SHENZHENFREESCALE AO3460

AO3460
60V N-Channel MOSFET
General Description
The AO3460 uses advanced trench technology to provide excellent RDS(ON) , low gate charge, and
operation with gate voltages as low as 4.5V, in the small SOT-23 footprint. It can be used for a wide
variety of applications, including load switching, low current inverters and low current DC-DC converters.
It is ESD protected.
Features
VDS (V) = 60V
ID = 0.65A (VGS = 10V)
RDS(ON) < 1.7Ω (VGS = 10V)
RDS(ON) < 2Ω (VGS = 4.5V)
ESD protected
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Maximum
VDS
Drain-Source Voltage
60
VGS
Gate-Source Voltage
Continuous Drain
Current A, F
Pulsed Drain Current
TA=70°C
TA=25°C
Power Dissipation A
TA=70°C
0.65
ID
0.5
IDM
1.6
Maximum Junction-to-Lead C
1/4
W
0.9
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
1.4
PD
Junction and Storage Temperature Range TJ, TSTG
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
V
±20
TA=25°C
B
Units
V
RθJA
RθJL
Typ
70
100
63
°C
Max
90
125
80
Units
°C/W
°C/W
°C/W
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AO3460
60V N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
Conditions
Min
ID=250µA, VGS=0V
Typ
60
Zero Gate Voltage Drain Current
IGSS
VGS(th)
Gate-Body leakage current
Gate Threshold Voltage
VDS=VGS ID=250uA
ID(ON)
On state drain current
VGS=10V, VDS=5V
1
TJ=55°C
5
VDS=0V, VGS=±20V
±10
1
2.2
1.4
1.7
2.5
3
VGS=4.5V, ID=0.5A
1.6
2
VDS=5V, ID=0.65A
0.8
Static Drain-Source On-Resistance
gFS
Forward Transconductance
VSD
Diode Forward Voltage
IS=0.1A,VGS=0V
0.8
IS
Maximum Body-Diode Continuous Current
TJ=125°C
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Output Capacitance
Crss
Reverse Transfer Capacitance
22
VGS=0V, VDS=30V, f=1MHz
SWITCHING PARAMETERS
tD(on)
Turn-On DelayTime
µA
V
Ω
Ω
S
1
V
1.2
A
27
pF
6
pF
2
pF
5.3
ns
2.8
ns
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
IF=0.65A, dI/dt=100A/µs, VGS=-9V
11.3
Qrr
Body Diode Reverse Recovery Charge IF=0.65A, dI/dt=100A/µs, VGS=-9V
7.5
Body Diode Reverse Recovery Time
VGS=10V, VDS=30V, RL=75Ω,
RGEN=3Ω
µA
A
RDS(ON)
Coss
2.5
1.6
VGS=10V, ID=0.65A
Units
V
VDS=60V, VGS=0V
IDSS
Max
19.7
ns
5.5
ns
14
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The
value in any given application depends on the user's specific board design.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
curve provides a single pulse rating.
F. The current rating is based on the t ≤ 10s thermal resistance rating.
Rev 2: Nov. 2010
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
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AO3460
60V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1
2
0.8
4.5V
VDS=0V, VGS=±10V
4V
1
0.6
ID(A)
ID (A)
1.5
VDS=5V
10V
6V
25°C
0.4
VDS=VGS ID=250µA
3.5V
0.5
0.2
125°C
VGS=3.0V
0
0
0
1
2
3
4
0
5
1
2
3
4
3
Normalized On-Resistance
2.2
2.5
VGS=4.5V
2
1.5
VGS=10V
1
VGS=10V
ID=0.65A
1.8
VGS=4.5V
ID=0.5
1.4
1.0
0.6
0
0.5
1
1.5
-50
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
0
50
100
150
1.0E+00
ID=0.65A
125°C
3.5
25°C
1.0E-01
-40°C
IS (A)
3
RDS(ON) (Ω )
200
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
4
2.5
1.0E-02
125°C
1.0E-03
2
25°C
1.0E-04
1.5
1.0E-05
1
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
3/4
5
VGS(Volts)
Figure 2: Transfer Characteristics
VDS (Volts)
Figure 1: On-Region Characteristics
RDS(ON) (Ω )
-40°C
0.0
0.4
0.8
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO3460
60V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
10
VDS=30V
ID=0.65A
Ciss
25
6
VDS=0V, VGS=±10V
4
VDS=VGS ID=250µA
Capacitance (pF)
VGS (Volts)
8
20
15
10
2
Coss
5
0
Crss
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0
Qg (nC)
Figure 7: Gate-Charge Characteristics
30
40
50
60
20
10µs
100µs
1ms
10ms
RDS(ON)
limited
0.100
0.1s
1s
10s
DC
0.010
1
VDS (Volts)
10
100
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=125°C/W
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
8
0
0.0001
0.001
0.1
12
4
TJ(Max)=150°C
TC=25°C
0.01
TJ(Max)=150°C
TA=25°C
16
Power (W)
1.000
ID (Amps)
20
VDS (Volts)
Figure 8: Capacitance Characteristics
10.000
Zθ JA Normalized Transient
Thermal Resistance
10
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1
PD
0.01
Ton
T
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
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