SHENZHENFREESCALE SUD45P03-09

SUD45P03-09
P-Channel 30 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 30
RDS(on) (Ω)
ID (A)
0.0087 at VGS = - 10 V
- 45d
0.0150 at VGS = - 4.5 V
- 32
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
Qg (Typ.)
60
APPLICATIONS
• Power Switch
• Load Switch in High Current Applications
• DC/DC Converters
TO-252
S
G
Drain Connected to Tab
G
D
S
D
Top View
Ordering Information: SUD45P03-09-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Symbol
Limit
Drain-Source Voltage
Parameter
VDS
- 30
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 70 °C
Pulsed Drain Current
Avalanche Current
a
L = 0.1 mH
Single Avalanche Energy
TC = 25 °C
Maximum Power Dissipationa
TA = 25 °C
Operating Junction and Storage Temperature Range
c
ID
V
- 45d
- 42.5
IDM
- 100
IAS
- 35
EAS
61
PD
Unit
41.7
A
mJ
b
2.1
W
TJ, Tstg
- 55 to 150
°C
Symbol
Limit
Unit
RthJA
60
RthJC
3
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount)
c
Junction-to-Case (Drain)
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When Mounted on 1" square PCB (FR-4 material).
d. Package limited.
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°C/W
SUD45P03-09
P-Channel 30 V (D-S) MOSFET
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VDS = 0 V, ID = - 250 µA
- 30
VGS(th)
VDS = VGS, ID = - 250 µA
-1
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
IDSS
- 2.5
± 250
VDS = - 30 V, VGS = 0 V
1
VDS = - 30 V, VGS = 0 V, TJ = 125 °C
50
VDS = - 30 V, VGS = 0 V, TJ = 150 °C
250
VDS ≤ - 10 V, VGS = - 10 V
ID(on)
RDS(on)
gfs
- 50
V
nA
µA
A
VGS = - 10 V, ID = - 20 A
0.0072
0.0087
VGS = - 4.5 V, ID = - 15 A
0.0125
0.0150
VDS = - 15 V, ID = - 20 A
45
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
445
60
VDS = - 15 V, VGS = - 10 V, ID = - 20 A
Turn-On Delay Timec
Rise Timec
Fall Timec
f = 1 MHz
td(on)
tr
c
td(off)
90
nC
9.3
15
Rg
Gate Resistance
pF
515
Qgd
Gate-Drain Charge
Turn-Off Delay Time
2700
VGS = 0 V, VDS = - 15 V, f = 1 MHz
VDD = - 15 V, RL = 1.5 Ω
ID ≅ - 10 A, VGEN = - 10 V, Rg = 1 Ω
tf
Drain-Source Body Diode Ratings and Characteristics TC = 25 °C
0.5
2.5
5
12
20
11
20
40
60
12
20
- 45
Pulsed Current
ISM
- 100
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
Qrr
A
IF = - 10 A, VGS = 0 V
- 0.8
- 1.5
V
27
40
ns
IF = - 10 A, dI/dt = 100 A/µs
1.3
2
A
20
30
nC
trr
IRM(REC)
ns
b
IS
Continuous Current
Ω
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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SUD45P03-09
P-Channel 30 V (D-S) MOSFET
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
0.020
I D - Drain Current (A)
60
R DS(on) - On-Resistance (Ω)
VGS = 10 V thru 5 V
80
VGS = 4 V
40
20
0.015
VGS = 4.5 V
0.010
VGS = 10 V
0.005
VGS = 3 V
0
0.0
0.000
0.5
1.0
1.5
2.0
2.5
0
20
40
Output Characteristics
4
0.04
R DS(on) - On-Resistance (Ω)
0.05
3
2
TC = 25 °C
1
0.03
0.02
TJ = 150 °C
0.01
TC = 125 °C
TJ = 25 °C
TC = - 55 °C
0
1
2
3
0.00
2
4
6
8
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
On-Resistance vs. Gate-to-Source Voltage
10
10
ID = 20 A
VGS - Gate-to-Source Voltage (V)
TC = - 55 °C
g fs - Transconductance (S)
4
VGS - Gate-to-Source Voltage (V)
