Product Specification PE42451 Product Description The PE42451 is a HaRP™-enhanced Absorptive SP5T RF Switch developed on the UltraCMOS™ process technology. This general purpose switch is comprised of five symmetric RF ports and has very high isolation. An on-chip CMOS decode logic facilitates a three-pin low voltage CMOS control interface and an optional external Vss feature (VssEXT). High ESD tolerance and no blocking capacitor requirements make this the ultimate in integration and ruggedness. Peregrine’s HaRP™ technology enhancements deliver high linearity and exceptional harmonics performance. It is an innovative feature of the UltraCMOS™ process, providing performance superior to GaAs with the economy and integration of conventional CMOS. SP5T Absorptive UltraCMOS™ High-Isolation RF Switch 450-4000 MHz, VssEXT option Features • HaRP™-enhanced UltraCMOS™ device • Five symmetric, absorptive RF ports • High Isolation: • 68 dB at 450 MHz • 62 dB at 900 MHz • 55 dB at 2100 MHz • 53 dB at 2600 MHz • 50 dB at 4000 MHz • IIP2 of 95 dBm, IIP3 of 58 dBm • High ESD tolerance of 3500 V HBM • Optional External Vss Control (VssEXT) Figure 1. Functional Diagram • Three pin CMOS logic control • No blocking capacitors required • Small RoHS-Compliant 24-lead 4x4 mm RFC QFN package ESD RF4 RF1 ESD ESD 50Ω 50Ω RF5 RF2 ESD ESD 50Ω Figure 2. Package Photo 24-lead 4x4x0.85 mm QFN Package 50Ω RF3 ESD CMOS Control/Driver and ESD V1 V2 V3 50Ω VssEXT (optional) Document No. 70-0298-03 │ www.psemi.com ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 11 PE42451 Product Specification Table 1. Electrical Specifications @ 25 °C, VDD = 3.0 V (ZS = ZL = 50 Ω) Electrical Parameter Path Condition Operating Frequency Min Typ 450 RFC - RFX RFC - RFX RFC - RFX RFC - RFX RFC - RFX 450 MHz 900 MHz 2100 MHz 2600 MHz 4000 MHz RFC/RFX - RFX RFC/RFX - RFX RFC/RFX - RFX RFC/RFX - RFX RFC/RFX - RFX 450 MHz 900 MHz 2100 MHz 2600 MHz 4000 MHz Return Loss, Active Port RFX Return Loss, Terminated Port Insertion Loss, IL 1.6 1.65 1.95 2.05 2.25 Unit 4000 MHz 1.95 2.05 2.30 2.40 2.75 dB dB dB dB dB 68 62 55 53 50 dB dB dB dB dB 450 - 4000 MHz 16 dB RFX 450 - 4000 MHz 15 dB Input 1 dB compression1, P1dB RFX - RFC All Bands,100% duty cycle 35 dBm Input IP2 RFX - RFC All Bands, 100% duty cycle 95 dBm Input IP3 RFX - RFC All Bands, 100% duty cycle 58 dBm "On" "Off" 50% Control to 90% RF 50% Control to 10% RF 200 200 Isolation, Iso Switching Time, TSW Notes: 58.5 53.0 46.5 46.5 41.5 Max 500 500 ns ns 1. Please refer to Maximum Operating Power in Table 2 Table 2. Operating Ranges Parameter VDD Supply Voltage VssEXT Negative Power Supply Voltage2 IDD Power Supply Current VDD = 3.0 V, PIN= 0 dBm IDD Max Power Supply Current VDD = 3.3 V, PMAX= 33 dBm, Temperature = -40°C Symbol Min Typ Max Units VDD 2.7 3.0 3.3 V VssEXT -3.3 -3.0 -2.7 V IDD 14 IDD (max) µA 50 µA Control Voltage High VIH 0.7 x VDD VDD V Control Voltage Low VIL 0 0.3 x VDD V ICTRL 1 µA PMAX 33 dBm PMAX 24 dBm +85 °C ICTRL Control Current3 Maximum Operating Power (RFX-RFC, All Bands (50Ω), 100% duty cycle) Maximum power into termination (RFX, All Bands (50Ω),100% duty cycle) Operating temperature range Note: TOP -40 2. Applied only when external Vss power supply used. Pin 20 must be grounded when using internal Vss supply. 3. Pull-down resistor in EVK schematic may increase control current. ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 11 Document No. 70-0298-03 │ UltraCMOS™ RFIC Solutions PE42451 Product Specification Electrostatic Discharge (ESD) Precautions GND GND RFC GND VssEXT / GND V3 24 23 22 21 20 19 Figure 3. Pin Configuration (Top View) GND 1 18 V2 RF5 2 17 V1 16 Vdd 15 GND Exposed Ground Paddle GND 12 GND GND 13 11 6 RF2 GND GND RF1 10 14 9 5 8 RF4 RF3 4 GND 3 GND 7 GND When handling this UltraCMOS™ device, observe the same precautions that you would use with other ESDsensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the specified rating. Latch-Up Avoidance Unlike conventional CMOS devices, UltraCMOS™ devices are immune to latch-up. Moisture Sensitivity Level The Moisture Sensitivity Level rating for the PE42451 in the 24-lead 4x4 QFN package is MSL1. Table 3. Pin Descriptions Pin # Name 1, 3, 4, 6, 7, 9, 10, 12, 13, 15, 21, 23, 24 2 Description Optional External Vss Control (VssEXT) GND Ground RF54 RF I/O 5 4 RF4 RF I/O 8 RF34 RF I/O 11 RF24 RF I/O 14 4 RF1 RF I/O 16 VDD Supply 17 V1 Switch control input, CMOS logic level 18 V2 Switch control input, CMOS logic level 19 V3 Switch control input, CMOS logic level VssEXT / External Vss Control / Ground GND5 4 RFC RF Common 20 22 Paddle Note: GND Ground for proper device operation 4. Blocking capacitors needed only when non-zero DC voltage present. 