SP3222E/SP3232E True +3.0V to +5.5V RS-232 Transceivers FEATURES ■ Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply ■ Minimum 120kbps Data Rate Under Full Load ■ 1µA Low Power Shutdown with Receivers active (SP3222E) ■ Interoperable with RS-232 down to a +2.7V power source ■ Enhanced ESD Specifications: +15kV Human Body Model +15kV IEC61000-4-2 Air Discharge +8kV IEC61000-4-2 Contact Discharge EN 18 SHDN 1 C1+ 2 17 VCC V+ 3 16 GND C1- 4 C2+ 5 15 T1OUT SP3222E 13 R1OUT C2- 6 V- 14 R1IN 7 12 T1IN T2OUT 8 11 T2IN R2IN 9 10 R2OUT nSOIC Now Available in Lead Free Packaging Note: See page 6 for other pinouts DESCRIPTION The SP3222E/SP3232E series is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook or palmtop computers. The SP3222E/SP3232E series has a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the SP3222E/SP3232E series to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222E/SP3232E are 2-driver/2-receiver devices. This series is ideal for portable or hand-held applications such as notebook or palmtop computers. The ESD tolerance of the SP3222E/SP3232E devices are over +/-15kV for both Human Body Model and IEC61000-4-2 Air discharge test methods. The SP3222E device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1µA. SELECTION TABLE MODEL Power Supplies RS-232 Drivers RS-232 Receivers External Components Shutdown TTL 3-State # of Pins SP3222E +3.0V to +5.5V 2 2 4 Capacitors Yes Yes 18, 20 SP3232E +3.0V to +5.5V 2 2 4 Capacitors No No 16 Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. Power Dissipation per package VCC.......................................................-0.3V to +6.0V V+ (NOTE 1).......................................-0.3V to +7.0V V- (NOTE 1)........................................+0.3V to -7.0V V+ + |V-| (NOTE 1)...........................................+13V ICC (DC VCC or GND current).........................+100mA 20-pin SSOP (derate 9.25mW/oC above +70oC)..............750mW 18-pin SOIC (derate 15.7mW/oC above +70oC)..............1260mW 20-pin TSSOP (derate 11.1mW/oC above +70oC).............890mW 16-pin SSOP (derate 9.69mW/oC above +70oC)...............775mW 16-pin PDIP (derate 14.3mW/oC above +70oC)...............1150mW 16-pin Wide SOIC (derate 11.2mW/oC above +70oC)........900mW 16-pin TSSOP (derate 10.5mW/oC above +70oC)..............850mW 16-pin nSOIC (derate 13.57mW/oC above +70oC)...........1086mW Input Voltages TxIN, EN, SHDN...........................-0.3V to Vcc + 0.3V RxIN...................................................................+15V Output Voltages TxOUT.............................................................+13.2V RxOUT, .......................................-0.3V to (VCC +0.3V) Short-Circuit Duration TxOUT....................................................Continuous Storage Temperature......................-65°C to +150°C NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, PARAMETER MIN. TYP. MAX. UNITS CONDITIONS Supply Current 0.3 1.0 mA no load, VCC = 3.3V, TAMB = 25oC, TxIN = GND or VCC Shutdown Supply Current 1.0 10 µA SHDN = GND, VCC = 3.3V, TAMB = 25oC, TxIN = Vcc or GND 0.8 V TxIN, EN, SHDN, Note 2 Vcc V Vcc = 3.3V, Note 2 DC CHARACTERISTICS LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW Input Logic Threshold HIGH 2.0 Input Logic Threshold HIGH 2.4 Vcc V Vcc = 5.0V, Note 2 Input Leakage Current +0.01 +1.0 µA TxIN, EN, SHDN, TAMB = +25oC, VIN = 0V to VCC Output Leakage Current +0.05 +10 µA Receivers