SHENZHENFREESCALE AO4610

Freescale
AO4610/ MC4610
P & N-Channel 30-V (D-S) MOSFET
These miniature surface mount MOSFETs utilize
High Cell Density process. Low rDS(on) assures
minimal power loss and conserves energy, making
this device ideal for use in power management
circuitry. Typical applications are PWMDC-DC
converters, power management in portable and
battery-powered products such as computers,
printers, battery charger, telecommunication power
system, and telephones power system.
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•
•
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PRODUCT SUMMARY
VDS (V)
rDS(on) m(Ω)
ID (A)
40 @ VGS = 4.5V
31 @ VGS = 10V
80 @ VGS = -4.5V
52 @ VGS = -10V
30
-30
Low rDS(on) Provides Higher Efficiency and
Extends Battery Life
Miniature SO-8 Surface Mount Package
Saves Board Space
High power and current handling capability
Low side high current DC-DC Converter
applications
6.0
6.9
-4.2
-5.2
1
8
2
7
3
6
4
5
o
ABSOLUTE MAXIMUM RATINGS (TA = 25 C UNLESS OTHERWISE NOTED)
Parameter
Symbol N-Channel P-Channel Units
30
-30
Drain-Source Voltage
VDS
V
VGS
Gate-Source Voltage
±20
±20
o
TA=25 C
a
Continuous Drain Current
o
TA=70 C
b
Pulsed Drain Current
a
Continuous Source Current (Diode Conduction)
6.9
-5.2
5.4
-6.8
IDM
20
-20
IS
1.3
-1.3
2.1
2.1
1.3
1.3
ID
o
TA=25 C
a
Power Dissipation
o
TA=70 C
PD
Operating Junction and Storage Temperature Range
THERMAL RESISTANCE RATINGS
Parameter
a
t <= 5 sec
Maximum Junction-to-Case
Maximum Junction-to-Ambient
a
t <= 5 sec
TJ, Tstg
A
A
W
o
-55 to 150
Symbol
Maximum
RθJC
40
o
60
o
RθJA
C
Units
C/W
C/W
Notes
a.
Surface Mounted on 1” x 1” FR4 Board.
b.
Pulse width limited by maximum junction temperature
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AO4610/ MC4610
SPECIFICATIONS (TA = 25oC UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limits
Min Typ
Test Conditions
Ch
VGS = VDS, ID = 250 uA
N
1
VGS = VDS, ID = -250 uA
VGS = -20 V, VDS = 0 V
VGS = 20 V, VDS = 0 V
VDS = -24 V, VGS = 0 V
VDS = 24 V, VGS = 0 V
VDS = 5 V, VGS = 10 V
VDS = -5 V, VGS = -10 V
VGS = 10 V, ID = 6.9 A
VGS = 4.5 V, ID = 6 A
VGS = -10 V, ID = -5.2 A
VGS = -4.5 V, ID = -4.2 A
VDS = 15 V, ID = 6.9 A
VDS = -15 V, ID = -5.2 A
P
P
N
P
N
N
P
-1.0
Max Unit
Static
VGS(th)
Gate-Threshold Voltage
IGSS
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
A
ID(on)
A
Drain-Source On-Resistance
Forward Tranconductance
IDSS
A
rDS(on)
gfs
V
±100
±100
-1
1
20
-20
nA
uA
A
31
40
52
80
N
P
N
P
25
10
N
P
N
P
N
4.0
10
1.1
2.2
1.4
P
1.7
mΩ
S
Dynamic
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
Fall-Time
tr
td(off)
tf
N-Channel
VDS=15V, VGS=10V, ID=6.9A
P-Channel
VDS=-15V, VGS=-10V, ID=-5.2A
N-Chaneel
VDD=15V, VGS=10V, ID=1A ,
RGEN=6Ω,
P-Channel
VDD=-15V, VGS=-10V, ID=-1A
RGEN=6Ω
N
P
N
P
8
10
5
2.8
N
P
N
P
23
53.6
3
46
nC
nS
Notes
a.
