FUJI FA5613N

FA5612, FA5613
FUJI Power Supply Control IC
Power Factor Correction
FA5612 / FA5613
Application Note
’11-4
Fuji Electric Co.,Ltd.
Electric
Co., Ltd.
.0.08Fuji
AN-049J
Rev.1.0
AN-054E Rev.1.2
Apr.-2011
1
http://www.fujielectric.co.jp/products/semiconductor/
FA5612, FA5613
WARNING
1. This Data Book contains the product specifications, characteristics, data, materials, and structures as of Apr. 2011. The
contents are subject to change without notice for specification changes or other reasons. When using a product listed
in this Data Book, be sure to obtain the latest specifications.
2. All applications described in this Data Book exemplify the use of Fuji’s products for your reference only. No right or
license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned
by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji makes no representation or warranty, whether express or
implied, relating to the infringement or alleged infringement of other’s intellectual property rights which may arise from
the use of the applications described herein.
3. Although Fuji Electric is enhancing product quality and reliability, a small percentage of semiconductor products may
become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take
adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the
products become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction.
4. The products introduced in this Data Book are intended for use in the following electronic and electrical equipment
which has normal reliability requirements.
▪ Computers ·OA equipment ▪ Communications equipment (terminal devices)
▪ Measurement equipment ▪ Machine tools ·Audiovisual equipment ▪ Electrical home appliance
▪ Personal equipment ▪ Industrial robots etc.
5. If you need to use a product in this Data Book for equipment requiring higher reliability than normal, such as for the
equipment listed below, it is imperative to contact Fuji Electric to obtain prior approval. When using these products for
such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning
even if a Fuji’s product incorporated in the equipment becomes faulty.
▪ Transportation equipment (mounted on cars and ships) ▪ Trunk communications equipment
▪ Traffic-signal control equipment ▪ Gas leakage detectors with an auto-shut-off feature
▪ Emergency equipment for responding to disasters and anti-burglary devices ▪ Safety devices
6. Do not use products in this Data Book for the equipment requiring strict reliability such as (without limitation)
▪ Space equipment ▪ Aeronautic equipment ▪ Atomic control equipment
▪ Submarine repeater equipment ▪ Medical equipment
7. Copyright © 1995 by Fuji Electric Co., Ltd. All rights reserved. No part of this Data Book may be reproduced in any
form or by any means without the express permission of Fuji Electric.
8. If you have any question about any portion in this Data Book, ask Fuji Electric or its sales agents before using the
product. Neither Fuji nor its agents shall be liable for any injury caused by any use of the products not in accordance
with instructions set forth herein.
Electric
Co., Ltd.
.0.08Fuji
AN-049J
Rev.1.0
AN-054E Rev.1.2
Apr.-2011
2
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FA5612, FA5613
CONTENTS
1.
Description
....................
4
2.
Features
....................
4
3.
Outline
....................
4
4.
Types of FA5612/13
....................
4
5.
Block diagram
....................
5
6.
Pin assignment
....................
5
7.
Ratings and characteristics
....................
6~10
8.
Characteristics curves
....................
11~13
9.
Outline of circuit operation
....................
14
10.
Description of each circuit block
....................
15~19
11.
Descriptions of use for each pin
....................
20~26
12.
Advice for design
....................
27~29
13.
Example of application circuit
....................
30
Note
▪ The contents are subject to change without notice for specification changes or other reasons.
▪ Parts tolerance and characteristics are not defined in all application described in this Date book.
When design an actual circuit for a product, you must determine parts tolerance and characteristics
for safe and economical operation.
Electric
Co., Ltd.
.0.08Fuji
AN-049J
Rev.1.0
AN-054E Rev.1.2
Apr.-2011
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FA5612, FA5613
1. Description
FA5612/13 is control IC for power factor correction converter. It realizes low power consumption by using high voltage
CMOS process. Thanks to a average current control, a stable operation is obtained, whereby a power factor of 99% or
more is easily available. DC output voltage is controlled under a wide range of load from rated to no load. Further, a
unique switching frequency diffusion function incorporated simplifies the line filter.
2. Features
▪ Unique switching frequency diffusion function incorporated
▪ Selectable switching frequency : Diffuse or Fix (60 kHz, 65 kHz)
▪ High-precision over current protection : 0.5V ± 5%
▪ No audible noise at startup by dynamic OVP circuit
▪ Low current consumption by high voltage CMOS process
Operating : 2mA (typ.)
▪ Enabled to drive power MOSFET directly.
Output peak current, source : 1.5A, sink : 1.5A.
▪ Open/short protection at feedback (FB) pin
▪ Under-voltage lockout
FA5612 : 9.6V ON / 9V OFF FA5613 : 13V ON / 9V OFF
▪ 8-pin package: SOP-8, DIP-8
3. Outline
SOP-8
DIP-8
5
6.5
8
1
4
4.5 Max.
3.4
3.5 Max.
9.4
0.25 ±0.1
2.54
0.5±0.1
0°
~
15
°
7.6
2.54×3=7.62
4. Type of FA5612/13
Type
FA5612N
FA5612P
FA5613N
Startup Threshold
9.6V (typ.)
9.6V (typ.)
13V (typ.)
Package
SOP-8
DIP-8
SOP-8
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AN-049J
Rev.1.0
AN-054E Rev.1.2
Apr.-2011
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FA5612, FA5613
5. Block diagram
6. Pin assignment
FB
1
8
VCC
VCMP
2
7
OUT
VDET
3
6
GND
IS
4
5
ICMP
FA5612N
Pin
No.
Pin
symbol
1
FB
2
VCMP
Voltage Loop Compensation
3
VDET
AC Voltage Input
Input terminal for sinusoidal AC input voltage waveform.
4
IS
Current Sense Input
Input terminal for inductor current signal.
5
ICMP
Current Loop Compensation
Output of current error amplifier.
Phase compensator circuit is connected. *2
6
GND
Ground
Ground
7
OUT
Output
Output for driving a power MOSFET.
8
VCC
Power Supply
Power supply for IC control circuit and output circuit. *1
Function
Description
Inverting input for voltage error amplifier.
Input terminal of converter output voltage.
Output of voltage error amplifier.
Phase compensator circuit is connected. *2
Voltage Feedback Input
*1 connect the capacitor.
*2 connect capacitor and the resistor.
Electric
Co., Ltd.
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AN-049J
Rev.1.0
AN-054E Rev.1.2
Apr.-2011
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FA5612, FA5613
7. Ratings and characteristics
The contents are subject to change without notice. When using a product, be sure to obtain the latest specifications.
Stress exceeding absolute maximum ratings may malfunction or damage the device.
“+” shows sink and “–“ shows source in current prescription.
(1) Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Total power supply and Zener Current (VCC) *1
Supply Voltage (VCC)
Icc > 4.8mA
*1
Icc < 4.8mA
Output voltage (OUT) *4
Output current (OUT) *1
Output peak current (OUT) *2
input voltage (FB , VDET)
Input current (FB , VDET) *3
Input voltage (VCMP)
Input current (VCMP) *3
Input voltage (ICMP)
Input current (ICMP) *3
Input voltage (IS)
Input current (IS) *3
Power dissipation
DIP-8
SOP-8
Operating Junction Temperature
Storage temperature
Icc+Iz
Vcc1
Vcc2
Vout
Iout
Iout_pk
Vfb,Vvdet
Ifb,Ivdet
Vvcmp
Ivcmp
Vvcmp
Iicmp
Vis
Iis
Pd1
Pd2
Tj
Tstg
15
- 0.3 to 28
- 0.3 to Self Limiting
- 0.3 to VCC + 0.3
- 1500 to 1500
Self Limiting
- 0.3 to 5.0
-100 to 100
- 0.3 to 5.0
- 0.5 to 30
- 0.3 to 5.0
- 0.2 to 30
- 5.0 to 1.0
- 300 to 100
800
400
- 30 to +150
- 40 to +150
mA
V
V
V
mA
mA
V
μA
V
mA
V
mA
V
μA
mW
mW
°C
°C
*1 Must not exceed power dissipation.
*2 Period exceeding 1500mA must be 100ns or less.
*3 When the pin current flows continuously for 100ns or more.
