Intel® Pentium® 4 Processor 6xxΔ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet – On 90 nm Process in the 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ , and supporting Intel® Virtualization Technology November 2005 Document Number: 306382-003 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Pentium® 4 processor 6xx sequence, and Intel® Pentium® 4 processor Extreme Edition on 90 nm process in the 775-land package may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details. 1 Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting Hyper-Threading Technology and an HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See http:/ /www.intel.com/info/hyperthreading/ for more information including details on which processors support HT Technology. ΦIntel® Extended Memory 64 Technology (Intel® EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including details on which processors support EM64T or consult with your system vendor for more information. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality. Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and for some uses, certain platform software enabled for it. Functionality, performance or other benefit will vary depending on hardware and software configurations. Intel Virtualization Technology-enabled BIOS and VMM applications are currently in development. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, Itanium, Intel Xeon, Intel NetBurst, Intel SpeedStep, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2005 Intel Corporation. All rights reserved. 2 Datasheet Contents Contents 1 Introduction.................................................................................................................................. 11 1.1 1.2 2 Electrical Specifications ............................................................................................................. 15 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 3 Package Mechanical Drawing ............................................................................................ 35 Processor Component Keep-Out Zones............................................................................. 39 Package Loading Specifications......................................................................................... 39 Package Handling Guidelines............................................................................................. 39 Package Insertion Specifications........................................................................................ 40 Processor Mass Specification............................................................................................. 40 Processor Materials ............................................................................................................ 40 Processor Markings ............................................................................................................ 40 Processor Land Coordinates ..............................................................................................41 Land Listing and Signal Descriptions ....................................................................................... 43 4.1 4.2 5 FSB and GTLREF............................................................................................................... 15 Power and Ground Lands................................................................................................... 15 Decoupling Guidelines........................................................................................................ 15 2.3.1 VCC Decoupling .................................................................................................... 16 2.3.2 FSB GTL+ Decoupling........................................................................................... 16 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 16 Voltage Identification .......................................................................................................... 17 2.4.1 Phase Lock Loop (PLL) Power and Filter .............................................................. 19 Reserved, Unused, FC, and TESTHI Signals..................................................................... 20 FSB Signal Groups ............................................................................................................. 20 GTL+ Asynchronous Signals ..............................................................................................22 Test Access Port (TAP) Connection ................................................................................... 22 FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 23 Absolute Maximum and Minimum Ratings ......................................................................... 23 Processor DC Specifications ..............................................................................................24 VCC Overshoot Specification ............................................................................................. 33 2.12.1 Die Voltage Validation ........................................................................................... 33 GTL+ FSB Specifications....................................................................................................34 Package Mechanical Specifications .......................................................................................... 35 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 Terminology ........................................................................................................................ 12 1.1.1 Processor Packaging Terminology ........................................................................ 13 References ......................................................................................................................... 14 Processor Land Assignments ............................................................................................. 43 Alphabetical Signals Reference .......................................................................................... 66 Thermal Specifications and Design Considerations................................................................ 75 5.1 5.2 Datasheet Processor Thermal Specifications ...................................................................................... 75 5.1.1 Thermal Specifications .......................................................................................... 75 5.1.2 Thermal Metrology ................................................................................................. 79 Processor Thermal Features ..............................................................................................79 5.2.1 Thermal Monitor..................................................................................................... 79 5.2.2 Thermal Monitor 2.................................................................................................. 80 3 Contents 5.2.3 5.2.4 5.2.5 5.2.6 5.2.7 6 Features........................................................................................................................................ 85 6.1 6.2 7 7.2 7.3 Mechanical Specifications .................................................................................................. 92 7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 92 7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 93 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly....... 93 Electrical Requirements...................................................................................................... 93 7.2.1 Fan Heatsink Power Supply .................................................................................. 93 Thermal Specifications ....................................................................................................... 95 7.3.1 Boxed Processor Cooling Requirements............................................................... 95 7.3.2 Variable Speed Fan ............................................................................................... 96 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications .................. 99 8.1 8.2 8.3 4 Power-On Configuration Options........................................................................................ 85 Clock Control and Low Power States ................................................................................. 86 6.2.1 Normal State.......................................................................................................... 86 6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 87 6.2.3 Stop-Grant State.................................................................................................... 88 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88 6.2.5 HALT Snoop State, Grant Snoop State ................................................................. 89 6.2.6 Enhanced Intel SpeedStep® Technology .............................................................. 89 Boxed Processor Specifications................................................................................................ 91 7.1 8 On-Demand Mode ................................................................................................. 82 PROCHOT# Signal................................................................................................ 82 THERMTRIP# Signal............................................................................................. 83 TCONTROL and Fan Speed Reduction.................................................................... 83 Thermal Diode ....................................................................................................... 83 Mechanical Specifications ................................................................................................ 100 8.1.1 Cooling Solution Dimensions............................................................................... 100 8.1.2 Boxed Processor Fan Heatsink Weight ............................................................... 100 8.1.3 Boxed Processor Support and Retention Module (SRM) .................................... 101 Electrical Requirements.................................................................................................... 101 8.2.1 Fan Heatsink Power Supply ................................................................................ 101 Thermal Specifications ..................................................................................................... 103 8.3.1 Boxed Processor Cooling Requirements............................................................. 103 8.3.2 Variable Speed Fan ............................................................................................. 104 Datasheet Contents Figures 2-1 2-2 2-3 2-4 3-1 3-2 3-3 3-4 3-5 3-6 3-7 4-1 4-2 5-1 5-2 5-3 5-4 6-1 7-1 7-2 7-3 7-4 7-5 7-6 7-7 7-8 7-9 8-1 8-2 8-3 8-4 8-5 8-6 Phase Lock Loop (PLL) Filter Requirements.............................................................................. 19 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30 VCC Overshoot Example Waveform .......................................................................................... 33 Processor Package Assembly Sketch ........................................................................................ 35 Processor Package Drawing 1 ................................................................................................... 36 Processor Package Drawing 2 ................................................................................................... 37 Processor Package Drawing 3 ................................................................................................... 38 Processor Top-Side Marking Example for Intel® Pentium® 4 Processor Extreme Edition ......... 40 Processor Top-Side Marking Example for Intel® Pentium® 4 Processor 6xx Sequence............ 41 Processor Land Coordinates (Top View).................................................................................... 42 land-out Diagram (Top View – Left Side).................................................................................... 44 land-out Diagram (Top View – Right Side) ................................................................................. 45 Thermal Profile for Processors with PRB = 1 ............................................................................. 77 Thermal Profile for Processors with PRB = 0 ............................................................................. 78 Case Temperature (TC) Measurement Location ........................................................................ 79 Thermal Monitor 2 Frequency and Voltage Ordering .................................................................81 Processor Low Power State Machine......................................................................................... 86 Mechanical Representation of the Boxed Processor.................................................................. 91 Space Requirements for the Boxed Processor (Side View–applies to all four side views) ........ 92 Space Requirements for the Boxed Processor (Top View) ........................................................ 92 Overall View Space Requirements for the Boxed Processor ..................................................... 93 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 94 Baseboard Power Header Placement Relative to Processor Socket ......................................... 94 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 95 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 96 Boxed Processor Fan Heatsink Set Points................................................................................. 96 Mechanical Representation of the Boxed Processor.................................................................. 99 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ........100 Assembly Stack Including the Support and Retention Module .................................................101 Boxed Processor Fan Heatsink Power Cable Connector .........................................................102 Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) 103 Boxed Processor TMA Set Points ............................................................................................104 Datasheet 5 Contents Tables 1-1 References ................................................................................................................................. 14 2-1 Core Frequency to FSB Multiplier Configuration ........................................................................ 16 2-2 Voltage Identification Definition .................................................................................................. 18 2-3 FSB Signal Groups..................................................................................................................... 21 2-4 Signal Characteristics ................................................................................................................. 22 2-5 Signal Reference Voltages ......................................................................................................... 22 2-6 BSEL[2:0] Frequency Table for BCLK[1:0] ................................................................................. 23 2-7 Processor DC Absolute Maximum Ratings ................................................................................ 24 2-8 Voltage and Current Specifications ............................................................................................ 25 2-9 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Processors ........................... 27 2-10 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Processors ........................... 29 2-11 GTL+ Asynchronous Signal Group DC Specifications .............................................................. 31 2-12 GTL+ Signal Group DC Specifications ....................................................................................... 31 2-13 PWRGOOD and TAP Signal Group DC Specifications .............................................................. 32 2-14 VTTPWRGD DC Specifications.................................................................................................. 32 2-15 BSEL [2:0] and VID[5:0] DC Specifications ................................................................................ 32 2-16 BOOTSELECT DC Specifications .............................................................................................. 32 2-17 VCC Overshoot Specifications .................................................................................................... 33 2-18 GTL+Bus Voltage Definitions ..................................................................................................... 34 2-19 GTLREF Definition for Intel® 945G/945P/955X Express Chipset and Intel® E7230 Chipset Platforms ....................................................................................................................... 34 3-1 Processor Loading Specifications .............................................................................................. 39 3-2 Package Handling Guidelines .................................................................................................... 39 3-3 Processor Materials .................................................................................................................... 40 4-1 Alphabetical Land Assignments ................................................................................................. 46 4-2 Numerical Land Assignment....................................................................................................... 56 4-3 Signal Description (Sheet 1 of 9) ................................................................................................ 66 5-1 Processor Thermal Specifications .............................................................................................. 76 5-2 Thermal Profile for Processors with PRB = 1 ............................................................................. 77 5-3 Thermal Profile for Processors with PRB = 0 ............................................................................. 78 5-4 Thermal Monitor 2 Support......................................................................................................... 81 5-5 Thermal Diode Parameters ........................................................................................................ 83 5-6 Thermal Diode Interface ............................................................................................................. 84 6-1 Power-On Configuration Option Signals..................................................................................... 85 6-2 Enhanced Halt Powerdown Support........................................................................................... 87 7-1 Fan Heatsink Power and Signal Specifications .......................................................................... 94 7-2 Fan Heatsink Power and Signal Specifications .......................................................................... 97 8-1 Fan Heatsink Power and Signal Specifications ........................................................................ 102 8-2 Balanced Technology Extended (BTX) Type I Boxed Processor TMA Set Points for 3-wire Operation ....................................................................................................................... 104 6 Datasheet Contents Revision History Revision Number Description Date -001 • Initial release February 2005 -002 • Added specifications for processor number 670. May 2005 • Added specifications for processor numbers 662 and 672 -003 • Added Balanced Technology Extended (BTX) Type I Boxed Processor Specifications chapter. November 2005 § Datasheet 7 Contents 8 Datasheet Contents Intel® Pentium® 4 Processor 6xx SequenceΔ and Intel® Pentium® 4 Processor Extreme Edition Features • Available at 3.73 GHz (Intel® Pentium® 4 • • • • • • • • • • • • • Very deep out-of-order execution • Enhanced branch prediction • Optimized for 32-bit applications running on processor Extreme Edition only) Available at 3.80 GHz, 3.60 GHz, 3.40 GHz, 3.20 GHz, and 3 GHz (Pentium 4 processors 6xx sequence only) Enhanced Intel Speedstep® Technology (Pentium 4 processors 6xx sequence only) Intel® Virtualization Technology (Pentium 4 processors 672 and 662 only) Supports Intel® Extended Memory 64 Technology (Intel® EM64T)Φ Supports Hyper-Threading Technology1 (HT Technology) Supports Execute Disable Bit capability Binary compatible with applications running on previous members of the Intel microprocessor line Intel NetBurst® microarchitecture FSB frequency at 800 MHz (Pentium 4 processors 6xx sequence only) FSB frequency at 1066 MHz (Pentium 4 processor Extreme Edition only) Hyper-Pipelined Technology Advance Dynamic Execution advanced 32-bit operating systems • 16-KB Level 1 data cache • 2-MB Advanced Transfer Cache (on-die, fullspeed Level 2 (L2) cache) with 8-way associativity and Error Correcting Code (ECC) • 144 Streaming SIMD Extensions 2 (SSE2) instructions • 13 Streaming SIMD Extensions 3 (SSE3) instructions • Enhanced floating point and multimedia unit for enhanced video, audio, encryption, and 3D performance • • • • Power Management capabilities System Management mode Multiple low-power states 8-way cache associativity provides improved cache hit rate on load/store operations • 775-land Package The Intel® Pentium® 4 processor family supporting Hyper-Threading Technology1 (HT Technology) delivers Intel's advanced, powerful processors for desktop PCs that are based on the Intel NetBurst® microarchitecture. The Pentium 4 processor is designed to deliver performance across applications and usages where end-users can truly appreciate and experience the performance. These applications include Internet audio and streaming video, image processing, video content creation, speech, 3D, CAD, games, multimedia, and multitasking user environments. Intel® Extended Memory 64 Technology (Intel® EM64T) enables Pentium 4 processor to execute operating systems and applications written to take advantage of the Intel EM64T. The Pentium 4 processors 6xx sequence supporting Enhanced Intel Speedstep® Technology allows tradeoffs to be made between performance and power consumption. The Pentium 4 processor also includes the Execute Disable Bit capability. This feature, combined with a supported operating system, allows memory to be marked as executable or non-executable. The Pentium 4 processors 662 and 772 support Intel® Virtualization Technology. Virtualization Technology provides silicon-based funtionality that works together with compatible Virtual Machine Monitor (VMM) software to improve on software-only solutions. § Datasheet 9 Contents 10 Datasheet Introduction 1 Introduction The Intel® Pentium® 4 processor 6xx sequence on 90 nm process in the 775-land package and the Intel® Pentium® 4 processor Extreme Edition on 90 nm process in the 775-land package are follow-ons to the Pentium 4 processor in the 478-pin package, with enhancements to the Intel NetBurst® microarchitecture. These Pentium 4 processors on 90 nm process in the 775-land package use Flip-Chip Land Grid Array (FC-LGA4) package technology, and plug into the LGA775 socket. The Intel Pentium 4 processor 6xx sequence on 90 nm process in the 775-land package and the Pentium 4 processor Extreme Edition on 90 nm process in the 775-land package, like their predecessor, the Pentium 4 processor in the 478-pin package, are based on the same Intel 32-bit microarchitecture and maintain the tradition of compatibility with IA-32 software. The Intel Pentium 4 processor 6xx sequence on 90 nm process in the 775-land package and the Pentium 4 processor Extreme Edition on 90 nm process in the 775-land package support Intel® Extended Memory 64 Technology (Intel EM64T)Φ as an enhancement to Intel’s IA-32 architecture. This enhancement enables the processor to execute operating systems and applications written to take advantage of Intel EM64T. With appropriate 64 bit supporting hardware and software, platforms based on an Intel processor supporting Intel EM64T can enable use of extended virtual and physical memory. Further details on the 64-bit extension architecture and programming model is provided in the Intel® Extended Memory 64 Technology Software Developer Guide at http://developer.intel.com/technology/64bitextensions/. Note: In this document, unless otherwise specified, the Pentium 4 processor 6xx sequence on 90 nm process in the 775-land package and the Pentium 4 processor Extreme Edition on 90 nm process in the 775-land package are also referred to as Pentium 4 processor or simply as the processor. Note: In this document, unless otherwise specified, the Intel® Pentium® 4 processor 6xx sequence refers to Intel Pentium 4 processors 670/672, 660/662, 650, 640, and 630. The Pentium 4 processor supports Hyper-Threading Technology1. Hyper-Threading Technology allows a single, physical processor to function as two logical processors. While some execution resources (such as caches, execution units, and buses) are shared, each logical processor has its own architecture state with its own set of general-purpose registers, control registers to provide increased system responsiveness in multitasking environments, and headroom for next generation multithreaded applications. Intel recommends enabling Hyper-Threading Technology with Microsoft Windows* XP Professional or Windows* XP Home, and disabling Hyper-Threading Technology via the BIOS for all previous versions of the Windows operating systems. For more information on Hyper-Threading Technology, see http://www.intel.com/info/hyperthreading. Refer to Section 6.1, for Hyper-Threading Technology configuration details. In addition to supporting all the existing Streaming SIMD Extensions 2 (SSE2), there are 13 new instructions that further extend the capabilities of Intel processor technology. These new instructions are called Streaming SIMD Extensions 3 (SSE3). These new instructions enhance the performance of optimized applications for the digital home (such as, video, image processing, and media compression technology). 