disabled, VOUT = 0V to VCC 0.4 Output Voltage LOW Output Voltage HIGH V IOUT = 1.6mA VCC -0.6 VCC -0.1 V IOUT = -1.0mA +5.0 +5.4 V All driver outputs loaded with 3kΩ to GND, TAMB = +25oC DRIVER OUTPUTS Output Voltage Swing Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, Typical values apply at VCC = +3.3V or +5.0V and TAMB = 25°C. PARAMETER MIN. TYP. MAX. UNITS +35 +60 mA +25 µA +15 V CONDITIONS DRIVER OUTPUTS (continued) Output Resistance 300 Output Short-Circuit Current Ω Output Leakage Current VCC = V+ = V- = 0V, TOUT=+2V VOUT = 0V VCC = 0V or 3.0V to 5.5V, VOUT = +12V, Drivers disabled RECEIVER INPUTS Input Voltage Range -15 Input Threshold LOW 0.6 1.2 V Vcc = 3.3V Input Threshold LOW 0.8 1.5 V Vcc = 5.0V Input Threshold HIGH 1.5 2.4 V Vcc = 3.3V Input Threshold HIGH 1.8 2.4 V Vcc = 5.0V Input Hysteresis 0.3 Input Resistance V 3 5 7 kΩ 120 235 kbps Driver Propagation Delay, tPHL 1.0 µs RL = 3kΩ, CL = 1000pF Driver Propagation Delay, tPLH 1.0 µs RL = 3kΩ, CL = 1000pF Receiver Propagation Delay, tPHL 0.3 µs Receiver input to Receiver output, CL = 150pF Receiver Propagation Delay, tPLH 0.3 µs Receiver input to Receiver output, CL = 150pF Receiver Output Enable Time 200 ns Receiver Output Disable Time 200 ns Driver Skew 100 500 ns | tPHL - tPLH |, TAMB = 25°C Receiver Skew 200 1000 ns | tPHL - tPLH | 30 V/µs TIMING CHARACTERISTICS Maximum Data Rate Transition-Region Slew Rate RL = 3kΩ, CL = 1000pF, one driver switching Vcc = 3.3V, RL = 3kΩ, CL = 1000pF, TAMB = 25°C, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V NOTE 2: Driver input hysteresis is typically 250mV. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 120kbps data rate, all drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C. 14 12 4 10 Vout+ Vout- 2 Slew Rate [V/µs ] Transmitter Output Voltage [V] 6 0 500 0 1000 2000 1500 -2 8 6 4 +Slew -Slew 2 -4 0 -6 Load Capacitance [pF] 0 500 1000 1500 Load Capacitance [pF] 2000 2330 Figure 2. Slew Rate vs Load Capacitance for the SP3222E and SP3232E Figure 1. Transmitter Output Voltage vs Load Capacitance for the SP3222E and SP3232E 50 118KHz 60KHz 10KHz 45 40 Suppl y Current [mA] 35 30 25 20 15 10 5 0 0 500 1000 1500 2000 2330 Load Capacitance [pF] Figure 3. Supply Current VS. Load Capacitance when Transmitting Data Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 Pin Function PIN NUMBER NAME SP3222E FUNCTION SOIC SSOP TSSOP SP3232E EN Receiver Enable. Apply Logic LOW for normal operation. Apply logic HIGH to disable the receiver outputs (high-Z state) 1 1 - C1+ Positive terminal of the voltage doubler charge-pump capacitor 2 2 1 V+ +5.5V output generated by the charge pump 3 3 2 C1- Negative terminal of the voltage doubler charge-pump capacitor 4 4 3 C2+ Positive terminal of the inverting charge-pump capacitor 5 5 4 C2- Negative terminal of the inverting charge-pump capacitor 6 6 5 -5.5V output generated by the charge pump 7 7 6 T1OUT RS-232 driver output. 15 17 14 T2OUT RS-232 driver output. 