*4 The period of 100ns (dead time period) when the voltage of the terminal OUT changes Low⇒High is out of
the question.
Maximum dissipation curve
Package thermal resistor *5
400mW(SOP)
800mW(DIP)
θj-a= 312°C/W, θj-c= 72°C /W (SOP-8)
許容損失 Pd (mW)
Maximum disspation
θj-a= 156°C/W, θj-c= 50°C /W (DIP-8)
-40
25
105
150
Ambience
temperature
周囲温度
Ta(℃) Ta (°C)
*5 JEDEC standard test board
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Co., Ltd.
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AN-049J
Rev.1.0
AN-054E Rev.1.2
Apr.-2011
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FA5612, FA5613
(2) Recommended Operating Conditions
Item
Supply Voltage
VDET pin input voltage
VDET pin peak input voltage
IS pin voltage
IS pin connection noise filter resistance
Ambiance temperature in operation
Symbol
Vcc
Vvdet
Vpvdet
Vis
Risf
Ta
Min.
10
0
0.54
- 1.0
-40
Item
Symbol
Resistance
Accuracy
4.7kΩ
12kΩ
13kΩ
27kΩ
±5%
±2%
±5%
±5%
Frequency setting
resistance *2
Frequency diffusion Rg1
65kHz fixed
Rg2
60kHz fixed
Rg3
Typ.
18
-
Max.
26
2.4
2.4
0.5
100
105
Unit
V
V
V
V
Ω
℃
Temperature
characteristics
200ppm/°C
200ppm/°C
200ppm/°C
200ppm/°C
*2) For connection in Fig.2, Ro range: 0 to 100Ω
VCC
8
Driver
OUT
7
Ro
Rg
6
GND
Fig.1 IS pin-connected filter resistance
Fig.2 Frequency setting resistance
Electric
Co., Ltd.
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AN-049J
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AN-054E Rev.1.2
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FA5612, FA5613
(3) Electrical Characteristics (Unless otherwise specified, Vfb=2.5V, Vvcmp=2.5V, Vvdet=0V, Vis=0V, Vicmp=2.0V,
Vcc=18V, Rg=4.7kΩ, Tj=25°C)
“+” shows sink and “–“ shows source in current prescription.
Voltage amplifier (FB, VCMP pin)
Item
Voltage feedback input threshold
Symbol
Vref
Condition
Ivcmp = 0uA
Min.
2.450
Typ.
2.500
Max.
2.550
Unit
V
Line regulation
Regline
Vfb = Vref, Vcc = 10V to 26V
- 12.5
-
12.5
mV
Temperature stability
Transconductance
VrefdT
Gmv
Ivsrc
Ivsnk
Vvcmph
Vfb = vref, Tj = - 30°C to 150°C
Vfb = Vref ± 0.3V
Source : Vfb = 1.5V
Sink : Vfb = 3.5V
Vfb = 1.5V
Source : Vfb = 1.5V
- 0.5
70
- 70
30
-
90
- 50
50
-
0.5
120
- 30
70
5.5
mV/°C
µmho
µA
µA
V
- 170
- 140
- 110
µA
VCMP output current
VCMP output H voltage
VCMP transient response
output current
VCMP transient response
detection voltage
Iresp
0.902
*Vref
Vresp
0.940
*Vref
0.978
*Vref
V
Current amplifier (ICMP pin)
Item
Transconductance
Output current
ICMP clamp voltage
Symbol
Gmc
Icsrc
Icsnk
Vclamp
Condition
Vis= - 0.2V to - 0.4V, Vvdet *1
Source : Vvdet = 3.5V
Sink : Vis = -2.0V,
Vicmp = 3.0V
Iicmp max = 320μA
Min.
40
- 70
30
Typ.
60
- 50
50
Max.
80
- 30
70
Unit
µmho
µA
µA
2.6
2.7
2.9
V
Condition
Vvdet = 0V,
Vvdet = 2.4V
Vvcmp = 1V, Iicmp = 0μA
Vvdet = 0.3V, 1.3V
Vis = 0.1V to -0.2V
Min.
- 1.5
0.3
Typ.
-0.5
0.5
Max.
0.5
0.70
Condition
Min.
*1 Vvdet is for when Vis = -0.3V, Iicmp = 0µA
Multiplier
Item
VDET input bias current
VCMP threshold voltage
Symbol
Ivdet
Vthvcmp
Output voltage coefficient
K
0
0.7
Unit
μA
V
0.95
-
Oscillator
Item
Symbol
Frequency diffusion
(reference frequency)
Fswref
Vvdet = 0.88V, Vis = - 0.18V,
Vvcmp *1, Iicmp = 0µA,
FswrefdT
Vvdet = 0.88V, Vis = - 0.18V,
Vvcmp *1,
Iicmp = 0µA,Tj=-30°C to 125°C
Fswmax
Frequency
temperature stability
Frequency diffusion
(maximum frequency)
Frequency diffusion,
(minimum frequency)
Fixed frequency 1
Fixed frequency 2
Maximum duty cycle
Typ.
Max.
Unit
54
60
66
kHz
-0.06
-
0.06
kHz/°C
Vvcmp = 0V, Vvdet = 2.4V
64
68
70
kHz
Fswmin
Vvcmp = 0V, Vvdet = 0V
50
52
55
kHz
Fsw1
Fsw2
Vout2 < Vout
Vout1 < Vout < Vout2
Vvdet = 2.4V,
ICMP no connect
54
58.5
60
65
66
71.5
kHz
kHz
91
94
97
%
DMAX
*1 Vvcmp is for when Vvdet = 0.88V, Vis = -0.18V, Iicmp = 0µA
Electric
Co., Ltd.
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AN-049J
Rev.1.0
AN-054E Rev.1.2
Apr.-2011
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FA5612, FA5613
Overvoltage protection comparator (FB pin)
Item
Symbol
Static OVP threshold voltage
Hysteresis
Static OVP temperature stability
Dynamic OVP threshold voltage
⊿OVP
Condition
Vfb = 2.5V to 2.9V,
Vsovp
Vvcmp = 0V, Vvdet = 0V
Vfb = 2.9V to 2.5V,
Vsovphys
Vvcmp = 0V, Vvdet = 0V
Vfb = 2.5V to 2.9V, Vvcmp = 0V
VsovpdT
Vvdet = 0V, Tj= -30°C to 125°C
Vfb = 2.5V to 2.8V,
Vdovp
Vvcmp = 1V, Vvdet = 2V
⊿OVP
Vsovpn -Vdovp
Min.
Typ.
Max.
Unit
1.070*Vref
1.090*Vref
1.105*Vref
V
0.005*Vref
0.020*Vref
0.040*Vref
V
-0.0001*Vref -
0.0001*Vref
V/°C
1.025*Vref
1.050*Vref
1.075*Vref
V
50
95
140
mV
FB short detection comparator (FB pin)
Item
Input threshold voltage
Symbol
Vthfb
Pull-down resistance
Rfb
Condition
Vfb = 0V to 1V,
Vvcmp = 0V
Vfb = 2.5V
Min.
Typ.
Max.
Unit
0.1
0.3
0.5
V
2.0
2.5
3.0
MΩ
Overcurrent detection comparator (IS pin)
Item
Symbol
Condition
Min.
Typ.
Max.