3D graphics and other entertainment applications (such as, gaming) will have the opportunity to take advantage of these new instructions. The processor’s Intel NetBurst microarchitecture FSB uses a split-transaction, deferred reply protocol like the Pentium 4 processor. The Intel NetBurst microarchitecture FSB uses SourceSynchronous Transfer (SST) of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address Datasheet 11 Introduction bus can deliver addresses two times per bus clock and is referred to as a “double-clocked” or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 6.4 GB/s (800 MHz FSB) or 8.5 GB/s (1066 MHz FSB). The Pentium 4 processor includes the Execute Disable Bit capability previously available in Intel® Itanium® processors. This feature, combined with a supported operating system, allows memory to be marked as executable or non-executable. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer over run vulnerabilities and can thus help improve the overall security of the system. See the Intel® Architecture Software Developer's Manual for more detailed information. The Pentium 4 processor 662 and 672 support Intel® Virtualization Technology. Intel Virtualization Technology provides silicon-based functionality that works together with compatible Virtual Machine Monitor (VMM) software to improve upon software-only solutions. Because this virtualization hardware provides a new architecture upon which the operating system can run directly, it removes the need for binary translation. Thus, it helps eliminate associated performance overhead and vastly simplifies the design of the VMM, in turn allowing VMMs to be written to common standards and to be more robust. See the Intel® Virtualization Technology Specification for the IA-32 Intel® Architecture for more details. The Pentium 4 processor 6xx sequence features Enhanced Intel SpeedStep® technology. Enhanced Intel SpeedStep technology allows trade-offs to be made between performance and power consumptions. This may lower average power consumption (in conjunction with OS support). The Pentium 4 processor Extreme Edition does not support Enhanced Intel SpeedStep technology. Intel will enable support components for the processor including heatsink, heatsink retention mechanism, and socket. Manufacturability is a high priority; hence, mechanical assembly may be completed from the top of the baseboard and should not require any special tooling. The processor includes an address bus powerdown capability that removes power from the address and data pins when the FSB is not in use. This feature is always enabled on the processor. 1.1 Terminology A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level). “FSB” refers to the interface between the processor and system core logic (a.k.a. the chipset components). The FSB is a multiprocessing interface to processors, memory, and I/O. 12 Datasheet Introduction 1.1.1 Processor Packaging Terminology Commonly used terms are explained here for clarification: • Pentium 4 processor Extreme Edition on 90 nm process in the 775-land package— Processor in the FC-LGA4 package with a 2-MB L2 cache. • Pentium 4 processor 6xx sequence on 90 nm process in the 775-land package— Processor in the FC-LGA4 package with a 2-MB L2 cache. • Processor — For this document, the term processor refers to the Pentium 4 processor 6xx sequence on 90 nm process in the 775-land package and the Pentium 4 processor Extreme Edition on 90 nm process in the 775-land package. • Keep-out zone — The area on or near the processor that system design can not use. • Intel® 925X/925XE Express chipset — Chipsets that supports DDR2 memory technology for the Pentium 4 processor in the 775-land package. • Intel® 915G/915GV/915GL and 915P/915PL Express chipset — Chipsets that supports DDR/DDR2 memory technology for the Pentium 4 processor in the 775-land package. • Intel® 945G/945P Express chipset — Chipsets that supports DDR2 memory technology for the Pentium 4 processor in the 775-land package. • Intel® 955X Express chipset — Chipsets that supports DDR2 memory technology for the Pentium 4 processor in the 775-land package. • Processor core — Processor core die with integrated L2 cache. • FC-LGA4 package — The Pentium 4 processor is available in a Flip-Chip Land Grid Array 4 package, consisting of a processor core mounted on a substrate with an integrated heat spreader (IHS). • LGA775 socket — The Pentium 4 processor mates with the system board through a surface mount, 775-land, LGA socket. • Integrated heat spreader (IHS) —A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. • Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical features for heatsink attach, a retention mechanism is required. Component thermal solutions should attach to the processor via a retention mechanism that is independent of the socket. • Storage conditions—Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. • Functional operation—Refers to normal operating conditions in which all processor specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are satisfied. Datasheet 13 Introduction 1.2 References Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. References Document Intel® Document Number/Location Pentium® 4 Processor on 90 nm Process in the 775-land LGA Package Thermal Design Guidelines http://developer.intel.com/design/ Pentium4/guides/302553.htm Intel® Pentium® 4 Processor on 90 nm Process Specification Update http://developer.intel.com/design/ Pentium4/specupdt/302352.htm Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket http://intel.com/design/Pentium4/ guides/302356.htm LGA775 Socket Mechanical Design Guide http://intel.com/design/Pentium4/ guides/302666.htm Intel® Virtualization Technology Specification for the IA-32 Intel® Architecture http://www.intel.com/technology/ computing/vptech/index.htm Balanced Technology Extended (BTX) System Design Guide Intel® www.formfactors.org Architecture Software Developer's Manual Volume 1: Basic Architecture Volume 2a: Instruction Set Reference (A - M) http://developer.intel.com/design/ pentium4/manuals/index_new.htm Volume 2b: Instruction Set Reference (N - Z) Volume 3: System Programming Guide § 14 Datasheet Electrical Specifications 2 Electrical Specifications This chapter describes the electrical characteristics of the processor interfaces and signals. DC electrical characteristics are provided. 2.1 FSB and GTLREF Most processor FSB signals use Gunning Transceiver Logic (GTL+) signaling technology. Platforms implement a termination voltage level for GTL+ signals defined as VTT. VTT must be provided via a separate voltage source and not be connected to VCC. This configuration allows for improved noise tolerance as processor frequency increases. Because of the speed improvements to the data and address bus, signal integrity and platform design methods have become more critical than with previous processor families. Contact your Intel representative for further details and documentation. The GTL+ inputs require a reference voltage (GTLREF) that is used by the receivers to determine if a signal is a logical 0 or a logical 1. GTLREF must be generated on the system board (see Table 2-18 for GTLREF specifications). Termination resistors are provided on the processor silicon and are terminated to VTT. Intel chipsets will also provide on-die termination, thus eliminating the need to terminate the bus on the system board for most GTL+ signals. Some GTL+ signals do not include on-die termination and must be terminated on the system board. See Table 2-4 for details regarding these signals. The GTL+ bus depends on incident wave switching. Therefore, timing calculations for GTL+ signals are based on flight time, rather than capacitive deratings. Analog signal simulation of the FSB, including trace lengths, is highly recommended when designing a system. 2.2 Power and Ground Lands For clean on-chip power distribution, the Pentium 4 processor has 226 VCC (power), 24 VTT, and 273 VSS (ground) lands. All power lands must be connected to VCC, all VTT lands must be connected to VTT, and all VSS lands must be connected to a system ground plane. The processor VCC lands must be supplied by the voltage determined by the Voltage IDentification (VID) signals. 2.3 Decoupling Guidelines Due to its large number of transistors and high internal clock speeds, the processor is capable of generating large current swings between low and full power states. This may cause voltages on power planes to sag below their minimum values if bulk decoupling is not adequate. Care must be taken in the board design to ensure that the voltage provided to the processor remains within the specifications listed in Table 2-8. Failure to do so can result in timing violations or reduced lifetime of the component. For further information and design guidelines, refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket. Contact your Intel representative for further details and documentation. Datasheet 15 Electrical Specifications 2.3.1 VCC Decoupling Regulator solutions need to provide bulk capacitance with a low Effective Series Resistance (ESR) and keep a low interconnect resistance from the regulator to the socket. Bulk decoupling for the large current swings when the part is powering on, or entering/exiting low power states, must be provided by the voltage regulator solution (VR). In addition, a sufficient quality of low ESR ceramic capacitors are required in the socket cavity to ensure proper high frequency noise suppression. For more details on this topic, refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket. Contact your Intel representative for further details and documentation. 2.3.2 FSB GTL+ Decoupling The Pentium 4 processor integrates signal termination on the die as well as incorporating high frequency decoupling capacitance on the processor package. Decoupling must also be provided by the system baseboard for proper GTL+ bus operation. Contact your Intel representative for further details and documentation. 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the processor. As in previous generation processors, the Pentium 4 processor core frequency is a multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its default ratio during manufacturing. No user intervention is necessary; the processor will automatically run at the speed indicated on the package. The Pentium 4 processor uses a differential clocking implementation. For more information on the Pentium 4 processor clocking, contact your Intel representative. Table 2-1. Core Frequency to FSB Multiplier Configuration Core Frequency (200 MHz BCLK/ 800 MHz FSB) Core Frequency (266 MHz BCLK/ 1066 MHz FSB) 1/14 — 3.73 GHz — 1/15 3 GHz — — 1/16 3.20 GHz — — 1/17 3.40 GHz — — 1/18 3.60 GHz — — 1/19 3.80 GHz — — Multiplication of System Core Frequency to FSB Frequency Notes1, 2 NOTES: 1. 2. 16 Individual processors operate only at or below the rated frequency. Listed frequencies are not necessarily committed production frequencies. Datasheet Electrical Specifications 2.4 Voltage Identification The VID specification for the Pentium 4 processor is supported by the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket. The voltage set by the VID signals is the reference VR output voltage to be delivered to the processor VCC pins. A minimum voltage is provided in Table 2-8 and changes with frequency. This allows processors running at a higher frequency to have a relaxed minimum voltage specification. The specifications have been set such that one voltage regulator can work with all supported frequencies. Individual processor VID values may be calibrated during manufacturing such that two devices at the same speed may have different VID settings. The Pentium 4 processor uses six voltage identification signals, VID[5:0], to support automatic selection of power supply voltages. Table 2-2 specifies the voltage level corresponding to the state of VID[5:0]. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to low voltage level. If the processor socket is empty (VID[5:0] = x11111), or the voltage regulation circuit cannot supply the voltage that is requested, it must disable itself. See the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket for more details. Power source characteristics must be guaranteed to be stable whenever the supply to the voltage regulator is stable. The LL_ID[1:0] lands are used by the platform to configure the proper loadline slope for the processor. LL_ID[1:0] = 00 for the Pentium 4 processor. The VTT_SEL land is used by the platform to configure the proper VTT voltage level for the processor. VTT_SEL = 1 for the Pentium 4 processor. The GTLREF_SEL signal is used by the platform to select the appropriate chipset GTLREF level. GTLREF_SEL = 0 for the Pentium 4 processor. LL_ID[1:0] and VTT_SEL are signals that are implemented on the processor package. That is, they are either connected directly to VSS or are open lands. Datasheet 17 Electrical Specifications Table 2-2. Voltage Identification Definition VID5 VID4 VID3 VID2 VID1 VID0 VID VID5 VID4 VID3 VID2 VID1 VID0 VID 0 0 1 0 1 0 0.8375 0 1 1 0 1 0 1.2125 1 0 1 0 0 1 0.8500 1 1 1 0 0 1 1.2250 0 0 1 0 0 1 0.8625 0 1 1 0 0 1 1.2375 1 0 1 0 0 0 0.8750 1 1 1 0 0 0 1.2500 0 0 1 0 0 0 0.8875 0 1 1 0 0 0 1.2625 1 0 0 1 1 1 0.9000 1 1 0 1 1 1 1.2750 0 0 0 1 1 1 0.9125 0 1 0 1 1 1 1.2875 1 0 0 1 1 0 0.9250 1 1 0 1 1 0 1.3000 0 0 0 1 1 0 0.9375 0 1 0 1 1 0 1.3125 1 0 0 1 0 1 0.9500 1 1 0 1 0 1 1.3250 0 0 0 1 0 1 0.9625 0 1 0 1 0 1 1.3375 1 0 0 1 0 0 0.9750 1 1 0 1 0 0 1.3500 0 0 0 1 0 0 0.9875 0 1 0 1 0 0 1.3625 1 0 0 0 1 1 1.0000 1 1 0 0 1 1 1.3750 0 0 0 0 1 1 1.0125 0 1 0 0 1 1 1.3875 1 0 0 0 1 0 1.0250 1 1 0 0 1 0 1.4000 0 0 0 0 1 0 1.0375 0 1 0 0 1 0 1.4125 1 0 0 0 0 1 1.0500 1 1 0 0 0 1 1.4250 0 0 0 0 0 1 1.0625 0 1 0 0 0 1 1.4375 1 0 0 0 0 0 1.0750 1 1 0 0 0 0 1.4500 0 0 0 0 0 0 1.0875 0 1 0 0 0 0 1.4625 1 1 1 1 1 1 VR output off 1 0 1 1 1 1 1.4750 0 1 1 1 1 1 VR output off 0 0 1 1 1 1 1.4875 1 1 1 1 1 0 1.1000 1 0 1 1 1 0 1.5000 0 1 1 1 1 0 1.1125 0 0 1 1 1 0 1.5125 1 1 1 1 0 1 1.1250 1 0 1 1 0 1 1.5250 0 1 1 1 0 1 1.1375 0 0 1 1 0 1 1.5375 1 1 1 1 0 0 1.1500 1 0 1 1 0 0 1.5500 0 1 1 1 0 0 1.1625 0 0 1 1 0 0 1.5625 1 1 1 0 1 1 1.1750 1 0 1 0 1 1 1.5750 0 1 1 0 1 1 1.1875 0 0 1 0 1 1 1.5875 1 1 1 0 1 0 1.2000 1 0 1 0 1 0 1.6000 18 Datasheet Electrical Specifications 2.4.1 Phase Lock Loop (PLL) Power and Filter VCCA and VCCIOPLL are power sources required by the PLL clock generators for the Pentium 4 processor. Since these PLLs are analog, they require low noise power supplies for minimum jitter. Jitter is detrimental to the system: it degrades external I/O timings as well as internal core timings (i.e., maximum frequency). To prevent this degradation, these supplies must be low pass filtered from VTT. The AC low-pass requirements, with input at VTT are as follows: • • • • < 0.2 dB gain in pass band < 0.5 dB attenuation in pass band < 1 Hz > 34 dB attenuation from 1 MHz to 66 MHz > 28 dB attenuation from 66 MHz to core frequency The filter requirements are illustrated in Figure 2-1. Contact your Intel representative for further details and documentation. . Figure 2-1. Phase Lock Loop (PLL) Filter Requirements 0.2 dB 0 dB –0.5 dB Forbidden Zone Forbidden Zone –28 dB –34 dB DC 1 Hz fpeak 1 MHz 66 MHz Passband fcore High Frequency Band NOTES: 1. Diagram not to scale. 2. No specification exists for frequencies beyond fcore (core frequency). 3. fpeak, if existent, should be less than 0.05 MHz. Datasheet 19 Electrical Specifications 2.5 Reserved, Unused, FC, and TESTHI Signals All RESERVED signals must remain unconnected. Connection of these signals to VCC, VSS, VTT, or to any other signal (including each other) can result in component malfunction or incompatibility with future processors. See Chapter 4 for a land listing of the processor and the location of all RESERVED signals. For reliable operation, always connect unused inputs or bidirectional signals to an appropriate signal level. In a system level design, on-die termination has been included on the Pentium 4 processor to allow signals to be terminated within the processor silicon. Most unused GTL+ inputs should be left as no connects, as GTL+ termination is provided on the processor silicon. However, see Table 2-4 for details on GTL+ signals that do not include on-die termination. Unused active high inputs should be connected through a resistor to ground (VSS). Unused outputs can be left unconnected; however, this may interfere with some test access port (TAP) functions, complicate debug probing, and prevent boundary scan testing. A resistor must be used when tying bidirectional signals to power or ground. When tying any signal to power or ground, a resistor will also allow for system testability. For unused GTL+ input or I/O signals, use pull-up resistors of the same value as the on-die termination resistors (RTT). Refer to Table 2-18 for more details. TAP, GTL+ Asynchronous inputs, and GTL+ Asynchronous outputs do not include on-die termination. Inputs and used outputs must be terminated on the system board. Unused outputs may be terminated on the system board or left unconnected. Note that leaving unused outputs unterminated may interfere with some TAP functions, complicate debug probing, and prevent boundary scan testing. FCx signals are signals that are available for compatibility with other processors. Contact your Intel representative for further details and documentation. The TESTHI signals must be tied to the processor VTT using a matched resistor, where a matched resistor has a resistance value within ±20% of the impedance of the board transmission line traces. For example, if the trace impedance is 60 Ω, then a value between 48 Ω and 72 Ω is required. The TESTHI signals may use individual pull-up resistors or be grouped together as detailed below. A matched resistor must be used for each group: • • • • • • • • 2.6 TESTHI[1:0] TESTHI[7:2] TESTHI8 – cannot be grouped with other TESTHI signals TESTHI9 – cannot be grouped with other TESTHI signals TESTHI10 – cannot be grouped with other TESTHI signals TESTHI11 – cannot be grouped with other TESTHI signals TESTHI12 – cannot be grouped with other TESTHI signals TESTHI13 – cannot be grouped with other TESTHI signals FSB Signal Groups The FSB signals have been combined into groups by buffer type. GTL+ input signals have differential input buffers that use GTLREF as a reference level. In this document, the term “GTL+ Input” refers to the GTL+ input group as well as the GTL+ I/O group when receiving. Similarly, “GTL+ Output” refers to the GTL+ output group as well as the GTL+ I/O group when driving. 20 Datasheet Electrical Specifications With the implementation of a source synchronous data bus comes the need to specify two sets of timing parameters. One set is for common clock signals that are dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second set is for the source synchronous signals that are relative to their respective strobe lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are still present (A20M#, IGNNE#, etc.) and can become active at any time during the clock cycle. Table 2-3 identifies which signals are common clock, source synchronous, and asynchronous. Table 2-3. FSB Signal Groups Signal Group Signals1 Type GTL+ Common Clock Input Synchronous to BCLK[1:0] BPRI#, DEFER#, RS[2:0]#, RSP#, TRDY#, GTL+ Common Clock I/O Synchronous to BCLK[1:0] AP[1:0]#, ADS#, BINIT#, BNR#, BPM[5:0]#, BR0#, DBSY#, DP[3:0]#, DRDY#, HIT#, HITM#, LOCK#, MCERR# Signals REQ[4:0]#, GTL+ Source Synchronous I/O Synchronous to associated strobe Synchronous to BCLK[1:0] GTL+ Strobes A[35:17]# A[16:3]#3 3 Associated Strobe ADSTB0# ADSTB1# D[15:0]#, DBI0# DSTBP0#, DSTBN0# D[31:16]#, DBI1# DSTBP1#, DSTBN1# D[47:32]#, DBI2# DSTBP2#, DSTBN2# D[63:48]#, DBI3# DSTBP3#, DSTBN3# ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]# GTL+ Asynchronous Input A20M#, IGNNE#, INIT#, LINT0/INTR, LINT1/NMI, SMI#, STPCLK#, RESET# GTL+ Asynchronous Output FERR#/PBE#, IERR#, THERMTRIP# GTL+ Asynchronous Input/Output PROCHOT# TAP Input Synchronous to TCK TCK, TDI, TMS, TRST# TAP Output Synchronous to TCK TDO FSB Clock Clock BCLK[1:0], ITP_CLK[1:0]2 Power/Other VCC, VTT, VCCA, VCCIOPLL, VID[5:0], VSS, VSSA, GTLREF, COMP[1:0], RESERVED, TESTHI[13:0], THERMDA, THERMDC, VCC_SENSE, VSS_SENSE, BSEL[2:0], SKTOCC#, DBR#2, VTTPWRGD, BOOTSELECT, PWRGOOD, VTT_OUT_LEFT, VTT_OUT_RIGHT, VTT_SEL, LL_ID[1:0], FCx, VCC_MB_REGULATION, VSS_MB_REGULATION, MSID[1:0] NOTES: 1. Refer to Section 4.2 for signal descriptions. 2. In processor systems where there is no debug port implemented on the system board, these signals are used to support a debug port interposer. In systems with the debug port implemented on the system board, these signals are no connects. 3. The value of these signals during the active-to-inactive edge of RESET# defines the processor configuration options. See Section 6.1 for details. Datasheet 21 Electrical Specifications Table 2-4. Signal Characteristics Signals with RTT A[35:3]#, ADS#, ADSTB[1:0]#, AP[1:0]#, BINIT#, BNR#, BOOTSELECT1, BPRI#, D[63:0]#, DBI[3:0]#, DBSY#, DEFER#, DP[3:0]#, DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, HIT#, HITM#, LOCK#, MCERR#, PROCHOT#, REQ[4:0]#, RS[2:0]#, RSP#, TRDY# Signals with no RTT A20M#, BCLK[1:0], BPM[5:0]#, BR0#, BSEL[2:0], COMP[1:0], FERR#/PBE#, IERR#, IGNNE#, INIT#, LINT0/INTR, LINT1/NMI, PWRGOOD, RESET#, SKTOCC#, SMI#, STPCLK#, TDO, TESTHI[13:0], THERMDA, THERMDC, THERMTRIP#, VID[5:0], VTTPWRGD, GTLREF, TCK, TDI, TRST#, TMS Open Drain Signals2 BSEL[2:0], VID[5:0], THERMTRIP#, FERR#/PBE#, IERR#, BPM[5:0]#, BR0#, TDO, VTT_SEL, LL_ID[1:0], MSID[1:0] NOTES: 1. 