Table 10-2: Overview CM-BF537-C-I-Q25S32F4 product changes .................................................................................................... 28
Table 10-3: Overview CM-BF537-C-C-Q25S64F4 product changes................................................................................................... 28
Table 10-4: Overview product anomalies .................................................................................................................................................... 29
Table 11-1: Revision history .............................................................................................................................................................................. 30
Table 12-1: List of abbreviations ..................................................................................................................................................................... 31
CM-BF537_HUM_V3.2.docx
32