Unit
IS offset voltage
IS pin voltage
Visof
Vis_054
Vvdet = -0.25V, Vvcmp = 0.6V
Vvdet = 0.54V, Vvcmp = 5.0V
Vvdet max = 1.2V,
Vvdet min = 0V, Fvdet = 50kHz,
Dvdet=50%
Vvdet max = 1.8V,
Vvdet min = 0V, Fvdet = 50kHz,
Dvdet=50%
Vvdet max = 1.2V,
Vvdet min = 0V, Fvdet = 50kHz
Dvdet=50%,Vis = -0.4V to -0.6V
Tj=-30°C to 125°C
Vvdet max = 1.2V, to 1.8V
Vvdet min = 0V, Fvdet = 50kHz
Dvdet=50%,Vis= -Vocpl + 0.05V
Vvdet max = 1.8V to 1.0V,
Vvdet min = 0V, Fvdet = 50kHz
Dvdet=50%,Vis= -Vocpl + 0.05V
Vvdet max = 1.8V
Vvdet min = 0V, Fvdet = 50kHz
Dvdet=50%,Vis= -Vocpl + 0.05V
Vis= -0.6V
Vis = Vocpl + 30mV to-1.0V
Pulse signal
Vvcmp = 0V, Vis = 0V
0
- 0.43
30
- 0.38
60
- 0.33
mV
V
- 0.525
- 0.50
- 0.475
V
- 0.432
- 0.40
- 0.368
V
- 0.1
-
0.1
mV/°C
1.54
1.60
1.66
V
1.30
1.35
1.40
V
0.25
0.30
0.35
V
300
450
600
ns
200
350
500
ns
Vocpl
IS threshold voltage
Vocph
IS threshold voltage
temperature characteristics
VocpldT
Vvdeth
VDET threshold voltage
Vvdetl
IS threshold change voltage
Vvdets
Blanking time *1
Tblk
Delay time
Tdly
Input bias current
Iis
- 170
- 120
- 70
μA
*1 Includes delay time
Output (OUT pin)
Item
Symbol
Output voltage (L)
Voutl
Output voltage (H)
Vouth
Output rise time
Output fall time
Tr
Tf
Condition
Vfb = 0V, Vvcmp = 0.3V,
Vicmp = 3V to 2V,
Sink : Iout = 100mA
Vvcmp = 0.3V,
Vicmp = 3V to 2V,
Source : Iout = - 100mA
CL = 1nF
CL= 1nF
Min.
Typ.
Max.
Unit
-
0.5
1.0
V
15.5
16.5
-
V
-
50
50
-
ns
ns
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AN-049J
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FA5612, FA5613
Frequency setting (OUT pin)
Item
Detection current
OUT threshold voltage
Frequency setting time *1
Detection time *2
Symbol
Istate
Vout1
Vout2
Tset
Tdet
Condition
Tj=-30°C to 125°C
Tj=-30°C to 125°C
Tj=-30°C to 125°C
Vvcmp = 0V, Vicmp = 0V
Vfb = 2V
Vvcmp = 0V, Vicmp = 0V
VFfb= 2V
Min.
34
260
700
Typ.
40
310
760
Max.
46
390
830
Unit
μA
mV
mV
4.1
5.9
7.7
ms
420
530
640
μs
*1: Time elapsing until detection current is outputted from OUT pin after removal of UVLO
*2: Period during which detection current is outputted from OUT pin
Low voltage protection (VCC pin)
Item
Symbol
ON threshold voltage
Vccon
OFF threshold voltage
Vccoff
Hysteresis
Vcchys
Condition
FA5612: Vcc= 8V to 11V
FA5613: Vcc= 11V to 15V
Vcc= 11V to 7V
FA5612
FA5613
Min.
8.6
11.5
8.0
0.4
3.5
Typ.
9.6
13
9.0
0.6
4.0
Max.
10.6
14.5
10.0
0.8
4.5
Unit
V
V
V
V
V
Condition
Vcc = 8V, Vvcmp = 0V
Vicmp =0V
OUT pin no load
OUT pin no load
Vvcmp=0V
Vcc = 18V, Vfb = 0V
Vvcmp=0V, Vicmp =0V
Min.
Typ.
Max.
Unit
70
90
110
µA
-
2.0
4.0
mA
-
1.8
3.8
mA
80
110
180
µA
All devices (VCC pin)
Item
Symbol
Start-up current
Istart
Operating current
Icc
OFF time current
Iccoff
Standby current
Istb
Electric
Co., Ltd.
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AN-049J
Rev.1.0
AN-054E Rev.1.2
Apr.-2011
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FA5612, FA5613
8. Characteristics curves
(Unless otherwise specified, Vfb = 2.5V, Vvcmp = 2.5V, Vvdet = 0V, Vis = 0V, Vicmp = 2.0V, Vcc = 18V, Rg = 4.7kΩ, Tj = 25°C)
Voltage error amplifier: Input threshold (Vref)
vs. Junction temperature (Tj)
2.55
2.55
2.53
2.53
2.51
2.51
Vref [V]
Vref [V]
Voltage error amplifier: Input threshold (Vref)
vs. Supply voltage (Vcc)
2.49
2.49
2.47
2.47
2.45
2.45
10
15
20
25
-50
30
0
50
Fswref,Fswmax,Fswmin [kHz]
Fswref,Fswmax,Fswmin [kHz]
75
70
Fswmax
66
62
Fswref
58
54
Fswmin
50
70
Fswmax
65
60
Fswref
55
Fswmin
50
45
10
15
20
25
30
-50
0
50
Vcc [V]
100
150
Tj [°C]
Oscillator: Fixed frequency 1,2 (Fswr1, Fsw2)
vs. Junction temperature (Tj)
Oscillator: Fixed frequency 1,2 (Fswr1, Fsw2)
vs. Supply voltage (Vcc)
75
70
70
66
Fsw2(65kHz)
62
Fsw1(60kHz)
58
Fsw1,Fsw2 [kHz]
Fsw1,Fsw2 [kHz]
150
Oscillator: Reference, maximum, minimum frequency
(Fswref, Fswmax, Fswmin) vs. Junction temperature (Tj)
Oscillator: Reference, maximum, minimum frequency )
(Fswref, Fswmax, Fswmin) vs. Supply voltage (Vcc)
54
Fsw2(65kHz)
65
60
Fsw1(60kHz)
55
50
50
45
10
15
20
25
30
-50
0
50
Vcc [V]
100
150
Tj [°C]
Oscillator: Maximum duty cycle (Dmax)
vs. Junction temperature (Tj)
Overcurrent detection: IS threshold voltage (Vocpl, Vovph)
vs. Junction temperature (Tj)
98.0
-0.37
97.0
-0.39
96.0
-0.41
Vocpl,Vocph [V]
Dmax [%]
100
Tj [°C]
Vcc [V]
95.0
94.0
93.0
92.0
91.0
Vocph
-0.43
-0.45
-0.47
Vocpl
-0.49
-0.51
90.0
-0.53
-50
0
50
100
150
-50
Tj [°C]
0
50
100
150
Tj [°C]
Electric
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AN-049J
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FA5612, FA5613
Current error amplifier: Output current (Ivcmp)
vs. FB pin voltage (Vfb)
60
40
40
20
20
Ivcmp [uA]
Iicmp [uA]
Current error amplifier: Output current (Iicmp)
vs. IS pin voltage (Vis)
60
0
-20
0
-20
-40
-40
-60
-0.6
-60
-0.5
-0.4
-0.3
-0.2
-0.1
1.0
0
1.5
2.0
4.0
1.095
Vdovp / Vref, Vsovp / Vref
0
Vvcmp=0.6V
-100
Vis [V]
3.5
1.105
100
Vvcmp=2.0V
-200
Vvcmp=1.5V
-300
Vvcmp=1.0V
-400
Vvcmp=3.0V
-500
0.5
1.0
1.5
2.0
2.5
Vsovp
1.085
1.075
1.065
1.055
1.045
Vdovp
1.035
1.025
3.0
-50
0
Vvdet [V]
50
100
150
Tj [°C]
OUT pin: Output voltage(H) (Vouth) vs. Supply voltage (Vcc)
Vcc - Vouth
OUT pin: Output voltage(L) (Voutl)
vs. Supply voltage (Vcc)
0.8
2
0.7
1.8
1.6
Vcc - Vouth [V]
0.6
Voutl [V]
3.0
Overvoltage comparator: Dynamic/static OVP
(Vdovp/Vref, Vsovp/Vref) vs. Junction temperature (Tj)
Multiplier: IS pin voltage (Vis)
vs. VDET pin voltage (Vvdet)
-600
0.0
2.5
Vfb [V]
Vis [V]
0.5
0.4
0.3
0.2
1.4
1.2
1
0.8
0.6
0.4
0.2
0.1
0
0
10
15
20
25
10
30
15
20
25
30
Vcc [V]
Vcc [V]
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FA5612, FA5613
FA5612
Current consumption: Operating current (Icc)
vs. Supply voltage (Vcc)
Under voltage lockout: VCC threshold voltage (Vccon, Vccoff)
vs. Junction temperature (Tj)
FA5612
4.0
3.5
Vccon, Vccoff [V]
Icc [mA]
3.0
2.5
2.0
1.5
1.0
10.5
10.3
10.1
9.9
9.7
9.5
9.3
9.1
Vccon
8.9
8.7
8.5
0.5
0.0
0
5
10
15
20
25
30
Vccoff
-50
0
Vcc [V]
Current consumption: Operating current (Icc)
vs. Supply voltage (Vcc)
FA5613
4.0
100
150
Under voltage lockout: VCC threshold voltage (Vccon, Vccoff)
vs. Junction temperature (Tj)
14.5
3.5
FA5613
13.5
Vccon, Vccoff [V]
3.0
Icc [mA]
50
Tj [°C]
2.5
2.0
1.5
1.0
12.5
Vccon
11.5
10.5
Vccoff
9.5
0.5
0.0
8.5
0
5
10
15
20
25
30
-50
0
Vcc [V]
50
100
150
Tj [°C]
Current consumption: Operating current (Icc)
vs. Junction temperature (Tj)
4.0
3.5
Icc [mA]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
0
50
100
150
Tj [°C]
Overvoltage
comparator ⊿OVP ⊿OVP
過電圧コンパレータ
vs. Junction
temperature (Tj)
vs. ジャンクション温度(Tj)
電圧誤差増幅
過渡応答検出電圧(Vresp)
Current error amplifier.
