PRODUCT SPECIFICATION PRODUCT SPECIFICATION FOR Mini-Fit Plus HCS™ INTERCONNECT SYSTEMS 46015 Vertical Header 46012 Male Terminal 45750 Female Terminal 5559 5557 Plug Housing Receptacle Housing 5569 Right Angle Header Crimp Terminals and Housing for Wire-Wire 42475 BMI Plug Housing Headers for Wire-Board 44516 BMI Slide and Lock Receptacle 42474 BMI Receptacle w/ Spirals BMI Style Panel Mount Housings for Wire-Panel, Panel-Panel and Panel-Board REVISION: C1 ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 1 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 42404 46010 BMI Receptacle Header BMI Right Angle Header 46011 BMI Vertical Header BMI Style Headers for Panel-Board or Board-Board 44068 BMI SMC Vertical Header 87427 SMC Vertical Header 43810 BMI SMC Right Angle Header Also available in Right Angle BMI Surface Mount Compatible Style Headers 30068 TPA Plug Housing 30070 30067 TPA Receptacle Housing 30072 TPA Pin CPA Key 30070 TPA Right Angle Header 43130 Mounting Ears TPA Series Header and Housings for use with Plus HCS Terminals Product feature designations: REVISION: C1 BMI Blind Mate Interface – features allowing easier alignment in panel-board and board to board applications. SMC Surface Mount Compatible - reflow solder temperatures up to 245°C. TPA Terminal Position Assurance – helps ensure crimp terminals are fully engaged and prevents terminals from backing out in high vibration applications. CPA Connector Position Assurance – assures housing cannot be inadvertently disengaged. ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 2 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION MINI-FIT PLUS HCS TABLE OF CONTENTS SECTION PAGE 1.0 Scope 4 2.0 Product Description 4-5 2.1 2.2 2.3 Names and Series Numbers Dimensions, Materials, Platings, and Markings Safety Agency Approvals 4 5 5 3.0 Applicable Documents and Specifications 5 4.0 Packaging 5 5.0 Ratings 5-6 5.1 5.2 5.3 5.4 5.5 5.6 6.0 REVISION: C1 5 5 5 5 5 6 Product Performance Tests and Requirements 5.1 5.2 5.3 7.0 Voltage Applicable Wires Temperature Wave Solder Process Temperature Durability (Mating Cycles) Maximum Current Carrying Capacities Wire-To-Wire Wire-To-Board Board-To-Board 7-9 Electrical Requirements Mechanical Requirements Environmental Requirements 7 7 9 Test Sequences ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 11-13 TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 3 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the electrical, mechanical and environmental performance requirements for the Mini-Fit Plus HCSTM (High Current System) in 4.20 mm (.165 inch) pitch. The Mini-Fit Plus HCSTM uses contacts stamped in High Performance Alloy for increased current carrying capacity, while maintaining properties at elevated operating temperatures. Wire-Wire, Wire-Panel, Wire-Board, Panel-Panel, Panel-Board, and Board-Board configurations in Tin and Gold plated systems. Crimp terminals accept 16 to 20 AWG stranded wire. 2.0 PRODUCT DESCRIPTION 2.1 SERIES NUMBERS, DESCRIPTION, SALES DRAWING NUMBERS SERIES DESCRIPTION SALES DRAWING 45750 46012 Female Crimp Terminal Male Crimp Terminal 5557 5559 42475 43770 42474 43974 30067 30068 Receptacle Housing Plug Housing Panel Mount BMI Plug Housing Panel Mount Plug Housing, 36 Ckt Panel Mount Receptacle Housing Panel Mount Receptacle Hsg 40 Ckt Panel Mount Receptacle Housing, Slide-and-Lock TPA Receptacle Housing Panel Mount TPA Plug Housing 44068 46010 46011 46014 46015 87427 Vertical BMI SMC Header, solid pin Vertical PCB Receptacle Header Vertical BMI