PANASONICBATTERY DB2440100L

Doc No. TT4-EA-14120
Revision. 2
Product Standards
Schottky Barrier Diode
DB2440100L
DB2440100L
Silicon epitaxial planar type
Unit: mm
2.4
For rectification
0.15
2
 Features
3.8
4.7
 Low forward voltage VF
 Low terminal capacitance Ct
 Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
1
 Marking Symbol: 41
1.75
0.85
 Packaging
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
 Absolute Maximum Ratings Ta = 25 C
Parameter
Symbol
Reverse voltage
Maximum peak reverse voltage
Forward current *1
Non-repetitive peak forward surge current
Junction temperature *1
Operating ambient temperature
Storage temperature
Note:
*2
VR
VRM
IF
IFSM
Tj
Topr
Tstg
1. Cathode
2. Anode
Panasonic
JEITA
Code
Rating
Unit
40
40
1.0
30
150
-40 to +85
-55 to +150
V
V
A
A
°C
°C
°C
*1 Tl = 80 °C
*2 50 Hz sine wave 1 cycle (Non-repetitive peak current)
TMiniP2-F2-B
SC-110A
―
Internal Connection
2
1
Page 1 of 4
Established : 2012-03-02
Revised
: 2013-04-19
Doc No. TT4-EA-14120
Revision. 2
Product Standards
Schottky Barrier Diode
DB2440100L
 Electrical Characteristics Ta = 25 C  3 C
Parameter
Symbol
Forward voltage
Reverse current
Terminal capacitance
Reverse recovery time * 1
VF
IR
Ct
trr
Conditions
Min
IF = 1.0 A
VR = 40 V
VR = 10 V, f = 1 MHz
IF = IR = 100 mA, Irr = 10 mA
Typ
Max
Unit
0.39
250
V
μA
pF
ns
50
15
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on
the charge of a human body and the leakage of current from the operating equipment.
3. *1 trr test circuit
Input Pulse
Bias Application Unit (N-50BU)
tp
tr
10%
A
Pulse Generator
(PG-10N)
Rs = 50 Ω
VR
Wave Form Analyzer
(SAS-8130)
Ri = 50 Ω
Output Pulse
t
IF
trr
90%
tp = 2 μs
tr = 0.35 ns
δ = 0.05
IF = 100 mA
IR = 100 mA
t
Irr = 10 mA
Page 2 of 4
Established : 2012-03-02
Revised
: 2013-04-19
Doc No. TT4-EA-14120
Revision. 2
Product Standards
Schottky Barrier Diode
DB2440100L
Technical Data ( reference )
IR - VR
IF - VF
1.E-01
Ta = 125 °C
1.E+00
Reverse current IR (A)
Forward current IF (A)
1.E+01
85 °C
1.E-01
1.E-02
25 °C
1.E-03
-40 °C
1.E-04
1.E-05
0.0
Ta = 125 °C
1.E-02
1.E-03
25 °C
1.E-04
1.E-05
-40 °C
1.E-06
1.E-07
1.E-08
0.1
0.2
0.3
0.4
0.5
0.6
0
5
10
Forward voltage VF (V)
15
25
30
35
40
Rth - t
Ct - VR
1000
(1)
Ta = 25 °C
f = 1 MHz
200
Thermal resistance Rth (°C/W)
Terminal capacitance Ct (pF)
20
Reverse voltage VR (V)
250
150
100
50
(2)
100
0
5
10
15
20
25
30
Reverse voltage VR (V)
35
(3)
Rth(j-l) = 9 °C/W
10
0
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(3) Mounted on alumina print board.
Board size : 50 mm × 50 mm x 0.8 mm
Solder in : 2 mm x 2 mm
1
0.001
40
0.01
IF(AV) - Tl
0.1
1
10
Time t (s)
100
1000
PF(AV) - IF(AV)
0.5
IF
tp/T
1
Forward power dissipation (Average) PF(AV) (W)
1.25
Forward current (Average) IF(AV) (A)
85 °C
tp
T
DC
VR = 20 V
Tj = 125 °C
1/2
0.75
0.5
1/4
Sine Wave
0.25
0
IF
0.4
tp
DC
T
Sine Wave
0.3
1/2
1/4
0.2
0.1
0
0
25
50
75
100
125
Lead temperature Tl (°C)
150
175
0
0.2
0.4
0.6
0.8
1
1.2
Forward current (Average) IF(AV) (A)
Page 3 of 4
Established : 2012-03-02
Revised
: 2013-04-19
Doc No. TT4-EA-14120
Revision. 2
Product Standards
Schottky Barrier Diode
DB2440100L
TMiniP2-F2-B
Unit: mm
2.4±0.1
0.15±0.05
(5°)
4.7±0.1
3.8±0.1
2
0.45±0.10
1
0 to 0.03
(5°)
0 to 0.4
0.85±0.05
1.75±0.10
 Land Pattern (Reference) (Unit: mm)
1.4
4.4
1.4
2.1
Page 4 of 4
Established : 2012-03-02
Revised
: 2013-04-19
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202