TAIYO-YUDEN UMK105CG8R2DV-F

Notice for TAIYO YUDEN products 1
Please read this notice before using the TAIYO YUDEN products.
■ Product information in this catalog is as of October 2008. All of the contents specified herein are
subject to change without notice due to technical improvements, etc. Therefore, please check for the
latest information carefully before practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment
incorporating such products, which are caused under the conditions other than those specified in this
catalog or individual specification.
INFORMATION ON THE GENERAL CATALOG
REMINDERS
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual
specification is available.
■ Please conduct validation and verification of products in actual condition of mounting and operating
environment before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and
intended for use in general electronics equipment.(for AV, office automation, household, office supply,
information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the
components or devices into any equipment in the field such as transportation,( automotive control, train
control, ship control), transportation signal, disaster prevention, medical, public information network
(telephone exchange, base station) etc. which may have direct influence to harm or injure a human
body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear
control, submarine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic
equipment, if the equipment or the electric circuit require high safety or reliability function or
performances, a sufficient reliability evaluation check for safety shall be performed before commercial
shipment and moreover, due consideration to install a protective circuit is strongly recommended at
customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices
or distributors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that
may occur in connection with a third party's intellectual property rights and other related rights arising
from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign
Exchange and Foreign Trade Control Law”of Japan,“U.S. Export Administration Regulations”
, and
other applicable regulations. Should you have any question or inquiry on this matter, please contact our
sales staff.
Should you have any question or inquiry on this matter, please contact our sales staff.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
3
一般積層セラミックコンデンサ
（温度補償用・Class 1）
STANDARD MULTILAYER
CERAMIC CAPACITORS
(CLASS1 : TEMPERATURE COMPENSATING
DIELECTRIC TYPE)
OPERATING TEMP.
−55∼＋125℃
特長 FEATURES
・実装密度の向上が図れます
・モノリシックの構造のため、信頼性が高い
・同一形状、静電容量範囲が広い
・Improve Higher Mounting Densities.
・Multilayer block structure provides higher reliability
・A wide range of capacitance values available in standard case sizes.
用途 APPLICATIONS
・General electronic equipment
・Communication equipment（cellular phone, PHS, other wireless applications, etc.）
・一般電子機器用
・通信機器用（携帯電話、PHS、コードレス電話 etc.）
形名表記法 ORDERING CODE
1
4
6
7
9
定格電圧〔VDC〕
形状寸法
（EIA）L×W
〔mm〕
公称静電容量〔pF〕
容量許容差
個別仕様
E
T
U
042（01005）
063（0201）
105（0402）
16
25
50
2
C
D
F
J
K
0.5
1
10
温度特性〔ppm/℃〕
積層コンデンサ
C□
R□
S□
T□
U□
SL
3
端子電極
メッキ品
K
例
0R5
010
100
※R＝小数点
5
シリーズ名
M
0.4×0.2
0.6×0.3
1.0×0.5
−150：CG、CH、CJ、CK
−220：RH、
−330：SH、SJ、SK
G
−470：TJ、TK
H
−750：UJ、UK
J
＋350∼−1000
K
± 0.25
± 0.5
± 1
± 5
± 10 pF
pF
pF
%
%
−
標準
10
包装
F
8
φ178mm テーピング
（2mmピッチ）
製品厚み〔mm〕
C
P
V
W
±30
±60
±120
±250
0.2
0.3
0.5
0.5
11
当社管理記号
△
□＝許容差
標準品
△＝スペース
U M K 1 0 5 C H 1 0 1 J V _ F △
1
3
2
6
5
4
7
9
10
1
4
6
7
9
Rated voltage
〔VDC〕
Dimensions（case size）