Pulse test: PW <= 300us duty cycle <= 2%.
b.
Guaranteed by design, not subject to production testing.
FREESCALE reserves the right to make changes without fu rther notice to any products herein. FREESCALE makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does freescale assumeany liability arising out of the application or
use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in freescale data sheets and/or specifications can and do vary in different applications and
actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by
customer’s technical experts. freescale does not convey any license under its patent rights nor the rights of others. freescale products are not designed,
intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the freescale product could create a situ ation where personal injury or death may occur.
Should Buyer purchase or use freescale products for any s uch unintended or unauthorized application, Buyer s hall indemnify and hold freescale and its
officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney
fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that freescale was negligent regarding the design or manufacture of the part. freescale is an Equal Opportunity/Affirmative Action Employer.
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AO4610/ MC4610
Typical Electrical Characteristics (N-Channel)
30
TA = -55oC
VDS = 5V
VGS = 10V
25
6.0V
20
5.0V
4.0V
15
3.0V
10
5
25oC
25
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
30
125oC
20
15
10
5
0
0
0
0.5
1
1.5
2
0.5
2.5
1.5
2.5
3.5
4.5
VGS, GATE TO SOURCE VOLTAGE (V)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. On-Region Characteristics
Figure 2. Body Diode Forward Voltage Variation
with Source Current and Temperature
1500
CAPACITANCE (pF)
RDS(ON), NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
2.5
2
4.5V
1.5
6.0V
1
10V
f = 1MHz
VGS = 0 V
1200
CISS
900
600
COSS
300
CRSS
0
0.5
0
5
10
15
20
25
0
30
1.6
10
15V
6
4
2
0
6
9
20
25
30
VGS = 10V
ID = 7A
ID = 7A
3
15
Figure 4. Capacitance Characteristics
Normalized R DS(on)
VG S, G A TE-SOU RCE V OLTAG E (V )
Figure 3. On Resistance Vs Vgs Voltage
0
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
ID, DRAIN CURRENT (A)
8
5
12
1.4
1.2
1.0
0 .8
0 .6
15
-50
Qg, GATE CHARGE (nC)
-2 5
0
25
50
75
10 0
12 5
150
T J Juncation Temperature (篊)
Figure 5. Gate Charge Characteristics
Figure 6. On-Resistance Variation with Temperature
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AO4610/ MC4610
Typical Electrical Characteristics (N-Channel)
RDS(ON), ON-RESISTANCE (OHM)
IS, REVERSE DRAIN CURRENT (A)
100
VGS = 0V
10
o
1
TA = 125 C
o
25 C
0.1
0.01
0.001
0.0001
0.1
ID = 7 A
0.08
0.06
0.04
o
TA = 25 C
0.02
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
2
Figure 7. Transfer Characteristics
6
8
50
VDS = VGS
ID = -250mA
2
1.8
1.6
1.4
1.2
1
-50
-25
0
25
50
75
100 125
10
Figure 8. On-Resistance with Gate to Source Voltage
2.2
P(pk), PEAK TRANSIENT POWER (W)
-Vth, GATE-SOURCE THRESTHOLD
VOLTAGE (V)
4
VGS, GATE TO SOURCE VOLTAGE (V)
VSD, BODY DIODE FORWARD VOLTAGE (V)
150 175
SINGLE PULSE
RqJA = 125oC/W
TA = 25oC
40
30
20
10
0
0.001
0.01
TA, AMBIENT TEMPERATURE (oC)
Figure 9. Vth Gate to Source Voltage Vs Temperature