5. Pin 20 must be grounded when using internal Vss supply Table 4. Absolute Maximum Ratings Symbol Parameter/Conditions For proper operation, the VssEXT control must be grounded or at the Vss voltage specified in the Operating Ranges table (Table 2). When the VssEXT control pin on the package is grounded the switch FET’s are biased with an internal low spur negative voltage generator. For applications that require the lowest possible spur performance, VssEXT can be applied to bypass the internal negative voltage generator to eliminate the spurs. Switching Frequency The PE42451 has a maximum 25 kHz switching rate when the internal negative voltage generator is used (pin 20=GND). The rate at which the PE42451 can be switched is only limited to the switching time if an external -3 V supply is provided (pin 20=VssEXT ). Table 5. Truth Table Min Max Units Mode V3 V2 V1 -60 +150 °C All off 0 0 0 Maximum Operating Power (RFX-RFC, All Bands (50Ω), 100% duty cycle) RF1 on 0 0 1 33 dBm RF2 on 0 1 0 Maximum power into termination (RFX, All Bands (50Ω),100% duty cycle) RF3 on 0 1 1 PMAX 24 dBm RF4 on 1 0 0 VESD ESD Voltage HBM6, All Pins 3500 V RF5 on 1 0 1 VESD ESD Voltage MM7, All Pins All off 1 1 0 Unsupported 1 1 1 TST Storage temperature range PMAX Notes: 150 V 6. Human Body Model ESD Voltage (HBM, MIL_STD 883 Method 3015.7) 7. Machine Model ESD Voltage (JESD22-A115-A) Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Document No. 70-0298-03 │ www.psemi.com ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 11 PE42451 Product Specification Figure 4. Evaluation Board Layouts Evaluation Kit Peregrine Specification 101/0479 The SP5T switch EK Board was designed to ease customer evaluation of Peregrine’s PE42451. The RF common port is connected through a 50 Ω transmission line via the top SMA connector. RF1, RF2, RF3 and RF4 are connected through 50 Ω transmission lines via side SMA connectors. A through 50 Ω transmission is available via SMA connectors RFCAL1 and RFCAL2. This transmission line can be used to estimate the loss of the PCB over the environmental conditions being evaluated. The EVK board is constructed with four metal layers on dielectric materials of Rogers 4003C and 4450 with a total thickness of 32 mils. Layer 1 and layer 3 provide ground for the 50 ohm transmission lines. The 50 ohm transmission lines are designed in layer 2 for high isolation purpose and use a stripline waveguide design with a trace width of 9.4 mils and trace metal thickness of 1.8 mils. The board stack up for 50 ohm transmission lines has 8 mil thickness of Rogers 4003C between layer 1 and layer 2, and 10 mil thickness of Rogers 4450 between layer 2 and layer 3. Please consult manufacturer's guidelines for proper board material properties in your application. The PCB should be designed in such a way that RF transmission lines and sensitive DC i/o traces such as VssEXT are heavily isolated from one another, otherwise the true performance of the PE42451 will not be yielded. Figure 5. Evaluation Board Schematic Peregrine Specification 102/0569 J1 HEADER 14 R1 VSS VDD 0 OHM R2 C1 V3 V2 V1 1M DNI 13 11 9 7 5 3 1 13 11 9 7 5 3 1 14 12 10 8 6 4 2 14 12 10 8 6 4 2 R3 0 OHM R4 C2 100pF RFC 1M R5 2 1 0 OHM R6 C3 100pF RFC 1M R7 1 RF5 RF5 1 GND 2 RF5 3 GND 4 GND 20 19 V3 VSS 22 23 21 GND RFC GND GND 24 0 OHM R8 C4 100pF V2 18 V1 17 VDD 16 GND 15 1M 2 R9 U1 0 OHM 1 RF2 1 RF3 RF3 C6 1µF USE PCB 101-0479-03 2 RF1 C5 100pF 12 11 10 9 7 RF1 GND 13 RF2 14 GND GND RF1 GND GND RF4 6 RF3 5 GND 2 RF4 