（EIA）L×W〔mm〕
Nominal capacitance
〔pF〕
Capacitance tolerance
Special
code
E
T
U
Multilayer ceramic
capacitor
3
End termination K
0.4×0.2
0.6×0.3
1.0×0.5
Plated
example
0R5
010
100
C
D
F
J
K
0.5
1
10
*R=decimal point
5
Series name
M
042（01005）
063（0201）
105（0402）
16
25
50
2
C□
R□
S□
T□
U□
SL
−150：CG、CH、CJ、CK
−220：RH、
−330：SH、SJ、SK
G
−470：TJ、TK
H
−750：UJ、UK
J
＋350∼−1000
K
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
± 0.25
± 0.5
± 1
± 5
± 10 pF
pF
pF
%
%
−
11
Standard Products
10
Packaging F
8
Temperature characteristics
〔ppm/℃〕
φ178mm Taping
（2mm pitch）
Thickness[mm]
C
P
V
W
±30
±60
±120
±250
□＝Tolerance
56
8
0.2
0.3
0.5
0.5
11
Internal code
△
Standard Products
△＝Blank space
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
外形寸法 EXTERNAL DIMENSIONS
Type（EIA）
L
W
T
e
□MK042
0.4±0.02
0.2±0.02
0.2±0.02
0.1±0.03
C
（01005）
（0.016±0.001）（0.008±0.001）（0.008±0.001）
（0.004±0.001）
□MK063
0.6±0.03
0.3±0.03
0.3±0.03
0.15±0.05
P
（0201）
（0.024±0.001）（0.012±0.001）（0.012±0.001）
（0.006±0.002）
□MK105
1.0±0.05
0.5±0.05
0.5±0.05
0.25±0.10
（0402）
（0.039±0.002）（0.020±0.002） （0.020±0.002） W, V （0.010±0.004）
Unit：mm（inch）
CAPACITORS
概略バリエーション AVAILABLE CAPACITANCE RANGE
Type
042
063
Temp.char. C□ C□ U□ C□ U□
Cap VDC
16V
25V
[ pF ]［pF：3digits］
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
0R5
010
1R5
020
030
040
050
060
070
080
090
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
105
SL R□ S□
温度特性 Temperature Characteristics
温度特性
Temperature
char.（EIA）
T□
50V
W
P
C
W
W
W
W
P
0±250
C J（C0J）
0±120
C H（C0H）
0±60
C G（C0G）
0±30
R H（R2H）
−220±60
S K（S2K）
−330±250
S J（S2J）
−330±120
S H（S2H）
−330±60
T K（T2K）
−470±250
T J（T2J）
−470±120
U K（U2K）
−750±250
−55∼＋125℃
−750±120
−1000∼＋350
SL
V
温度係数範囲
使用温度範囲
〔ppm/℃〕※1
Temperature coefficient range Operating Temp. range
C K（C0K）
U J（U2J）
V
4
※1：20℃における静電容量を基準。
Based on the capacitance at 20℃
静電容量許容差 Capacitance Tolerance Symbol
V
記号
Symbol
注：グラフの記号は製品の厚み記号です。
Note: Letters in the table indicate thickness.
許容差
Tolerance
区分
Item
C
±0.25pF
∼5pF
D
±0.5 pF
∼10pF
F
±1pF
6∼10 pF
J
±5 %
11pF∼
K
±10 %
11pF∼
Q
区分
Item
Q※2
Symbol
≧400＋20・C※1
∼27pF
≧1000
30pF∼
※1：C＝公称静電容量 Nominal capacitance〔pF〕
※2：測定周波数 Measurement Frequency= 1±0.1MHz（C≦1000pF）
1±0.1kHz（C＞1000pF）
測定電圧
Measurement voltage
= 0.5∼5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
セレクションガイド
Selection Guide
P.12
etc
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
P.58
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
̶̶̶̶̶̶
梱包
Packaging
信頼性
Reliability Data
P.98
P.102
9
使用上の注意
Precautions
P.108
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
57
アイテム一覧 PART NUMBERS
042TYPE
Class 1
定格電圧
Rated
形 名
Voltage
Ordering code
(DC)
16V
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK0 4 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
温度特性
公称静電
EHS
静電容量
厚み
容 量 許 容 差
Temperature characteristics (EIA)
(Environmental
Thicknees
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ
Capacitance Capacitance [mm]
SL
Substances) (C0K) (C0J) (C0H) (C0G) (P2K) (P2J) (P2H) (R2K) (R2J) (R2H) (S2K) (S2J) (S2H) (T2K) (T2J) (T2H) (U2K) ( U2J)
tolerance
(inch)
[pF]
△ 0 R 5 □C
△ 0 1 0 □C
△ 1 R 5 □C
△ 0 2 0 □C
△ 0 3 0 □C
△ 0 4 0□C
△ 0 5 0 □C
△ 0 6 0 □C
△ 0 7 0 □C
△ 0 8 0□C
△ 0 9 0 □C
△ 1 0 0 □C
△ 1 2 0 □C
△ 1 5 0□C
△ 1 8 0□P
△ 2 2 0 □P
△ 2 7 0□P
△ 3 3 0□P
△ 3 9 0□P
△ 4 7 0□P
△ 5 6 0□P
△ 6 8 0□P
△ 8 2 0□P
△ 1 0 1□P
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
±0.25pF
±0.5pF
±0.5pF
±1pF
0.2±0.02
(0.008±0.001)
±5%
±10%
注：形名の△には温度特性、□には静電容量許容差記号が入ります。
△ Please specify the temperature characteristics code and □ the capacitance tolerance code.