8 8 7 R1IN RS-232 receiver input 14 16 13 R2IN RS-232 receiver input 9 9 8 R1OUT TTL/CMOS receiver output 13 15 12 R2OUT TTL/CMOS receiver output 10 10 9 T1IN TTL/CMOS driver input 12 13 11 T2IN TTL/CMOS driver input 11 12 10 GND Ground 16 18 15 +3.0V to +5.5V supply voltage 17 19 16 Shutdown Control Input. Drive HIGH for normal device operation. Drive LOW to shutdown the drivers (high-Z output) and the onboard power supply 18 20 - - 11, 14 - V- VCC SHDN N.C. No Connect Table 1. Device Pin Description Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 PINOUT EN 1 C1+ 2 V+ 3 C1- EN 1 18 SHDN 19 VCC C1+ 2 17 VCC V+ 3 16 GND 18 GND 4 C2+ 5 20 SHDN 17 T1OUT SP3222E C1- 4 16 R1IN C2- 6 15 R1OUT V- 7 14 N.C. T2OUT 8 13 T1IN C2+ 5 SP3222E 14 R1IN 13 R1OUT C2- 6 V- 7 12 T1IN 11 T2IN 9 12 T2IN T2OUT 8 R2OUT 10 11 N.C. R2IN 9 R2IN 15 T1OUT 10 R2OUT nSOIC SSOP/TSSOP Figure 4. Pinout Configurations for the SP3222E C1+ 1 16 VCC V+ 2 15 GND C1- 3 C2+ 4 14 T1OUT SP3232E 13 R1IN C2- 5 12 R1OUT V- 6 11 T1IN T2OUT 7 10 T2IN R2IN 8 9 R2OUT Figure 5. Pinout Configuration for the SP3232E Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 TYPICAL OPERATING CIRCUITS VCC C5 C1 C2 LOGIC INPUTS + + + 0.1µF 2 C1+ 0.1µ F 19 VCC 6 C2- V+ SP3222E SSOP TSSOP 3 + *C3 0.1µF + C1 V- 7 C4 13 T1IN T1OUT 17 12 T2IN T2OUT 8 + 0.1µF + C2 RS-232 OUTPUTS 2 C1+ 0.1µF LOGIC INPUTS RS-232 INPUTS R2IN 9 6 C2- SP3222E WSOIC *C3 C4 T1OUT 15 11 T2IN T2OUT 8 0.1µF + 0.1µF RS-232 OUTPUTS R1IN 14 5kΩ LOGIC OUTPUTS + V- 7 12 T1IN 10 R2OUT R2IN 9 5kΩ 1 EN 3 4 C15 C2+ 0.1µF V+ 13 R1OUT 5kΩ 10 R2OUT 17 VCC 0.1µF R1IN 16 15 R1OUT LOGIC OUTPUTS + C5 4 C15 C2+ 0.1µF VCC RS-232 INPUTS 5kΩ SHDN GND 1 EN 20 SHDN GND *can be returned to either VCC or GND 18 16 18 *can be returned to either VCC or GND Figure 6. SP3222E Typical Operating Circuits VCC C5 C1 C2 + + + 0.1µF 1 C1+ 0.1µF LOGIC INPUTS V+ SP3232E V- *C3 + 0.1µF 6 C4 5 C211 T1IN T1OUT 14 10 T2IN T2OUT 7 + 0.1µF RS-232 OUTPUTS R1IN 13 12 R1OUT LOGIC OUTPUTS 2 3 C14 C2+ 0.1µF 16 VCC 5kΩ R2IN 9 R2OUT 8 RS-232 INPUTS 5kΩ GND 15 *can be returned to either VCC or GND Figure 7. SP3232E Typical Operating Circuit Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 DESCRIPTION The SP3222E/SP3232E transceivers meet the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be implemented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. The SP3222E/SP3232E devices feature Exar's proprietary on-board charge pump circuitry that generates ±5.5V for RS-232 voltage levels from a single +3.0V to +5.5V power supply. This series is ideal for +3.3V-only systems, mixed +3.3V to +5.5V systems, or +5.0V-only systems that require true RS-232 performance. The SP3222E/SP3232E devices can operate at a typical data rate of 235kbps when fully loaded. The drivers can guarantee a data rate of 120kbps fully loaded with 3kΩ in parallel with 1000pF, ensuring compatability with PC-to-PC communication software. The slew rate of the driver is internally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Paragraph 5). The transition of the loaded output from HIGH to LOW also meet the monotonicity requirements of the standard. Figure 8 shows a loopback test circuit used to test the RS-232 Drivers. Figure 9 shows the test results of the loopback circuit with all drivers active at 120kbps with RS-232 loads in parallel with a 1000pF capacitor. Figure 10 shows the test results where one driver was active at 235kbps and all drivers loaded with an RS-232 receiver in parallel with 1000pF capacitors. A solid RS-232 data transmission rate of 120kbps provides compatibility with many designs in personal computer peripherals and LAN applications. The SP3222E and SP3232E are 2-driver/2receiver devices ideal for portable or handheld applications. The SP3222E features a 1µA shutdown mode that reduces power consumption and extends battery life in portable systems. Its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1µA supply