Header Vertical Header, single row Vertical Header, dual row Vertical SMC Header TPA BMI AGENCY APP’L SMC CRIMP TERMINALS SD-46012-001 SD-45750-001 NA NA HOUSINGS 44516 SD-5557-003 SD-5559-NP SD-42475-***1 SD-43770-001 SD-42474-**** SD-43974-005 U,C,T U,C,T U,C,T U,C,T U,C,T U,C,T X X X X SD-44516-00* SD-30067-* SD-30068-* X X X U,C X U,C,T U,C,T VERTICAL HEADERS SD-44068-031 SD-46010-001 SD-46011-001 SD-46014-001 SD-46015-001 SD-87427-**4* X X X U,C,T U,C U,C U,C U,C U,C X X RIGHT ANGLE HEADERS 5569 42404 43810 43973 45567 Right Angle Header Right Angle TPA Header with mounting flanges Right Angle BMI Header Right Angle BMI SMC Header Right Angle Header, 40 Ckt Right Angle Header, 36 Ckt 87427 Right Angle SMC Header 30070 SD-5569-002 SD-30070-001 SDA-30070-**** SDA-42404-**** SD-43810-0** SD-43973-00* SD-45567-001 SD-87427-**0*, -**1*, -**2* U,C,T U,C,T X X X X X X X U,C,T U,C,T U,C,T U,C X U,C Agency Approval designations: U-UL REVISION: C1 C-CSA ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 T-TUV TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 4 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS For details regarding dimensions, materials and terminal platings, refer to the appropriate sales drawings for further information. 2.3 SAFETY AGENCY APPROVALS UL File: E29179 CSA Certificate: LR19980 TUV Certificate: R72081037 3.0 APPLICABLE STANDARDS AND SPECIFICATIONS - EIA-364-1000 - Molex solderability specification SMES-152 4.0 PACKAGING Parts shall be packaged to protect against damage during normal handling, transit and storage. For details refer to the Packaging Specification as called out on the applicable product Sales Drawing. 5.0 RATINGS 5.1 VOLTAGE 600 Volts AC RMS or 600 Volts DC 5.2 APPLICABLE WIRES WIRE GAUGE INSULATION DIAMETER 16 AWG 1.80-3.10 millimeters / .071-.122 inches 18-20 AWG 1.65-2.95 millimeters / .065-.116 inches 5.3 TEMPERATURE RATING Mini-Fit Plus HCS has a field temperature of 65°C and field life rating for 10 years based on testing per EIA-364-17B, Method A. 5.4 WAVE SOLDER PROCESS TEMPERATURE Headers with molded pegs: 240°C MAX. Headers without pegs: 265°C MAX 5.5 DURABILITY (MATING CYCLES) Tin: 100 cycles Gold: 250 cycles Durability ratings established as tested per Durability Test Procedures described by EIA-364-09C and meet requirements for low level contact resistance and DWV as prescribed per EIA-364-1000 Test Sequence Group 7. REVISION: C1 ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 5 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 5.6 MAXIMUM CURRENT RATING (AMPERES)** WIRE-TO-WIRE Single Row Circuit Sizes Dual Row Circuit Sizes Wire Size 3 4 5 2 4 6, 8 10, 12 14, 16, 18 20, 22, 24 16 AWG 13A 12.5A 12A 13A 12A 11A 10.5A 10A 9.5A 18 AWG 11A 10.5A 10A 11A 10A 9A 8.5A 8A 7.5A 20 AWG 9.5A 9A 9A 9.5A 8.5A 8A 7.5A 7A 6.5A WIRE-TO-BOARD Single Row Circuit Sizes Dual Row Circuit Sizes Wire Size 3 4 5 2 4 6, 8 10, 12 14, 16, 18 20, 22, 24 16 AWG 12.5A 12A 11.5A 12.5A 11.5A 10A 9A 8.5A 8.0A 18 AWG 10.5A 10A 9.5A 10.5A 9.5A 8.5A 8A 7.5A 7A 20 AWG 9A 8.5A 8.5A 9A 8A 7A 6.5A 6A 5.5A BOARD-TO-BOARD Dual Row Circuit Sizes 2 4 6, 8 10, 12 11.5A 11A 9.5A 8A 14, 16, 18 20, 22, 24 6.5A 5A ** Ratings shown represent MAXIMUM current carrying capacity of a fully loaded connector with all circuits powered. Ratings are based on a 30°C maximum temperature rise limit over ambient (room temperature). Testing conducted with tinned copper conductor stranded wire. Above charts are intended as a guideline. Current rating is application dependent. Appropriate