2. The BOOTSELECT signal has a 500–5000 Ω pull-up to VTT rather than on-die termination. Signals that do not have RTT, nor are actively driven to their high-voltage level. . Table 2-5. Signal Reference Voltages GTLREF BPM[5:0]#, LINT0/INTR, LINT1/NMI, RESET#, BINIT#, BNR#, HIT#, HITM#, MCERR#, PROCHOT#, BR0#, A[35:0]#, ADS#, ADSTB[1:0]#, AP[1:0]#, BPRI#, D[63:0]#, DBI[3:0]#, DBSY#, DEFER#, DP[3:0]#, DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, LOCK#, REQ[4:0]#, RS[2:0]#, RSP#, TRDY# VTT/2 BOOTSELECT, VTTPWRGD, A20M#, IGNNE#, INIT#, PWRGOOD1, SMI#, STPCLK#, TCK1, TDI1, TMS1, TRST#1 NOTES: 1. 2.7 These signals also have hysteresis added to the reference voltage. See Table 2-13 for more information. GTL+ Asynchronous Signals Legacy input signals (such as, A20M#, IGNNE#, INIT#, SMI#, and STPCLK#) use CMOS input buffers. All of these signals follow the same DC requirements as GTL+ signals; however, the outputs are not actively driven high (during a logical 0-to-1 transition) by the processor. These signals do not have setup or hold time specifications in relation to BCLK[1:0]. All of the GTL+ Asynchronous signals are required to be asserted/de-asserteded for at least six BCLKs for the processor to recognize the proper signal state. See Section 2.11 through Section 2.13 for the DC specifications for the GTL+ Asynchronous signal groups. See Section 6.2 for additional timing requirements for entering and leaving the low power states. 2.8 Test Access Port (TAP) Connection Due to the voltage levels supported by other components in the Test Access Port (TAP) logic, it is recommended that the Pentium 4 processor be first in the TAP chain and followed by any other components within the system. A translation buffer should be used to connect to the rest of the chain unless one of the other components is capable of accepting an input of the appropriate voltage level. Similar considerations must be made for TCK, TMS, TRST#, TDI, and TDO. Two copies of each signal may be required, with each driving a different voltage level. 22 Datasheet Electrical Specifications 2.9 FSB Frequency Select Signals (BSEL[2:0]) The BSEL[2:0] signals are used to select the frequency of the processor input clock (BCLK[1:0]). Table 2-6 defines the possible combinations of the signals and the frequency associated with each combination. The required frequency is determined by the processor, chipset, and clock synthesizer. All agents must operate at the same frequency. Only the Pentium 4 processor Extreme Edition currently operates at a 1066 MHz FSB frequency (selected by a 266 MHz BCLK[1:0] frequency). The Pentium 4 Processor 6xx sequence operate at a 800 MHz FSB Frequency (selected by a 200 MHz BCLK[1:0] frequency) Individual processors will only operate at their specified FSB frequency. For more information about these signals, refer to Section 4.2. Contact your Intel representative for further details and documentation. Table 2-6. BSEL[2:0] Frequency Table for BCLK[1:0] 2.10 BSEL2 BSEL1 BSEL0 FSB Frequency L L L 266 MHz L H L 200 MHz Absolute Maximum and Minimum Ratings Table 2-7 specifies absolute maximum and minimum ratings. Within functional operation limits, functionality and long-term reliability can be expected. At conditions outside functional operation condition limits, but within absolute maximum and minimum ratings, neither functionality nor long-term reliability can be expected. If a device is returned to conditions within functional operation limits after having been subjected to conditions outside these limits, but within the absolute maximum and minimum ratings, the device may be functional, but with its lifetime degraded depending on exposure to conditions exceeding the functional operation condition limits. At conditions exceeding absolute maximum and minimum ratings, neither functionality nor longterm reliability can be expected. Moreover, if a device is subjected to these conditions for any length of time then, when returned to conditions within the functional operating condition limits, it will either not function, or its reliability will be severely degraded. Although the processor contains protective circuitry to resist damage from static electric discharge, precautions should always be taken to avoid high static voltages or electric fields. Datasheet 23 Electrical Specifications Table 2-7. Processor DC Absolute Maximum Ratings Symbol Parameter Min Max Unit Notes1, VCC Core voltage with respect to VSS - 0.3 1.55 V — VTT FSB termination voltage with respect to VSS - 0.3 1.55 V — TC Processor case temperature See Chapter 5 See Chapter 5 °C — TSTORAGE Processor storage temperature –40 +85 °C 3, 4 2 NOTES: 1. 2. 3. 4. 2.11 For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must be satisfied. Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor. Storage temperature is applicable to storage conditions only. In this scenario, the processor must not receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect the long-term reliability of the device. For functional operation, refer to the processor case temperature specifications. This rating applies to the processor and does not include any tray or packaging. Processor DC Specifications The processor DC specifications in this section are defined at the processor core silicon and not at the package lands unless noted otherwise. See Chapter 4 for the signal definitions and signal assignments. Most of the signals on the processor FSB are in the GTL+ signal group. The DC specifications for these signals are listed in Table 2-12. Previously, legacy signals and Test Access Port (TAP) signals to the processor used low-voltage CMOS buffer types. However, these interfaces now follow DC specifications similar to GTL+. The DC specifications for these signal groups are listed in Table 2-11 and Table 2-13. Table 2-8 through Table 2-15 list the DC specifications for the Pentium 4 processor and are valid only while meeting specifications for case temperature, clock frequency, and input voltages. Care should be taken to read all notes associated with each parameter. MSR_PLATFORM_BRV bit 18 is a Platform Requirement Bit (PRB) that indicates whether the processor requires a 775_VR_CONFIG_04B (PRB = 1) or 775_VR_CONFIG_04A (PRB = 0) platform. 24 Datasheet Electrical Specifications Table 2-8. Voltage and Current Specifications (Sheet 1 of 2) Symbol VID range Processor Name/ Number Parameter Min Typ Max Unit Notes1 VID 1.200 — 1.400 V 2 Refer to Table 2-10 and Figure 2-3 V 3, 4, 5, 6, 7 Refer to Table 2-9and Figure 2-2 V 3, 4, 6, 7, 8, 9 A 7, 10 A 11, 12, 13 A 12, 13 Core Frequency VCC for 775_VR_CONFIG_04B processors VCC Extreme Edition 670/672 660/662 Processor Name/ Number 3.73 GHz (PRB = 1) 3.80 GHz (PRB = 1) 3.60 GHz (PRB = 1) Core Frequency VCC for 775_VR_CONFIG_04A processors VCC 650 3.40 GHz (PRB = 0) 640 3.20 GHz (PRB = 0) 630 Processor Name/ Number 3 GHz (PRB = 0) Core Frequency ICC for processor with multiple VID Extreme Edition ICC 3.73 GHz (PRB = 1) 119 670/672 3.80 GHz (PRB = 1) 660/662 3.60 GHz (PRB = 1) 650 3.40 GHz (PRB = 0) 78 640 3.20 GHz (PRB = 0) 78 630 3 GHz (PRB = 0) 78 Processor Name/ Number 119 — — 119 Core Frequency ICC Stop-Grant ISGNT Extreme Edition 3.73 GHz (PRB = 1) 670/672 3.80 GHz (PRB = 1) 660/662 3.60 GHz (PRB = 1) 650 3.40 GHz (PRB = 0) 40 640 3.20 GHz (PRB = 0) 40 630 3 GHz (PRB = 0) 40 Processor Name/ Number 62 62 — — 62 Core Frequency ICC Enhanced Auto Halt IENHANCED_ 670/672 3.80 GHz (PRB = 1) 40 AUTO_HALT 660/662 3.60 GHz (PRB = 1) 40 650 3.40 GHz (PRB = 0) 38 640 3.20 GHz (PRB = 0) 42 630 3 GHz (PRB = 0) 42 ITCC ICC TCC active VTT FSB termination voltage (DC+AC specifications) VTT_OUT ICC DC Current that may be drawn from VTT_OUT per pin Datasheet — — ICC A 14 1.14 1.20 1.26 V 15, 16 — — 580 mA 25 Electrical Specifications Table 2-8. Voltage and Current Specifications (Sheet 2 of 2) Symbol Parameter Min Typ Max Unit Notes1 ITT FSB termination current — — 3.5 A 13, 17 ICC_VCCA ICC for PLL lands — — 120 mA 13 ICC_VCCIOPLL ICC for I/O PLL land — — 100 mA 13 ICC_GTLREF ICC for GTLREF — — 200 μA 13 NOTES: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 26 Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and can not be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State). These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is required. See Section 2.4 and Table 2-2 for more information. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe. Refer to Table 2-10 and Figure 2-3 for the minimum, typical, and maximum VCC allowed for a given current. The processor should not be subjected to any VCC and ICC combination wherein VCC exceeds Vcc_max for a given current. 775_VR_CONFIG_04A and 775_VR_CONFIG_04B refers to voltage regulator configurations that are defined in the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. Refer to Table 2-9 and Figure 2-2 for the minimum, typical, and maximum VCC allowed for a given current. The processor should not be subjected to any VCC and ICC combination wherein VCC exceeds VCC_max for a given current. These frequencies will operate in a system designed for 775_VR_CONFIG_04B processors. The power and ICC will be incrementally higher in this configuration due to the improved loadline and resulting higher VCC. Icc_max is specified at VCC_max. The current specified is also for AutoHALT State. ICC Stop-Grant and ICC Auto Halt are specified at VCC_max. These parameters are based on design characterization and are not tested. The maximum instantaneous current the processor will draw while the thermal control circuit is active as indicated by the assertion of PROCHOT# is the same as the maximum ICC for the processor. VTT must be provided via a separate voltage source and not be connected to VCC. This specification is measured at the land. Baseboard bandwidth is limited to 20 MHz. This is maximum total current drawn from VTT plane by only the processor. This specification does not include the current coming from RTT (through the signal line). Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket to determine the total ITT drawn by the system. Contact your Intel representative for further details and documentation. Datasheet Electrical Specifications Table 2-9. VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Processors Voltage Deviation from VID Setting (V)1, 2, 3, 4 Icc (A) Maximum Voltage 1.70 mΩ Typical Voltage 1.75 mΩ Minimum Voltage 1.80 mΩ 0 0.000 -0.025 -0.050 5 -0.009 -0.034 -0.059 10 -0.017 -0.043 -0.068 15 -0.026 -0.051 -0.077 20 -0.034 -0.060 -0.086 25 -0.043 -0.069 -0.095 30 -0.051 -0.078 -0.104 35 -0.060 -0.086 -0.113 40 -0.068 -0.095 -0.122 45 -0.077 -0.104 -0.131 50 -0.085 -0.113 -0.140 55 -0.094 -0.121 -0.149 60 -0.102 -0.130 -0.158 65 -0.111 -0.139 -0.167 70 -0.119 -0.148 -0.176 75 -0.128 -0.156 -0.185 78 -0.133 -0.162 -0.190 NOTES: 1. 2. 3. 4. Datasheet The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.12. This table is intended to aid in reading discrete points on Figure 2-2. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. 27 Electrical Specifications Figure 2-2. VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Icc [A] 0 10 20 30 40 50 60 70 VID - 0.000 VID - 0.025 Vcc Maximum VID - 0.050 Vcc [V] VID - 0.075 VID - 0.100 Vcc Typical VID - 0.125 Vcc Minimum VID - 0.150 VID - 0.175 VID - 0.200 NOTES: 1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.12. 2. This loadline specification shows the deviation from the VID set point. 3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. 4. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. 28 Datasheet Electrical Specifications Table 2-10. VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Processors Voltage Deviation from VID Setting (V)1, 2, 3, 4 Icc (A) Maximum Voltage 1.30 mΩ Typical Voltage 1.35 mΩ Minimum Voltage 1.40 mΩ 0 0.000 -0.019 -0.038 5 -0.007 -0.026 -0.045 10 -0.013 -0.033 -0.052 15 -0.020 -0.039 -0.059 20 -0.026 -0.046 -0.066 25 -0.033 -0.053 -0.073 30 -0.039 -0.060 -0.080 35 -0.046 -0.066 -0.087 40 -0.052 -0.073 -0.094 45 -0.059 -0.080 -0.101 50 -0.065 -0.087 -0.108 55 -0.072 -0.093 -0.115 60 -0.078 -0.100 -0.122 65 -0.085 -0.107 -0.129 70 -0.091 -0.114 -0.136 75 -0.098 -0.120 -0.143 80 -0.104 -0.127 -0.150 85 -0.111 -0.134 -0.157 90 -0.117 -0.141 -0.164 95 -0.124 -0.147 -0.171 100 -0.130 -0.154 -0.178 105 -0.137 -0.161 -0.185 110 -0.143 -0.168 -0.192 115 -0.150 -0.174 -0.199 119 -0.155 -0.180 -0.205 NOTES: 1. 2. 3. 4. Datasheet The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.12. This table is intended to aid in reading discrete points on Figure 2-3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. 29 Electrical Specifications Figure 2-3. VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Icc [A] 0 10 20 30 40 50 60 70 80 90 100 110 120 VID - 0.000 VID - 0.019 VID - 0.038 Vcc Maximum VID - 0.057 VID - 0.076 Vcc [V] VID - 0.095 Vcc Typical VID - 0.114 VID - 0.133 Vcc Minimum VID - 0.152 VID - 0.171 VID - 0.190 VID - 0.209 VID - 0.228 NOTES: 1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.12. 2. This loadline specification shows the deviation from the VID set point. 3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. 4. Adherence to this loadline specification for the processor is required to ensure reliable processor operation. 30 Datasheet Electrical Specifications Table 2-11. GTL+ Asynchronous Signal Group DC Specifications Symbol VIL Parameter Input Low Voltage Notes1 Min Max Unit 0.0 VTT/2 – (0.10 * VTT) V 2, 3 VIH Input High Voltage VTT/2 + (0.10 * VTT) VTT V 3, 4, 5, 6 VOH Output High Voltage 0.90*VTT VTT V 5, 6, 7 IOL Output Low Current — VTT/[(0.50*RTT_MIN) + RON_MIN] A 8 ILI Input Leakage Current N/A ± 200 µA 9 ILO Output Leakage Current N/A ± 200 µA 10 RON Buffer On Resistance (at 1066 MHz FSB) 10.5 14.5 Ω — RON Buffer On Resistance (at 800 MHz FSB) 8 12 Ω — NOTES: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Unless otherwise noted, all specifications in this table apply to all processor frequencies. VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical low value. LINT0/INTR and LINT1/NMI use GTLREF as a reference voltage. For these two signals VIH = GTLREF + (0.10 * VTT) and VIL= GTLREF – (0.10 * VTT). VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical high value. VIH and VOH may experience excursions above VTT. However, input signal drivers must comply with the signal quality specifications. The VTT referred to in these specifications refers to instantaneous VTT. All outputs are open drain. The maximum output current is based on maximum current handling capability of the buffer and is not specified into the test load. Leakage to VSS with land held at VTT. Leakage to VTT with land held at 300 mV. Table 2-12. GTL+ Signal Group DC Specifications Symbol VIL Parameter Input Low Voltage Notes1 Min Max Unit 0.0 GTLREF – (0.10 * VTT) V 2, 3 VIH Input High Voltage GTLREF + (0.10 * VTT) VTT V 3, 4, 5 VOH Output High Voltage 0.90*VTT VTT V 3, 5 IOL Output Low Current N/A VTT/[(0.50*RTT_MIN) + RON_MIN] A — ILI Input Leakage Current N/A ± 200 µA 6 ILO Output Leakage Current N/A ± 200 µA 6 RON Buffer On Resistance (at 1066 MHz FSB) 10.5 14.5 Ω — RON Buffer On Resistance (at 800 MHz FSB) 8 12 Ω — NOTES: 1. 2. 3. 4. 5. 6. Datasheet Unless otherwise noted, all specifications in this table apply to all processor frequencies. VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical low value. The VTT referred to in these specifications is the instantaneous VTT. VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical high value. VIH and VOH may experience excursions above VTT. However, input signal drivers must comply with the signal quality specifications in. Leakage to VSS with land held at VTT. 31 Electrical Specifications . Table 2-13. PWRGOOD and TAP Signal Group DC Specifications Symbol VHYS Parameter Input Hysteresis Notes1, Min Max Unit 200 350 mV 3 VT+ Input low to high threshold voltage 0.5 * (VTT + VHYS_MIN) 0.5 * (VTT + VHYS_MAX) V 4 VT- Input high to low threshold voltage 0.5 * (VTT – VHYS_MAX) 0.5 * (VTT – VHYS_MIN) V 4 VOH Output High Voltage N/A VTT V 4 IOL Output Low Current — 45 mA 5 ILI Input Leakage Current — ± 200 µA 6 ILO Output Leakage Current — ± 200 µA — RON Buffer On Resistance 7 12 Ω — 2 NOTES: 1. 2. 3. 4. 5. 6. Unless otherwise noted, all specifications in this table apply to all processor frequencies. All outputs are open drain. VHYS represents the amount of hysteresis, nominally centered about 0.5 * VTT, for all TAP inputs. The VTT referred to in these specifications refers to instantaneous VTT. The maximum output current is based on maximum current handling capability of the buffer and is not specified into the test load. Leakage to VSS with land held at VTT. Table 2-14. VTTPWRGD DC Specifications Symbol Parameter Min Typ Max Unit VIL Input Low Voltage — — 0.3 V VIH Input High Voltage 0.9 — — V Notes Table 2-15. BSEL [2:0] and VID[5:0] DC Specifications Symbol Parameter RON (BSEL) Buffer On Resistance RON (VID) Buffer On Resistance IOL Max Land Current ILO Output Leakage Current VTOL Voltage Tolerance Notes1, Max Unit 60 Ω — 60 Ω — 8 mA — 200 µA 3 VTT (max) V — 2 NOTES: 1. 2. 3. Unless otherwise noted, all specifications in this table apply to all processor frequencies. These parameters are not tested and are based on design simulations. Leakage to VSS with land held at 2.5 V. Table 2-16. BOOTSELECT DC Specifications Symbol Parameter Min Typ Max Unit Notes VIL Input Low Voltage — — 0.24 V 1 VIH Input High Voltage 0.96 — — V — NOTES: 1. 32 These parameters are not tested and are based on design simulations. Datasheet Electrical Specifications 2.12 VCC Overshoot Specification The Pentium 4 processor can tolerate short transient overshoot events where VCC exceeds the VID voltage when transitioning from a high to low current load condition. This overshoot cannot exceed VID + VOS_MAX (VOS_MAX is the maximum allowable overshoot voltage). The time duration of the overshoot event must not exceed TOS_MAX (TOS_MAX is the maximum allowable time duration above VID). These specifications apply to the processor die voltage as measured across the VCC_SENSE and VSS_SENSE lands. Consult the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket for proper application of the overshoot specification. Table 2-17. VCC Overshoot Specifications Symbol Parameter Min Typ Max Unit Figure VOS_MAX Magnitude of VCC overshoot above VID — — 0.050 V 2-4 TOS_MAX Time duration of VCC overshoot above VID — — 25 μs 2-4 Figure 2-4. VCC Overshoot Example Waveform Example Overshoot Waveform Voltage (V) VID + 0.050 VOS VID TOS Time TOS: Overshoot time above VID VOS: Overshoot above VID NOTES: 1. VOS is measured overshoot voltage. 2. TOS is measured time duration above VID. 2.12.1 Die Voltage Validation Overshoot events from application testing on real processors must meet the specifications in Table 2-17 when measured across the VCC_SENSE and VSS_SENSE lands. Overshoot events that are < 10 ns in duration may be ignored. These measurements of processor die level overshoot should be taken with a 100 MHz bandwidth limited oscilloscope. Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket for additional voltage regulator validation details. Datasheet 33 Electrical Specifications 2.13 GTL+ FSB Specifications Termination resistors are not required for most GTL+ signals, as these are integrated into the processor silicon. Valid high and low levels are determined by the input buffers that compare a signal’s voltage with a reference voltage called GTLREF. Table 2-18 lists the GTLREF specifications. The GTL+ reference voltage (GTLREF) should be generated on the system board using high precision voltage divider circuits. Contact your Intel representative for further details and documentation. Table 2-18. GTL+Bus Voltage Definitions Symbol Min Typ Max Units Notes1 (0.98 * 0.67) * VTT 0.67 * VTT (1.02 * 0.67) * VTT V 2, 3, 4, 5 Parameter GTLREF Bus Reference Voltage RPULLUP On die pull-up for BOOTSELECT signal 500 — 5000 Ω 6 Termination Resistance 54 60 66 Ω 7 59.8 60.4 61 Ω 8 RTT COMP[1:0] COMP Resistance NOTES: 1. 2. 3. 4. 5. 6. 7. 8. Unless otherwise noted, all specifications in this table apply to all processor frequencies. The tolerances for this specification have been stated generically to enable the system designer to calculate the minimum and maximum values across the range of VTT. GTLREF should be generated from VTT by a voltage divider of 1% resistors or 1% matched resistors. Contact your Intel representative for further details and documentation. The VTT referred to in these specifications is the instantaneous VTT. The Intel 915G/915GV/915GL/915P/915PL and 925X/925XE Express chipset platforms use a pull-up resistor of 100 Ω and pull-down resistor of 210 Ω. Contact your Intel representative for further details and documentation. These pull-ups are to VTT. RTT is the on-die termination resistance measured at VTT/2 of the GTL+ output driver. COMP resistance must be provided on the system board with 1% resistors. Contact your Intel representative for further details and documentation.COMP[1:0] resistors are to VSS. Table 2-19. GTLREF Definition for Intel® 945G/945P/955X Express Chipset and Intel® E7230 Chipset Platforms Symbol Parameter Min Typ Max Units GTLREF_PU GTLREF pull-up resistor 124*0.99 124 124*1.01 Ω GTLREF_PD GTLREF pull-down resistor 210*0.99 210 210*1.01 Ω Notes1 NOTES: 1. GTLREF is to be generated from VTT by a voltage divider of 1% resistors (one divider for each GTLREF land). Refer to the appropriate platform design guide for additional implementation details. § 34 Datasheet Package Mechanical Specifications 3 Package Mechanical Specifications The Pentium 4 processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package that interfaces with the motherboard via an LGA775 socket. The package consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket. The package components shown in Figure 3-1 include the following: 1. 2. 3. 4. 5. Integrated Heat Spreader (IHS) Thermal Interface Material (TIM) Processor core (die) Package substrate Capacitors Figure 3-1. Processor Package Assembly Sketch Core (die) TIM IHS Substrate Capacitors LGA775 Socket System Board NOTE: 1. Socket and motherboard are included for reference and are not part of processor package. 3.1 Package Mechanical Drawing The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: 1. 2. 3. 4. 5. 6. Note: Datasheet Package reference with tolerances (total height, length, width, etc.) IHS parallelism and tilt Land dimensions Top-side and back-side component keep-out dimensions Reference datums All drawing dimensions are in mm [in]. Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the processor Thermal/Mechanical Design Guidelines. 35 Package Mechanical Specifications Figure 3-2. Processor Package Drawing 1 36 Datasheet Package Mechanical Specifications Figure 3-3. Processor Package Drawing 2 Datasheet 37 Package Mechanical Specifications Figure 3-4. Processor Package Drawing 3 38 Datasheet Package Mechanical Specifications 3.2 Processor Component Keep-Out Zones The processor may contain components on the substrate that define component keep-out zone requirements. A thermal and mechanical solution design must not intrude into the required keepout zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 3-2 and Figure 3-3 for keep-out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. 3.3 Package Loading Specifications Table 3-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum loading specification must be maintained by any thermal and mechanical solutions. . Table 3-1. Processor Loading Specifications Parameter Minimum Maximum Notes Static 80 N [18 lbf] 311 N [70 lbf] 1, 2, 3 Dynamic — 756 N [170 lbf] 1, 3, 4 NOTES: 1. 2. 3. 4. 3.4 These specifications apply to uniform compressive loading in a direction normal to the processor IHS. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified load on the processor package. These specifications are based on limited testing for design characterization. Loading limits are for the package only and does not include the limits of the processor socket. Dynamic loading is defined as the sum of the load on the package from a 1 lb heatsink mass accelerating through a 11 ms trapezoidal pulse of 50 g and the maximum static load. Package Handling Guidelines Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Table 3-2. Package Handling Guidelines Parameter Maximum Recommended Notes Shear 311 N [70 lbf] 1, 4 Tensile 111 N [25 lbf] 2, 4 Torque 3.95 N-m [35 lbf-in] 3, 4 NOTES: 1. 