current. The SP3222E driver's output stages are turned off (tri-state) when the device is in shutdown mode. When the power is off, the SP3222E device permits the outputs to be driven up to +/-12V. The driver's inputs do not have pull-up resistors. Designers should connect unused inputs to Vcc or GND. THEORY OF OPERATION The SP3222E/SP3232E series is made up of three basic circuit blocks: 1. Drivers 2. Receivers 3. The Exar proprietary charge pump In the shutdown mode, the supply current falls to less than 1µA, where SHDN = LOW. When the SP3222E device is shut down, the device's driver outputs are disabled (tristated) and the charge pumps are turned off with V+ pulled down to Vcc and V- pulled to GND. The time required to exit shutdown is typically 100µs. Connect SHDN to Vcc if the shutdown mode is not used. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to +5.0V EIA/TIA-232 levels with an inverted sense relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.4V with no load and +5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of +/-3.7V with supply voltages as low as 2.7V. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 DESCRIPTION Receivers VCC C5 C1 + + 0.1µF 0.1µF C1+ + V+ C3 C1C2 C2+ 0.1µF SP3222E SP3232E LOGIC OUTPUTS + 0.1µF VC4 C2LOGIC INPUTS The Receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. The SP3222E receivers have an inverting tri-state output. These receiver outputs (RxOUT) are tri-stated when the enable control EN = HIGH. In the shutdown mode, the receivers can be active or inactive. EN has no effect on TxOUT. The truth table logic of the SP3222E driver and receiver outputs can be found in Table 2. VCC + 0.1µF TxOUT TxIN RxIN RxOUT 5kΩ EN* VCC *SHDN GND 1000pF * SP3222E only Figure 8. SP3222E/SP3232E Driver Loopback Test Circuit [ T ] T T R1 OUT 3 0V Figure 9. Loopback Test results at 120kbps [ T1 IN 1 T RxOUT 0 0 Tri-state Active 0 1 Tri-state Tri-state 1 0 Active Active 1 1 Active Tri-state Charge Pump The charge pump is an Exar-patended design (U.S. 5,306,954) and uses a unique approach compared to older less-efficient designs. The charge pump still requires four external capacitors, but uses a four-phase voltage shifting technique to attain symmetrical 5.5V power supplies. The internal power supply consists of a regulated dual charge pump that provides output voltages of +/-5.5V regardless of the input voltage (Vcc) over the +3.0V to +5.5V range. ] T T1 OUT 2 T T R1 OUT 3 Ch1 5.00V Ch2 5.00V M 2.50µs Ch1 Ch3 5.00V TxOUT Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, an internal 5kΩ pulldown resistor to ground will commit the output of the receiver to a HIGH state. T1 OUT 2 Ch1 5.00V Ch2 5.00V M 5.00µs Ch1 Ch3 5.00V EN Table 2. SP3222E Truth Table Logic for Shutdown and Enable Control T T1 IN 1 SHDN 0V Figure 10. Loopback Test results at 235kbps Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3222E/SP3232E_101_031413 DESCRIPTION In most circumstances, decoupling the power supply can be achieved adequately using a 0.1µF bypass capacitor at C5 (refer to figures 6 and 7). In applications that are sensitive to power-supply noise, decouple Vcc to ground with a capacitor of the same value as charge-pump capacitor C1. Physically connect bypass capcitors as close to the IC as possible. Phase 4 — VDD transfer — The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. The charge pump operates in a discontinuous mode using an internal oscillator. If the output