de-rating is required depending on factors such as higher ambient temperature, smaller copper weight of PCB traces, gross heating from adjacent modules or components and other factors that influence connector performance. REVISION: C1 ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 6 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 6.0 PRODUCT PERFORMANCE TESTS & REQUIREMENTS 6.1 ELECTRICAL REQUIREMENTS ITEM TEST TEST PROCEDURE REQUIREMENT 10 mΩ Maximum Initial resistance for each test sequence. Resistance measurements for subsequent tests are the Maximum change from Initial as specified. 1 Contact Resistance (Low Level) EIA-364-23: Mate connectors; apply a maximum voltage of 20 mV and a current of 100 mA. Wire resistance shall be removed from the measured value. 2 Insulation Resistance Mate connectors: apply a voltage of 500 VDC between adjacent terminals and between terminals to ground. 1000 Megohms MINIMUM 3 Dielectric Withstanding Voltage EIA-364-20: Apply a voltage of 1500 VAC for 1 minute between adjacent contacts. No breakdown. Current leakage < 5 mA 4 EIA-364-70 (Temperature Rise) & EIA-36455 (Current Cycling): Apply current to mated connectors & incrementally increase Temperature Rise until specified T-Rise is reached to (via Current Cycling) establish rated current. Measure the T-Rise at the rated current after 96 hours, during current cycling (45 minutes ON and 15 minutes OFF per hour) for 240 hours, and after final 96-hour steady state. Temperature rise: +30°C MAXIMUM 6.2 MECHANICAL REQUIREMENTS ITEM TEST TEST PROCEDURE Tin, W-W & W-B (formed pin): Mate: 15.6 N (3.50 lbf) MAX. Unmate: 13.8N (3.10 lbf) MAX. Terminal Mate / Unmate Forces Per Circuit for: 1 REVISION: C1 REQUIREMENT Mate and unmate female to male crimp Gold, W-W & W-B (formed pin): terminal or female terminal to header at a Mate: 4.9 N (1.10 lbf) MAX. rate of 25 ± 6 mm (1 ± ¼ inch) per minute. Unmate: 4.0 N (0.91 lbf) MAX. Wire – Wire; Testing to be conducted with individual Wire – Board Tin, W-B (solid pin): (single) circuit. Measure and record the (formed pin header); Mate: 10.5 N (2.36 lbf) MAX. maximum mate and unmate forces across 5 and Unmate: 11.0N (2.47 lbf) MAX. mating cycles. Wire – Board (solid pin header) Gold, W-B (solid pin): Mate: 3.4 N (0.77 lbf) MAX. Unmate: 2.8 N (0.63 lbf) MAX. ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 7 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 6.2 MECHANICAL REQUIREMENTS (CON’D) ITEM 2 TEST PROCEDURE REQUIREMENT Normal Force Apply a perpendicular force simultaneously to each beam until the desired total deflection is achieved. Return to original size, then deflect beams a second time and measure normal force. 3.5 N (360 g) MINIMUM 3 Durability Per EIA-364-09C, mate connectors 100 cycles for tin plated product, 250 cycles for gold plated product at a maximum rate of 500 cycles per minute. 4 Durability (preconditioning) Mate connectors by hand, 20 cycles for tin plated product, 50 cycles for gold as required prior to environmental test sequence as indicated. Visual: no damage 5 Reseating Unmate / mate connectors by hand three cycles. Visual: no damage 6 Vibration (Random) EIA 364-28: Mate connectors and vibrate per, test condition VII. 10 mΩ Max. chg. from Initial; Discontinuity < 1 microsecond 7 Crimp Terminal Insertion Force (into housing) Apply an axial insertion force on the terminal at a rate of 25 ± 6 mm (1 ± ¼ inches). 15.0 N (3.37 lbf) MAXIMUM insertion force 8 Crimp Terminal Retention Force (in housing) Axial pullout force on the terminal in the housing at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. 