2. 3. 4. Datasheet A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface. These guidelines are based on limited testing for design characterization. 39 Package Mechanical Specifications 3.5 Package Insertion Specifications The Pentium 4 processor can be inserted into and removed from a LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the Pentium 4 processor is 21.5 g [0.76 oz]. This mass [weight] includes all the components that are included in the package. 3.7 Processor Materials Table 3-3 lists some of the package components and associated materials. Table 3-3. Processor Materials 3.8 Component Material Integrated Heat Spreader (IHS) Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Processor Markings Figure 3-5 and Figure 3-6 show the topside markings on the processor. These diagrams are to aid in the identification of the Pentium 4 processor Extreme Edition. Figure 3-5. Processor Top-Side Marking Example for Intel® Pentium® 4 Processor Extreme Edition S-Spec/CountryofAssy Frequency/L2Cache/Bus/ 775_VR_CONFIG_04x FPO INTEL m © ‘04 Pentium ® 4 SLxxx [COO] 3.73GHZ/2M/1066/04B [FPO] UniqueUnit Identifier ATPO Serial # 2-D MatrixMark ATPO S/N 40 Datasheet Package Mechanical Specifications Figure 3-6. Processor Top-Side Marking Example for Intel® Pentium® 4 Processor 6xx Sequence ProcessorNumber/S-Spec/ CountryofAssy Frequency/L2Cache/Bus/ 775_VR_CONFIG_04x FPO INTEL m © ‘04 Pentium ® 4 660 SLxxx [COO] 3.60GHZ/2M/800/04B [FPO] UniqueUnit Identifier ATPO Serial # 2-D MatrixMark ATPO S/N 3.9 Processor Land Coordinates Figure 3-7 shows the top view of the processor land coordinates. The coordinates are referred to throughout the document to identify processor lands. Datasheet 41 Package Mechanical Specifications . Figure 3-7. Processor Land Coordinates (Top View) VCC / VSS 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Socket 775 Quadrants Top View AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Address / Common Clock / Async 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VTT / Clocks Data § 42 Datasheet Land Listing and Signal Descriptions 4 Land Listing and Signal Descriptions This chapter provides the processor land assignment and signal descriptions. 4.1 Processor Land Assignments This section contains the land listings for the Pentium 4 processor. The land-out footprint is shown in Figure 4-1 and Figure 4-2. These figures represent the land-out arranged by land number and they show the physical location of each signal on the package land array (top view). Table 4-1 is a listing of all processor lands ordered alphabetically by land (signal) name. Table 4-2 is also a listing of all processor lands; the ordering is by land number. Datasheet 43 Land Listing and Signal Descriptions Figure 4-1. land-out Diagram (Top View – Left Side) 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AM VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AN AL VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AK VSS VSS VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AJ VSS VSS VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AH VCC VCC VCC VCC VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AG VCC VCC VCC VCC VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AF VSS VSS VSS VSS VSS VSS VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AE VSS VSS VSS VSS VSS VSS VSS VCC VCC VCC VSS VCC VCC VSS VSS VCC AD VCC VCC VCC VCC VCC VCC VCC VCC AC VCC VCC VCC VCC VCC VCC VCC VCC AB VSS VSS VSS VSS VSS VSS VSS VSS AA VSS VSS VSS VSS VSS VSS VSS VSS Y VCC VCC VCC VCC VCC VCC VCC VCC W VCC VCC VCC VCC VCC VCC VCC VCC V VSS VSS VSS VSS VSS VSS VSS VSS U VCC VCC VCC VCC VCC VCC VCC VCC T VCC VCC VCC VCC VCC VCC VCC VCC R VSS VSS VSS VSS VSS VSS VSS VSS P VSS VSS VSS VSS VSS VSS VSS VSS N VCC VCC VCC VCC VCC VCC VCC VCC M VCC VCC VCC VCC VCC VCC VCC VCC L VSS VSS VSS VSS VSS VSS VSS VSS K VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC DP3# DP0# VCC BSEL1 GTLREF _SEL VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS DP2# DP1# BSEL2 BSEL0 BCLK1 D47# D44# D35# D36# D32# D31# F RSVD BCLK0 VTT_SEL TESTHI0 TESTHI2 TESTHI7 RSVD VSS D43# D41# VSS D38# D37# VSS D30# E VSS VSS VSS VSS VSS RSVD RSVD D45# D42# VSS D40# D39# VSS D34# D33# VTT VTT VTT VTT VTT VSS FC9 D46# VSS D48# DBI2# VSS D49# RSVD VSS VSS D58# DBI3# VSS D54# DSTBP3# VSS D51# J H G D VTT TESTHI4 TESTHI5 TESTHI3 TESTHI6 RESET# DSTBN2# DSTBP2# C VTT VTT VTT VTT VTT VTT VSS VCCIO PLL B VTT VTT VTT VTT VTT VTT VSS VSSA D63# D59# VSS D60# D57# VSS D55# D53# A VTT VTT VTT VTT VTT VTT VSS VCCA D62# VSS RSVD D61# VSS D56# DSTBN3# VSS 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 44 Datasheet Land Listing and Signal Descriptions Figure 4-2. land-out Diagram (Top View – Right Side) 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VCC VSS VCC VCC VSS VCC VCC FC16 VSS_ SENSE VCC_ SENSE VSS VSS AN VCC VSS VCC VCC VSS VCC VCC FC12 VTTPWRGD VCC VSS VCC VCC VSS VCC VCC VSS VID3 FC11 VSS VID2 VID0 VSS AM VID1 VID5 VSS VCC VSS VCC VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS FC8 VSS VID4 ITP_CLK0 VSS THERMDC AK A35# A34# VSS ITP_CLK1 BPM0# BPM1# AJ VCC VSS VCC VCC VSS VCC VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS VSS A33# A32# VSS RSVD VSS AH A29# A31# A30# BPM5# BPM3# TRST# AG VCC VSS VCC VCC VSS VCC VCC VSS VSS A27# VCC VSS VCC VCC VSS VCC SKTOCC# VSS RSVD VSS A28# VSS BPM4# TDO AF RSVD FC18 VSS TCK AE VCC VSS A22# ADSTB1# VSS BINIT# BPM2# TDI AD VCC VSS VSS A25# RSVD VCC VSS A17# A24# A26# VSS DBR# TMS AC MCERR# IERR# VSS AB VCC VSS VSS A23# A21# VSS LL_ID1 VTT_OUT_ RIGHT AA VCC VSS A19# VSS A20# FC17 VSS BOOT SELECT Y VCC VSS A18# A16# VSS TESTHI1 TESTHI12 MSID0 W VCC VSS VCC VSS VSS A14# A15# VSS LL_ID0 MSID1 V A10# A12# A13# AP1# AP0# VSS U VCC VSS VSS A9# A11# VSS FC4 COMP1 T VSS FC2 R VSS_MB_ VCC_MB_ REGULATION REGULATION PROCHOT# THERMDA AL VCC VSS ADSTB0# VSS A8# FERR#/ PBE# VCC VSS A4# RSVD VSS INIT# SMI# TESTHI11 P VCC VSS VSS RSVD RSVD VSS IGNNE# PWRGOOD N STPCLK# THERMTRIP# VSS M VCC VSS REQ2# A5# A7# VCC VSS VSS A3# A6# VSS TESTHI13 LINT1 L VCC VSS REQ3# VSS REQ0# A20M# VSS LINT0 K J VCC VCC VCC VCC VCC VCC VCC VSS REQ4# REQ1# VSS FC22 FC3 VTT_OUT_ LEFT VSS VSS VSS VSS VSS VSS VSS VSS VSS TESTHI10 RSP# VSS FC6 GTLREF D29# D27# DSTBN1# DBI1# RSVD D16# BPRI# DEFER# RSVD FC7 TESTHI9 TESTHI8 FC1 VSS H G D28# VSS D24# D23# VSS D18# D17# VSS FC21 RS1# VSS BR0# FC5 F VSS D26# DSTBP1# VSS D21# D19# VSS RSVD RSVD FC20 HITM# TRDY# VSS E RSVD D25# VSS D15# D22# VSS D12# D20# VSS VSS HIT# VSS ADS# RSVD D52# VSS D14# D11# VSS RSVD DSTBN0# VSS D3# D1# VSS LOCK# BNR# DRDY# VSS FC19 D13# VSS D10# DSTBP0# VSS D6# D5# VSS D0# RS0# DBSY# VSS D50# COMP0 VSS D9# D8# VSS DBI0# D7# VSS D4# D2# RS2# VSS 14 13 12 11 10 9 8 7 6 5 4 3 2 Datasheet D C B A 1 45 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land # Signal Buffer Type Direction Land Name A3# L5 Source Synch Input/Output BCLK1 G28 A4# P6 Source Synch Input/Output BINIT# AD3 Common Clock Input/Output A5# M5 Source Synch Input/Output BNR# C2 Common Clock Input/Output A6# L4 Source Synch Input/Output BOOTSELECT Y1 A7# M4 Source Synch Input/Output BPM0# AJ2 Common Clock Input/Output A8# R4 Source Synch Input/Output BPM1# AJ1 Common Clock Input/Output A9# T5 Source Synch Input/Output BPM2# AD2 Common Clock Input/Output A10# U6 Source Synch Input/Output BPM3# AG2 Common Clock Input/Output Land Name 46 Table 4-1. Alphabetical Land Assignments Land # Signal Buffer Type Direction Clock Input Power/Other Input A11# T4 Source Synch Input/Output BPM4# AF2 Common Clock Input/Output A12# U5 Source Synch Input/Output BPM5# AG3 Common Clock Input/Output A13# U4 Source Synch Input/Output BPRI# G8 Common Clock A14# V5 Source Synch Input/Output BR0# F3 Common Clock Input/Output A15# V4 Source Synch Input/Output BSEL0 G29 Power/Other Output A16# W5 Source Synch Input/Output BSEL1 H30 Power/Other Output A17# AB6 Source Synch Input/Output BSEL2 G30 Power/Other Output A18# W6 Source Synch Input/Output COMP0 A13 Power/Other Input A19# Y6 Source Synch Input/Output COMP1 T1 Power/Other Input A20# Y4 Source Synch Input/Output D0# B4 Source Synch Input/Output Input A20M# K3 Asynch GTL+ Input D1# C5 Source Synch Input/Output A21# AA4 Source Synch Input/Output D2# A4 Source Synch Input/Output A22# AD6 Source Synch Input/Output D3# C6 Source Synch Input/Output A23# AA5 Source Synch Input/Output D4# A5 Source Synch Input/Output A24# AB5 Source Synch Input/Output D5# B6 Source Synch Input/Output A25# AC5 Source Synch Input/Output D6# B7 Source Synch Input/Output A26# AB4 Source Synch Input/Output D7# A7 Source Synch Input/Output A27# AF5 Source Synch Input/Output D8# A10 Source Synch Input/Output A28# AF4 Source Synch Input/Output D9# A11 Source Synch Input/Output A29# AG6 Source Synch Input/Output D10# B10 Source Synch Input/Output A30# AG4 Source Synch Input/Output D11# C11 Source Synch Input/Output A31# AG5 Source Synch Input/Output D12# D8 Source Synch Input/Output A32# AH4 Source Synch Input/Output D13# B12 Source Synch Input/Output A33# AH5 Source Synch Input/Output D14# C12 Source Synch Input/Output A34# AJ5 Source Synch Input/Output D15# D11 Source Synch Input/Output A35# AJ6 Source Synch Input/Output D16# G9 Source Synch Input/Output Common Clock Input/Output ADS# D2 ADSTB0# R6 ADSTB1# AD5 AP0# U2 AP1# U3 Common Clock Input/Output BCLK0 F28 D17# F8 Source Synch Input/Output Source Synch Input/Output D18# F9 Source Synch Input/Output Source Synch Input/Output D19# E9 Source Synch Input/Output Common Clock Input/Output D20# D7 Source Synch Input/Output D21# E10 Source Synch Input/Output D22# D10 Source Synch Input/Output Clock Input Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land # Signal Buffer Type D23# F11 Source Synch D24# F12 Source Synch D25# D13 Source Synch Input/Output DBI1# G11 Source Synch Input/Output D26# E13 Source Synch Input/Output DBI2# D19 Source Synch Input/Output D27# G13 Source Synch Input/Output DBI3# C20 Source Synch Input/Output D28# F14 Source Synch Input/Output DBR# AC2 Power/Other Output D29# G14 Source Synch Input/Output DBSY# B2 Common Clock Input/Output D30# F15 Source Synch Input/Output DEFER# G7 Common Clock D31# G15 Source Synch Input/Output DP0# J16 Common Clock Input/Output D32# G16 Source Synch Input/Output DP1# H15 Common Clock Input/Output D33# E15 Source Synch Input/Output DP2# H16 Common Clock Input/Output D34# E16 Source Synch Input/Output DP3# J17 Common Clock Input/Output D35# G18 Source Synch Input/Output DRDY# C1 Common Clock Input/Output D36# G17 Source Synch Input/Output DSTBN0# C8 Source Synch Input/Output D37# F17 Source Synch Input/Output DSTBN1# G12 Source Synch Input/Output D38# F18 Source Synch Input/Output DSTBN2# G20 Source Synch Input/Output D39# E18 Source Synch Input/Output DSTBN3# A16 Source Synch Input/Output D40# E19 Source Synch Input/Output DSTBP0# B9 Source Synch Input/Output Land Name Datasheet Table 4-1. Alphabetical Land Assignments Land Name Land # Input/Output D63# Input/Output DBI0# Direction Signal Buffer Type Direction B22 Source Synch Input/Output A8 Source Synch Input/Output Input D41# F20 Source Synch Input/Output DSTBP1# E12 Source Synch Input/Output D42# E21 Source Synch Input/Output DSTBP2# G19 Source Synch Input/Output D43# F21 Source Synch Input/Output DSTBP3# C17 Source Synch Input/Output D44# G21 Source Synch Input/Output FC1 G2 Power/Other Input D45# E22 Source Synch Input/Output FC2 R1 Power/Other Input D46# D22 Source Synch Input/Output FC3 J2 Power/Other Input D47# G22 Source Synch Input/Output FC4 T2 Power/Other Input D48# D20 Source Synch Input/Output FC5 F2 Common Clock Input D49# D17 Source Synch Input/Output FC6 H2 Power/Other Input D50# A14 Source Synch Input/Output FC7 G5 Source Synch Output D51# C15 Source Synch Input/Output FC8 AK6 D52# C14 Source Synch Input/Output FC9 D23 D53# B15 Source Synch Input/Output FC11 AM5 Power/Other Output D54# C18 Source Synch Input/Output FC12 AM7 Power/Other Output D55# B16 Source Synch Input/Output FC16 AN7 Power/Other Output D56# A17 Source Synch Input/Output FC17 Y3 D57# B18 Source Synch Input/Output FC18 AE3 D58# C21 Source Synch Input/Output FC19 B13 D59# B21 Source Synch Input/Output FC20 E5 D60# B19 Source Synch Input/Output FC21 F6 D61# A19 Source Synch Input/Output FC22 J3 D62# A22 Source Synch Input/Output FERR#/PBE# R3 Asynch GTL+ Output 47 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name 48 Land # Signal Buffer Type Table 4-1. Alphabetical Land Assignments Direction Land Name Land # GTLREF H1 Power/Other Input RESERVED N4 GTLREF_SEL H29 Power/Other Output RESERVED N5 Signal Buffer Type Direction HIT# D4 Common Clock Input/Output RESERVED P5 HITM# E4 Common Clock Input/Output RESERVED G6 IERR# AB2 Asynch GTL+ Output RESET# G23 Common Clock Input IGNNE# N2 Asynch GTL+ Input RS0# B3 Common Clock Input INIT# P3 Asynch GTL+ Input RS1# F5 Common Clock Input ITP_CLK0 AK3 TAP Input RS2# A3 Common Clock Input ITP_CLK1 AJ3 TAP Input RSP# H4 Common Clock Input LINT0 K1 Asynch GTL+ Input SKTOCC# AE8 Power/Other Output LINT1 L1 Asynch GTL+ Input SMI# P2 Asynch GTL+ Input LL_ID0 V2 Power/Other Output STPCLK# M3 Asynch GTL+ Input Power/Other Output TCK AE1 TAP Input TDI AD1 TAP Input LL_ID1 AA2 LOCK# C3 Common Clock Input/Output MCERR# AB3 Common Clock Input/Output MSID0 W1 Power/Other TDO AF1 TAP Output Output TESTHI0 F26 Power/Other Input MSID1 V1 Power/Other Output TESTHI1 W3 Power/Other Input PROCHOT# AL2 Asynch GTL+ Input/Output TESTHI2 F25 Power/Other Input PWRGOOD N1 Power/Other Input TESTHI3 G25 Power/Other Input REQ0# K4 Source Synch Input/Output TESTHI4 G27 Power/Other Input REQ1# J5 Source Synch Input/Output TESTHI5 G26 Power/Other Input REQ2# M6 Source Synch Input/Output TESTHI6 G24 Power/Other Input REQ3# K6 Source Synch Input/Output TESTHI7 F24 Power/Other Input REQ4# J6 Source Synch Input/Output TESTHI8 G3 Power/Other Input RESERVED A20 TESTHI9 G4 Power/Other Input RESERVED AC4 TESTHI10 H5 Power/Other Input RESERVED AE4 TESTHI11 P1 Power/Other Input RESERVED AE6 TESTHI12 W2 Power/Other Input RESERVED AH2 TESTHI13 L2 Asynch GTL+ Input RESERVED C9 THERMDA AL1 Power/Other RESERVED D1 THERMDC AK1 Power/Other RESERVED D14 THERMTRIP# M2 Asynch GTL+ Output RESERVED D16 TMS AC1 TAP Input RESERVED E23 TRDY# E3 Common Clock Input RESERVED E24 TRST# AG1 TAP Input RESERVED E6 VCC AA8 Power/Other RESERVED E7 VCC AB8 Power/Other RESERVED F23 VCC AC23 Power/Other RESERVED F29 VCC AC24 Power/Other RESERVED G10 VCC AC25 Power/Other Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Datasheet Land Name Land # Signal Buffer Type VCC AC26 VCC AC27 VCC VCC Table 4-1. Alphabetical Land Assignments Land Name Land # Signal Buffer Type Power/Other VCC AG19 Power/Other Power/Other VCC AG21 Power/Other AC28 Power/Other VCC AG22 Power/Other AC29 Power/Other VCC AG25 Power/Other VCC AC30 Power/Other VCC AG26 Power/Other VCC AC8 Power/Other VCC AG27 Power/Other VCC AD23 Power/Other VCC AG28 Power/Other VCC AD24 Power/Other VCC AG29 Power/Other VCC AD25 Power/Other VCC AG30 Power/Other VCC AD26 Power/Other VCC AG8 Power/Other VCC AD27 Power/Other VCC AG9 Power/Other VCC AD28 Power/Other VCC AH11 Power/Other VCC AD29 Power/Other VCC AH12 Power/Other VCC AD30 Power/Other VCC AH14 Power/Other VCC AD8 Power/Other VCC AH15 Power/Other VCC AE11 Power/Other VCC AH18 Power/Other VCC AE12 Power/Other VCC AH19 Power/Other VCC AE14 Power/Other VCC AH21 Power/Other VCC AE15 Power/Other VCC AH22 Power/Other VCC AE18 Power/Other VCC AH25 Power/Other VCC AE19 Power/Other VCC AH26 Power/Other VCC AE21 Power/Other VCC AH27 Power/Other VCC AE22 Power/Other VCC AH28 Power/Other VCC AE23 Power/Other VCC AH29 Power/Other Direction VCC AE9 Power/Other VCC AH30 Power/Other VCC AF11 Power/Other VCC AH8 Power/Other VCC AF12 Power/Other VCC AH9 Power/Other VCC AF14 Power/Other VCC AJ11 Power/Other VCC AF15 Power/Other VCC AJ12 Power/Other VCC AF18 Power/Other VCC AJ14 Power/Other VCC AF19 Power/Other VCC AJ15 Power/Other VCC AF21 Power/Other VCC AJ18 Power/Other VCC AF22 Power/Other VCC AJ19 Power/Other VCC AF8 Power/Other VCC AJ21 Power/Other VCC AF9 Power/Other VCC AJ22 Power/Other VCC AG11 Power/Other VCC AJ25 Power/Other VCC AG12 Power/Other VCC AJ26 Power/Other VCC AG14 Power/Other VCC AJ8 Power/Other VCC AG15 Power/Other VCC AJ9 Power/Other VCC AG18 Power/Other VCC AK11 Power/Other Direction 49 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments 50 Land Name Land # Signal Buffer Type VCC AK12 VCC AK14 VCC VCC Table 4-1. Alphabetical Land Assignments Land Name Land # Signal Buffer Type Power/Other VCC AN12 Power/Other Power/Other VCC AN14 Power/Other AK15 Power/Other VCC AN15 Power/Other AK18 Power/Other VCC AN18 Power/Other VCC AK19 Power/Other VCC AN19 Power/Other VCC AK21 Power/Other VCC AN21 Power/Other VCC AK22 Power/Other VCC AN22 Power/Other VCC AK25 Power/Other VCC AN25 Power/Other VCC AK26 Power/Other VCC AN26 Power/Other VCC AK8 Power/Other VCC AN29 Power/Other Direction VCC AK9 Power/Other VCC AN30 Power/Other VCC AL11 Power/Other VCC AN8 Power/Other VCC AL12 Power/Other VCC AN9 Power/Other VCC AL14 Power/Other VCC J10 Power/Other VCC AL15 Power/Other VCC J11 Power/Other VCC AL18 Power/Other VCC J12 Power/Other VCC AL19 Power/Other VCC J13 Power/Other VCC AL21 Power/Other VCC J14 Power/Other VCC AL22 Power/Other VCC J15 Power/Other VCC AL25 Power/Other VCC J18 Power/Other VCC AL26 Power/Other VCC J19 Power/Other VCC AL29 Power/Other VCC J20 Power/Other VCC AL30 Power/Other VCC J21 Power/Other VCC AL8 Power/Other VCC J22 Power/Other VCC AL9 Power/Other VCC J23 Power/Other VCC AM11 Power/Other VCC J24 Power/Other VCC AM12 Power/Other VCC J25 Power/Other VCC AM14 Power/Other VCC J26 Power/Other VCC AM15 Power/Other VCC J27 Power/Other VCC AM18 Power/Other VCC J28 Power/Other VCC AM19 Power/Other VCC J29 Power/Other VCC AM21 Power/Other VCC J30 Power/Other VCC AM22 Power/Other VCC J8 Power/Other VCC AM25 Power/Other VCC J9 Power/Other VCC AM26 Power/Other VCC K23 Power/Other VCC AM29 Power/Other VCC K24 Power/Other VCC AM30 Power/Other VCC K25 Power/Other VCC AM8 Power/Other VCC K26 Power/Other VCC AM9 Power/Other VCC K27 Power/Other VCC AN11 Power/Other VCC K28 Power/Other Direction Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name Land # Signal Buffer Type VCC K29 VCC K30 VCC VCC Land Name Land # Power/Other VCC U30 Power/Other Power/Other VCC U8 Power/Other K8 Power/Other VCC V8 Power/Other L8 Power/Other VCC W23 Power/Other VCC M23 Power/Other VCC W24 Power/Other VCC M24 Power/Other VCC W25 Power/Other VCC M25 Power/Other VCC W26 Power/Other VCC M26 Power/Other VCC W27 Power/Other VCC M27 Power/Other VCC W28 Power/Other VCC M28 Power/Other VCC W29 Power/Other VCC M29 Power/Other VCC W30 Power/Other VCC M30 Power/Other VCC W8 Power/Other VCC M8 Power/Other VCC Y23 Power/Other VCC N23 Power/Other VCC Y24 Power/Other VCC N24 Power/Other VCC Y25 Power/Other VCC N25 Power/Other VCC Y26 Power/Other VCC N26 Power/Other VCC Y27 Power/Other VCC N27 Power/Other VCC Y28 Power/Other VCC N28 Power/Other VCC Y29 Power/Other VCC N29 Power/Other VCC Y30 Power/Other VCC N30 Power/Other VCC Y8 Power/Other VCC N8 Power/Other VCC_MB_ REGULATION AN5 Power/Other Output VCC P8 Power/Other VCC_SENSE AN3 Power/Other Output VCC R8 Power/Other VCC T23 Power/Other VCC T24 Power/Other VCC T25 Power/Other VCC T26 Power/Other VCC T27 Power/Other VCC T28 Power/Other VCC T29 Power/Other VCC T30 Power/Other VCC T8 Power/Other VCC U23 Power/Other VCC U24 Power/Other VCC U25 Power/Other VCC U26 Power/Other VCC U27 Power/Other VCC U28 Power/Other VCC Datasheet Table 4-1. Alphabetical Land Assignments U29 Direction Signal Buffer Type Direction VCCA A23 Power/Other VCCIOPLL C23 Power/Other VID0 AM2 Power/Other Output VID1 AL5 Power/Other Output VID2 AM3 Power/Other Output VID3 AL6 Power/Other Output VID4 AK4 Power/Other Output VID5 AL4 Power/Other Output VSS A12 Power/Other VSS A15 Power/Other VSS A18 Power/Other VSS A2 Power/Other VSS A21 Power/Other VSS A24 Power/Other VSS A6 Power/Other VSS A9 Power/Other VSS AA23 Power/Other Power/Other 51 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments 52 Land Name Land # Signal Buffer Type VSS AA24 VSS AA25 VSS VSS Table 4-1. Alphabetical Land Assignments Land Name Land # Signal Buffer Type Power/Other VSS AF10 Power/Other Power/Other VSS AF13 Power/Other AA26 Power/Other VSS AF16 Power/Other AA27 Power/Other VSS AF17 Power/Other VSS AA28 Power/Other VSS AF20 Power/Other VSS AA29 Power/Other VSS AF23 Power/Other VSS AA3 Power/Other VSS AF24 Power/Other VSS AA30 Power/Other VSS AF25 Power/Other VSS AA6 Power/Other VSS AF26 Power/Other VSS AA7 Power/Other VSS AF27 Power/Other VSS AB1 Power/Other VSS AF28 Power/Other VSS AB23 Power/Other VSS AF29 Power/Other VSS AB24 Power/Other VSS AF3 Power/Other VSS AB25 Power/Other VSS AF30 Power/Other VSS AB26 Power/Other VSS AF6 Power/Other VSS AB27 Power/Other VSS AF7 Power/Other VSS AB28 Power/Other VSS AG10 Power/Other VSS AB29 Power/Other VSS AG13 Power/Other VSS AB30 Power/Other VSS AG16 Power/Other VSS AB7 Power/Other VSS AG17 Power/Other VSS AC3 Power/Other VSS AG20 Power/Other VSS AC6 Power/Other VSS AG23 Power/Other VSS AC7 Power/Other VSS AG24 Power/Other VSS AD4 Power/Other VSS AG7 Power/Other Direction VSS AD7 Power/Other VSS AH1 Power/Other VSS AE10 Power/Other VSS AH10 Power/Other VSS AE13 Power/Other VSS AH13 Power/Other VSS AE16 Power/Other VSS AH16 Power/Other VSS AE17 Power/Other VSS AH17 Power/Other VSS AE2 Power/Other VSS AH20 Power/Other VSS AE20 Power/Other VSS AH23 Power/Other VSS AE24 Power/Other VSS AH24 Power/Other VSS AE25 Power/Other VSS AH3 Power/Other VSS AE26 Power/Other VSS AH6 Power/Other VSS AE27 Power/Other VSS AH7 Power/Other VSS AE28 Power/Other VSS AJ10 Power/Other VSS AE29 Power/Other VSS AJ13 Power/Other VSS AE30 Power/Other VSS AJ16 Power/Other VSS AE5 Power/Other VSS AJ17 Power/Other VSS AE7 Power/Other VSS AJ20 Power/Other Direction Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Datasheet Land Name Land # Signal Buffer Type VSS AJ23 VSS AJ24 VSS VSS Table 4-1. Alphabetical Land Assignments Land Name Land # Signal Buffer Type Power/Other VSS AM24 Power/Other Power/Other VSS AM27 Power/Other AJ27 Power/Other VSS AM28 Power/Other AJ28 Power/Other VSS AM4 Power/Other VSS AJ29 Power/Other VSS AN1 Power/Other VSS AJ30 Power/Other VSS AN10 Power/Other VSS AJ4 Power/Other VSS AN13 Power/Other VSS AJ7 Power/Other VSS AN16 Power/Other VSS AK10 Power/Other VSS AN17 Power/Other VSS AK13 Power/Other VSS AN2 Power/Other VSS AK16 Power/Other VSS AN20 Power/Other VSS AK17 Power/Other VSS AN23 Power/Other VSS AK2 Power/Other VSS AN24 Power/Other VSS AK20 Power/Other VSS AN27 Power/Other VSS AK23 Power/Other VSS AN28 Power/Other VSS AK24 Power/Other VSS B1 Power/Other VSS AK27 Power/Other VSS B11 Power/Other VSS AK28 Power/Other VSS B14 Power/Other VSS AK29 Power/Other VSS B17 Power/Other VSS AK30 Power/Other VSS B20 Power/Other VSS AK5 Power/Other VSS B24 Power/Other VSS AK7 Power/Other VSS B5 Power/Other VSS AL10 Power/Other VSS B8 Power/Other VSS AL13 Power/Other VSS C10 Power/Other VSS AL16 Power/Other VSS C13 Power/Other VSS AL17 Power/Other VSS C16 Power/Other VSS AL20 Power/Other VSS C19 Power/Other VSS AL23 Power/Other VSS C22 Power/Other VSS AL24 Power/Other VSS C24 Power/Other VSS AL27 Power/Other VSS C4 Power/Other VSS AL28 Power/Other VSS C7 Power/Other VSS AL3 Power/Other VSS D12 Power/Other VSS AL7 Power/Other VSS D15 Power/Other VSS AM1 Power/Other VSS D18 Power/Other VSS AM10 Power/Other VSS D21 Power/Other VSS AM13 Power/Other VSS D24 Power/Other VSS AM16 Power/Other VSS D3 Power/Other VSS AM17 Power/Other VSS D5 Power/Other VSS AM20 Power/Other VSS D6 Power/Other VSS AM23 Power/Other VSS D9 Power/Other Direction Direction 53 Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Land Name 54 Land # Signal Buffer Type Table 4-1. Alphabetical Land Assignments Direction Land Name Land # Signal