Output current (Iicmp)
vs. Junction
temperature (Tj)
vs. ジャンクション温度(Tj)
140
130
⊿OVP [mV]
Vresp [V/V]
0.970
0.965
0.960
0.955
0.950
0.945
0.940
120
110
100
0.935
0.930
0.925
90
80
70
60
50
-50
0
50
100
150
-50
Tj [℃]
0
50
100
150
Tj [ ℃]
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FA5612, FA5613
9. Outline of circuit operation
FA5612/FA5613 are controllers for power factor correction converter using
boost topology. These IC are designed for the CCM mode operation with the
average current control.
The operations, (1) Switching and (2) Power factor collection, are explained
as below with the simplified circuit diagram shown in Fig.1.
(1) Switching operation
Fig. 2 outlines the waveform of each part of switching operation at a steady
state. The operation is as follows.
I. Set signal of switching frequency outputted from the oscillator sets RS. F/F,
whereby OUT pin voltage goes high, thus turning on Q1. ... (t1)
II. Q1 turned on raises the current of L1. The current of L1 is converted by
Rs connected on GND side into a voltage and is inputted to IS pin (VIS). VIS
is compared by current amplifier (CUR. AMP) with reference voltage that is
obtained via arithmetic output by multiplier (MUL) from input voltage
monitoring VDET and VCMP that is obtained by feedback from output and
error amplification.
Current amplifier output (ICMP) is compared by PWM comparator (PWM.
COMP) with slope waveform outputted from oscillator and, as soon as it
attains the reference value, reset signal enters RS. F/F, thereby turning off
Q1. ... (t2)
III. Q1 turned off inverts the voltage of L1. While a current is being fed to the
output via D1, the current of L1 reduces. Set signal outputted from internal
oscillator transfers the circuit to the next switching cycle. ... (t1)
Fig.1 Block diagram of operating circuit
(2) Power factor correcting operation
The voltage at VCMP pin that constitutes output of error amplifier
(ERR.AMP) is almost DC voltage at a steady state, because of connected
phase compensation capacitance. This voltage is inputted to multiplier.
Another input to multiplier is a waveform obtained by rectifying AC input
voltage. A multiplier multiplies these two of input and outputs a sinusoidal
wave proportional to AC input voltage.
This outputted sinusoidal voltage waveform is applied as a reference
inductor current to current amplifier (CUR.AMP).
Therefore, the inductor current's mean value forms a sinusoidal waveform.
The current of inductor L1 is deprived of switching ripples by C1 and is
turned into a average current. Thus, the current from AC input voltage
becomes practically sinusoidal, thus improving the power factor.
L1
AC
Fig.2 Waveforms of switching operation (outline)
D1
I
C1
Q1
t
Rs
t
V
4
V
3
(正弦波)
Sinusoidal
t
ICMP
5
IL Detector
C1 removes ripples caused
CUR.AMP
t
VDET
V
IS
MUL
by switching from current
ERR.AMP
1
V
(正弦波)
Sinusoidal
2
FB
t
VCMP
V
(ほぼDC)
Almost
DC
t
Fig.4 Power factor corrected waveform
Fig.3 Aspects of waveforms at different parts
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FA5612, FA5613
10. Description of each circuit block
OUT
(1) Frequency setting circuit
Driver
Ro
7
The switching frequency is selectable out of 3 modes by resistance Rg connected
between OUT and GND pins.
▪ Mode 1: Frequency diffusion 50 kHz to 70 kHz
▪ Mode 2: Fixed frequency 1 65 kHz
▪ Mode 3: Fixed frequency 2 60 kHz
Istate
UVLO_L
State
Set
Rg
END信号:
END
signal:
各 ブロック始動開始
Each
block starts up
OSC
The status setting is completed after FB short detection or UVLO are canceled. The
switching operation will start after this completion. Therefore, the mode will not
change while operating.
Fig.5 Frequency setting circuit
VCC
Vccon
As an example, the operation of frequency setting which is in case of a cancellation
of UVLO is shown in Fig. 6.
IC starts to operate after Vcc exceeds Vccon. Then after 5.9ms, the OUT pin
outputs current Istate (40mA (typ.)) during 530us.
The current generates a voltage at OUT pin because external resistors (Ro and Rg)
are connected to OUT pin.
The frequency setting is done with based on this OUT pin voltage.
The internal circuits start switching operation after frequency setting.
Internal
power
内部電源
supply
Istate
END
END信号
signal
0.5V
Likewise, in case of cancellation of FB short detection, 5.9ms after the cancellation,
a current is outputted from OUT pin for 530us, and then switching starts.
VCMP
Istate*(Ro+Rg)
OUT
0V
OUT pin has in its inside reference voltages of 2 levels, or Vout1 (310mV (typ.)) and
Vout2 (760mV (typ.)) To select a frequency, a reference voltage is compared with
OUT pin voltage while current Istate is flowing. The relationship is as follows.
時間
time
Tset
Tdet
5.9ms
530us
Fig.6 Frequency setting sequence
OUT pin voltage
Mode
Frequency
OUT pin < Vout1
Mode1
Frequency diffusion
Vout1 < OUT pin < Vout2
Mode2
Fixed frequency 65kHz
Vout2 < OUT pin
Mode3
Fixed frequency 60kHz
(2) Oscillator
Oscillator outputs two signals. One is a set signal to flip-flop for setting the OUT pin to Vcc level. Another is a sawtooth signal for PWM
comparison.
The oscillation frequency is set by frequency setting circuit to either the frequency diffusion mode or 2 kinds of the fixed frequency mode.
(2-1) Frequency diffusion
When the frequency diffusion mode is selected, the frequency changes
between 50 and 70 kHz according to the input/output status of PFC power
supply. The optimized frequency diffusion based on input/output status
realizes a low noise operation with a wide operation range.
OSC block determines the frequency based on VDET pin input voltage and
multiplier block output voltage. When the phase angle is range of 0° to 30°
or 150° to 180° approximately, the frequency rises in proportion to VDET pin
voltage. When it is range of 30° to 150° approximately, the frequency is
reversely proportional to the multiplier output. (Fig.8)
When the multiplier output is high like when PFC output current is large, the
frequency drop is bigger. And it is small in case of reverse situation.
VDET
3
CUR.AMP.
VCMP
2
Multiplier
IL
Detector
OSC
PWM Comp.
signal
F.F. Set
Set信号
Fig.7 Block diagram for oscillator area
The approximate frequency (Fsw_b) is given by an equation below when the phase angle is range of 30° to 150°.
Fsw_b = 75 – 71.4 × (IS pin voltage) [kHz]
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(2-2) Maximum and minimum frequencies in frequency diffusion mode
As stated above, the switching frequency in the frequency diffusion mode
depends on VDET pin or multiplier output voltage within maximum and
minimum frequencies determined. However, maximum or minimum
frequency may never appear under some conditions while 1/2 of AC cycle.