063TYPE
Class 1
定格電圧
Rated
形 名
Voltage
Ordering code
（DC）
25V
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
TMK0 6 3
△ 0 R 5□P
△ 0 1 0□P
△ 1 R 5□P
△ 0 2 0□P
△ 0 3 0□P
△ 0 4 0□P
△ 0 5 0□P
△ 0 6 0□P
△ 0 7 0□P
△ 0 8 0□P
△ 0 9 0□P
△ 1 0 0□P
△ 1 2 0□P
△ 1 5 0□P
△1 8 0□P
△ 2 2 0 □P
△ 2 7 0 □P
△3 3 0□P
△ 3 9 0 □P
△ 4 7 0 □P
△5 6 0□P
△ 6 8 0 □P
△ 8 2 0 □P
△ 1 0 1 □P
温度特性
公称静電
EHS
静電容量
厚み
容 量 許 容 差
Temperature characteristics（EIA）
（Environmental
Thicknees
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ
Capacitance Capacitance [mm]
SL
tolerance （inch）
Substances） （C0K）（C0J）（C0H）（C0G）（P2K）（P2J）（P2H）（R2K）（R2J）（R2H）（S2K）（S2J）（S2H）（T2K）（T2J）（T2H）（U2K）（U2J）
[pF]
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
±0.25pF
±0.5pF
±0.5pF
±1pF
0.3±0.03
±
（0.012±0.001）
±
±5%
±10%
注：形名の△には温度特性、□には静電容量許容差記号が入ります。
△ Please specify the temperature characteristics code and □ the capacitance tolerance code.
58
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
アイテム一覧 PART NUMBERS
105TYPE
Class 1
定格電圧
Rated
形 名
Voltage
Ordering code
（DC）
△ 0R5□W
△ 0 1 0□W
△ 1R5□W
△ 0 2 0□W
△ 0 3 0□W
△ 0 4 0□W
△ 0 5 0□W
△ 0 6 0□W
△ 0 7 0□W
△ 0 8 0 □○
△ 0 9 0 □○
△ 1 0 0 □○
△ 1 2 0 □○
△ 1 5 0 □○
△ 1 8 0 □○
△ 2 2 0□ V
△ 2 7 0□ V
△ 3 3 0□ V
△ 3 9 0□ V
△ 4 7 0□ V
△ 5 6 0□ V
△ 6 8 0□ V
△ 8 2 0□ V
△ 1 0 1□ V
△ 1 2 1□ V
△ 1 5 1□ V
△ 1 8 1□ V
△ 2 2 1□ V
△ 2 7 1□ V
△ 3 3 1□ V
SL 1 2 1 □ V
SL 1 5 1 □ V
SL 1 8 1 □ V
SL 2 2 1 □ V
SL 2 7 1 □ V
SL 3 3 1 □ V
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
120
150
180
220
270
330
±0.25pF
±0.5pF
±0.5pF
±1pF
4
CAPACITORS
50V
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
温度特性
公称静電
EHS
静電容量
厚み
Temperature characteristics（EIA）
容 量 許 容 差
（Environmental
Thicknees
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ
Capacitance Capacitance [mm]
SL
tolerance （inch）
Substances） （C0K）（C0J）（C0H）（C0G）（P2K）（P2J）（P2H）（R2K）（R2J）（R2H）（S2K）（S2J）（S2H）（T2K）（T2J）（T2H）（U2K）（U2J）
[pF]
0.5±0.05
（0.020±0.002）
±5%
±10%
注：形名の△には温度特性、□には静電容量許容差記号、○にはCHの時には
「V」、UJの時は
「W」
が入ります。
△ Please specify the temperature characteristics code. □ Please specify the capacitance tolerance code.
○ comes to“V”when △ is“ＣＨ”and“W”when △ is“UJ”
.