Buffer Type VSS E11 Power/Other VSS H9 Power/Other VSS E14 Power/Other VSS J4 Power/Other VSS E17 Power/Other VSS J7 Power/Other VSS E2 Power/Other VSS K2 Power/Other VSS E20 Power/Other VSS K5 Power/Other VSS E25 Power/Other VSS K7 Power/Other VSS E26 Power/Other VSS L23 Power/Other VSS E27 Power/Other VSS L24 Power/Other VSS E28 Power/Other VSS L25 Power/Other VSS E29 Power/Other VSS L26 Power/Other VSS E8 Power/Other VSS L27 Power/Other VSS F10 Power/Other VSS L28 Power/Other VSS F13 Power/Other VSS L29 Power/Other VSS F16 Power/Other VSS L3 Power/Other VSS F19 Power/Other VSS L30 Power/Other VSS F22 Power/Other VSS L6 Power/Other VSS F4 Power/Other VSS L7 Power/Other VSS F7 Power/Other VSS M1 Power/Other VSS G1 Power/Other VSS M7 Power/Other VSS H10 Power/Other VSS N3 Power/Other VSS H11 Power/Other VSS N6 Power/Other VSS H12 Power/Other VSS N7 Power/Other VSS H13 Power/Other VSS P23 Power/Other VSS H14 Power/Other VSS P24 Power/Other VSS H17 Power/Other VSS P25 Power/Other VSS H18 Power/Other VSS P26 Power/Other VSS H19 Power/Other VSS P27 Power/Other VSS H20 Power/Other VSS P28 Power/Other VSS H21 Power/Other VSS P29 Power/Other VSS H22 Power/Other VSS P30 Power/Other VSS H23 Power/Other VSS P4 Power/Other VSS H24 Power/Other VSS P7 Power/Other VSS H25 Power/Other VSS R2 Power/Other VSS H26 Power/Other VSS R23 Power/Other VSS H27 Power/Other VSS R24 Power/Other VSS H28 Power/Other VSS R25 Power/Other VSS H3 Power/Other VSS R26 Power/Other VSS H6 Power/Other VSS R27 Power/Other VSS H7 Power/Other VSS R28 Power/Other VSS H8 Power/Other VSS R29 Power/Other Direction Datasheet Land Listing and Signal Descriptions Table 4-1. Alphabetical Land Assignments Datasheet Land Name Land # Signal Buffer Type VSS R30 VSS R5 VSS VSS Table 4-1. Alphabetical Land Assignments Land Name Land # Signal Buffer Type Power/Other VTT A25 Power/Other Power/Other VTT A26 Power/Other R7 Power/Other VTT A27 Power/Other T3 Power/Other VTT A28 Power/Other VSS T6 Power/Other VTT A29 Power/Other VSS T7 Power/Other VTT A30 Power/Other VSS U1 Power/Other VTT B25 Power/Other VSS U7 Power/Other VTT B26 Power/Other VSS V23 Power/Other VTT B27 Power/Other VSS V24 Power/Other VTT B28 Power/Other VSS V25 Power/Other VTT B29 Power/Other VSS V26 Power/Other VTT B30 Power/Other VSS V27 Power/Other VTT C25 Power/Other VSS V28 Power/Other VTT C26 Power/Other VSS V29 Power/Other VTT C27 Power/Other VSS V3 Power/Other VTT C28 Power/Other VSS V30 Power/Other VTT C29 Power/Other VSS V6 Power/Other VTT C30 Power/Other VSS V7 Power/Other VTT D25 Power/Other VSS W4 Power/Other VTT D26 Power/Other VSS W7 Power/Other VTT D27 Power/Other VSS Y2 Power/Other VTT D28 Power/Other VSS Y5 Power/Other VTT D29 Power/Other VSS Y7 Power/Other VTT D30 Power/Other VSS_MB_ REGULATION AN6 Power/Other VTT_OUT_LEFT J1 Power/Other Output VTT_OUT_RIGHT AA1 Power/Other Output VSS_SENSE AN4 Power/Other VSSA B23 Power/Other Direction Output Direction Output VTT_SEL F27 Power/Other Output VTTPWRGD AM6 Power/Other Input 55 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # 56 Land Name Signal Buffer Type Direction Table 4-2. Numerical Land Assignment Land # Land Name Signal Buffer Type Direction A2 VSS Power/Other B13 FC19 A3 RS2# Common Clock Input B14 VSS Power/Other A4 D02# Source Synch Input/Output B15 D53# Source Synch Input/Output A5 D04# Source Synch Input/Output B16 D55# Source Synch Input/Output A6 VSS Power/Other B17 VSS Power/Other A7 D07# Source Synch Input/Output B18 D57# Source Synch Input/Output A8 DBI0# Source Synch Input/Output B19 D60# Source Synch Input/Output A9 VSS Power/Other B20 VSS Power/Other A10 D08# Source Synch Input/Output B21 D59# Source Synch Input/Output A11 D09# Source Synch Input/Output B22 D63# Source Synch Input/Output A12 VSS Power/Other B23 VSSA Power/Other A13 COMP0 Power/Other Input B24 VSS Power/Other A14 D50# Source Synch Input/Output B25 VTT Power/Other A15 VSS Power/Other B26 VTT Power/Other A16 DSTBN3# Source Synch Input/Output B27 VTT Power/Other A17 D56# Source Synch Input/Output B28 VTT Power/Other B29 VTT Power/Other B30 VTT Power/Other C1 DRDY# Common Clock Input/Output C2 BNR# Common Clock Input/Output Common Clock Input/Output A18 VSS Power/Other A19 D61# Source Synch A20 RESERVED A21 VSS Power/Other A22 D62# Source Synch C3 LOCK# A23 VCCA Power/Other C4 VSS Power/Other A24 VSS Power/Other C5 D01# Source Synch Input/Output A25 VTT Power/Other C6 D03# Source Synch Input/Output A26 VTT Power/Other C7 VSS Power/Other A27 VTT Power/Other C8 DSTBN0# Source Synch A28 VTT Power/Other C9 RESERVED A29 VTT Power/Other C10 VSS Input/Output Input/Output Input/Output Power/Other A30 VTT Power/Other C11 D11# Source Synch Input/Output B1 VSS Power/Other C12 D14# Source Synch Input/Output B2 DBSY# Common Clock Input/Output C13 VSS Power/Other B3 RS0# Common Clock Input C14 D52# Source Synch Input/Output B4 D00# Source Synch Input/Output C15 D51# Source Synch Input/Output B5 VSS Power/Other C16 VSS Power/Other B6 D05# Source Synch Input/Output C17 DSTBP3# Source Synch Input/Output B7 D06# Source Synch Input/Output C18 D54# Source Synch Input/Output B8 VSS Power/Other C19 VSS Power/Other B9 DSTBP0# Source Synch Input/Output C20 DBI3# Source Synch Input/Output B10 D10# Source Synch Input/Output C21 D58# Source Synch Input/Output B11 VSS Power/Other C22 VSS Power/Other B12 D13# Source Synch C23 VCCIOPLL Power/Other Input/Output Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Datasheet Land # Land Name Signal Buffer Type C24 VSS C25 VTT C26 C27 Table 4-2. Numerical Land Assignment Land # Land Name Power/Other E6 RESERVED Power/Other E7 RESERVED VTT Power/Other E8 VSS Power/Other VTT Power/Other E9 D19# Source Synch Input/Output C28 VTT Power/Other E10 D21# Source Synch Input/Output C29 VTT Power/Other E11 VSS Power/Other C30 VTT Power/Other E12 DSTBP1# Source Synch Input/Output D1 RESERVED E13 D26# Source Synch Input/Output D2 ADS# D3 VSS D4 HIT# D5 VSS Direction Common Clock Input/Output Power/Other Common Clock Input/Output Power/Other Signal Buffer Type Direction E14 VSS Power/Other E15 D33# Source Synch Input/Output E16 D34# Source Synch Input/Output E17 VSS Power/Other D6 VSS Power/Other E18 D39# Source Synch Input/Output D7 D20# Source Synch Input/Output E19 D40# Source Synch Input/Output D8 D12# Source Synch Input/Output E20 VSS Power/Other D9 VSS Power/Other E21 D42# Source Synch Input/Output Source Synch Input/Output D10 D22# Source Synch Input/Output E22 D45# D11 D15# Source Synch Input/Output E23 RESERVED E24 RESERVED E25 VSS Power/Other E26 VSS Power/Other E27 VSS Power/Other E28 VSS Power/Other E29 VSS Power/Other D12 VSS Power/Other D13 D25# Source Synch D14 RESERVED D15 VSS D16 RESERVED D17 D49# Input/Output Power/Other Source Synch Input/Output D18 VSS Power/Other F2 FC5 D19 DBI2# Source Synch Input/Output F3 BR0# D20 D48# Source Synch Input/Output F4 VSS Power/Other D21 VSS Power/Other F5 RS1# Common Clock D22 D46# Source Synch F6 FC21 D23 FC9 F7 VSS Power/Other D24 VSS Power/Other F8 D17# Source Synch Input/Output D25 VTT Power/Other F9 D18# Source Synch Input/Output D26 VTT Power/Other F10 VSS Power/Other D27 VTT Power/Other F11 D23# Source Synch Input/Output D28 VTT Power/Other F12 D24# Source Synch Input/Output D29 VTT Power/Other F13 VSS Power/Other Input/Output Common Clock Input Common Clock Input/Output Input D30 VTT Power/Other F14 D28# Source Synch Input/Output E2 VSS Power/Other F15 D30# Source Synch Input/Output E3 TRDY# Common Clock E4 HITM# Common Clock Input/Output E5 FC20 Input F16 VSS Power/Other F17 D37# Source Synch Input/Output F18 D38# Source Synch Input/Output 57 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # 58 Land Name Signal Buffer Type Direction Table 4-2. Numerical Land Assignment Land # Land Name Signal Buffer Type Direction F19 VSS Power/Other H1 GTLREF Power/Other Input F20 D41# Source Synch Input/Output H2 FC6 Power/Other Input F21 D43# Source Synch Input/Output H3 VSS Power/Other F22 VSS Power/Other H4 RSP# Common Clock Input F23 RESERVED H5 TESTHI10 Power/Other Input F24 TESTHI7 Power/Other Input H6 VSS Power/Other F25 TESTHI2 Power/Other Input H7 VSS Power/Other F26 TESTHI0 Power/Other Input H8 VSS Power/Other F27 VTT_SEL Power/Other Output H9 VSS Power/Other F28 BCLK0 Clock Input H10 VSS Power/Other F29 RESERVED G1 VSS Power/Other G2 FC1 Power/Other G3 TESTHI8 Power/Other G4 TESTHI9 Power/Other G5 FC7 Source Synch G6 RESERVED G7 DEFER# Common Clock Input G8 BPRI# Common Clock G9 D16# Source Synch G10 RESERVED G11 DBI1# Source Synch Input/Output G12 DSTBN1# Source Synch G13 D27# Source Synch G14 D29# Source Synch G15 D31# Source Synch G16 D32# G17 D36# H11 VSS Power/Other H12 VSS Power/Other Input H13 VSS Power/Other Input H14 VSS Power/Other Input H15 DP1# Common Clock Input/Output Output H16 DP2# Common Clock Input/Output H17 VSS Power/Other H18 VSS Power/Other Input H19 VSS Power/Other Input/Output H20 VSS Power/Other H21 VSS Power/Other H22 VSS Power/Other Input/Output H23 VSS Power/Other Input/Output H24 VSS Power/Other Input/Output H25 VSS Power/Other Input/Output H26 VSS Power/Other Source Synch Input/Output H27 VSS Power/Other Source Synch Input/Output H28 VSS Power/Other G18 D35# Source Synch Input/Output H29 GTLREF_SEL Power/Other Output G19 DSTBP2# Source Synch Input/Output H30 BSEL1 Power/Other Output G20 DSTBN2# Source Synch Input/Output J1 VTT_OUT_LEFT Power/Other Output G21 D44# Source Synch Input/Output J2 FC3 Power/Other Input G22 D47# Source Synch Input/Output J3 FC22 G23 RESET# Common Clock Input J4 VSS Power/Other G24 TESTHI6 Power/Other Input J5 REQ1# Source Synch Input/Output G25 TESTHI3 Power/Other Input J6 REQ4# Source Synch Input/Output G26 TESTHI5 Power/Other Input J7 VSS Power/Other G27 TESTHI4 Power/Other Input J8 VCC Power/Other G28 BCLK1 Clock Input J9 VCC Power/Other G29 BSEL0 Power/Other Output J10 VCC Power/Other G30 BSEL2 Power/Other Output J11 VCC Power/Other Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Datasheet Land # Land Name Signal Buffer Type J12 VCC Power/Other J13 VCC Power/Other J14 VCC J15 VCC J16 DP0# J17 DP3# J18 VCC J19 VCC J20 J21 Table 4-2. Numerical Land Assignment Land Name Signal Buffer Type L7 VSS Power/Other L8 VCC Power/Other Power/Other L23 VSS Power/Other Power/Other L24 VSS Power/Other Common Clock Input/Output L25 VSS Power/Other Common Clock Input/Output L26 VSS Power/Other Power/Other L27 VSS Power/Other Power/Other L28 VSS Power/Other VCC Power/Other L29 VSS Power/Other VCC Power/Other L30 VSS Power/Other J22 VCC Power/Other M1 VSS Power/Other J23 VCC Power/Other M2 THERMTRIP# Asynch GTL+ J24 VCC Power/Other M3 STPCLK# Asynch GTL+ Input J25 VCC Power/Other M4 A07# Source Synch Input/Output J26 VCC Power/Other M5 A05# Source Synch Input/Output J27 VCC Power/Other M6 REQ2# Source Synch Input/Output J28 VCC Power/Other M7 VSS Power/Other J29 VCC Power/Other M8 VCC Power/Other M23 VCC Power/Other M24 VCC Power/Other J30 VCC Power/Other K1 LINT0 Asynch GTL+ Direction Input Land # K2 VSS Power/Other M25 VCC Power/Other K3 A20M# Asynch GTL+ Input M26 VCC Power/Other K4 REQ0# Source Synch Input/Output M27 VCC Power/Other K5 VSS Power/Other M28 VCC Power/Other K6 REQ3# Source Synch M29 VCC Power/Other K7 VSS Power/Other M30 VCC Power/Other Input/Output Direction Output K8 VCC Power/Other N1 PWRGOOD Power/Other Input K23 VCC Power/Other N2 IGNNE# Asynch GTL+ Input K24 VCC Power/Other N3 VSS Power/Other K25 VCC Power/Other N4 RESERVED K26 VCC Power/Other N5 RESERVED K27 VCC Power/Other N6 VSS Power/Other K28 VCC Power/Other N7 VSS Power/Other K29 VCC Power/Other N8 VCC Power/Other K30 VCC Power/Other N23 VCC Power/Other L1 LINT1 Asynch GTL+ Input N24 VCC Power/Other L2 TESTHI13 Asynch GTL+ Input N25 VCC Power/Other L3 VSS Power/Other N26 VCC Power/Other L4 A06# Source Synch Input/Output N27 VCC Power/Other L5 A03# Source Synch Input/Output N28 VCC Power/Other L6 VSS Power/Other N29 VCC Power/Other 59 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # 60 Land Name Signal Buffer Type N30 VCC Power/Other P1 TESTHI11 Power/Other P2 SMI# P3 INIT# P4 VSS Power/Other P5 RESERVED P6 A04# Source Synch P7 VSS Power/Other Direction Table 4-2. Numerical Land Assignment Land # Land Name Signal Buffer Type T23 VCC Power/Other Input T24 VCC Power/Other Asynch GTL+ Input T25 VCC Power/Other Asynch GTL+ Input T26 VCC Power/Other T27 VCC Power/Other T28 VCC Power/Other T29 VCC Power/Other T30 VCC Power/Other Input/Output Direction P8 VCC Power/Other U1 VSS P23 VSS Power/Other U2 AP0# Common Clock Input/Output P24 VSS Power/Other U3 AP1# Common Clock Input/Output P25 VSS Power/Other U4 A13# Source Synch Input/Output P26 VSS Power/Other U5 A12# Source Synch Input/Output P27 VSS Power/Other U6 A10# Source Synch Input/Output P28 VSS Power/Other U7 VSS Power/Other P29 VSS Power/Other U8 VCC Power/Other P30 VSS Power/Other U23 VCC Power/Other R1 FC2 Power/Other U24 VCC Power/Other Input Power/Other R2 VSS Power/Other U25 VCC Power/Other R3 FERR#/PBE# Asynch GTL+ Output U26 VCC Power/Other R4 A08# Source Synch Input/Output U27 VCC Power/Other R5 VSS Power/Other U28 VCC Power/Other R6 ADSTB0# Source Synch U29 VCC Power/Other R7 VSS Power/Other U30 VCC Power/Other Input/Output R8 VCC Power/Other V1 MSID1 Power/Other Output R23 VSS Power/Other V2 LL_ID0 Power/Other Output R24 VSS Power/Other V3 VSS Power/Other R25 VSS Power/Other V4 A15# Source Synch Input/Output R26 VSS Power/Other V5 A14# Source Synch Input/Output R27 VSS Power/Other V6 VSS Power/Other R28 VSS Power/Other V7 VSS Power/Other R29 VSS Power/Other V8 VCC Power/Other R30 VSS Power/Other V23 VSS Power/Other T1 COMP1 Power/Other Input V24 VSS Power/Other Input V25 VSS Power/Other V26 VSS Power/Other T2 FC4 Power/Other T3 VSS Power/Other T4 A11# Source Synch Input/Output V27 VSS Power/Other T5 A09# Source Synch Input/Output V28 VSS Power/Other T6 VSS Power/Other V29 VSS Power/Other T7 VSS Power/Other V30 VSS Power/Other T8 VCC Power/Other W1 MSID0 Power/Other Output Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Datasheet Table 4-2. Numerical Land Assignment Land # Land Name Signal Buffer Type Direction Land # Land Name Signal Buffer Type W2 TESTHI12 Power/Other Input AA25 VSS Power/Other W3 TESTHI1 Power/Other Input AA26 VSS Power/Other W4 VSS Power/Other AA27 VSS Power/Other W5 A16# Source Synch Input/Output AA28 VSS Power/Other W6 A18# Source Synch Input/Output AA29 VSS Power/Other W7 VSS Power/Other AA30 VSS Power/Other Direction W8 VCC Power/Other AB1 VSS Power/Other W23 VCC Power/Other AB2 IERR# Asynch GTL+ W24 VCC Power/Other AB3 MCERR# W25 VCC Power/Other AB4 A26# Source Synch Input/Output W26 VCC Power/Other AB5 A24# Source Synch Input/Output W27 VCC Power/Other AB6 A17# Source Synch Input/Output W28 VCC Power/Other AB7 VSS Power/Other W29 VCC Power/Other AB8 VCC Power/Other AB23 VSS Power/Other AB24 VSS Power/Other AB25 VSS Power/Other AB26 VSS Power/Other AB27 VSS Power/Other AB28 VSS Power/Other Common Clock Input/Output W30 VCC Power/Other Y1 BOOTSELECT Power/Other Y2 VSS Power/Other Y3 FC17 Y4 A20# Source Synch Y5 VSS Power/Other Y6 A19# Source Synch AB29 VSS Power/Other Y7 VSS Power/Other AB30 VSS Power/Other Input Input/Output Input/Output Output Y8 VCC Power/Other AC1 TMS TAP Input Y23 VCC Power/Other AC2 DBR# Power/Other Output Y24 VCC Power/Other AC3 VSS Power/Other Y25 VCC Power/Other AC4 RESERVED Y26 VCC Power/Other AC5 A25# Source Synch Y27 VCC Power/Other AC6 VSS Power/Other Y28 VCC Power/Other AC7 VSS Power/Other Y29 VCC Power/Other AC8 VCC Power/Other Y30 VCC Power/Other AC23 VCC Power/Other AA1 VTT_OUT_RIGHT Power/Other Output AC24 VCC Power/Other AA2 LL_ID1 Power/Other Output AC25 VCC Power/Other AA3 VSS Power/Other AC26 VCC Power/Other AA4 A21# Source Synch Input/Output AC27 VCC Power/Other AA5 A23# Source Synch Input/Output AC28 VCC Power/Other AA6 VSS Power/Other AC29 VCC Power/Other AA7 VSS Power/Other AC30 VCC Power/Other TAP Input/Output AA8 VCC Power/Other AD1 TDI AA23 VSS Power/Other AD2 BPM2# Common Clock Input/Output Input AA24 VSS Power/Other AD3 BINIT# Common Clock Input/Output 61 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # 62 Land Name Signal Buffer Type Direction Table 4-2. Numerical Land Assignment Land # Land Name Signal Buffer Type AD4 VSS Power/Other AE29 VSS Power/Other AD5 ADSTB1# Source Synch Input/Output AE30 VSS Power/Other AD6 A22# Source Synch Input/Output AF1 TDO AD7 VSS Power/Other AF2 BPM4# TAP Direction Output Common Clock Input/Output AD8 VCC Power/Other AF3 VSS Power/Other AD23 VCC Power/Other AF4 A28# Source Synch Input/Output AD24 VCC Power/Other AF5 A27# Source Synch Input/Output AD25 VCC Power/Other AF6 VSS Power/Other AD26 VCC Power/Other AF7 VSS Power/Other AD27 VCC Power/Other AF8 VCC Power/Other AD28 VCC Power/Other AF9 VCC Power/Other AD29 VCC Power/Other AF10 VSS Power/Other AD30 VCC Power/Other AE1 TCK TAP AE2 VSS Power/Other AE3 FC18 AE4 RESERVED AE5 VSS AE6 RESERVED AE7 VSS AE8 SKTOCC# Power/Other AE9 VCC Power/Other Input Power/Other Power/Other Output AF11 VCC Power/Other AF12 VCC Power/Other AF13 VSS Power/Other AF14 VCC Power/Other AF15 VCC Power/Other AF16 VSS Power/Other AF17 VSS Power/Other AF18 VCC Power/Other AF19 VCC Power/Other AF20 VSS Power/Other AE10 VSS Power/Other AF21 VCC Power/Other AE11 VCC Power/Other AF22 VCC Power/Other AE12 VCC Power/Other AF23 VSS Power/Other AE13 VSS Power/Other AF24 VSS Power/Other AE14 VCC Power/Other AF25 VSS Power/Other AE15 VCC Power/Other AF26 VSS Power/Other AE16 VSS Power/Other AF27 VSS Power/Other AE17 VSS Power/Other AF28 VSS Power/Other AE18 VCC Power/Other AF29 VSS Power/Other AE19 VCC Power/Other AF30 VSS Power/Other AE20 VSS Power/Other AG1 TRST# AE21 VCC Power/Other AG2 BPM3# Common Clock Input/Output TAP Input AE22 VCC Power/Other AG3 BPM5# Common Clock Input/Output AE23 VCC Power/Other AG4 A30# Source Synch Input/Output AE24 VSS Power/Other AG5 A31# Source Synch Input/Output AE25 VSS Power/Other AG6 A29# Source Synch Input/Output AE26 VSS Power/Other AG7 VSS Power/Other AE27 VSS Power/Other AG8 VCC Power/Other AE28 VSS Power/Other AG9 VCC Power/Other Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # Datasheet Land Name Signal Buffer Type Direction Table 4-2. Numerical Land Assignment Land # Land Name Signal Buffer Type AG10 VSS Power/Other AH21 VCC Power/Other AG11 VCC Power/Other AH22 VCC Power/Other AG12 VCC Power/Other AH23 VSS Power/Other AG13 VSS Power/Other AH24 VSS Power/Other AG14 VCC Power/Other AH25 VCC Power/Other AG15 VCC Power/Other AH26 VCC Power/Other AG16 VSS Power/Other AH27 VCC Power/Other AG17 VSS Power/Other AH28 VCC Power/Other AG18 VCC Power/Other AH29 VCC Power/Other AG19 VCC Power/Other AH30 VCC Power/Other Direction AG20 VSS Power/Other AJ1 BPM1# Common Clock Input/Output AG21 VCC Power/Other AJ2 BPM0# Common Clock Input/Output AG22 VCC Power/Other AJ3 ITP_CLK1 TAP AG23 VSS Power/Other AJ4 VSS Power/Other Input AG24 VSS Power/Other AJ5 A34# Source Synch Input/Output AG25 VCC Power/Other AJ6 A35# Source Synch Input/Output AG26 VCC Power/Other AJ7 VSS Power/Other AG27 VCC Power/Other AJ8 VCC Power/Other AG28 VCC Power/Other AJ9 VCC Power/Other AG29 VCC Power/Other AJ10 VSS Power/Other AG30 VCC Power/Other AJ11 VCC Power/Other AH1 VSS Power/Other AJ12 VCC Power/Other AH2 RESERVED AJ13 VSS Power/Other AH3 VSS Power/Other AJ14 VCC Power/Other AH4 A32# Source Synch Input/Output AJ15 VCC Power/Other AH5 A33# Source Synch Input/Output AJ16 VSS Power/Other AH6 VSS Power/Other AJ17 VSS Power/Other AH7 VSS Power/Other AJ18 VCC Power/Other AH8 VCC Power/Other AJ19 VCC Power/Other AH9 VCC Power/Other AJ20 VSS Power/Other AH10 VSS Power/Other AJ21 VCC Power/Other AH11 VCC Power/Other AJ22 VCC Power/Other AH12 VCC Power/Other AJ23 VSS Power/Other AH13 VSS Power/Other AJ24 VSS Power/Other AH14 VCC Power/Other AJ25 VCC Power/Other AH15 VCC Power/Other AJ26 VCC Power/Other AH16 VSS Power/Other AJ27 VSS Power/Other AH17 VSS Power/Other AJ28 VSS Power/Other AH18 VCC Power/Other AJ29 VSS Power/Other AH19 VCC Power/Other AJ30 VSS Power/Other AH20 VSS Power/Other AK1 THERMDC Power/Other 63 Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # 64 Land Name Signal Buffer Type AK2 VSS Power/Other AK3 ITP_CLK0 TAP Input AK4 VID4 Power/Other Output AK5 VSS Power/Other Direction Table 4-2. Numerical Land Assignment Land # Land Name Signal Buffer Type AL13 VSS Power/Other AL14 VCC Power/Other AL15 VCC Power/Other AL16 VSS Power/Other AK6 FC8 AL17 VSS Power/Other AK7 VSS Power/Other AL18 VCC Power/Other AK8 VCC Power/Other AL19 VCC Power/Other AK9 VCC Power/Other AL20 VSS Power/Other AK10 VSS Power/Other AL21 VCC Power/Other AK11 VCC Power/Other AL22 VCC Power/Other AK12 VCC Power/Other AL23 VSS Power/Other AK13 VSS Power/Other AL24 VSS Power/Other AK14 VCC Power/Other AL25 VCC Power/Other AK15 VCC Power/Other AL26 VCC Power/Other AK16 VSS Power/Other AL27 VSS Power/Other AK17 VSS Power/Other AL28 VSS Power/Other AK18 VCC Power/Other AL29 VCC Power/Other AK19 VCC Power/Other AL30 VCC Power/Other Direction AK20 VSS Power/Other AM1 VSS Power/Other AK21 VCC Power/Other AM2 VID0 Power/Other Output AK22 VCC Power/Other AM3 VID2 Power/Other Output AK23 VSS Power/Other AM4 VSS Power/Other AK24 VSS Power/Other AM5 FC11 Power/Other Output AK25 VCC Power/Other AM6 VTTPWRGD Power/Other Input AK26 VCC Power/Other AM7 FC12 Power/Other Output AK27 VSS Power/Other AM8 VCC Power/Other AK28 VSS Power/Other AM9 VCC Power/Other AK29 VSS Power/Other AM10 VSS Power/Other AK30 VSS Power/Other AM11 VCC Power/Other AL1 THERMDA Power/Other AM12 VCC Power/Other AL2 PROCHOT# Asynch GTL+ AM13 VSS Power/Other AL3 VSS Power/Other AM14 VCC Power/Other AL4 VID5 Power/Other Output AM15 VCC Power/Other AL5 VID1 Power/Other Output AM16 VSS Power/Other AL6 VID3 Power/Other Output AM17 VSS Power/Other AL7 VSS Power/Other AM18 VCC Power/Other AL8 VCC Power/Other AM19 VCC Power/Other AL9 VCC Power/Other AM20 VSS Power/Other Input/Output AL10 VSS Power/Other AM21 VCC Power/Other AL11 VCC Power/Other AM22 VCC Power/Other AL12 VCC Power/Other AM23 VSS Power/Other Datasheet Land Listing and Signal Descriptions Table 4-2. Numerical Land Assignment Land # Datasheet Land Name Signal Buffer Type Direction Table 4-2. Numerical Land Assignment Land # Land Name Signal Buffer Type AM24 VSS Power/Other AN13 VSS Power/Other AM25 VCC Power/Other AN14 VCC Power/Other AM26 VCC Power/Other AN15 VCC Power/Other AM27 VSS Power/Other AN16 VSS Power/Other AM28 VSS Power/Other AN17 VSS Power/Other AM29 VCC Power/Other AN18 VCC Power/Other AM30 VCC Power/Other AN19 VCC Power/Other AN1 VSS Power/Other AN20 VSS Power/Other AN2 VSS Power/Other AN21 VCC Power/Other AN3 VCC_SENSE Power/Other Output AN22 VCC Power/Other AN4 VSS_SENSE Power/Other Output AN23 VSS Power/Other AN5 VCC_MB_ REGULATION Power/Other Output AN24 VSS Power/Other AN25 VCC Power/Other AN6 VSS_MB_ REGULATION Power/Other Output AN26 VCC Power/Other AN7 FC16 Power/Other Output AN27 VSS Power/Other AN8 VCC Power/Other AN28 VSS Power/Other AN9 VCC Power/Other AN29 VCC Power/Other AN10 VSS Power/Other AN30 VCC Power/Other AN11 VCC Power/Other AN12 VCC Power/Other Direction 65 Land Listing and Signal Descriptions 4.2 Alphabetical Signals Reference Table 4-3. Signal Description (Sheet 1 of 9) Name A[35:3]# Type Input/ Output Description A[35:3]# (Address) define a 236-byte physical memory address space. In subphase 1 of the address phase, these signals transmit the address of a transaction. In sub-phase 2, these signals transmit transaction type information. These signals must connect the appropriate pins/lands of all agents on the processor FSB. A[35:3]# are protected by parity signals AP[1:0]#. A[35:3]# are source synchronous signals and are latched into the receiving buffers by ADSTB[1:0]#. On the active-to-inactive transition of RESET#, the processor samples a subset of the A[35:3]# signals to determine power-on configuration. See Section 6.1 for more details. A20M# Input If A20M# (Address-20 Mask) is asserted, the processor masks physical address bit 20 (A20#) before looking up a line in any internal cache and before driving a read/write transaction on the bus. Asserting A20M# emulates the 8086 processor's address wrap-around at the 1-MB boundary. Assertion of A20M# is only supported in real mode. A20M# is an asynchronous signal. However, to ensure recognition of this signal following an Input/Output write instruction, it must be valid along with the TRDY# assertion of the corresponding Input/Output write bus transaction. ADS# Input/ Output ADS# (Address Strobe) is asserted to indicate the validity of the transaction address on the A[35:3]# and REQ[4:0]# signals. All bus agents observe the ADS# activation to begin parity checking, protocol checking, address decode, internal snoop, or deferred reply ID match operations associated with the new transaction. Address strobes are used to latch A[35:3]# and REQ[4:0]# on their rising and falling edges. Strobes are associated with signals as shown below. ADSTB[1:0]# AP[1:0]# BCLK[1:0] Input/ Output Input/ Output Input Signals Associated Strobe REQ[4:0]#, A[16:3]# ADSTB0# A[35:17]# ADSTB1# AP[1:0]# (Address Parity) are driven by the request initiator along with ADS#, A[35:3]#, and the transaction type on the REQ[4:0]#. A correct parity signal is high if an even number of covered signals are low and low if an odd number of covered signals are low. This allows parity to be high when all the covered signals are high. AP[1:0]# should connect the appropriate pins/lands of all processor FSB agents. The following table defines the coverage model of these signals. Request Signals Subphase 1 Subphase 2 A[35:24]# AP0# AP1# A[23:3]# AP1# AP0# REQ[4:0]# AP1# AP0# The differential pair BCLK (Bus Clock) determines the FSB frequency. All processor FSB agents must receive these signals to drive their outputs and latch their inputs. All external timing parameters are specified with respect to the rising edge of BCLK0 crossing VCROSS. 66 Datasheet Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 1 of 9) Name Type Description BINIT# (Bus Initialization) may be observed and driven by all processor FSB agents and if used, must connect the appropriate pins/lands of all such agents. If the BINIT# driver is enabled during power-on configuration, BINIT# is asserted to signal any bus condition that prevents reliable future operation. BINIT# Input/ Output If BINIT# observation is enabled during power-on configuration, and BINIT# is sampled asserted, symmetric agents reset their bus LOCK# activity and bus request arbitration state machines. The bus agents do not reset their IOQ and transaction tracking state machines upon observation of BINIT# activation. Once the BINIT# assertion has been observed, the bus agents will re-arbitrate for the FSB and attempt completion of their bus queue and IOQ entries. If BINIT# observation is disabled during power-on configuration, a central agent may handle an assertion of BINIT# as appropriate to the error handling architecture of the system. BNR# BOOTSELECT Input/ Output Input BNR# (Block Next Request) is used to assert a bus stall by any bus agent unable to accept new bus transactions. During a bus stall, the current bus owner cannot issue any new transactions. This input is required to determine whether the processor is installed in a platform that supports the Pentium 4 processor. The processor will not operate if this signal is low. This input has a weak internal pull-up to VCC. BPM[5:0]# (Breakpoint Monitor) are breakpoint and performance monitor signals. They are outputs from the processor that indicate the status of breakpoints and programmable counters used for monitoring processor performance. BPM[5:0]# should connect the appropriate pins/lands of all processor FSB agents. BPM[5:0]# Input/ Output BPM4# provides PRDY# (Probe Ready) functionality for the TAP port. PRDY# is a processor output used by debug tools to determine processor debug readiness. BPM5# provides PREQ# (Probe Request) functionality for the TAP port. PREQ# is used by debug tools to request debug operation of the processor. These signals do not have on-die termination. Refer to Section 2.5. Contact your Intel representative for further details and documentation. BPRI# Input BR0# Input/ Output BPRI# (Bus Priority Request) is used to arbitrate for ownership of the processor FSB. It must connect the appropriate pins/lands of all processor FSB agents. Observing BPRI# active (as asserted by the priority agent) causes all other agents to stop issuing new requests, unless such requests are part of an ongoing locked operation. The priority agent keeps BPRI# asserted until all of its requests are completed, then releases the bus by de-asserting BPRI#. BR0# (Bus Request) drives the BREQ0# signal in the system and is used by the processor to request the bus. During power-on configuration, this signal is sampled to determine the agent ID = 0. This signal does not have on-die termination and must be terminated. BSEL[2:0] Output The BCLK[1:0] frequency select signals BSEL[2:0] are used to select the processor input clock frequency. Table 2-6 defines the possible combinations of the signals and the frequency associated with each combination. The required frequency is determined by the processor, chipset, and clock synthesizer. All agents must operate at the same frequency. For more information about these signals, including termination recommendations, refer to Section 2.9. Contact your Intel representative for further details and documentation. COMP[1:0] Datasheet Analog COMP[1:0] must be terminated to VSS on the system board using precision resistors. Contact your Intel representative for further details and documentation. 67 Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 1 of 9) Name Type Description D[63:0]# (Data) are the data signals. These signals provide a 64-bit data path between the processor FSB agents, and must connect the appropriate pins/ lands on all such agents. The data driver asserts DRDY# to indicate a valid data transfer. D[63:0]# are quad-pumped signals and will, thus, be driven four times in a common clock period. D[63:0]# are latched off the falling edge of both DSTBP[3:0]# and DSTBN[3:0]#. Each group of 16 data signals correspond to a pair of one DSTBP# and one DSTBN#. The following table shows the grouping of data signals to data strobes and DBI#. Quad-Pumped Signal Groups D[63:0]# Input/ Output Data Group DSTBN#/ DSTBP# DBI# D[15:0]# 0 0 D[31:16]# 1 1 D[47:32]# 2 2 D[63:48]# 3 3 Furthermore, the DBI# signals determine the polarity of the data signals. Each group of 16 data signals corresponds to one DBI# signal. When the DBI# signal is active, the corresponding data group is inverted and therefore sampled active high. DBI[3:0]# (Data Bus Inversion) are source synchronous and indicate the polarity of the D[63:0]# signals.The DBI[3:0]# signals are activated when the data on the data bus is inverted. If more than half the data bits, within a 16-bit group, would have been asserted electrically low, the bus agent may invert the data bus signals for that particular sub-phase for that 16-bit group. DBI[3:0] Assignment To Data Bus DBI[3:0]# 68 Input/ Output Bus Signal Data Bus Signals DBI3# D[63:48]# DBI2# D[47:32]# DBI1# D[31:16]# DBI0# D[15:0]# DBR# Output DBR# (Debug Reset) is used only in processor systems where no debug port is implemented on the system board. DBR# is used by a debug port interposer so that an in-target probe can drive system reset. If a debug port is implemented in the system, DBR# is a no connect in the system. DBR# is not a processor signal. DBSY# Input/ Output DBSY# (Data Bus Busy) is asserted by the agent responsible for driving data on the processor FSB to indicate that the data bus is in use. The data bus is released after DBSY# is de-asserted. This signal must connect the appropriate pins/lands on all processor FSB agents. DEFER# Input DEFER# is asserted by an agent to indicate that a transaction cannot be guaranteed in-order completion. Assertion of DEFER# is normally the responsibility of the addressed memory or input/output agent. This signal must connect the appropriate pins/lands of all processor FSB agents. DP[3:0]# Input/ Output DP[3:0]# (Data parity) provide parity protection for the D[63:0]# signals. They are driven by the agent responsible for driving D[63:0]#, and must connect the appropriate pins/lands of all processor FSB agents. Datasheet Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 1 of 9) Name DRDY# Type Description Input/ Output DRDY# (Data Ready) is asserted by the data driver on each data transfer, indicating valid data on the data bus. In a multi-common clock data transfer, DRDY# may be de-asserted to insert idle clocks. This signal must connect the appropriate pins/lands of all processor FSB agents. DSTBN[3:0]# are the data strobes used to latch in D[63:0]#. DSTBN[3:0]# Input/ Output Signals Associated Strobe D[15:0]#, DBI0# DSTBN0# D[31:16]#, DBI1# DSTBN1# D[47:32]#, DBI2# DSTBN2# D[63:48]#, DBI3# DSTBN3# DSTBP[3:0]# are the data strobes used to latch in D[63:0]#. DSTBP[3:0]# FCx FERR#/PBE# GTLREF Associated Strobe D[15:0]#, DBI0# DSTBP0# D[31:16]#, DBI1# DSTBP1# D[47:32]#, DBI2# DSTBP2# D[63:48]#, DBI3# DSTBP3# Other FC signals are signals that are available for compatibility with other processors. Contact your Intel representative for further details and documentation. Output FERR#/PBE# (floating point error/pending break event) is a multiplexed signal and its meaning is qualified by STPCLK#. When STPCLK# is not asserted, FERR#/PBE# indicates a floating-point error and will be asserted when the processor detects an unmasked floating-point error. When STPCLK# is not asserted, FERR#/PBE# is similar to the ERROR# signal on the Intel 387 coprocessor, and is included for compatibility with systems using MS-DOS*type floating-point error reporting. When STPCLK# is asserted, an assertion of FERR#/PBE# indicates that the processor has a pending break event waiting for service. The assertion of FERR#/PBE# indicates that the processor should be returned to the Normal state. For additional information on the pending break event functionality, including the identification of support of the feature and enable/disable information, refer to volume 3 of the Intel Architecture Software Developer's Manual and the Intel Processor Identification and the CPUID Instruction application note. Input GTLREF determines the signal reference level for GTL+ input signals. GTLREF is used by the GTL+ receivers to determine if a signal is a logical 0 or logical 1. Contact your Intel representative for further details and documentation. GTLREF_SEL Output HIT# Input/ Output HITM# Datasheet Input/ Output Signals Input/ Output GTLREF_SEL is used to select the appropriate chipset GTLREF voltage. Contact your Intel representative for further details and documentation. HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop operation results. Any FSB agent may assert both HIT# and HITM# together to indicate that it requires a snoop stall that can be continued by reasserting HIT# and HITM# together. 69 Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 1 of 9) Name IERR# Type Output Description IERR# (Internal Error) is asserted by a processor as the result of an internal error. Assertion of IERR# is usually accompanied by a SHUTDOWN transaction on the processor FSB. This transaction may optionally be converted to an external error signal (e.g., NMI) by system core logic. The processor keeps IERR# asserted until the assertion of RESET#. This signal does not have on-die termination. Refer to Section 2.5 for termination requirements. IGNNE# Input IGNNE# (Ignore Numeric Error) is asserted to force the processor to ignore a numeric error and continue to execute noncontrol floating-point instructions. If IGNNE# is de-asserted, the processor generates an exception on a noncontrol floating-point instruction if a previous floating-point instruction caused an error. IGNNE# has no effect when the NE bit in control register 0 (CR0) is set. IGNNE# is an asynchronous signal. However, to ensure recognition of this signal following an Input/Output write instruction, it must be valid along with the TRDY# assertion of the corresponding Input/Output write bus transaction. INIT# Input INIT# (Initialization), when asserted, resets integer registers inside the processor without affecting its internal caches or floating-point registers. The processor then begins execution at the power-on Reset vector configured during power-on configuration. The processor continues to handle snoop requests during INIT# assertion. INIT# is an asynchronous signal and must connect the appropriate pins/lands of all processor FSB agents. If INIT# is sampled active on the active to inactive transition of RESET#, then the processor executes its Built-in Self-Test (BIST). ITP_CLK[1:0] LINT[1:0] Input Input ITP_CLK[1:0] are copies of BCLK that are used only in processor systems where no debug port is implemented on the system board. ITP_CLK[1:0] are used as BCLK[1:0] references for a debug port implemented on an interposer. If a debug port is implemented in the system, ITP_CLK[1:0] are no connects in the system. These are not processor signals. LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins/lands of all APIC Bus agents. When the APIC is disabled, the LINT0 signal becomes INTR, a maskable interrupt request signal, and LINT1 becomes NMI, a nonmaskable interrupt. INTR and NMI are backward compatible with the signals of those names on the Pentium processor. Both signals are asynchronous. Both of these signals must be software configured via BIOS programming of the APIC register space to be used either as NMI/INTR or LINT[1:0]. Because the APIC is enabled by default after Reset, operation of these signals as LINT[1:0] is the default configuration. LL_ID[1:0] LOCK# 70 Output Input/ Output The LL_ID[1:0] signals are used to select the correct loadline slope for the processor. LL_ID[1:0] = 00 for the Pentium 4 processor. LOCK# indicates to the system that a transaction must occur atomically. This signal must connect the appropriate pins/lands of all processor FSB agents. For a locked sequence of transactions, LOCK# is asserted from the beginning of the first transaction to the end of the last transaction. When the priority agent asserts BPRI# to arbitrate for ownership of the processor FSB, it will wait until it observes LOCK# de-asserted. This enables symmetric agents to retain ownership of the processor FSB throughout the bus locked operation and ensure the atomicity of lock. Datasheet Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 1 of 9) Name Type Description MCERR# (Machine Check Error) is asserted to indicate an unrecoverable error without a bus protocol violation. It may be driven by all processor FSB agents. MCERR# assertion conditions are configurable at a system level. Assertion options are defined by the following options: • Enabled or disabled. MCERR# Input/ Output • Asserted, if configured, for internal errors along with IERR#. • Asserted, if configured, by the request initiator of a bus transaction after it observes an error. • Asserted by any bus agent when it observes an error in a bus transaction. For more details regarding machine check architecture, refer to the IA-32 Software Developer’s Manual, Volume 3: System Programming Guide. MSID[1:0] PROCHOT# PWRGOOD Output MSID[1:0] are provided to indicate the market segment for the processor and may be used for future processor compatibility or for keying. Input/ Output As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that the processor has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the TCC, if enabled. The TCC remains active until the system de-asserts PROCHOT#. See Section 5.2.4 for more details. Input PWRGOOD (Power Good) is a processor input. The processor requires this signal to be a clean indication that the clocks and power supplies are stable and within their specifications. ‘Clean’ implies that the signal will remain low (capable of sinking leakage current), without glitches, from the time that the power supplies are turned on until they come within specification. The signal must then transition monotonically to a high state. PWRGOOD can be driven inactive at any time, but clocks and power must again be stable before a subsequent rising edge of PWRGOOD. The PWRGOOD signal must be supplied to the processor; it is used to protect internal circuits against voltage sequencing issues. It should be driven high throughout boundary scan operation. REQ[4:0]# RESET# Input/ Output Input REQ[4:0]# (Request Command) must connect the appropriate pins/lands of all processor FSB agents. They are asserted by the current bus owner to define the currently active transaction type. These signals are source synchronous to ADSTB0#. Refer to the AP[1:0]# signal description for a details on parity checking of these signals. Asserting the RESET# signal resets the processor to a known state and invalidates its internal caches without writing back any of their contents. For a power-on Reset, RESET# must stay active for at least one millisecond after VCC and BCLK have reached their proper specifications. On observing active RESET#, all FSB agents will de-assert their outputs within two clocks. RESET# must not be kept asserted for more than 10 ms while PWRGOOD is asserted. A number of bus signals are sampled at the active-to-inactive transition of RESET# for power-on configuration. These configuration options are described in the Section 6.1. This signal does not have on-die termination and must be terminated on the system board. RS[2:0]# Datasheet Input RS[2:0]# (Response Status) are driven by the response agent (the agent responsible for completion of the current transaction), and must connect the appropriate pins/lands of all processor FSB agents. 71 Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 1 of 9) Name RSP# SKTOCC# SMI# Type Input Output Input Description RSP# (Response Parity) is driven by the response agent (the agent responsible for completion of the current transaction) during assertion of RS[2:0]#, the signals for which RSP# provides parity protection. It must connect to the appropriate pins/lands of all processor FSB agents. A correct parity signal is high if an even number of covered signals are low and low if an odd number of covered signals are low. While RS[2:0]# = 000, RSP# is also high, since this indicates it is not being driven by any agent guaranteeing correct parity. SKTOCC# (Socket Occupied) will be pulled to ground by the processor. System board designers may use this signal to determine if the processor is present. SMI# (System Management Interrupt) is asserted asynchronously by system logic. On accepting a System Management Interrupt, the processor saves the current state and enters System Management Mode (SMM). An SMI Acknowledge transaction is issued, and the processor begins program execution from the SMM handler. If SMI# is asserted during the de-assertion of RESET#, the processor will tristate its outputs. STPCLK# Input STPCLK# (Stop Clock), when asserted, causes the processor to enter a low power Stop-Grant state. The processor issues a Stop-Grant Acknowledge transaction, and stops providing internal clock signals to all processor core units except the FSB and APIC units. The processor continues to snoop bus transactions and service interrupts while in Stop-Grant state. When STPCLK# is de-asserted, the processor restarts its internal clock to all units and resumes execution. The assertion of STPCLK# has no effect on the bus clock; STPCLK# is an asynchronous input. TCK Input TCK (Test Clock) provides the clock input for the processor Test Bus (also known as the Test Access Port). TDI Input TDI (Test Data In) transfers serial test data into the processor. TDI provides the serial input needed for JTAG specification support. TDO Output TESTHI[13:0] TESTHI[13:0] must be connected to the processor’s appropriate power source (refer to VTT_OUT_LEFT and VTT_OUT_RIGHT signal description) through a resistor for proper processor operation. See Section 2.5 for more details. THERMDA Other Thermal Diode Anode. See Section 5.2.7. THERMDC Other Thermal Diode Cathode. See Section 5.2.7. Output In the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the maximum TC. Assertion of THERMTRIP# (Thermal Trip) indicates the processor junction temperature has reached a level beyond where permanent silicon damage may occur. Upon assertion of THERMTRIP#, the processor will shut off its internal clocks (thus, halting program execution) in an attempt to reduce the processor junction temperature. To protect the processor, its core voltage (VCC) must be removed following the assertion of THERMTRIP#. Driving of the THERMTRIP# signal is enabled within 10 μs of the assertion of PWRGOOD and is disabled on de-assertion of PWRGOOD. Once activated, THERMTRIP# remains latched until PWRGOOD is de-asserted. While the deassertion of the PWRGOOD signal will de-assert THERMTRIP#, if the processor’s junction temperature remains at or above the trip level, THERMTRIP# will again be asserted within 10 μs of the assertion of PWRGOOD. Input TMS (Test Mode Select) is a JTAG specification support signal used by debug tools. THERMTRIP# TMS 72 Input TDO (Test Data Out) transfers serial test data out of the processor. TDO provides the serial output needed for JTAG specification support. Datasheet Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 1 of 9) Name Type Description TRDY# Input TRDY# (Target Ready) is asserted by the target to indicate that it is ready to receive a write or implicit writeback data transfer. TRDY# must connect the appropriate pins/lands of all FSB agents. TRST# Input TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be driven low during power on Reset. VCC Input VCC are the power pins for the processor. The voltage supplied to these pins is determined by the VID[5:0] pins. VCCA Input VCCA provides isolated power for the internal processor core PLLs. VCCIOPLL Input VCCIOPLL provides isolated power for internal processor FSB PLLs. VCC_SENSE Output VCC_SENSE is an isolated low impedance connection to processor core power (VCC). It can be used to sense or measure voltage near the silicon with little noise. VCC_MB_ REGULATION Output This land is provided as a voltage regulator feedback sense point for VCC. It is connected internally in the processor package to the sense point land U27 as described in the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775. VID[5:0] Output VID[5:0] (Voltage ID) signals are used to support automatic selection of power supply voltages (VCC). These are open drain signals that are driven by the processor and must be pulled up on the motherboard. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775 for more information. The voltage supply for these signals must be valid before the VR can supply VCC to the processor. Conversely, the VR output must be disabled until the voltage supply for the VID signals becomes valid. The VID signals are needed to support the processor voltage specification variations. See Table 2-2 for definitions of these signals. The VR must supply the voltage that is requested by the signals, or disable itself. Contact your Intel representative for further details and documentation. VSS Input VSS are the ground pins for the processor and should be connected to the system ground plane. VSSA Input VSSA is the isolated ground for internal PLLs. VSS_SENSE Output VSS_SENSE is an isolated low impedance connection to processor core VSS. It can be used to sense or measure ground near the silicon with little noise. VSS_MB_ REGULATION Output This land is provided as a voltage regulator feedback sense point for VSS. It is connected internally in the processor package to the sense point land V27 as described in the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775. VTT Miscellaneous voltage supply. The VTT_OUT_LEFT and VTT_OUT_RIGHT signals are included to provide a voltage supply for some signals that require termination to VTT on the motherboard. Contact your Intel representative for further details and documentation. For future processor compatibility some signals are required to be pulled up to VTT_OUT_LEFT or VTT_OUT_RIGHT. Refer to the following table for the signals that should be pulled up to VTT_OUT_LEFT and VTT_OUT_RIGHT. VTT_OUT_LEFT Output VTT_OUT_RIGHT Datasheet Pull-up 4Signal Signals to be Pulled Up VTT_OUT_RIGHT VTT_PWRGOOD, VID[5:0], GTLREF, TMS, TDI, TDO, BPM[5:0], other VRD components VTT_OUT_LEFT RESET#, BR0#, PWRGOOD, TESTHI1, TESTHI8, TESTHI9, TESTHI10, TESTHI11, TESTHI12 73 Land Listing and Signal Descriptions Table 4-3. Signal Description (Sheet 1 of 9) Name VTT_SEL VTTPWRGD Type Output Input Description The VTT_SEL signal is used to select the correct VTT voltage level for the processor. The processor requires this input to determine that the VTT voltages are stable and within specification. § 74 Datasheet Thermal Specifications and Design Considerations 5 Thermal Specifications and Design Considerations 5.1 Processor Thermal Specifications The Pentium 4 processor requires a thermal solution to maintain temperatures within operating limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. As processor technology changes, thermal management becomes increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to reliable, long-term system operation. A complete thermal solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting. For more information on designing a component level thermal solution, refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-land LGA Package Thermal Design Guidelines. Note: 5.1.1 The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on the boxed processor. Thermal Specifications To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed such that the processor remains within the minimum and maximum case temperature (TC) specifications when operating at or below the Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, refer to the appropriate processor thermal design guidelines. The Pentium 4 processor introduces a new methodology for managing processor temperatures that is intended to support acoustic noise reduction through fan speed control. Selection of the appropriate fan speed is based on the temperature reported by the processor’s Thermal Diode. If the diode temperature is greater than or equal to TCONTROL, then the processor case temperature must remain at or below the temperature as specified by the thermal profile. If the diode temperature is less than TCONTROL, then the case temperature is permitted to exceed the thermal profile, but the diode temperature must remain at or below TCONTROL. Systems that implement fan speed control must be designed to take these conditions into account. Systems that do not alter the fan speed only need to guarantee the case temperature meets the thermal profile specifications. To determine a processor's case temperature specification based on the thermal profile, it is necessary to accurately measure processor power dissipation. Datasheet 75 Thermal Specifications and Design Considerations The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained periods of time. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained period of time. For more details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature must be enabled for the processor to remain within specification. Table 5-1. Processor Thermal Specifications Thermal Minimum TC Design Power (°C) (W) Processor Name/Number Core Frequency (GHz) Extreme Edition 3.73 (PRB = 1) 115 670/672 3.80 (PRB = 1) 660/662 Maximum TC (°C) Notes 5 See Table 5-2 and Figure 5-1 1, 2 115 5 See Table 5-2 and Figure 5-1 1, 2 3.60 (PRB = 1) 115 5 See Table 5-2 and Figure 5-1 1, 2 650 3.40 (PRB = 0) 84 5 See Table 5-3 and Figure 5-2 1, 2 640 3.20 (PRB = 0) 84 5 See Table 5-3 and Figure 5-2 1, 2 630 3 (PRB = 0) 84 5 See Table 5-3 and Figure 5-2 1, 2 NOTES: 1. 2. 76 Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed combinations of power and TC. Datasheet Thermal Specifications and Design Considerations Table 5-2. Thermal Profile for Processors with PRB = 1 Power (W) Maximum TC (°C) Power (W) Maximum TC (°C) Power (W) Maximum TC (°C) Power (W) Maximum TC (°C) 0 44.3 30 51.2 60 58.1 90 65.0 2 44.8 32 51.7 62 58.6 92 65.5 4 45.2 34 52.1 64 59.0 94 65.9 6 45.7 36 52.6 66 59.5 96 66.4 8 46.1 38 53.0 68 59.9 98 66.8 10 46.6 40 53.5 70 60.4 100 67.3 12 47.1 42 54.0 72 60.9 102 67.8 14 47.5 44 54.4 74 61.3 104 68.2 16 48.0 46 54.9 76 61.8 106 68.7 18 48.4 48 55.3 78 62.2 108 69.1 20 48.9 50 55.8 80 62.7 110 69.6 22 49.4 52 56.3 82 63.2 112 70.1 24 49.8 54 56.7 84 63.6 114 70.5 26 50.3 56 57.2 86 64.1 115 70.8 28 50.7 58 57.6 88 64.5 Figure 5-1. Thermal Profile for Processors with PRB = 1 75.0 70.0 y = 0.23x + 44.3 65.0 Tcase (C) 60.0 55.0 50.0 45.0 40.0 0 Datasheet 10 20 30 40 50 60 Power (W) 70 80 90 100 110 77 Thermal Specifications and Design Considerations Table 5-3. Thermal Profile for Processors with PRB = 0 Power (W) Maximum TC (°C) Power (W) Maximum TC (°C) Power (W) Maximum TC (°C) 0 43.9 30 52.0 60 60.1 2 44.4 32 52.5 62 60.6 4 45.0 34 53.1 64 61.2 6 45.5 36 53.6 66 61.7 8 46.1 38 54.2 68 62.3 10 46.6 40 54.7 70 62.8 12 47.1 42 55.2 72 63.3 14 47.7 44 55.8 74 63.9 16 48.2 46 56.3 76 64.4 18 48.8 48 56.9 78 65.0 20 49.3 50 57.4 80 65.5 22 49.8 52 57.9 82 66.0 24 50.4 54 58.5 84 66.6 26 50.9 56 59.0 28 51.5 58 59.6 Figure 5-2. Thermal Profile for Processors with PRB = 0 70.0 y = 0.27x + 43.9 65.0 Tcase (C) 60.0 55.0 50.0 45.0 40.0 0 78 10 20 30 40 Power (W) 50 60 70 80 Datasheet Thermal Specifications and Design Considerations 5.1.2 Thermal Metrology The maximum and minimum case temperatures (TC) are specified in Table 5-1. These temperature specifications are meant to help ensure proper operation of the processor. Figure 5-3 illustrates where Intel recommends TC thermal measurements should be made. For detailed guidelines on temperature measurement methodology, refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-land LGA Package Thermal Design Guidelines. Figure 5-3. Case Temperature (TC) Measurement Location 37.5 mm Measure TC at this point (geometric center of the package) 37.5 mm 5.2 Processor Thermal Features 5.2.1 Thermal Monitor The Thermal Monitor feature helps control the processor temperature by activating the TCC when the processor silicon reaches its maximum operating temperature. The TCC reduces processor power consumption as needed by modulating (starting and stopping) the internal processor core clocks. The Thermal Monitor feature must be enabled for the processor to be operating within specifications. The temperature at which Thermal Monitor activates the Thermal Control Circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal manner, and interrupt requests are latched (and serviced during the time that the clocks are on) while the TCC is active. When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TCC is active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to the processor (typically 30–50%). Clocks often will not be off for more than 3.0 microseconds when the TCC is active. Cycle times are processor speed dependent and will decrease as processor core frequencies increase. A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near its maximum operating temperature. Once the temperature has dropped below the maximum operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases. Datasheet 79 Thermal Specifications and Design Considerations With a properly designed and characterized thermal solution, it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications. The processor performance impact due to these brief periods of TCC activation is expected to be so minor that it would be immeasurable. An under-designed thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss, and in some cases may result in a TC that exceeds the specified maximum temperature and may affect the long-term reliability of the processor. In addition, a thermal solution that is significantly under-designed may not be capable of cooling the processor even when the TCC is active continuously. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-land LGA Package Thermal Design Guidelines for information on designing a thermal solution. The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and cannot be modified. The Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines. 5.2.2 Thermal Monitor 2 Thermal Monitor 2 provides an efficient mechanism for limiting the processor temperature by reducing power consumption within the processor. When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the enhanced Thermal Control Circuit (TCC) will be activated. This enhanced TCC causes the processor to adjust its operating frequency (bus multiplier) and input voltage (VID). This combination of reduced frequency and VID results in a decrease in processor power consumption. A processor enabled for Thermal Monitor 2 includes two operating points, each consisting of a specific operating frequency and voltage. The first point represents the normal operating conditions for the processor. The second point consists of both a lower operating frequency and voltage. When the enhanced TCC is activated, the processor automatically transitions to the new frequency. This transition occurs very rapidly (on the order of 5 us). During the frequency transition, the processor is unable to service any bus requests, and consequently, all bus traffic is blocked. Edge-triggered interrupts will be latched and kept pending until the processor resumes operation at the new frequency. Once the new operating frequency is engaged, the processor will transition to the new core operating voltage by issuing a new VID code to the voltage regulator. The voltage regulator must support VID transitions to support Thermal Monitor 2. During the voltage change, it will be necessary to transition through multiple VID codes to reach the target operating voltage. Each step will be one VID table entry (i.e., 12.5 mV steps). The processor continues to execute instructions during the voltage transition. Operation at this lower voltage reduces both the dynamic and leakage power consumption of the processor, providing a reduction in power consumption at a minimum performance impact. Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first to insure proper operation once the processor reaches its normal operating frequency. Refer to Figure 5-4 for an illustration of this ordering. 80 Datasheet Thermal Specifications and Design Considerations Figure 5-4. Thermal Monitor 2 Frequency and Voltage Ordering TTM2 Temperature fMAX fTM2 Frequency VID VIDTM2 VID PROCHOT# Time The PROCHOT# signal is asserted when a high temperature situation is detected, regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled. It should be noted that the Thermal Monitor 2 TCC can not be activated via the on demand mode. The Thermal Monitor TCC, however, can be activated through the use of the on demand mode. If a processor has its Thermal Control Circuit activated via a Thermal Monitor 2 event, and an Enhanced Intel SpeedStep technology transition to a higher target frequency (through the applicable MSR write) is attempted, this frequency transition will be delayed until the TCC is deactivated and the TM2 event is complete. Table 5-4 lists the Intel Pentium 4 processors in this document that support Thermal Monitor 2. Table 5-4. Thermal Monitor 2 Support Processor Name/Number Thermal Monitor 2 Supported1 Extreme Edition No 670/672 Yes 660/662 Yes 650 No 640 No 630 No NOTES: 1. Datasheet Refer to the Intel® Pentium® 4 Processor on 90 nm Process Specification Update for a complete list of the processor steppings and frequencies that support this feature. 81 Thermal Specifications and Design Considerations 5.2.3 On-Demand Mode The Pentium 4 processor provides an auxiliary mechanism that allows system software to force the processor to reduce its power consumption. This mechanism is referred to as "On-Demand" mode and is distinct from the Thermal Monitor feature. On-Demand mode is intended as a means to reduce system level power consumption. Systems using the Pentium 4 processor must not rely on software usage of this mechanism to limit the processor temperature. If bit 4 of the ACPI P_CNT Control Register (located in the processor IA32_THERM_CONTROL MSR) is written to a '1', the processor will immediately reduce its power consumption via modulation (starting and stopping) of the internal core clock, independent of the processor temperature. When using On-Demand mode, the duty cycle of the clock modulation is programmable via bits 3:1 of the same ACPI P_CNT Control Register. In On-Demand mode, the duty cycle can be programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-Demand mode may be used in conjunction with the Thermal Monitor. If the system tries to enable On-Demand mode at the same time the TCC is engaged, the factory configured duty cycle of the TCC will override the duty cycle selected by the On-Demand mode. 5.2.4 PROCHOT# Signal An external signal, PROCHOT# (processor hot), is asserted when the processor die temperature has reached its maximum operating temperature. If the Thermal Monitor is enabled (note that the Thermal Monitor must be enabled for the processor to be operating within specification), the TCC will be active when PROCHOT# is asserted. The processor can be configured to generate an interrupt upon the assertion or de-assertion of PROCHOT#. Refer to the Intel Architecture Software Developer's Manuals for specific register and programming details. The Pentium 4 processor implements a bi-directional PROCHOT# capability to allow system designs to protect various components from over-temperature situations. The PROCHOT# signal is bi-directional in that it can either signal when the processor has reached its maximum operating temperature or be driven from an external source to activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means for thermal protection of system components. One application is the thermal protection of voltage regulators (VR). System designers can create a circuit to monitor the VR temperature and activate the TCC when the temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and activating the TCC, the VR can cool down as a result of reduced processor power consumption. Bi-directional PROCHOT# can allow VR thermal designs to target maximum sustained current instead of maximum current. Systems should still provide proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in case of system cooling failure. The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its Thermal Design Power. With a properly designed and characterized thermal solution, it is anticipated that bi-directional PROCHOT# would only be asserted for very short periods of time when running the most power intensive applications. An under-designed thermal solution that is not able to prevent excessive assertion of PROCHOT# in the anticipated ambient environment may cause a noticeable performance loss. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775 for details on implementing the bi-directional PROCHOT# feature. Contact your Intel representative for further details and documentation. 82 Datasheet Thermal Specifications and Design Considerations 5.2.5 THERMTRIP# Signal Regardless of whether or not the Thermal Monitor feature is enabled, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in Table 4-3). At this point, the FSB signal THERMTRIP# will go active and stay active as described in Table 4-3. THERMTRIP# activation is independent on processor activity and does not generate any bus cycles. 5.2.6 TCONTROL and Fan Speed Reduction TCONTROL is a temperature specification based on a temperature reading from the thermal diode. The value for TCONTROL will be calibrated in manufacturing and configured for each processor. When TDIODE is above TCONTROL, TC must be at or below TC(max) as defined by the thermal profile in Table 5-2 and Figure 5-1; otherwise, the processor temperature can be maintained at TCONTROL (or lower) as measured by the thermal diode. The purpose of this feature is to support acoustic optimization through fan speed control. Contact your Intel representative for further details and documentation. 5.2.7 Thermal Diode The processor incorporates an on-die thermal diode. A thermal sensor located on the system board may monitor the die temperature of the processor for thermal management/long term die temperature change purposes. Table 5-5 and Table 5-6 provide the diode parameter and interface specifications. This thermal diode is separate from the Thermal Monitor’s thermal sensor and cannot be used to predict the behavior of the Thermal Monitor. Table 5-5. Thermal Diode Parameters Symbol IFW n RT Parameter Forward Bias Current Min Typ Max Unit 11 — 187 µA Diode Ideality Factor 1.0083 1.011 1.023 Series Resistance 3.242 3.33 3.594 Notes 1 2, 3, 4, 5 Ω 2, 3, 6 NOTES: 1. 2. 3. 4. Intel does not support or recommend operation of the thermal diode under reverse bias. Characterized at 75 °C. Not 100% tested. Specified by design characterization. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode equation: IFW = IS * (e qVD/nkT –1) where IS = saturation current, q = electronic charge, VD = voltage across the diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin). 5. 6. Devices found to have an ideality factor of 1.0183 to 1.023 will create a temperature error approximately 2 °C higher than the actual temperature. To minimize any potential acoustic impact of this temperature error, TCONTROL will be increased by 2 °C on these parts. The series resistance, RT, is provided to allow for a more accurate measurement of the thermal diode temperature. RT, as defined, includes the pins of the processor but does not include any socket resistance or board trace resistance between the socket and the external remote diode thermal sensor. RT can be used by remote diode thermal sensors with automatic series resistance cancellation to calibrate out this error term. Another application is that a temperature offset can be manually calculated and programmed into an offset register in the remote diode thermal sensors as exemplified by the equation: Terror = [RT * (N–1) * IFWmin] / [nk/q * ln N] where Terror = sensor temperature error, N = sensor current ratio, k = Boltzmann Constant, q = electronic charge. Datasheet 83 Thermal Specifications and Design Considerations Table 5-6. Thermal Diode Interface Signal Name Land Number Signal Description THERMDA AL1 diode anode THERMDC AK1 diode cathode § 84 Datasheet Features 6 Features This chapter contains power-on configuration options and clock control/low power state descriptions. 6.1 Power-On Configuration Options Several configuration options can be configured by hardware. The Pentium 4 processor samples the hardware configuration at reset, on the active-to-inactive transition of RESET#. For specifications on these options, refer to Table 6-1. The sampled information configures the processor for subsequent operation. These configuration options cannot be changed except by another reset. All resets reconfigure the processor; for reset purposes, the processor does not distinguish between a “warm” reset and a “power-on” reset. Table 6-1. Power-On Configuration Option Signals Configuration Option Signal1, 2 Output tristate SMI# Execute BIST INIT# In Order Queue pipelining (set IOQ depth to 1) A7# Disable MCERR# observation A9# Disable BINIT# observation A10# APIC Cluster ID (0-3) A[12:11]# Disable bus parking A15# Disable Hyper-Threading Technology A31# Symmetric agent arbitration ID BR0# RESERVED A[6:3]#, A8#, A[14:13]#, A[16:30]#, A[32:35]# NOTES: 1. 2. Datasheet Asserting this signal during RESET# will select the corresponding option. Address signals not identified in this table as configuration options should not be asserted during RESET#. 85 Features 6.2 Clock Control and Low Power States The processor allows the use of AutoHALT and Stop-Grant states to reduce power consumption by stopping the clock to internal sections of the processor, depending on each particular state. See Figure 6-1 for a visual representation of the processor low power states. Figure 6-1. Processor Low Power State Machine HALT or MWAIT Instruction and HALT Bus Cycle Generated Norm al State Normal execution STPCLK# Asserted INIT#, BINIT#, INTR, NMI, SMI#, RESET#, FSB interrupts STPCLK# Deasserted # LK C ted P r ST s se A # d LK erte PC ss T S e-a D Enhanced HALT or HALT State BCLK running Snoops and interrupts allow ed Snoop Event Occurs Snoop Event Serviced Enhanced HALT Snoop or HALT Snoop State BCLK running Service snoops to caches Stop-Grant State BCLK running Snoops and interrupts allow ed 6.2.1 Snoop Event Occurs Snoop Event Serviced Grant Snoop State BCLK running Service snoops to caches Normal State This is the normal operating state for the processor. 86 Datasheet Features 6.2.2 HALT and Enhanced HALT Powerdown States Table 6-2 lists the Intel Pentium 4 processors in this document that support Enhanced Halt Powerdown. Table 6-2. Enhanced Halt Powerdown Support Processor Name/Number Enhanced Halt Powerdown Supported1 Extreme Edition Yes2 670/672 Yes 660/662 Yes 650 Yes 640 Yes 630 Yes NOTES: 1. 2. Refer to the Intel® Pentium® 4 Processor on 90 nm Process Specification Update for a complete list of the processor steppings and frequencies that support this feature. This feature is enabled for Pentium 4 Extreme Edition but there will be no thermal benefits if the feature is used. The Enhanced HALT Powerdown state is configured and enabled via the BIOS. The Enhanced HALT state is a lower power state as compared to the Stop Grant State. If Enhanced HALT is not enabled, the default Powerdown state entered will be HALT. Refer to the following sections for details about the HALT and Enhanced HALT states. 6.2.2.1 HALT Powerdown State HALT is a low power state entered when all the logical processors have executed the HALT or MWAIT instructions. When one of the logical processors executes the HALT instruction, that logical processor is halted; however, the other processor continues normal operation. The processor will transition to the Normal state upon the occurrence of SMI#, BINIT#, INIT#, or LINT[1:0] (NMI, INTR). RESET# causes the processor to immediately initialize itself. The return from a System Management Interrupt (SMI) handler can be to either Normal Mode or the HALT Power Down state. See the Intel Architecture Software Developer's Manual, Volume III: System Programmer's Guide for more information. The system can generate a STPCLK# while the processor is in the HALT Power Down state. When the system deasserts the STPCLK# interrupt, the processor will return execution to the HALT state. While in HALT Power Down state, the processor will process bus snoops. Datasheet 87 Features 6.2.2.2 Enhanced HALT Powerdown State Enhanced HALT is a low power state entered when all logical processors have executed the HALT or MWAIT instructions and Enhanced HALT has been enabled via the BIOS. When one of the logical processors executes the HALT instruction, that logical processor is halted; however, the other processor continues normal operation. The processor will automatically transition to a lower frequency and voltage operating point before entering the Enhanced HALT state. Note that the processor FSB frequency is not altered; only the internal core frequency is changed. When entering the low power state, the processor will first switch to the lower bus ratio and then transition to the lower VID. While in Enhanced HALT state, the processor will process bus snoops. The processor exits the Enhanced HALT state when a break event occurs. When the processor exits the Enhanced HALT state, it will first transition the VID to the original value and then change the bus ratio back to the original value. 