30 N (6.74 lbf) MINIMUM retention force 9 Wire Crimp Retention 10 Thumb Latch Operation Force 11 REVISION: C1 TEST Thumb Latch Yield Strength ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 10 mΩ Max. chg. from Initial; Visual: No Damage Apply an axial pullout force on the wire at a 16 Awg = 68.4 N (15.4 lbf) Min. rate of 25 ± 6 mm (1 ± ¼ inches) per 18 Awg = 68.4 N (15.4 lbf) Min. minute. 20 Awg = 58.7 N (13.2 lbf) Min. Depress latch at a rate of 25 ± 6mm (1 ± ¼ inches) per minute. 16.7 N (3.75 LBF) MAX. Manually mate and unmate unloaded housings for 30 cycles. Following the 30th mate, pull apart housings in an axial direction at a rate of 25 ± 6mm (1 ± ¼ inches) per minute. 75.2 N (16.9 LBF) MIN. TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 8 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 6.2 MECHANICAL REQUIREMENTS (CON’D) ITEM TEST 12 Header Solid Pin Retention Force in Housing 13 14 TEST PROCEDURE REQUIREMENT Axial pullout force on the terminal in the housing at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. Tin 4.45 N (1.00 lbf) MINIMUM Gold 4.45 N (1.00 lbf) MINIMUM Header Stamped Pin Axial pullout force on terminal from housing at a rate of 25 ± 6 mm (1 ± ¼ inch) per Retention Force in Housing minute. 30 N (6.74 lbf) MINIMUM retention force Engage and separate a connector at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. (Applies to parts with PCB retention features only) PCB Peg Engagement and Separation Forces 98.0 N (22.0 lbf) MAX. insertion force; 10.0 N (2.24 lbf) MIN. withdrawal force 6.3 ENVIRONMENTAL REQUIREMENTS ITEM TEST 1a Temperature Life Group 1 Per EIA-364-17, method A: mate 10 mΩ Max. chg. from Initial; connectors and expose to 240 hours at 105 Visual: No Damage ± 2°C. 1b Temperature Life (preconditioning) Groups 3 & 5 Per EIA-364-17, method A: mate 10 mΩ Max. chg. from Initial; connectors and expose to 120 hours at 105 Visual: No Damage ± 2°C. 1c Temperature Life (preconditioning) Group 4 Per EIA-364-17, method A: mate 10 mΩ Max. chg. from Initial; connectors and expose to 300 hours at 105 Visual: No Damage ± 2°C. 2 3 REVISION: C1 Thermal Shock Cyclic Temperature & Humidity TEST PROCEDURE Per EIA-364-32, method A, test condition I, test duration A-4: mate connectors and expose for 10 cycles between –55°C and 105° C; dwell 0.5 hours at each temperature. Per EIA-364-31, method III w/o conditioning, initial measurements, cold shock and vibration. Cycle mated connectors between 25°C ±3°C @ 80% ±3% RH and 65°C ±3°C @ 50% ±3RH. Ramp time: 0.5 hr.; dwell time: 1 hr. Perform 24 cycles. ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 REQUIREMENT TITLE: 10 mΩ Max. chg. from Initial; Visual: No Damage Dielectric Strength per 5.1.3 Insulation Resistance per 5.1.2 10 mΩ Max. chg. from Initial; Visual: No Damage PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 9 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 6.3 ENVIRONMENTAL REQUIREMENTS (CON’D) 4 5 Thermal Cycling 6 Solderability 7 Solder Temperature Heat Transfer Resistance REVISION: C1 Mixed Flowing Gas Per EIA-364-65 with Class IIA gas concentrations following Telcordia Specification GR1217. Per EIA-364-1000 Test Group 5: Cycle mated connector between 15°C±3°C and 85°C±3°C as measured on the part. Ramps 10 mΩ Max. chg. from Initial; should be a minimum of 2°C per minute, and dwell times should insure contacts Visual: No Damage reach the temperature extremes (minimum of 5 minutes). Humidity is not