Region
subject
乗算器出力により
to変化する領域
multiplier output
Fsw
70kHz
VDET電圧により
Region subject
変化する領域
to VDET voltage
(3) Error amplifier
The error amplifier is a circuit for controlling PFC output to a certain level.
This IC adopts a transconductance amplifier.
The non-inverting input terminal for the error amplifier is connected to the
internal reference voltage of 2.5 V (typ.) The inverting input terminal (FB)
receives the output voltage, usually resistively divided, from power factor
correction converter. For FB open detecting function, this terminal is
connected to a pull-down resistor of 2.5MΩ inside the IC. Error amplifier
output (VCMP) is connected to multiplier (MUL) to control the inductor
current.
Output voltage Vout of power factor correction converter usually contains a
lot of ripples of double the AC line frequency (50 or 60 Hz). When ripples
corresponding to double the AC frequency appear excessively on the error
amplifier output, power factor correction converter will not operate stably. So,
a capacitor and resistor network is connected between pin 2 (VCMP) which
is output of the error amplifier and GND for phase compensation.
Increasing the capacitance in the phase compensation network improves
the power factor, but the transient responsivity becomes slow.
The error amplifier in FA5612/13 has a function of improving the transient
responsivity.
When the load has suddenly become so heavy, the FB pin voltage drops
much. If lowered FB pin voltage is below transient response detection
voltage (Vresp), the transient response correction circuit increases output
current of error amplifier up to the transient response output current (Iresp).
Thus, the VCMP pin voltage rises quickly to increase the output current and
suppress the output voltage drop.
50kHz
30°
60°
90°
120° 150° 180°
位相角
Phase
angle
Fig.8 Oscillation frequency vs. phase angle
R3
C4
C5
Vout
2
VCMP
VREF(2.5V)
R1
FB
MUL
1
R2
C3
2.5M
Ω
ERRAMP
Open/Short Comp
SP
Vthfb(0.3V)
Dynamic OVP
O.V.P
Static OVP
Fig.9 Error amplifier and overvoltage
(4) Overvoltage protection circuit (OVP)
This is a circuit for limiting the voltage when the output voltage of power
factor correction converter has exceeded the setting.
When converter is started up or when the load has suddenly changed, the
converter output voltage may rise beyond the setting. In such a case, OVP
circuit prevents an over voltage and protects the converter.
FA5612/13 has a dynamic OVP function and a static OVP function. The
dynamic OVP function restricts the multiplier gain depending on rising of FB
pin voltage while FB pin voltage exceeds 2.5 V. The static OVP function
makes OUT pulses stop while FB pin voltage exceeds 1.09 time of the
reference voltage.
In normal operation, the FB pin voltage is 2.5 V that is almost the same as
the reference voltage of error amplifier.
When the FB pin voltage exceeds 2.5 V by startup or a sudden change of
load, the dynamic OVP function reduces output current by lowering the
multiplier gain. Then, if the FB pin voltage still rises and exceeds the
reference voltage of a static OVP function, FA5612/13 stops the output
pulses.
OUT pulses stopped by the overvoltage protection are resumed as soon as
the output voltage lowers back to 1.07 times the reference voltage.
protection circuit
Vo
7 OUT
SP
Output stop
出力停止
0.3V
Detect
検出
R1
Open
オープン
FB
1
R2
2.5MΩ
ショート
Short
VFB=0V
Fig.10 FB open/short detector
(5) FB short/open detector
On the circuit of Fig. 10, if the FB pin voltage is zero because of R2 short or R1 open, the error amplifier can not control the constant voltage.
Therefore, the output voltage rises abnormally. In such a case, the overvoltage protection circuit could not operate because the output voltage
detection is faulty.
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To avoid such inconvenience, the IC has FB short detector.
The circuit consists of reference voltage of 0.3 V (typ.) and comparator
(SP).
When the FB pin input voltage has dropped below 0.3 V because of R2
short or R1 open, the output of comparator (SP) is inverted to stop the IC
output.
The PFC converter outputs a voltage corresponding to the input voltage
even before startup because of the boost topology. That is why, this
function never operate as long as the converter is normal.
In case of an open failure of the FB pin FA5612/13 stops the output pulse
by this function because a pull-down resistor of 2.5 MΩ inside the IC is
connected to the FB pin.
If the FB pin voltage has dropped to almost zero, the IC output will stop.
When the FB pin voltage returns normal then, OUT pulses will reappear.
Sinusoidal
Sinusoidal
Almost DC
(6) Multiplier
Multiplier is the circuit for controlling the input current as the sinusoidal
wave forms the same as input voltage.
An input is connected to VDET pin and is inputted the dividing voltage
after being rectified from AC input voltage. The other input is connected to
error amplifier output (VCMP). Normally, the error amplifier output is
almost DC, and multiplier outputs a sinusoidal waveform voltage whose
amplitude changes according to the error amplifier output voltage. The
multiplier output constitutes a reference for current comparator to control
the input current to a sinusoidal waveform (Fig. 11).
Fig.11 Multiplier
It usually makes MUL pin peal voltage set to 0.65 to 2.4 V in the all AC
input range.
The voltage obtained by rectifying the AC input voltage contains many
noises attributable to switching by Q1. To eliminate the influence by the
noise, filtering capacitance C6 is provided usually.
(7) Current detector
IL. Detector inverts and amplifies a voltage obtained by voltage-current
conversion via current detecting resistance Rs of the inductor current.
Current amplifier (CUR. AMP) is error amplifier that composes a current
loop to make the input current follow a sinusoidal waveform.
Current amplifier receives IL. Detector output and multiplier (MUL) output,
subjects them to comparison and error amplification, and outputs the
result to PMW comparator (PWM. COMP).
Current amplifier is a transconductance amplifier the same as error
amplifier. Capacitance and resistance connected between output
terminal (ICMP) and GND for phase compensation eliminate switching
ripples of the input current.
The current detector output is clamped to Vclamp: 2.7 V by clamp circuit
that constitutes an upper limit of voltage.
Fig.12 Current detector and overcurrent
(8) Overcurrent protection circuit (OCP)
protection circuit
OCP circuit is the circuit to detect the inductor current, and is to stop the
output pulse to protect MOSFET when detected current exceeds certain
intensity.
A detected voltage by sense resistor Rs connected to GND is inputted to the IS pin, is converted by the IL_Detector which is an inverting
amplifier, and is compared by overcurrent detection comparator. When IS pin voltage lowers below a threshold value (OCP level), overcurrent
protection circuit outputs a signal of an overcurrent status.
The signal of overcurrent status resets a flip-flop for the OUT pulse, and then turns MOSFET off.
When IS voltage gets near a threshold value, overcurrent protection circuit lowers the gain of multiplier (MUL) to suppress the input current,
thereby suppressing the audible noise of inductor attributable to an overcurrent.
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OCP level is changed depending on the peak voltage of VDET pin by VIN_Detector as follows.
While period A, OCP level is set to Vocph (-0.4 V) because VDET pin voltage exceeds threshold voltage Vvdeth (1.6 V). OCP level is changed
only when VDET pin voltage is below Vvdets (0.3V). At this time, the inductor current is low enough, and therefore will not abruptly change.
Further, if the load current is very low such VDET will not be below 0.3 V, the OCP level will not change over regardless of VDET.
During period B, VDET will never go below threshold voltage Vvdetl: 1.35 V. Therefore, OCP level will not change either.
Some time in period C, VDET will be below threshold voltage Vvdetl: 1.35 V, whereby OCP level is set to Vocpl (-0.5 V). The same as period A,
OCP level is changed only when VDET pin voltage is below Vvdets (0.3 V).
VDET terminal voltage
Period A
Period B
Period C
OCP level
Fig.13 Overcurrent protection (OCP) level and VDET voltage
(9) Undervoltage lockout circuit (UVLO)
FA5612/13 has the UVLO circuit to avoid unexpected operation when the source voltage has dropped.
The IC starts operation when the source voltage rising from zero has reached 9.6 V (typ.) for FA5612, or 13 V (typ.) for FA5613.
After startup, each of ICs stops operating when the source voltage has dropped to 9 V (typ.)
While the IC stops a switching operation by UVLO circuit, the IC keeps OUT pin voltage low and further reduces IC consumption current
to below 100 μA.
(10) Output circuit
The output circuit consists of a push-pull circuit, directly drives MOSFET.
Its maximum peak current is 1.5 A for sink, and 1.5 A for source.
(11) Zero current correction circuit
Unless multiplier output or current error amplifier input has offset voltage, the input current to converter will be almost zero when PFC converter
has completely no load.
However, if the offset voltage viewed from IS pin is negative, the input current corresponding to offset voltage might flow to converter even
when no load or light load. In such a case, the output voltage of power factor correction converter will rise abnormally because the input current
will be excessive.
Offset voltage in the IS pin (Visof) is 0 mV. However, the offset voltage of the IS pin against sense resistor voltage may be negative because a
voltage will be generated by an external filter resistance connected to the IS pin. Therefore, FA5612/13 has this correction circuit to avoid rising
the output voltage when light load with such case.
Usual output voltage from error amplifier is 0.5 V or higher. When its output voltage has dropped below 0.5 V, zero current correction circuit
operates.
Error amplifier output voltage drops below 0.5 V when an input current flows under no or light load on account of offset in multiplier output or
current error amplifier input. Then, zero current correction circuit corrects the offset voltage of multiplier output. This function prevents the output
voltage of power factor correction converter from rising excessively, so that the output voltage is kept at a constant level.
The correction amount varies in a linear function of the output of current error amplifier, thereby ensuring a stable run.
Fig. 14 shows effects of zero current correction circuit.
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Consumption diagram of operations when IS pin offset is negative
Input current
Without
zero current correction circuit
軽負荷時補正回路なし
With
zero current correction circuit
軽負荷時補正回路あり
AC 交流入力電流
input current
AC 交流入力電流
input current
定格負荷
Rated load
No
load
無負荷
定格負荷
Rated load
Effect by light load
軽負荷時補正回路
による効果
correction circuit
オフセットに相当する電流
Current corresponding to offset
No load
無負荷
0
時間
Time
交流入力電圧の1/2周期
1/2 cycle of AC input voltage
0
交流入力電圧の1/2周期
1/2 cycle of AC input voltage
時間
Time
Without zero current correction circuit
軽負荷時補正回路なし
出力電圧
Vo
of power
factor correction
Output voltage Vo
力率改善コンバータ
Output voltage
軽負荷時補正回路あり
With light load correction circuit
0
力率改善コンバータ
出力電力 Po
Output power Po
of power factor correction
Fig.14 Effects of zero current correction circuit
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FA5612, FA5613
11. Description of use for each pin
(1) Terminal No.1 (FB pin)
Functions
(i) Inputs feedback signal of output voltage setting
(ii) Detects FB pin open/short
(iii) Detects output overvoltage state
Applications
(i) Feedback signal input
▪ Wiring
Connect the node of dividing resistance for output voltage setting
▪ Operation
The PFC output voltage is controlled so that the FB pin voltage will correspond
to the internal reference voltage (2.5 V).
For FB pin open circuit, FB pin is connected with pull-down resistance in IC
inside. Therefore, take its resistance into account when choosing the resistance
of R1 and R2 to set the output voltage (Vout).
Vout  (R2  Rfb) /(R2  Rfb)  VREF  R1  VREF
where:
VREF: Reference voltage = 2.5 V (typ.)
Rfb: FB pin pull-down resistance = 2.5 MΩ (typ.)
To avoid an erratic operation by noises, connect capacitance C3 of 100 to 3300
pF between FB pin and GND.
(ii) FB pin open/short detection
▪ Wiring
Same as feedback signal input in (i)
▪ Operation
When, on account of FB pin open circuit or short circuit of R2 in resistive divider,
the FB input voltage has dropped below 0.3 V, the output of comparator (SP) is
inverted, thereby stopping the IC output.
(iii) Output overvoltage detection
▪ Wiring
Same as feedback signal input in (i)
▪ Operation
In normal operation, FB pin voltage is almost the same as reference voltage of
error amplifier (2.5 V). Like when the output voltage has risen for some reason, if
the FB pin voltage reaches comparator reference voltage (1.09*VREF),
comparator (OVP) output is inverted to stop OUT pulses. As soon as output
voltage returns to a normal level, OUT pulses are recovered.
Vout
VREF(2.5V)
R1
FB
VCMP
1
R2
C3
ERRAMP
Rfb
Open/Short Comp
SP
Vthfb(0.3V)
O.V.P
Dynamic OVP
Static OVP
Fig.15 FB pin circuit
(2) Terminal No.2 (VCMP pin)
Function
(i) Phase compensation of output of incorporated voltage error amplifier
(ERRAMP)
Application
(i) Phase compensation of incorporated ERRAMP output
▪ Wiring
Connect R and C between COMP and GND as shown in Fig. 16
▪ Operation
COMP pin avoids an appearance of the double frequency ripple of the AC line
on the FB pin voltage with connecting R and C.
Reference:
Example of applied circuit: C4 = 0.47 uF
C5 = 2.2 uF
R3 = 10 kΩ
The above is an example. Determine them upon sufficiently verifying your
instrument.
VCMP
2
ERRAMP
MUL
R3
C4
C5
Fig.16 VCMP pin circuit
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Besides, Soft start function is realized by slowing a voltage rise of COMP pin
with adjustment of capacitance connected between COMP and GND.
When starting, VCMP voltage rises and a switching operation starts at 0.5 V.
At this time, MOSFET ON width increases gradually in proportion to the COMP
voltage rise. The soft start time is adjustable with adjustment with changing
capacitors C4 and C5.
Increasing C4, C5 capacitance → prolongs soft start time
Decreasing C4, C5 capacitance → shortens soft start time
C1
R6
VDET
3
R7
C6
(3) Terminal No.3 (VDET pin)
Function
(i) Input voltage detection (multiplier input)
Application
(i) Input voltage setting for VDET pin
Multiplier generates current reference signal. Its VDET pin (pin 3) receives
sinusoidal full-waveform rectified waveforms. Considering the dynamic range of
multiplier operation, VDET pin peak value would be used within 0.65 to 2.4 V.
Therefore, set R6 and R7 in Fig. 17 so that the peak voltage of sinusoidal
waveforms at VDET pin will be between 0.65 and 2.4 V with the entire range of
AC input voltage.
Recommended dividing ratio: R6:R7 = 160:1
Fig.17 VDET terminal circuit
D1
L1
C1
Q1
C2
Rs
Caution:
Because multiplier has dispersions of characteristics, even if VDET pin voltage
is 2.4 V or lower, multiplier might be saturated and the input peak current would
slightly be truncated like trapezoidal waves.
R4
C6
IS
(4) Terminal No.4 (IS pin)
Functions
(i) Inductor current detection
(ii) Turn off OUT output upon detecting an overcurrent
Applications
(i) Via IS pin, inductor current signal is applied to current error amplifier
(CUR_AMP) that constitutes a current loop for making the input current follow
sinusoidal waveforms. CUR_AMP that is connected with multiplier output
receives current reference signal. IS pin is current input terminal, and receives a
potential of 0 to -0.4 V with respect to GND level.
(ii) When IS pin voltage is lower than IS threshold voltage, comparator output
signal is inverted to turn off OUT output.
▪ Supplement
When MOSFET turns on, MOSFET gate drive current and surge current are
generated by discharge of stray capacitance, and then those currents flow to
current detecting resistance Rs. An excessively large surge current may cause
an erratic operation to disturb the input current waveform. Depending on the
surge current intensity, timing, etc., pulse shoots may mix with turn-on parts of
IC's OUT pulses. So, RC filter shown in Fig. 18 is connected in generally.
Since the level is determined by resistive division as shown in Fig. 18, 100 Ω or
lower is recommended for input resistance R4.
Rated voltage at IS pin for input of inductor current signal is -5 V.
In case of a general boost circuit, a rush current flows for charging the output
smoothing capacitance C2 the instant an AC input voltage has been connected.
This current may be considerably greater than at a steady operation.
As a result, IS pin may receive a voltage that is far higher than usual. Even if
such AC voltage is connected, IS pin must not be exposed to a potential higher
than -5 V that is an absolute maximum rated voltage.