0.1
1
t1, TIME (SEC)
10
100
Figure 10. Single Pulse Maximum Power Dissipation
Normalized Thermal Transient Junction to Ambient
1
D = 0.5
0.2
0.1
0.1
Rq J A (t) = r(t) + Rq J A
Rq J A = 1 2 5 o C/W
0.0
P(p k)
0.02
0.01
t1
t2
0.01
TJ - TA = P * Rq J A(t )
Duty Cycle, D = t1 / t2
S INGLE P ULS E
0.001
0.0001
0.001
0.01
0.1
t1, TIM E (s e c )
1
10
100
1000
Figure 11. Transient Thermal Response Curve
4
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Freescale
AO4610/ MC4610
Typical Electrical Characteristics (P-Channel)
30
15
-6.0V
o
VDS = -5V
-5.0V
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
VGS = -10V
20
-4.0V
10
o
TA = -55 C
25 C
12
o
125 C
9
6
3
-3.0V
0
0
0
1
2
3
4
5
1
6
1.5
-VDS, DRAIN TO SOURCE VOLTAGE (V)
3
3.5
4
4.5
with Source Current and Temperature
800
2
f = 1 MHz
VGS = 0 V
700
1.8
CAPACITANCE (pF)
RDS(ON), NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
2.5
Figure 2. Body Diode Forward Voltage Variation
Figure 1. On-Region Characteristics
1.6
-4.5V
-6.0V
1.4
1.2
-10V
1
CISS
600
500
400
300
COSS
200
100
0.8
0
6
12
18
24
CRSS
0
30
0
5
-ID, DRAIN CURRENT (A)
10
15
20
25
30
-VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 3. On Resistance Vs Vgs Voltage
Figure 4. Capacitance Characteristics
10
1.6
ID = -5.7A
VGS = 10V
ID = 5.7A
1.4
8
-15V
Normalized RDS(on)
-VGS, GATE-SOURCE VOLTAGE (V)
2
-VGS, GATE TO SOURCE VOLTAGE (V)
6
4
2
1.2
1.0
0.8
0.6
0
0
2
4
6
8
-50
10
-25
0
25
50
75
100
125
150
TJ Juncation Temperature (C)
Qg, GATE CHARGE (nC)
Figure 5. Gate Charge Characteristics
Figure 6. On-Resistance Variation with Temperature
5
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AO4610/ MC4610
0.25
100
ID = -5.7A
RDS(ON), ON-RESISTANCE (OHM)
VGS =0V
10
o
TA = 125 C
1
0.1
o
25 C
0.01
0.001
0.0001
0
0.2
0.15
0.1
0.05
TA = 25oC
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-VSD, BODY DIODE FORWARD VOLTAGE (V)
2
4
6
8
10
-VGS, GATE TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics
Figure 8. On-Resistance with Gate to Source Voltage
50
2.2
VDS = VGS
ID = -250mA
2
P(pk), PEAK TRANSIENT POWER (W)
-Vth, GATE-SOURCE THRESTHOLD
VOLTAGE (V)
-IS, REVERSE DRAIN CURRENT (A)
Typical Electrical Characteristics (P-Channel)
1.8
1.6
1.4
1.2
1
-50
-25
0
25
50
75
100 125 150 175
TA, AMBIENT TEMPERATURE (oC)
SINGLE PULSE
RqJA = 125C/W
TA = 25C
40
30
20
10
0
0.001
0.01
0.1
1
10
100
1000
t1, TIME (sec)
Figure 9. Vth Gate to Source Voltage Vs Temperature
Figure 10. Single Pulse Maximum Power Dissipation
Normalized Thermal Transient Junction to Ambient
1
0.1
D =0.5
0.2
Rq J A(t) = r(t) + Rq J A
Rq J A = 1 2 5 o C/W
0.1
0.05
P (pk)
0.02
0.01
t1
t2
0.01
TJ - TA = P * Rq J A(t)
Duty Cycle, D = t1 / t2
S INGLE P ULS E
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1 , TIM E (s ec)
Figure 11. Transient Thermal Response Curve
6
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Freescale
AO4610/ MC4610
Package Information
SO-8: 8LEAD
H x 45°
7
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Freescale
AO4610/ MC4610
Ordering information
• AM4512C-T1-XX
–
–
–
–
–
–
A:
M:
4512:
C:
T1:
XX:
Analog Power
MOSFET
Part number
Complementary
Tape & reel
Blank:
Standard
PF:
Leadfree
8
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