105TYPE
Class 1
定格電圧
Rated
形 名
Voltage
Ordering code
（DC）
50V
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
温度特性
公称静電
EHS
静電容量
厚み
Temperature characteristics（EIA）
容 量 許 容 差
（Environmental
Thicknees
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ
Capacitance Capacitance [mm]
SL
tolerance （inch）
Substances） （C0K）（C0J）（C0H）（C0G）（P2K）（P2J）（P2H）（R2K）（R2J）（R2H）（S2K）（S2J）（S2H）（T2K）（T2J）（T2H）（U2K）（U2J）
[pF]
△ 0 R 5 BW
△ 0 1 0 BW
△ 1 R 2 BW
△ 1 R 5 BW
△ 1 R 8 BW
△ 2R2 J W
△ 2R7 J W
△ 3R3 J W
△ 3R9 J W
△ 4R7 J W
△ 5R6 J W
△ 6R8 J W
△ 8R2 J W
△ 1 0 0 JW
△ 1 2 0 JW
△ 1 5 0 JW
△ 1 8 0 JW
△ 2 0 0 JW
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0.5
1
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
20
±0.1pF
0.5±0.05
（0.020±0.002）
±5%
注：形名の△には温度特性が入ります。
△ Please specify the temperature characteristics code.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
59
梱包 PACKAGING
①最小受注単位数 Minimum Quantity
■テーピング梱包 Taped packaging 形式
（EIA ）
Type
標準数量
Standard quantity
[ pcs ]
製品厚み
Thickness
紙テープ
paper
エンボステープ
Embossed tape
C
15000
̶
P
15000
̶
10000
̶
10000
̶
10000
̶
mm
（inch）
code
□MK042
（01005）
0.2
（0.008）
□MK063
（0201）
0.3
（0.012）
0.3
（0.012）
P
0.45
（0.018）
K
□2K096
（0302）
□WK105
（0204）
□MK105
（0402）
□VK105（0402）
0.3
（0.012）
0.5
（0.020）
P
V, W
W
0.45
（0.018）
K
4000
̶
0.5
（0.020）
V
̶
4000
0.8
（0.031）
A
4000
̶
0.5
（0.020）
V
4000
̶
0.8
（0.031）
A
4000
̶
0.6
（0.024）
B
4000
̶
0.45
（0.018）
K
4000
̶
0.85
（0.033）
D
4000
̶
1.25
（0.049）
G
̶
3000
□4K212
（0805）
0.85
（0.033）
D
4000
̶
□2K212
（0805）
0.85
（0.033）
D
4000
̶
0.85
（0.033）
D
4000
̶
1.15
（0.045）
F
1.25
（0.049）
G
̶
3000
1.6
（0.063）
L
̶
2000
0.85
（0.033）
D
̶
2000
□MK107
（0603）
□WK107
（0306）
□2K110
（0504）
□MK212
（0805）
□WK212
（0508）
□MK316
（1206）
□MK325
（1210）
□MK432
（1812）
1.15
（0.045）
F
1.5
（0.059）
H
1.9
（0.075）
N
2.0max
（0.079）
Y
̶
③バルクカセット Bulk Cassette
2000
2.5
（0.098）
M
̶
500（Ｔ）,
1000（Ｐ）
2.5
（0.098）
M
̶
500
②テーピング材質 Taping material
※□WK
※プレスポケットタイプは、
ボトムテープ無し。
Unit：mm（inch）
105, 107, 212形状で個別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement according to dimensions 0402, 0603, 0805.(inch)
※□WK
98
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
梱包 PACKAGING
③テーピング寸法 Taping dimensions 紙テープ Paper Tape（8mm幅）
（0.315inches wide）
エンボステープ Embossed tape（8mm幅）
（0.315inches wide）
部品挿入角穴
4
2.0±0.05
テープ厚み
挿入ピッチ
Insertion Pitch Tape Thickness
チップ挿入部
Chip Cavity
Type
（ＥＩＡ）
Ａ
Ｂ
Ｆ
Ｔ
T1
0.25
□MK042
（01005）
（0.010）
2.0±0.05
0.36max. 0.27max.
0.45
（0.018） （0.079±0.002） （0.014） （0.011）
0.37
□MK063
（0201）
（0.016）
2.0±0.05
0.45max. 0.42max.
0.67
（0.027） （0.079±0.002） （0.018） （0.017）
0.65
□WK105
（0204）
（0.026）
2.0±0.05
0.45max 0.42max
1.15
（0.045） （0.079±0.002）（0.018max）（0.017max）
チップ挿入部
Type
□WK107（0306）
□MK212（0805）
Unit：mm（inch）
□MK316（1206）
部品挿入角穴
□MK325（1210）
テープ厚み
Insertion Pitch Tape Thickness
Chip cavity
（EIA）
挿入ピッチ
CAPACITORS
T1
2.0±0.05
A
B
1.0
1.8
F
1.3max. 0.25±0.1
K
T
（0.039）
（0.071）
（0.051max.）
（0.01±0.004）
1.655
2.4
（0.065）
（0.094）
2.0
3.6
（0.079）
（0.142）
2.8
3.6
（0.110）
（0.142）
4.0±0.1
（0.157±0.004）3.4max. 0.6max.
（0.134max.）（0.024max.）
Unit：mm（inch）
エンボステープ Embossed tape（12mm幅）
（0.472inches wide）
2.0±0.05
2.0±0.05
Type
（EIA）
□2K096
（0302）
チップ挿入部
挿入ピッチ
Chip Cavity
Insertion Pitch Tape Thickness
A
B
0.72
1.02
（0.028）
□MK105
（0402）
0.655
□VK105
（0402）
（0.026）
F
テープ厚み
T
52.0±0.05 0.45max.(0.018max)
（0.040） （0.079±0.002）0.6max.(0.024max)
1.155
52.0±0.05
0.8max.
（0.045） （0.079±0.002）（0.031max.）
Unit：mm（inch）
Type
（EIA）
□MK432（1812）
チップ挿入部
A
3.7
（0.146）
挿入ピッチ
テープ厚み
Insertion Pitch Tape Thickness
Chip cavity
B
F
4.9
8.0±0.1
K
T
4.0max. 0.6max.
（0.193） （0.315±0.004） （0.157max.）（0.024max.）
Unit：mm（inch）
Type
（EIA）
チップ挿入部
挿入ピッチ
Chip Cavity
Insertion Pitch Tape Thickness
A
□MK107
（0603）
1.0
（0306） （0.039）
□WK107
□2K110
（0504）
1.15
（0.045）
B
F
T
1.8
4.0±0.1
1.1max.
（0.071） （0.157±0.004） （0.043max.）
1.55
4.0±0.1
1.0max.
（0.061） （0.157±0.004） （0.039max.）
□MK212
（0805）
□WK212
（0508）
1.655
2.4
□4K212
（0805）
（0.065）
（0.094）
4.0±0.1
1.1max.
（0.157±0.004） （0.043max.）
□2K212
（0805）
□MK316
（1206）
テープ厚み
2.0
3.6
（0.079）
（0.142）
Unit：mm（inch）
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
99
梱包 PACKAGING
④リーダー部／空部 Leader and Blank portion 160mm以上
（6.3inches or more）
100mm以上
（3.94inches or more）
引き出し方向
Direction of tape feed
400mm以上
（15.7inches or more）
⑤リール寸法 Reel size ⑥トップテープ強度 Top Tape Strength トップテープのはがし力は下図矢印方向にて0.1∼0.7Nとなります。
The top tape requires a peel-off force of 0.1∼0.7N in the direction of the
arrow as illustrated below.
100
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
1/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Item
Standard
1.Operating Temperature
High Permitivity（Class 2）
Temperature Compensating（Class 1）
High Frequency Type
Standard Note1
BJ：−55 to ＋125℃
−55 to ＋125℃
Test Methods and Remarks
High Value
−25 to ＋85℃
High Capacitance Type
BJ（X7R）
：−55∼＋125℃, BJ（X5R）
：−55∼＋85℃
−25 to ＋85℃
High Capacitance Type
BJ（X7R）
：−55∼＋125℃, BJ（X5R）
：−55∼＋85℃
F：−25 to ＋85℃
Range
2. S t o r a g e Te m p e r a t u r e
BJ：−55 to ＋125℃
−55 to ＋125℃
E（Y5U）：−30∼＋85℃, F（Y5V）：−30∼＋85℃
F：−25 to ＋85℃
Range
50VDC,25VDC,
16VDC
16VDC
50VDC
No breakdown or
No abnormality
50VDC,25VDC
E（Y5U）：−30∼＋85℃, F（Y5V）：−30∼＋85℃
50VDC,35VDC,25VDC
16VDC,10VDC,6.3VDC
4DVC, 2.5VDC
4.Withstanding Voltage
Between terminals
Applied voltage: Rated voltage×3 （Class 1）
No breakdown or damage
Rated voltage×2.5（Class 2）
damage
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max.（Class 1,2）
5.Insulation Resistance
500 MΩμF. or 10000 MΩ., whichever is the Applied voltage: Rated voltage
10000 MΩ min.
Duration: 60±5 sec.
smaller.