There may be the case that a voltage higher than the rated is applied to IS pin.
In such case, it needs to use a preventive circuit for suppression of a rush
current or to add the Zener diode to IS pin as shown in Fig. 19.
4
12kΩ
IL
Detector
28kΩ
5V
Fig.18 IS pin circuit
D1
L1
C2
Q1
Rs
7
R4
GND
ZD
FA5610
C6
4
IS
Fig.19 IS pin circuit (2)
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Caution:
Maximum power design
It needs a notice about a setting of the sense resistance to output maximum power at whole input condition because a power limitation
may occur by IC functions.
Fig. 20 shows a block diagram concerning the input current control.
The VDET voltage is relatively high at high RMS input voltage, and the input current is limited by OCP function shown in the path B of Fig.
20 in such case. (Reference figure is shown in Fig. 21.)
The VDET voltage is relatively low at the low RMS input voltage, and the maximum output voltage of multiplier is low too. So, the input
current is limited by the multiplier shown in the path A of Fig. 20 in such case. (Reference figure is shown in Fig. 22.)
This means that the maximum inductor current is limited by an above function unless the reasonable sense resistance is chosen.
Therefore, it needs to choose the sense resistor Rs which satisfies each condition shown in the next page.
M _OUT = K × A × B
VDET
A
VCM P
B
CUR. AMP
M_OUT
Multiplier
ICMPcurrent
電流
ICMP
ICMP
A
5V
PWM COMP
28kΩ
IL_DET
IL
Detector
Gate
Driver
OSC
12kΩ
OUT
B
O.C.P
インダクタ最大電流
Maximum
inductor current
Maximum
inductor current
インダクタ最大電流
Fig.20 Current control area block diagram
Fig.20 Current control area block diagram
IS
OCP
Limited
by multiplier
OCPに達する前に
before
reaching OCP
乗算器で制限される。
時間
Time
OCP
時間
Time
Fig.21 Maximum inductor current at high input voltage
Fig.22Maximum inductor current at low input voltage
Inductor
current
インダクタ電流
Note that the limitation of maximum inductor current is different as shown in Fig. 23 according to whether by OCP or by multiplier.
▪ By OCP: Current peaks including switching ripples are subjected to limitation.
▪ By multiplier: Current excluding switching ripples is subjected to limitation.
インダクタ最大電流
Maximum
inductor current
Detail
拡大
時間
Time
Limitation
by OCP
OCPによる制限
(cover
switching ripples)
(スイッチングリップル含む)
乗算器による制限
Limitation by multiplier
(スイッチングリップル
(do not
cover switching ripples)
含まない)
時間
Time
Fig.23 Maximum current limitation
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Design current detecting resistance Rs so as to meet a maximum power in the
input voltage range, and also to clear 2 power limiting conditions below (Fig. 24).
(1) Power limitation by multiplier
Design current detecting resistance Rs so that VIS voltage (mean) will be
-0.33 V or greater that is maximum of item “ IS pin voltage (Vis_054) “.
In case of settling as output power Po (W), efficiency η, and minimum input
voltage Vacmin (V), maximum inductor current Iinmax (A) is given by
following equation.
Po
Iinmax  2・
η Vacmin
Vis_054
(-0.33Vmax)
VIS voltage (mean) will be -0.33 V or higher when:
Po
 Rs  2・
η Vacmin
VIS
VIS(平均値)
(mean)
VIS (peak)
VIS(ピーク値)
Vocpl
(-0.475Vmax)
VIS(V)
Rs  Iinmax > - 0.33V
>  0.33V
VDET(V)
0.54V
①乗算器による制限
(1) By multiplier
②過電流スレッシュによる制限
(2) By overcurrent threshold
Fig.24 Maximum power limitation
Therefore, design current detecting resistance Rs (Ω) so as to meat:
Rs <
0.33 η Vacmin
2  Po
(Ω) ..... (1)
(2) Power limitation by OCP
Design current detecting resistance Rs so that VIS voltage (peak) will be -0.475 V or greater that is maximum of IS threshold voltage
(Vocpl).
In case of settling as ripple current Iripple (A), switching frequency fsw, output voltage Vout, boost inductance L, and ON duty D, ON duty
D is given by following equation.
D
Vout  2 Vac min
Vout
VIS voltage (peak) will be -0.475 V or higher when:
 Rs  (Iinmax 
Iripple
)
2
2  Po
 Rs  (

η Vacmin
> - 0.475V
2  Vac min D
)>  0.475V
2  fsw L
Therefore, design current detecting resistance Rs (Ω) so as to meat:
Rs<
0.475
2  Po
Vac min D

η Vacmin
2  fsw L
(Ω) ..... (2)
In order to output maximum power at a minimum input voltage, therefore, select Rs determined by expression (1) or (2), whichever
smaller.
Caution:
To define a current limitation by multiplier, select the voltage at VDET pin so as to be 0.54 V or higher even at a minimum input voltage.
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(5) Terminal No. 5 (ICMP pin)
Function
(i) Phase compensation for output of incorporated current error amplifier (CUR_AMP)
Application
(i) Phase compensation for output of incorporated CUR_AMP
▪ Wiring
Connect R and C between ICMP and GND as shown in Fig. 25.
▪ Operation
R and C are connected to ICMP pin to block ripple components of switching frequency that
could otherwise appear on IS pin input.
(Reference)
Example of applied circuit: C8 = 100 pF
C9 = 680 pF
R8 = 47 kΩ
The above is an example. Determine them upon sufficiently verifying your instrument.
ICMP
5
R8
CUR_AMP
PWM_COMP
C8
C9
Fig.25 ICMP pin circuit
(6) Terminal No. 6 (GND pin)
Function
Constitutes the reference of each part of IC.
(7) Terminal No. 7 (OUT pin)
Functions
(i) Drives MOSFET
(ii) Sets oscillation frequency
Fig.26 OUT pin circuit (1)
Applications
(i) Drive of MOSFET
▪ Wiring
Connected via resistance Ro to gate terminal of MOSFET
▪ Operation
Goes high when MOSFET is turned on. Nearly VCC voltage is outputted.
Goes low when MOSFET is turned off. Voltage of nearly 0 V is outputted.
▪ Supplement
Connect a gate resistance for current limitation at OUT pin, prevention of oscillation of gate
terminal voltage, etc.
Rated output currents of IC: Source ... 1.5 A, sink ... 1.5 A.
Connection in Fig. 27 or 28 allows to distinctly set the gate drive currents for turning on and
off MOSFET.
Fig.27 OUT pin circuit (2)
(ii) Setting of oscillation frequency
▪ Wiring
(1) Ordinary connection
Connect resistance Rg between MOSFET gate and GND if no buffer is connected on IC
output as shown in Fig. 26, 27 and 28. According to resistance Rg, switching frequency can
be selected out of 3 different modes given in table below.
Mode1
Frequency diffusion
Mode2
65kHz fixed
Mode3
60kHz fixed
Resistance
Rg
Accuracy
Temperature
characteristics
4.7kΩ
12kΩ
13kΩ
27kΩ
±5%max
±2%max
±5%max
±5%max
200ppm/°Cmax
200ppm/°Cmax
200ppm/°Cmax
200ppm/°Cmax
Fig.28 OUT pin circuit (3)
* Ro: 100 Ω max.
Caution:
▪ Resistance Ro between OUT pin and FET gate must be 100 Ω or less
▪ If mode 3 is selected (27 kΩ used), starting up the frequency setting raises the OUT-GND voltage up to 1.4V
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(2) If buffer is connected on IC output
If buffer is connected on IC output, select a configuration shown in Fig. 29, and select the
frequency setting resistance as given in table below.
Mode1
Jittering
Resistance
Rg
4.7kΩ
±5%max
Temperature
characteristics
200ppm/°Cmax
Mode2
65kHz fixed
13kΩ
±5%max
200ppm/°Cmax
Mode3
60kHz fixed
30kΩ
±5%max
200ppm/°Cmax
Accuracy
* Ro: 100 Ω max.
If combined resistance connected on buffer output is Rx, set Rx to 3 kΩ or higher taking
into account dispersion and temperature characteristics.