voltages are less than a magnitude of 5.5V, the charge pump is enabled. If the output voltages exceed a magnitude of 5.5V, the charge pump is disabled. This oscillator controls the four phases of the voltage shifting. A description of each phase follows. Since both V+ and V– are separately generated from VCC, in a no–load condition V+ and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design. Phase 1 — VSS charge storage — During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to VCC. Cl+ is then switched to GND and the charge in C1– is transferred to C2–. Since C2+ is connected to VCC, the voltage potential across capacitor C2 is now 2 times VCC. The clock rate for the charge pump typically operates at greater than 250kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating. Phase 2 — VSS transfer — Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor and the positive terminal of C2 to GND. This transfers a negative generated voltage to C3. This generated voltage is regulated to a minimum voltage of -5.5V. Simultaneous with the transfer of the voltage to C3, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND. Phase 3 — VDD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C1 produces –VCC in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C2+ is at VCC, the voltage potential across C2 is 2 times VCC. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 10 SP3222E/SP3232E_101_031413 DESCRIPTION VCC = +5V C4 +5V C1 + + C2 – –5V – + – VDD Storage Capacitor – + VSS Storage Capacitor C3 –5V Figure 11. Charge Pump — Phase 1 VCC = +5V C4 + C1 C2 – + – + – – + VDD Storage Capacitor VSS Storage Capacitor C3 -5.5V Figure 12. Charge Pump — Phase 2 [ T ] +6V a) C2+ T GND 1 GND 2 b) C2-6V T Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V Figure 13. Charge Pump Waveforms VCC = +5V C4 +5V C1 + – C2 –5V + + – – – VDD Storage Capacitor + VSS Storage Capacitor C3 –5V Figure 14. Charge Pump — Phase 3 VCC = +5V +5.5V C1 + – C2 C4 + + – – – + VDD Storage Capacitor VSS Storage Capacitor C3 Figure 15. Charge Pump — Phase 4 Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 11 SP3222E/SP3232E_101_031413 DESCRIPTION ESD Tolerance The SP3222E/SP3232E series incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up. the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC61000-4-2 is shown on Figure 17. There are two methods within IEC61000-4-2, the Air Discharge method and the Contact Discharge method. There are different methods of ESD testing applied: With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. a) MIL-STD-883, Method 3015.7 b) IEC61000-4-2 Air-Discharge c) IEC61000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semi-conductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 16. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the The IEC-61000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC61000-4-2 is that RS RC SW1 DC Power Source SW2 CS Figure 16. ESD Test Circuit for Human Body Model Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 12 Device Under Test SP3222E/SP3232E_101_031413 DESCRIPTION Contact-Discharge Model RS RC RV SW1 SW2 Device Under Test CS DC Power Source R S and RV add up to 330Ω for IEC61000-4-2. Figure 17. ESD Test Circuit for IEC61000-4-2 equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The higher CS value and lower RS value in the IEC61000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. I→ The circuit models in Figures 16 and 17 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. 