Charge/discharge current: 50mA max.
Note 5
6.Capacitance（Tolerance）
0.5 to 5 pF: ±0.25 pF
0.5 to 2 pF : ±0.1 pF
BJ: ±10%, ±20%
BJ：±10％、±20％
1 to 10pF: ±0.5 pF
2.2 to 5.1 pF : ±5%
F：＋80%
F：−20％／＋80％
5 to 10 pF: ±1 pF
−20
11 pF or over: ± 5%
±10%
105TYPER△, S△, T△, U△ only
0.5∼2pF: ±0.1pF
2.2∼20pF: ±5%
7.Q or Tangent of Loss Angle
Under 30 pF
R e f e r t o d e t a i l e d BJ: 2.5% max.（50V, 25V） BJ：2.5％ max.
（tan δ）
: Q≧400 ＋ 20C
specification
F: 5.0% max.（50V, 25V） F：7％ max.
Note 4
30 pF or over : Q≧1000
Note 4
C= Nominal capacitance
Measuring frequency：
Class1： 1ＭHz±10%（C≦1000pF）
1ｋHz±10%（C＞1000pF）
Class2： 1ｋHz±10%（C≦10μF）
120Hz±10Hz（C＞10μF）
Measuring voltage：
Note 4
Class1：0.5∼5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
Class2： 1±0.2Vrms（C≦10μF）
0.5±0.1Vrms（C＞10μF）
Bias application: None
Multilayer:
Measuring frequency：
Class1： 1ＭHz±10%（C≦1000pF）
1ｋHz±10%（C＞1000pF）
Class2： 1ｋHz±10%（C≦10μF）
120Hz±10Hz（C＞10μF）
Measuring voltage：
Note 4 Class1：0.5∼5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
Class2： 1±0.2Vrms（C≦10μF）
0.5±0.1Vrms（C＞10μF）
Bias application: None
HighーFrequencyーMultilayer:
Measuring frequency: 1GHz
Measuring equipment: HP4291A
Measuring jig: HP16192A
8.Temperature
（Without
CK：0±250
CH：0±60
BJ：±10％（−25∼85℃） BJ：±10％
According to JIS C 5102 clause 7.12.
Characteristic
voltage ap-
CJ：0±120
RH：−220±60
F： ＋30％（−25∼85℃）
（−25∼＋85℃）
Temperature compensating:
BJ（X7R）
：±15％
F：＋30％／−80％
Measurement of capacitance at 20℃ and 85℃ shall be
F（Y5V）
：＋22
％
（−25∼＋85℃）
made to calculate temperature characteristic by the fol-
of Capacitance plication）
CH：0±60
4
CAPACITORS
3.Rated Voltage
（ppm/℃）
CG：0±30
−80
−82
RH：−220±60
BJ（X7R、X5R）
：
SK：−330±250
±15％
SJ：−330±120
F（Y5V）
：
SH：−330±60
＋22％／−82％
lowing equation.
（C85ー C20）
× 106 （ppm/℃）
C20×△T
High permitivity:
TK：−470±250
Change of maximum capacitance deviation in step 1 to 5
TJ：−470±120
Temperature at step 1: ＋20℃
UK：−750±250
Temperature at step 2: minimum operating temperature
UJ：−750±120
Temperature at step 3: ＋20℃（Reference temperature）
S L ： ＋ 350 t o ー 1000
Temperature at step 4: maximum operating temperature
Temperature at step 5: ＋20℃
（ppm/℃）
Reference temperature for X7R, X5R, Y5U and Y5V shall be ＋25℃
9.Resistance to Flexure of
Substrate
Appearance:
Appearance:
Appearance:
No abnormality
No abnormality
No abnormality
Capacitance change:
Capacitance change:
Capacitance change:
Within ±5% or ±0.5 pF,
Within±0.5 pF
BJ：Within ±12.5%
whichever is larger.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
Warp: 1mm
Testing board: glass epoxyーresin substrate
Thickness: 1.6mm（063 TYPE : 0.8mm）
The measurement shall be made with board in the bent position.