8 1 RF4 PE4245x_24L_QFN RF2 RFCAL2 RFCAL1 1 1 RF RF CAL 1 ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 11 2 2 2 2 STRIPLINE Document No. 70-0298-03 │ UltraCMOS™ RFIC Solutions PE42451 Product Specification Performance Plots @ 25 °C and 3.0 V unless otherwise specified Figure 6. Insertion Loss: RFC-RFX @ 25 °C Figure 7. Insertion Loss: RFC-RFX @ 3.0 V Figure 8. Insertion Loss: All Paths Document No. 70-0298-03 │ www.psemi.com ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 11 PE42451 Product Specification Performance Plots @ 25 °C and 3.0 V unless otherwise specified Figure 9. Isolation: RFC-RFX @ 25 °C Figure 10. Isolation: RFC-RFX @ 3.0 V Figure 11. Isolation: RFX-RFX @ 25 °C Figure 12. Isolation: RFX-RFX @ 3.0 V ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 11 Document No. 70-0298-03 │ UltraCMOS™ RFIC Solutions PE42451 Product Specification Performance Plots @ 25 °C and 3.0 V unless otherwise specified (Continued) Figure 13. Return Loss at active port @ 25 °C Figure 14. Return Loss at active port @ 3.0 V Figure 15. Return Loss: RFC @ 25 °C Figure 16. Return Loss: RFC @ 3.0 V Figure 17. Return Loss: All Paths, Terminated Document No. 70-0298-03 │ www.psemi.com ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 11 PE42451 Product Specification Performance Plots @ 25 °C and 3.0 V unless otherwise specified (Continued) Figure 18. Nominal Linearity Performance (IIP3) Figure 19. Nominal Linearity Performance (IIP2) 70 120 60 100 50 IIP2 [dBm] IIP3 [dBm] 80 40 TX1 30 TX2 TX3 20 60 TX1 TX2 40 TX3 TX4 TX4 TX5 20 10 0 0 1000 2000 3000 4000 5000 6000 Frequency [MHz] ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 11 TX5 0 0 1000 2000 3000 4000 5000 6000 Frequency [MHz] Document No. 70-0298-03 │ UltraCMOS™ RFIC Solutions PE42451 Product Specification Figure 20. Package Drawing Peregrine Specification 19/0130 A Max. 0.900 Nom. 0.850 Min. 0.800 Document No. 70-0298-03 │ www.psemi.com ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 9 of 11 PE42451 Product Specification Figure 21. Tape and Reel Drawing A0 = 4.35 B0 = 4.35 K0 = 1.1 Tape Feed Direction Pin 1 Top of Device Device Orientation in Tape Figure 22. Marking Specifications 42451 YYWW ZZZZZ YYWW = Date Code ZZZZZ = Last five digits of Lot Number Table 6. Ordering Information Order Code Part Marking Description Package Shipping Method PE42451MLIAA 42451 PE42451G-24QFN 4x4mm-cut off tape and reel Green 24-lead 4x4mm QFN Bulk or tape cut from reel PE42451MLIAA-Z 42451 PE42451G-24QFN 4x4mm-3000C Green 24-lead 4x4mm QFN 3000 units / T&R EK42451-01 PE42451 -EK PE42451-24QFN 4x4mm-EK Evaluation Kit 1 / Box ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 10 of 11 Document No. 70-0298-03 │ UltraCMOS™ RFIC Solutions PE42451 Product Specification Sales Offices The Americas Peregrine Semiconductor Corporation Peregrine Semiconductor, Asia Pacific (APAC) 9380 Carroll Park Drive San Diego, CA 92121 Tel: 858-731-9400 Fax: 858-731-9499 Shanghai, 200040, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652 Europe Peregrine Semiconductor Europe Bâtiment Maine 13-15 rue des Quatre Vents F-92380 Garches, France Tel: +33-1-4741-9173 Fax : +33-1-4741-9173 High-Reliability and Defense Products Americas San Diego, CA, USA Phone: 858-731-9475 Fax: 848-731-9499 Europe/Asia-Pacific Parc Cezanne 1 380 Avenue Archimède, Parc de la Duranne 13857 Aix-En-Provence Cedex 3, France Phone: +33-4-4239-3361 Fax: +33-4-4239-7227 Peregrine Semiconductor, Korea #B-2607, Kolon Tripolis, 210 Geumgok-dong, Bundang-gu, Seongnam-si Gyeonggi-do, 463-943 South Korea Tel: +82-31-728-3939 Fax: +82-31-728-3940 Peregrine Semiconductor K.K., Japan Teikoku Hotel Tower 10B-6 1-1-1 Uchisaiwai-cho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213 For a list of representatives in your area, please refer to our Web site at: www.psemi.com Data Sheet Identification Advance Information The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). Document No. 70-0298-03 │ www.psemi.com The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. ©2009-2010 Peregrine Semiconductor Corp. All rights reserved. Page 11 of 11