30A 15A For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5kΩ an 100pF, respectively. For IEC-61000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330Ω an 150pF, respectively. Device PIN TESTED Driver Outputs Receiver Inputs 0A t = 0ns t = 30ns Figure 18. ESD Test Waveform for IEC61000-4-2 Human Body MODEL Air Discharge +15kV +15kV t→ +15kV +15kV IEC61000-4-2 Direct Contact Level +8kV +8kV 4 4 Table 3. Transceiver ESD Tolerance Levels Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 13 SP3222E/SP3232E_101_031413 PACKAGE: 20 PIN SSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 14 SP3222E/SP3232E_101_031413 PACKAGE: 16 PIN SSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 15 SP3222E/SP3232E_101_031413 ▲ ▲ PACKAGE: 16 PIN PDIP e Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 16 SP3222E/SP3232E_101_031413 PACKAGE: 16 PIN WSOIC Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 17 SP3222E/SP3232E_101_031413 PACKAGE: 18 PIN WSOIC Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 18 SP3222E/SP3232E_101_031413 PACKAGE: 16 PIN nSOIC Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 19 SP3222E/SP3232E_101_031413 PACKAGE: 16 PIN TSSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 20 SP3222E/SP3232E_101_031413 PACKAGE: 20 PIN TSSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 21 SP3222E/SP3232E_101_031413 ORDERING INFORMATION Part Number Temp. Range Package SP3222ECA-L 0°C to +70°C 20 Pin SSOP SP3222ECA-L/TR 0°C to +70°C 20 Pin SSOP SP3222ECT-L 0°C to +70°C 18 Pin WSOIC SP3222ECT-L/TR 0°C to +70°C 18 Pin WSOIC SP3222ECY-L 0°C to +70°C 20 Pin TSSOP SP3222ECY-L/TR 0°C to +70°C 20 Pin TSSOP SP3222EEA-L -40°C to +85°C 20 Pin SSOP SP3222EEA-L/TR -40°C to +85°C 20 Pin SSOP SP3222EET-L -40°C to +85°C 18 Pin WSOIC SP3222EET-L/TR -40°C to +85°C 18 Pin WSOIC SP3222EEY-L -40°C to +85°C 20 Pin TSSOP SP3222EEY-L/TR -40°C to +85°C 20 Pin TSSOP Part Number Temp. Range Package SP3232ECA-L 0°C to +70°C 16 Pin SSOP SP3232ECA-L/TR 0°C to +70°C 16 Pin SSOP SP3232ECN-L 0°C to +70°C 16 Pin NSOIC SP3232ECN-L/TR 0°C to +70°C 16 Pin NSOIC SP3232ECP-L 0°C to +70°C 16 Pin PDIP SP3232ECT-L 0°C to +70°C 16 Pin WSOIC SP3232ECT-L/TR 0°C to +70°C 16 Pin WSOIC SP3232ECY-L 0°C to +70°C 16 Pin TSSOP SP3232ECY-L/TR 0°C to +70°C 16 Pin TSSOP SP3232EEA-L -40°C to +85°C 16 Pin SSOP SP3232EEA-L/TR -40°C to +85°C 16 Pin SSOP SP3232EEN-L -40°C to +85°C 16 Pin NSOIC SP3232EEN-L/TR -40°C to +85°C 16 Pin NSOIC SP3232EEP-L -40°C to +85°C 16 Pin PDIP SP3232EET-L -40°C to +85°C 16 Pin WSOIC SP3232EET-L/TR -40°C to +85°C 16 Pin WSOIC SP3232EEY-L -40°C to +85°C 16 Pin TSSOP SP3232EEY-L/TR -40°C to +85°C 16 Pin TSSOP Note: "/TR" is for tape and Reel option. "-L" is for lead free packaging Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 22 SP3222E/SP3232E_101_031413 REVISION HISTORY DATE REVISION DESCRIPTION 08/22/05 -- 12/08/10 1.0.0 Convert to Exar Format and update ordering information. 03/14/13 1.0.1 Correct type error to driver Transition-Region Slew Rate conditions. Legacy Sipex Datasheet Notice EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writting, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Copyright 2013 EXAR Corporation Datasheet March 2013 For technical questions please email Exar's Serial Technical Support group at: [email protected] Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com 23 SP3222E/SP3232E_101_031413