F：Within ±30%
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
103
2/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Temperature Compensating（Class 1）
Item
Standard
10.Body Strength
High Frequency Type
High Permittivity（Class 2）
Standard Note1
Test Methods and Remarks
High Value
No mechanical dam-
High Frequency Multilayer:
age.
Applied force: 5N
4
Duration: 10 sec.
A
11.Adhesion of Electrode
No separation or indication of separation of electrode.
A
（LW Reverse）
Applied force: 5N
（01005, 0201, 0302 TYPE 2N）
Duration: 30±5 sec.
12.Solderability
At least 95% of terminal electrode is covered by new solder.
Solder temperature: 230±5℃
13.Resistance to soldering
Appearance: No ab- Appearance: No ab-
Appearance: No abnormality
normality
Capacitance change: Within ±7.5%（BJ）
CAPACITORS
A
Duration: 4±1 sec.
normality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
Within ±20%（F）
Capacitance change: Capacitance change:
W i t h i n ± 2 . 5 % o r Within ±2.5%
tan δ: Initial value
±0.25pF, whichever is
Q: Initial value
Insulation resistance: Initial value
larger.
Insulation resistance:
Withstanding voltage（between terminals）
: No
Q: Initial value
Initial value
abnormality
Note 4
Duration: 3±0.5 sec.
Preheating conditions: 80 to 100℃, 2 to 5 min. or 5 to 10 min.
150 to 200℃, 2 to 5 min. or 5 to 10 min.
Recovery: Recovery for the following period under the
Insulation resistance: Withstanding voltage
standard condition after the test.
6∼24 hrs（Class 1）
（between terminals）:
Initial value
（Applicable to Class 2.）
Solder temperature: 270±5℃
24±2 hrs（Class 2）
Withstanding voltage No abnormality
（between terminals）:
No abnormality
14.Thermal shock
Appearance: No ab- Appearance: No abnormality
normality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
Appearance: No abnormality
Capacitance change: Within ±7.5%（BJ）
Within ±20%（F）
Capacitance change: Capacitance change:
（Applicable to Class 2.）
Conditions for 1 cycle:
0 ℃ 30±3 min.
Step 1: Minimum operating temperature ＋
−3
W i t h i n ± 2 . 5 % o r Within ±0.25pF
tan δ: Initial value
±0.25pF, whichever is
Q: Initial value
Insulation resistance: Initial value
Step 2: Room temperature
larger.
Insulation resistance:
Withstanding voltage（between terminals）
: No
0 ℃ 30±3 min.
Step 3: Maximum operating temperature −
＋
Q: Initial value
Initial value
abnormality
Step 4: Room temperature
Note 4
2 to 3 min.
Number of cycles: 5 times
Insulation resistance: Withstanding voltage
Recovery after the test: 6∼24 hrs（Class 1）
（between terminals）:
Initial value
2 to 3 min.
3
24±2 hrs（Class 2）
Withstanding voltage No abnormality
（between terminals）:
No abnormality
15.Damp Heat（steady state）
Appearance: No ab-
Appearance: No ab-
Multilayer：
normality
normality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
Capacitance change: Capacitance change:
Capacitance change:
Capacitance change:
Within ±5% or ±0.5pF,
Within ±0.5pF,
BJ: Within ±12.5%
BJ:Within ±12.5%
Temperature: 40±2℃
whichever is larger.
Insulation resistance:
F: Within ±30%
Note 4
Humidity: 90 to 95% RH
Q:
1000 MΩ min.
tan δ: BJ: 5.0% max.
tan δ:
Duration: 500 ＋24
−0 hrs
BJ: 5.0% max. Note 4.
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
Appearance: No ab- Appearance: No abnormality
normality
C≧30 pF
F: 7.5% max.
: Q≧350
10 ≦ C ＜ 30 p F : Q ≧
Note 4
F: 11.0% max.
275 ＋ 2.5C
Insulation resistance:
Insulation resistance:
C＜10 pF
: Q≧200
50 MΩμF or 1000 MΩ 50 MΩμF or 1000 MΩ
（Applicable to Class 2.）
6∼24 hrs（Class 1）
24±2 hrs（Class 2）
＋ 10C
whichever is smaller.
whichever is smaller.