75
60
TC = 25 °C
45
TC = 125 °C
30
15
8
VDS = 15 V
6
VDS = 8 V
VDS = 24 V
4
2
0
0
0
3/8
100
On-Resistance vs. Drain Current
5
0
80
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
I D - Drain Current (A)
60
10
20
30
40
50
0
20
40
60
ID - Drain Current (A)
Qg - Total Gate Charge (nC)
Transconductance
Gate Charge
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80
SUD45P03-09
P-Channel 30 V (D-S) MOSFET
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
- 1.0
100
VGS(th) (V)
I S - Source Current (A)
- 1.3
TJ = 150 °C
10
TJ = 25 °C
ID = 250 µA
- 1.6
1
- 1.9
0.1
0.0
0.3
0.6
0.9
- 2.2
- 50
1.2
0
25
50
75
VSD - Source-to-Drain Voltage (V)
TJ - Temperature (°C)
Source-Drain Diode Forward Voltage
Threshold Voltage
4000
100
125
150
100
125
150
VDS - Drain-to-Source Voltage (V)
- 33
Ciss
3000
C - Capacitance (pF)
- 25
2000
1000
Coss
Crss
0
0
5
10
15
20
25
ID = 250 µA
- 34
- 35
- 36
- 37
- 50
30
- 25
0
25
50
75
VDS - Drain-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Capacitance
Drain Source Breakdown vs. Junction Temperature
60
1.8
ID = 20 A
I D - Drain Current (A)
(Normalized)
R DS(on) - On-Resistance
VGS = 10 V
1.5
1.2
VGS = 4.5 V
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Package Limited
30
15
0.9
0.6
- 50
45
0
- 25
0
25
50
75
100
125
150
0
25
50
75
100
TJ - Junction Temperature (°C)
TC - Case Temperature (°C)
On-Resistance vs. Junction Temperature
Current Derating
125
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150
SUD45P03-09
P-Channel 30 V (D-S) MOSFET
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
1000
100
Limited by RDS(on)*
TJ = 25 °C
TJ = 150 °C
10
I D - Drain Current (A)
I DAV (A)
100
100 µA
10
1 ms
10 ms, 100 ms
1 s, 10 s, DC
1
TA = 25 °C
Single Pulse
0.1
1
10-5
10-4
10-3
10-2
10-1
0.01
0.1
1
Time (s)
Single Pulse Avalanche Current Capability vs. Time
BVDSS
Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
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30
SUD45P03-09
P-Channel 30 V (D-S) MOSFET
TO-252AA CASE OUTLINE
E
A
MILLIMETERS
C1
e
b1
D1
e1
E1
L
gage plane height (0.5 mm)
L1
b
L3
H
D
L2
b2
C
A2
A1
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
2.21
2.38
0.087
0.094
A1
0.89
1.14
0.035
0.045
A2
0.030
0.127
0.001
0.005
b
0.71
0.88
0.028
0.035
b1
0.76
1.14
0.030
0.045
b2
5.23
5.44
0.206
0.214
C
0.46
0.58
0.018
0.023
C1
0.46
0.58
0.018
0.023
D
5.97
6.22
0.235
0.245
D1
4.10
4.45
0.161
0.175
E
6.48
6.73
0.255
0.265
E1
4.49
5.50
0.177
0.217
e
e1
2.28 BSC
4.57 BSC
0.090 BSC
0.180 BSC
H
9.65
10.41
0.380
L
1.40
1.78
0.055
0.070
L1
0.64
1.02
0.025
0.040
L2
0.89
1.27
0.035
0.050
L3
1.15
1.52
0.040
0.060
ECN: T11-0110-Rev. L, 18-Apr-11
DWG: 5347
Note
• Dimension L3 is for reference only.
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0.410
SUD45P03-09
P-Channel 30 V (D-S) MOSFET
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
0.243
0.087
(2.202)
0.090
(2.286)
(10.668)
0.420
(6.180)
(5.690)
0.180
0.055
(4.572)
(1.397)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
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SUD45P03-09
P-Channel 30 V (D-S) MOSFET
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