Vcc
R11
R12
OUT
Ro
7
R21
Rg
R22
Fig.29 Buffer
Combined
合成抵抗Rx
resistance Rx
Example:
Select R11 = 10 Ω, and R12 = 10 kΩ. Suppose their resistance may change by 10% maximum on account of their dispersion and
temperature characteristics. If 3 of them each are connected in parallel,
Rx = 10.01 kΩ × 90% ÷ 3 = 3.003 kΩ
holds, thereby clearing the requisite.
Caution:
▪ Resistance Ro between OUT pin and buffer must be 100 Ω or less
▪ If mode 3 is selected (30 kΩ used), starting up the frequency setting raises the OUT-GND voltage up to 1.2 V
▪ Above conditions presuppose hFE of transistor used in buffer is 50 minimum, and that Vbe is 0.3 V maximum taking the temperature
characteristics into account. Unless characteristics of a particular transistor to use clear the requisites, set the frequency resorting to a
method in “(3) Other circuit configuration.”
(3) Other circuit configuration
Unless the circuit configuration connected to OUT pin clears the specifications in (1) nor (2), determine the frequency based on the current
and voltage defined by specified frequency setting.
( See p. 15 Fig. 5 Frequency setting circuit )
Be sure to take into account the IC characteristics, and dispersion and temperature characteristics of parts connected to OUT pin.
General precaution about frequency setting:
In setting the frequency, make sure, in addition to respecting our recommendations in (1) and (2) above, there is no problem of influences
by dispersion and temperature characteristics of your resistors, wiring, noise (influence of auxiliary power supply that operates before PFC
starts, in particular) and other matters than resistance itself based on the current and voltage regarding the specified frequency setting.
In setting of the frequency, please confirm whether there is no bad influence of following items including our setting recommendation and
our setting specification.
- Dispersion of or the temperature characteristic of resistance used, a design of wiring, noise (especially from sub power supply before the
PFC start operation), etc.
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(8) Terminal No. 8 (VCC pin)
Function
(i) Supplies IC with power
Application
(i) Supplies IC with power
▪ Wiring
Connect a startup resistance between rectified voltage line and VCC pin.
Generally, connect a rectified and smoothed voltage from auxiliary winding provided
on transformer.
Or connect an external DC source.
▪ Operation
At the time of startup in case VCC voltage is obtained from auxiliary winding, the
current via the startup resistance charges the smoothing capacitance and, when the
level rises up to UVLO ON threshold voltage, IC starts up. Immediately before startup,
a current of at least 110 uA (max.) that is a startup current for IC must be fed. During a
steady operation, VCC is supplied from inductor's auxiliary winding (Fig. 30).
As the source voltage rises from zero, the operation starts at 9.6 V (typ.) for FA5612,
or at 13 V (typ.) for FA5613.
Any of started-up ICs stops operating when the source voltage drops down to 9 V
(typ.)
While IC stops operation by under voltage lockout circuit, OUT pin keeps low level and
shuts the output of power supply off.
Supplement:
Under voltage lockout function avoids an erratic operation of circuit when source
voltage has dropped.
Noise applied to VCC pin will cause an erratic operation. To avoid the noise, connect a
capacitance near VCC pin whether IC is operated by another source or not.
Determine the capacitance so that the noise generated on VCC pin will be within ±0.6
V, and make doubly sure no erratic operation occurs by noise (Fig. 31).
8
VCC
Fig.30 VCC pin circuit (1)
8
External
DC source
外部DC電源
VCC
Fig.31 VCC pin circuit (2)
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12. Advice for design
(1) Advice in pattern designing
Main circuit MOSFET, inductor, diodes, etc. perform switching under high
voltage and large current. If wiring of IC or signals inputted to IC gets too near
such main circuit parts, they may operate erratically upon being affected by
noise generated there.
Attention must be paid particularly in following cases (examples of faulty cases).
▪ IC is arranged under inductor or other main circuit parts, or immediately behind
main circuit parts on double sided circuit board (Fig. 32)
▪ IC is arranged close to inductor, MOSFET or diode (Fig. 33)
▪ Signal wiring is placed under inductor or near MOSFET or diode (Fig. 34)
IC is arranged under inductor
インダクタの下(基板の裏面の場合
(or on immediately
opposite side on circuit board)
も含む)にICが配置されている。
Fig.32 Example of inadvisable arrangement (1)
IC is arranged
close to inductor or MOSFET
インダクタやMOSFETのすぐ近くに
インダクタの下やMOSFETのすぐ近く
Signal wiring passes under inductor
を信号の配線が通過している。
or close to MOSFET
ICが配置されている。
Fig.33 Example of inadvisable arrangement (2)
Fig.34 Example of inadvisable pattern
(2) Typical GND wiring in IC area
To minimize influences on IC of noises from main circuit, separate GND of IC and signal lines for parts of IC area, and GND of PFC main circuit
away from each other, and connect them via one point near current detecting resistance Rs and output capacitance.
IS signal whose voltage level is low is liable to noise. Minimize lengths of IS pin-Rs and Rs-GND wiring.
Arrange VCC-GND capacitance close to IC. Otherwise, the effect will be poor.
Arrange the capacitance between IC area input terminal and GND close to IC. It also has a function of noise elimination and, if away from IC, it
will be affected by noise.
Caution:
Wiring is exemplified for you to understand how to connect the GND line.
Noise and incidental erratic operations differ from one instrument to another. Adopting any wiring exemplified in Fig. 35 will not necessarily
guarantee normal operations of your instruments.
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Rs
IS
VDET VCMP FB
FA5612
/FA5613
ICMP GND OUT
VCC
Fig.36 Example of inadvisable GND wiring
(GND is common to signal line parts and main circuit)
Fig.35 Example of advisable GND wiring
Rs
Drive current
when turning on
IS
VDET VCMP FB
Drive
current
ターンオン時
when
turning on
駆動電流
FA5612
/FA5613
ICMP GND OUT
VCC
Fig.37 Example of inadvisable GND wiring
Fig.38 Example of GND wiring
(Liable to noise when turning on if GND is
(GND of VCC capacitance is
common to VCC capacitance and signal line)
distinct from signal line GND)
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(3) Precautions in use regarding terminal noise
If noise is applied to any IC pin, an erratic operation may be caused. Proceed to design upon respecting the precautions below.
Condition
Pin
FB
Malfunction in fear
Input regulations
Cautions in design
switching may stop when noise is over over voltage protection level
input signal is only for
connect
IC may become stanbay mode when noise is under short detection level
feedback
terminal pin
offset occurs in output voltage and output voltage rises or falls
output voltage
output of multiplier output becomes unstable, and input current waveform may
cancel noise
voltage
of
confirm
disturbed
condenser
sufficiently
near
phase
compensation constant
VCMP
switching may become when noise is over threshold voltage
switching may stop when noise is under threshold voltage
output of multiplier output becomes unstable, and input current waveform may be
cancel noise
connect condensor near pin
cancel noise
connect condensor near pin
cancel noise
confirm
VDET
Input noise
disturbed
(within absolute
current may be detected incorrectly
IS
maximum ratings)
It may turn off when noise is over overcurrent protection level
because a duty changes, input current waveform may be disturbed
sufficiently
phase
ICMP
compensation constant
reference voltage changes, IC may not behave normally
cancel noise
ground wiring should be a
GND
wide wiring
the output may fall not to be able to drive Mos normally when signals more than the
cancel noise
OUT
ability of the driver are input
IC may stop when noise under UVLO is input
don't input noise under
connect condensor near pin
VCC
UVLO when moving
FB
a parasitism element works, and the malfunction such as IC stop may occur
don't input minus voltage
VCMP
less
than
maximum
VDET
absolute voltage
Input minus voltage
ICMP
(less than absolute
VCC
maximum voltage)
IS
IC may be destroyed
OUT
IC may be destroyed
VCC
a parasitism element works, and the malfunction such as IC stop may occur
FB
IC may be destroyed
don't input minus voltage
VCMP
more
Input plus voltage
VDET
absolute voltage
(more than absolute
ICMP
maximum voltage)
IS
OUT
than
maximum
gnd level may be changed
IC may be destroyed
VCC
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13. Example of application circuit ( 390V / 1.5A output )
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