Formosa MS Small Signal Schottky Diode BAS40WS List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-22161X 2008/02/10 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS40WS 200mA Surface Mount Small Signal Schottky Diode -40V Package Outline 0.053(1.35) 0.045(1.15) • Low current rectification and high speed switching. • Extremely small surface mount type. • Up to 100mA current capability. • Low forward voltage drop • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts for green partner, exceeds environmental 0.016(0.40) 0.010(0.25) SOD-323F Features 0.071(1.80) 0.063(1.60) standards of MIL-STD-19500 /228 0.039(1.00) 0.031(0.80) 0.003(0.08) 0.016(0.40) • Suffix "-H" indicates Halogen-free parts, ex. ΒΑS40WS-H. Mechanical data 0.106(2.70) 0.091(2.30) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOD-323F • Terminals : Solder plated, solderable per Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.005 gram Maximum ratings and Electrical Characteristics (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Repetitive peak reverse voltage V RM 40 V Continuous reverse voltage VR 40 V Mean rectifying current IO 200 mA I FSM 600 mA Forward surge current @t < 1.0 s Capacitance between terminals f=1MHz and applied VR =0V 5 pF Power Dissipation PD 350 mW Thermal Resistance Junction to Ambient R θJA 357 I F = 1 mA DC VF 0.38 V I F = 10 mA DC VF 0.50 V I F = 40 mA DC VF Reverse current V R = 10 V DC IR Reverse Recovery Time I F = I R = 10mA to I R = 1.0mA,R L=100 Ω t rr Forward voltage Operating temperature TJ Storage temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 CT T STG Page 2 4 20 -55 -55 Document ID Issued Date Revised Date DS-22161X 2008/02/10 2010/03/10 o C/W 1.0 V 200 nA 5.0 ns +125 o C +125 o C Revision Page. B 7 Rating and characteristic curves (BAS40WS) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date DS-22161X 2008/02/10 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS40WS Pinning information Pin Pin1 Pin2 Simplified outline cathode anode Symbol 2 1 1 2 Marking Type number Marking code BAS40WS 43 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-323F 0.059 (1.50) 0.039 (1.00) 0.051 (1.30) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-22161X 2008/02/10 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS40WS Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-323F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.46 2.95 1.25 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-22161X 2008/02/10 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS40WS Reel packing PACKAGE REEL SIZE SOD-323F 7" COMPONENT SPACING (m/m) REEL (pcs) 4.0 3,000 BOX (pcs) 30,000 INNER BOX (m/m) 183*183*123 REEL DIA, (m/m) 178 CARTON SIZE (m/m) CARTON (pcs) 382*262*387 240,000 APPROX. GROSS WEIGHT (kg) 8.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 6 Document ID Issued Date Revised Date DS-22161X 2008/02/10 2010/03/10 Revision Page. B 7 Formosa MS Small Signal Schottky Diode BAS40WS High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=125 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge Peak forward surge current @ t < 1.0s MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 C , RH=85% for 1000hrs. 11. High Temperature Storage Life at 175 C for 1000 hrs. O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 O O MIL-STD-750D METHOD-1021 O Page 7 MIL-STD-750D METHOD-1031 Document ID Issued Date Revised Date DS-22161X 2008/02/10 2010/03/10 Revision Page. B 7