controlled. Perform 500 cycles. DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 Solder coverage: 95% MINIMUM (per SMES-152) Per SMES-152 Expose connector terminals tails to wave solder process. Dwell time duration: 5 ± 0.5 seconds; Solder Temperature: 260 ± 5°C ECR/ECN INFORMATION: EC No: UCP2011-0141 10 mΩ Max. chg. from Initial; Visual: No Damage TITLE: Visual: No Damage to the insulator where terminal or pin locks to the connector housing. PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 10 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 7.0 TEST SEQUENCES Environmental test sequences for Groups 1, 2, 3, 5 and 7 performed in accordance with EIA-364-1000. Sequence for Group 4 per Nortel Optical Networks specification test plan. Test Group 1 (10) Tin; (10) Gold Test Group 2 (10) Tin; (10) Gold Test Group 3 (10) Tin; (10) Gold Initial Low Level Contact Resistance Initial Low Level Contact Resistance Initial Low Level Contact Resistance Durability (preconditioning) Durability (preconditioning) Durability (preconditioning) Low Level Contact Resistance Low Level Contact Resistance Low Level Contact Resistance Temperature Life 105°C for 240 hrs. Thermal Shock (85°C to -55°C) Temperature Life (preconditioning) 105°C for 120 hrs. Low Level Contact Resistance Low Level Contact Resistance Reseating Cyclic Humidity (25°C @ 80% RH to 65°C @ 50% RH Final Low Level Contact Resistance Low Level Contact Resistance Low Level Contact Resistance Vibration Final Low Level Contact Resistance Reseating Final Low Level Contact Resistance REVISION: C1 ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 11 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 7.0 TEST SEQUENCES (CON’D) Test Group 4 (10) Gold Unmate / Mate 1 Cycle Initial Low Level Contact Resistance Mixed Flowing Gas 5 Days Durability 50 cycles Low Level Contact Resistance Temperature Life (preconditioning) Unmate / Mate 1 Cycle Low Level Contact Resistance Mixed Flowing Gas 5 Days Mixed Flowing Gas 5 Days Low Level Contact Resistance Low Level Contact Resistance Thermal Disturbance Unmate / Mate 1 Cycle Final Low Level Contact Resistance Mixed Flowing Gas 5 Days Low Level Contact Resistance REVISION: C1 ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 12 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 7.0 TEST SEQUENCES (CON’D) Test Group 5 (10) Tin Individual Tests Test Group 7 (10) Tin; (10) Gold Mating / Unmating Force (individual ckts.) Initial Low Level Contact Resistance Initial Low Level Contact Resistance Temperature Rise Durability (preconditioning) Dielectric withstanding voltage Crimped Wire Retention Low Level Contact Resistance Low Level Contact Resistance PC Tail Retention in Housing Crimped Terminal Insertion / Retention Force in Housing Temperature Life (preconditioning) 105°C for 120 hrs. Durability 100 cycles tin; 250 cycles gold Low Level Contact Resistance Final Low Level Contact Resistance Thermal Cycling 15°C to 85°C Dielectric withstanding voltage Solder Heat Transfer Resistance Solderability Insulation Resistance PCB Peg Engagement and Separation Forces Low Level Contact Resistance Thumb Latch Operation Force Reseating Thumb Latch Yield Strength Final Low Level Contact Resistance REVISION: C1 ECR/ECN INFORMATION: EC No: UCP2011-0141 DATE: 2010 /07/15 DOCUMENT NUMBER: PS-45750-001 Normal Force TITLE: PRODUCT SPECIFICATION FOR MINI-FIT PLUS HCS CONNECTOR SYSTEM SHEET No. 13 of 13 CREATED / REVISED BY: CHECKED BY: APPROVED BY: BWIRKUS BWIRKUS APATEL TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC