AK6 Series Transient Voltage Suppression Diodes Dimensions A F G L2 L1 D Features t)BMPHFO'SFF t 3P)4DPNQMJBOU t 'PMECBL™ technology for superior clamping factor t (MBTT1BTTJWBUFE+VODUJPO for reliabilty t #JEJSFDUJPOBM t 6MUSBDPNQBDU times less volume than traditional discrete solutions t 7FSZ-PX$MBNQJOH 7PMUBHF t 4IBSQ#SFBLEPXO7PMUBHF t -PX4MPQF3FTJTUBODF B Dimensions Inches Millimeters A 0.950 24.15 B 0.095 2.4 C - 058C/076C 0.236 6.00 C 0.145 3.68 D 0.570 max. 14.48 max. E 0.050 1.270 F 0.500 max. 12.70 max. ($$ 0.200 5.08 ($$ 0.320 8.13 ($ 0.370 9.4 ($$ 0.543 13.8 L1 0.310 7.87 L1 - 380C/430C 0.150 3.81 -"(- UPMFSBODFJODINN Agency Approvals AGENCY E C AGENCY FILE NUMBER E128662 Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol 7BMVF Unit 0QFSBUJOH+VODUJPOBOE Storage Temperature Range T+T45( (-)55 to 150 °C IPP 6 kA Current Rating1 Note: 1. Rated IPP measured with 8 x 20μS pulse. Electrical Characteristics Part Numbers Standoff Voltage (VSO) Volts Max. Reverse Leakage (IR) @VSO μA Reverse Breakdown Voltage (VBR) @ IT Test Current IT Min Volts Max Volts (mA) VCL Volts IPP Amps (%/OC) (nF) 10 10 10 10 10 10 10 110 140 260 290 340 520 625 6,000 6,000 6,000 6,000 6,000 6,000 6,000 0.1 0.1 0.1 0.1 0.1 0.1 0.1 8 6.5 2.8 2.5 2.0 1.4 1.0 AK6 - 058C 58 20 64 AK6 - 076C 76 20 85 AK6 - 170C 170 20 180 AK6 - 190C 190 20 200 AK6 - 240C 240 20 250 Note: Using 8 x 20μS wave shape as defined in IEC 61000-4-5. AK6 - 380C 380 20 401 AK6 - 430C 430 20 440 http://www.luguang.cn 70 95 220 245 285 443 490 Max. Clamping Voltage Max. Temp Max. Agency VCL @ Ipp Peak Pulse Coefficient Capacitance Approval Current (IPP) (Note 1) OF VBR 0 Bias 10kHz mail:[email protected] X X X X X X X AK6 Series Transient Voltage Suppression Diodes Soldering Parameters Pre Heat Lead–free assembly Ramp-up - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs TL Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow tp TP Temperature (T) Reflow Condition Ts(max) Ramp-down Ts(min) ts Preheat 25˚C - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 280°C t 25˚C to Peak Time (t) Flow/Wave Soldering (Solder Dipping) Peak Temperature : 265OC Dipping Time : 10 seconds Soldering : 1 time Physical Specifications Weight Contact manufacturer Case Epoxy encapsulated Terminal Silver plated leads, solderable per MIL-STD-202 Method 208 Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Peak Power Derating Percent of Rated Value 120 100 80 60 40 20 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE (°C) http://www.luguang.cn Critical Zone TL to TP tL mail:[email protected]