6.2.3 Stop-Grant State When the STPCLK# signal is asserted, the Stop-Grant state of the processor is entered 20 bus clocks after the response phase of the processor-issued Stop Grant Acknowledge special bus cycle. Since the GTL+ signals receive power from the FSB, these signals should not be driven (allowing the level to return to VTT) for minimum power drawn by the termination resistors in this state. In addition, all other input signals on the FSB should be driven to the inactive state. BINIT# will not be serviced while the processor is in Stop-Grant state. The event will be latched and can be serviced by software upon exit from the Stop Grant state. RESET# will cause the processor to immediately initialize itself, but the processor will stay in Stop-Grant state. A transition back to the Normal state will occur with the de-assertion of the STPCLK# signal. A transition to the HALT/Grant Snoop state will occur when the processor detects a snoop on the FSB. While in the Stop-Grant State, SMI#, INIT#, BINIT#, and LINT[1:0] will be latched by the processor, and only serviced when the processor returns to the Normal State. Only one occurrence of each event will be recognized upon return to the Normal state. While in Stop-Grant state, the processor will process a FSB snoop. 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State The Enhanced HALT Snoop State is used in conjunction with the new Enhanced HALT state. If Enhanced HALT state is not enabled in the BIOS, the default Snoop State entered will be the HALT Snoop State. Refer to the following sections for details on HALT Snoop State, Grant Snoop State and Enhanced HALT Snoop State. 88 Datasheet Features 6.2.5 HALT Snoop State, Grant Snoop State The processor will respond to snoop transactions on the FSB while in Stop-Grant state or in HALT Power Down state. During a snoop transaction, the processor enters the HALT:Grant Snoop state. The processor will stay in this state until the snoop on the FSB has been serviced (whether by the processor or another agent on the FSB). After the snoop is serviced, the processor will return to the Stop-Grant state or HALT Power Down state, as appropriate. 6.2.5.1 Enhanced HALT Snoop State The Enhanced HALT Snoop State is the default Snoop State when the Enhanced HALT state is enabled via the BIOS. The processor will remain in the lower bus ratio and VID operating point of the Enhanced HALT state. While in the Enhanced HALT Snoop State, snoops are handled the same way as in the HALT Snoop State. After the snoop is serviced the processor will return to the Enhanced HALT Power Down state. Enhanced Intel SpeedStep® Technology 6.2.6 The Pentium 4 processor 6xx sequence features include Enhanced Intel SpeedStep technology. This technology enables the processor to switch between multiple frequency and voltage points to enable power savings. The system must support dynamic VID transitions. Switching between voltage/frequency states is software controlled. Note: Not all processors are capable of supporting Enhanced Intel SpeedStep technology. More details on which processor frequencies will support this feature will be provided in future releases of the Intel® Pentium® 4 Processor on 90 nm Process Specification Update. Enhanced Intel SpeedStep technology is a technology that creates processor performance states (P states). P states are power consumption and capability states within the Normal state as shown in Figure 6-1. Enhanced Intel SpeedStep technology enables real-time dynamic switching between frequency and voltage points. It alters the performance of the processor by changing the bus-tocore frequency ratio and voltage. This allows the processor to run at different core frequencies and voltages to best serve the performance and power requirements of the processor and system. Note that the front side bus is not altered; only the internal core frequency is changed. To run at reduced power consumption, the voltage is altered in step with the bus ratio. The following are key features of Enhanced Intel SpeedStep technology: • Multiple voltage/frequency operating points provide optimal performance at reduced power consumption. • Voltage/Frequency selection is software controlled by writing to processor MSRs (Model Specific Registers) that eliminates chipset dependency. — If the target frequency is higher than the current frequency, VCC is incremented in steps (+12.5 mV) by placing a new value on the VID signals; the PLL then locks to the new frequency. Note that the top frequency for the processor can not be exceeded. — If the target frequency is lower than the current frequency, the PLL locks to the new frequency and VCC is then decremented in steps (-12.5 mV) by changing the target VID through the VID signals. § Datasheet 89 Features 90 Datasheet Boxed Processor Specifications 7 Boxed Processor Specifications The Pentium 4 processor will also be offered as a boxed processor. Boxed processors are intended for system integrators who build systems from baseboards and standard components. The boxed Pentium 4 processor will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed Pentium 4 processor. This chapter is particularly important for OEMs that manufacture baseboards for system integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed Pentium 4 processor. Note: Drawings in this section reflect only the specifications on the boxed processor product. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designers’ responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis. Refer to the Intel® Pentium® 4 Processor on 90 nm Process on 90 nm Process in the 775-land LGA Package Thermal Design Guidelines for further guidance. Figure 7-1. Mechanical Representation of the Boxed Processor NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Datasheet 91 Boxed Processor Specifications 7.1 Mechanical Specifications 7.1.1 Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed Pentium 4 processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a mechanical representation of the boxed Pentium 4 processor. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 7-2 (Side View), and Figure 7-3 (Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. Figure 7-2. Space Requirements for the Boxed Processor (Side View–applies to all four side views) 95.0 [3.74] 81.3 [3.2] 10.0 [0.39] 25.0 [0.98] Figure 7-3. Space Requirements for the Boxed Processor (Top View) 95.0 [3.74] 95.0 [3.74] NOTES: 1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation. 92 Datasheet Boxed Processor Specifications Figure 7-4. Overall View Space Requirements for the Boxed Processor 7.1.2 Boxed Processor Fan Heatsink Weight The boxed processor fan heatsink will not weigh more than 450 grams. See Chapter 5 and the Intel® Pentium® 4 Processor on 90 nm Process in the 775-land LGA Package Thermal Design Guidelines for details on the processor weight and heatsink requirements. 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly The boxed processor thermal solution requires a heatsink attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. The boxed processor will ship with the heatsink attach clip assembly. 7.2 Electrical Requirements 7.2.1 Fan Heatsink Power Supply The boxed processor's fan heatsink requires a +12 V power supply. An attached fan power cable will be shipped with the boxed processor to draw power from a power header on the baseboard. The power cable connector and pinout are shown in Figure 7-5. Baseboards must provide a matched power header to support the boxed processor. Table 7-1 contains specifications for the input and output signals at the fan heatsink connector. The fan heatsink outputs a SENSE signal that is an open-collector output that pulses at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system boardmounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND. The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector labeled as CONTROL. Datasheet 93 Boxed Processor Specifications The boxed processor's fan heatsink requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control. The power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it. The power header identification and location should be documented in the platform documentation, or on the system board itself. Figure 7-6 shows the location of the fan power connector relative to the processor socket. The baseboard power header should be positioned within 110 mm [4.33 inches] from the center of the processor socket. Figure 7-5. Boxed Processor Fan Heatsink Power Cable Connector Description Pin 1 2 3 4 Signal GND +12 V SENSE CONTROL Straight square pin, 4-pin terminal housing with polarizing ribs and friction locking ramp. 0.100" pitch, 0.025" square pin width. Match with straight pin, friction lock header on mainboard. 1 2 3 4 Table 7-1. Fan Heatsink Power and Signal Specifications Description Min Typ Max Unit Notes 10.2 12 13.8 V — • Peak Fan current draw — 1.1 1.5 A • Fan start-up current draw — — 2.2 A • Fan start-up current draw maximum duration — — 1.0 Second 1 2, 3 +12 V: 12 volt fan power supply IC: — SENSE: SENSE frequency — 2 — pulses per fan revolution CONTROL 21 25 28 kHz NOTES: 1. 2. 3. Baseboard should pull this pin up to 5 V with a resistor. Open drain type, pulse width modulated. Fan will have pull-up resistor to 4.75 V maximum of 5.25 V. Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket B R110 [4.33] C 94 Datasheet Boxed Processor Specifications 7.3 Thermal Specifications This section describes the cooling requirements of the fan heatsink solution used by the boxed processor. 7.3.1 Boxed Processor Cooling Requirements The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specification is found in Chapter 5 of this document. The boxed processor fan heatsink is able to keep the processor temperature within the specifications (see Table 5-1) in chassis that provide good thermal management. For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature entering the fan should be kept below 38 ºC. A thermally Advantaged Chassis with an Air Guide 1.1 is recommended to meet the 38 °C requirement. Again, meeting the processor's temperature specification is the responsibility of the system integrator. Note: The processor fan is the primary source of airflow for cooling the VCC voltage regulator. Dedicated voltage regulator cooling components may be necessary if the selected fan is not capable of keeping regulator components below maximum rated temperatures. Figure 7-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) Datasheet 95 Boxed Processor Specifications Figure 7-8. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) 7.3.2 Variable Speed Fan If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header, it will operate as follows: The boxed processor fan will operate at different speeds over a short range of internal chassis temperatures. This allows the processor fan to operate at a lower speed and noise level, while internal chassis temperatures are low. If the internal chassis temperature increases beyond a lower set point, the fan speed will rise linearly with the internal temperature until the higher set point is reached. At that point, the fan speed is at its maximum. As fan speed increases, so does fan noise levels. Systems should be designed to provide adequate air around the boxed processor fan heatsink that remains cooler than the lower set point. These set points, represented in Figure 7-9 and Table 7-2, can vary by a few degrees from fan heatsink to fan heatsink. The internal chassis temperature should be kept below 38 ºC. Meeting the processor's temperature specification (see Chapter 5) is the responsibility of the system integrator. The motherboard must supply a constant +12 V to the processor's power header to ensure proper operation of the variable speed fan for the boxed processor. Refer to Table 7-1 for the specific requirements. Figure 7-9. Boxed Processor Fan Heatsink Set Points Higher Set Point Highest Noise Level Increasing Fan Speed & Noise Lower Set Point Lowest Noise Level X Y Z Internal Chassis Temperature (Degrees C) 96 Datasheet Boxed Processor Specifications Table 7-2. Fan Heatsink Power and Signal Specifications Boxed Processor Fan Heatsink Set Point (ºC) Boxed Processor Fan Speed Notes X ≤ 30 When the internal chassis temperature is below or equal to this set point, the fan operates at its lowest speed. Recommended maximum internal chassis temperature for nominal operating environment. Y = 35 When the internal chassis temperature is at this point, the fan operates between its lowest and highest speeds. Recommended maximum internal chassis temperature for worst-case operating environment. — Z ≥ 38 When the internal chassis temperature is above or equal to this set point, the fan operates at its highest speed. — 1 NOTES: 1. Set point variance is approximately ± 1 °C from fan heatsink to fan heatsink. If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the motherboard is designed with a fan speed controller with PWM output (CONTROL see Table 7-1) and remote thermal diode measurement capability, the boxed processor will operate as follows: As processor power has increased, the required thermal solutions have generated increasingly more noise. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage. The 4th wire PWM solution provides better control over chassis acoustics. This is achieved by more accurate measurement of processor die temperature through the processor's temperature diode (Tdiode). Fan RPM is modulated through the use of an ASIC located on the motherboard that sends out a PWM control signal to the 4th pin of the connector labeled as CONTROL. The fan speed is based on actual processor temperature instead of internal ambient chassis temperatures. If the new 4-pin active fan heatsink solution is connected to an older 3-pin baseboard processor fan header, it will default back to a thermistor controlled mode, allowing compatibility with existing 3-pin baseboard designs. Under thermistor controlled mode, the fan RPM is automatically varied based on the Tinlet temperature measured by a thermistor located at the fan inlet. For more details on specific motherboard requirements for 4-wire based fan speed control see the Intel® Pentium® 4 Processor on 90 nm Process in the 775-land LGA Package Thermal Design Guidelines. § Datasheet 97 Boxed Processor Specifications 98 Datasheet Balanced Technology Extended (BTX) Type I Boxed Processor Specifications 8 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications The Pentium 4 processor in the 775-land package will also be offered as an boxed Intel processor. Boxed Intel processors are intended for system integrators who build systems from largely standard components. The boxed Pentium 4 processor in the 775-land package will be supplied with a cooling solution known as the Thermal Module Assembly (TMA). Figure 8-1 shows a mechanical representation of a boxed Pentium 4 processor in the 775-land package. This chapter documents mainboard and system requirements for the TMA that will be supplied with the boxed Pentium 4 processor in the 775-land package. This chapter is particularly important for OEMs that manufacture mainboards for system integrators. Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets]. Note: Drawings in this section reflect only the specifications on the boxed Intel processor product. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designer’s responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal Design Guidelines for further guidance. Figure 8-1. Mechanical Representation of the Boxed Processor NOTE: The duct, clip, heatsink, and fan can differ from this drawing representation; however, the basic shape and size will remain the same. Datasheet 99 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications 8.1 Mechanical Specifications 8.1.1 Cooling Solution Dimensions This section documents the mechanical specifications of the boxed Intel Pentium 4 processor in the 775- land package fan heatsink. The boxed processor will be shipped with an unattached TMA. Figure 8-2 shows a mechanical representation of the boxed Pentium 4 processor in the 775-land package. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown. Figure 8-2. Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes NOTE: The diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation. 8.1.2 Boxed Processor Fan Heatsink Weight The boxed processor fan heatsink will not weigh more than 1290 grams. See Chapter 3 and the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal Design Guidelines for details on the processor weight and heatsink requirements. 100 Datasheet Balanced Technology Extended (BTX) Type I Boxed Processor Specifications 8.1.3 Boxed Processor Support and Retention Module (SRM) The boxed processor TMA requires a SRM assembly to attach directly to the chassis base pan and to secure the processor and TMA in the mainboard socket. The boxed processor TMA will ship with the heatsink attach clip assembly, duct, and screws for attachment. The SRM must be supplied by the chassis hardware vendor. See the Support and Retention Module (SRM) External Design Requirements Document, Balanced Technology Extended (BTX) System Design Guide, and the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal Design Guidelines for more detailed design information regarding the support and retention module. Figure 8-3. Assembly Stack Including the Support and Retention Module Thermal Module Assembly - Heatsink and Fan - Clip - Structural Duct Motherboard SRM Chassis Pan 8.2 Electrical Requirements 8.2.1 Fan Heatsink Power Supply The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be shipped with the boxed processor to draw power from a power header on the baseboard. The power cable connector and pinout are shown in Figure 8-4. Baseboards must provide a matched power header to support the boxed processor. Table 8-1 contains specifications for the input and output signals at the fan heatsink connector. The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system boardmounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND. The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector labeled as CONTROL. This signal must be an open-drain output to be compatible with the 4-wire PWM fan specification. Datasheet 101 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications Note: The boxed processor’s fan heatsink requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control. The power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it. The power header identification and location should be documented in the platform documentation, or on the system board itself. Figure 8-5 shows the location of the fan power connector relative to the processor socket. The baseboard power header should be positioned within 4.33 inches from the center of the processor socket. Figure 8-4. Boxed Processor Fan Heatsink Power Cable Connector Signal Pin 1 2 3 4 GND +12 V SENSE CONTROL Straight square pin, 4-pin terminal housing with polarizing ribs and friction locking ramp. 0.100" pitch, 0.025" square pin width. Match with straight pin, friction lock header on mainboard. 1 2 3 4 C Table 8-1. Fan Heatsink Power and Signal Specifications Description Min Typ Max Unit +12 V: 12 volt fan power supply 10.2 12 13.8 V A Notes IC: Peak Fan current draw — — 1.5 Fan start-up current draw — 1.0 2.0 A Fan start-up current draw maximum duration — — 1.0 Second SENSE: SENSE frequency — 2 — pulses per fan revolution 1 CONTROL 21 25 28 kHz 2,3 NOTES: Baseboard should pull this pin up to 5 V with a resistor. Open Drain Type, Pulse Width Modulated. Fan will have a pull-up resistor to 4.75 V, maximum 5.25 V. 1. 2. 3. 102 Datasheet Balanced Technology Extended (BTX) Type I Boxed Processor Specifications Figure 8-5. Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) 8.3 Thermal Specifications This section describes the cooling requirements of the fan heatsink solution used by the boxed processor. 8.3.1 Boxed Processor Cooling Requirements The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specification is found in Chapter 5. The boxed processor TMA is able to keep the processor temperature within the specifications listed in Table 5-1 for chassis that provide good thermal management. For the boxed processor TMA to operate properly, it is critical that the airflow provided to the TMA is unimpeded. Airflow of the TMA is into the duct and out of the rear of the duct in a linear flow. Blocking the airflow to the TMA inlet reduces the cooling efficiency and decreases fan life. The air temperature entering the fan should be kept below 35 °C. Meeting the processor's temperature specification is the responsibility of the system integrator. Datasheet 103 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications 8.3.2 Variable Speed Fan If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header, it will operate as follows: The boxed processor fan will operate at different speeds over a short range of temperatures based on a thermistor located in the fan hub area. This allows the boxed processor fan to operate at a lower speed and noise level while thermistor temperatures are low. If the thermistor senses a temperatures increase beyond a lower set point, the fan speed will rise linearly with the temperature until the higher set point is reached. At that point, the fan speed is at its maximum. As fan speed increases, so does fan noise levels. These set points are represented in Figure 8-6 and Table 8-2. The internal chassis temperature should be kept below 38 ºC. Meeting the processor’s temperature specification (see Chapter 5) is the responsibility of the system integrator. Note: The motherboard must supply a constant +12 V to the processor’s power header to ensure proper operation of the variable speed fan for the boxed processor (refer to Table 8-1) for the specific requirements. Figure 8-6. Boxed Processor TMA Set Points Higher Set Point Highest Noise Level Increasing Fan Speed & Noise Lower Set Point Lowest Noise Level X Y Z Internal Chassis Temperature (Degrees C) Table 8-2. Balanced Technology Extended (BTX) Type I Boxed Processor TMA Set Points for 3-wire Operation Boxed Processor TMA Set Point (ºC) Boxed Processor Fan Speed Notes X ≤ 23 When the internal chassis temperature is below or equal to this set point, the fan operates at its lowest speed. Recommended maximum internal chassis temperature for nominal operating environment. 1 Y = 29 When the internal chassis temperature is at this point, the fan operates between its lowest and highest speeds. Recommended maximum internal chassis temperature for worst-case operating environment. Z ≥ 35 When the internal chassis temperature is above or equal to this set point, the fan operates at its highest speed. 1 NOTES: 1. 104 Set point variance is approximately ±1 °C from fan heatsink to fan heatsink. Datasheet Balanced Technology Extended (BTX) Type I Boxed Processor Specifications If the boxed processor TMA 4-pin connector is connected to a 4-pin motherboard header and the motherboard is designed with a fan speed controller with PWM output (see Table 8-1) and remote thermal diode measurement capability, the boxed processor will operate as described in the following paragraphs. As processor power has increased the required thermal solutions have generated increasingly more noise. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage. The 4th wire PWM solution provides better control over chassis acoustics. This is achieved by more accurate measurement of processor die temperature through the processor’s temperature diode (TDIODE). Fan RPM is modulated through the use of an ASIC located on the motherboard that sends out a PWM control signal to the 4th pin of the connector labeled as CONTROL. The fan speed is based on a combination of actual processor temperature and thermistor temperature. If the new 4-pin active TMA solution is connected to an older 3-pin baseboard processor fan header, it will default back to a thermistor controlled mode allowing compatibility with existing 3pin baseboard designs. Under thermistor controlled mode, the fan RPM is automatically varied based on the Tinlet temperature measured by a thermistor located at the fan inlet. Note: For more details on specific motherboard requirements for 4-wire based fan speed control, see the Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal Design Guidelines. § Datasheet 105