HighーFrequency Multilayer:
C: Nominal capacitance
Note 5
Note 5
Temperature: 60±2℃
Insulation resistance:
Humidity: 90 to 95% RH
1000 MΩ min.
＋24 hrs
Duration: 500 −
0
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
6∼24 hrs（Class 1）
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
105
3/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Item
16.Loading under Damp Heat
High Permittivity（Class 2）
Test Methods and Remarks
Standard
High Frequency Type
Standard Note1
High Value
Appearance: No abnormality
Capacitance change:
Within ± 7.5% or ±
0.75pF, whichever is
larger.
Q: C≧30 pF: Q≧200
C＜30 pF: Q≧100 ＋
10C/3
C ： Nominal capacitance
Insulation resistance:
500 MΩ min.
Appearance: No abnormality
Capacitance change:
C≦2 pF: Within ±0.4 pF
C＞2 pF: Within ±0.75
pF
C ： Nominal capacitance
Insulation resistance:
500 MΩ min.
Appearance: No abnormality
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
Note 4
tan δ: BJ: 5.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
25 MΩμF or 500 MΩ,
whichever is the smaller.
Note 5
Appearance: No abnormality
Capacitance change:
BJ：Within±12.5％
F：Within±30％
Note 4
tanδ：
BJ：5.0％max.
F：11％max.
Note 4
Insulation resistance:
25 MΩμF or 500 MΩ,
whichever is the smaller.
Note 5
According to JIS C 5102 Clause 9. 9.
Multilayer:
Preconditioning: Voltage treatment（Class 2）
Temperature: 40±2℃
Humidity: 90 to 95% RH
Duration: 500 ＋24
hrs
−0
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.（Class 1,2）
Recovery: Recovery for the following period under the standard
condition after the removal from test chamber.
6∼24 hrs（Class 1）
24±2 hrs（Class 2）
HighーFrequency Multilayer:
Temperature: 60±2℃
Humidity: 90 to 95% RH
＋24
Duration: 500 −
hrs
0
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.
Recovery: 6∼24 hrs of recovery under the standard
condition after the removal from test chamber.
Appearance: No abnormality
Capacitance change:
Within ±3% or
±0.3pF, whichever is
larger.
Q: C≧30 pF : Q≧350
10≦C＜30 pF: Q≧275
＋ 2.5C
C＜10 pF: Q≧200 ＋
10C
C：Nominal
capacitance
Insulation resistance:
1000 MΩ min.
Appearance: No abnormality
Capacitance change:
Within ±3% or ±
0.3pF, whichever is
larger.
Insulation resistance:
1000 MΩ min.
Appearance: No abnormality
Capacitance change:
BJ：Within±12.5％
Within±20％※※
Within±25％※※
F：Within±30％
Note 4
tanδ：
BJ：5.0％max.
F：11％max. Note 4
Insulation resistance:
50 MΩμF or 1000 MΩ,
whichever is smaller.
Note 5
According to JIS C 5102 clause 9.10.
Multilayer:
Preconditioning: Voltage treatment（Class 2）
Temperature:125±3℃（Class 1, Class 2: B, BJ（X7R）
）
85±2℃（Class 2: BJ,F）
＋48
Duration: 1000 −
0 hrs
Applied voltage: Rated voltage×2 Note 6
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
6∼24 hrs（Class 1）
24±2 hrs（Class 2）
HighーFrequency Multilayer:
Temperature: 125±3℃（Class 1）
Duration: 1000＋48
hrs
−0
Applied voltage: Rated voltage×2
Recovery: 6∼24 hrs of recovery under the standard
condition after the removal from test chamber.
Appearance: No abnormality
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
Note 4
tan δ:
BJ: 4.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
50 MΩμF or 1000 MΩ,
whichever is smaller.
Note 5
4
CAPACITORS
17.Loading at High Temperature
Temperature Compensating（Class 1）
Note 1
:For 105 type, specified in "High value".
Note 2
:Thermal treatment（Multilayer）
: 1 hr of thermal treatment at 150 ＋0 /−10 ℃ followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement.
Note 3
:Voltage treatment（Multilayer）: 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement.
Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications.
Note 6
:Some of the parts are applicable in rated voltage×1.5. Please refer to individual specifications.
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative
humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
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107
1/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
1.Circuit Design
Precautions
Technical considerations
Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear
4
reactors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
CAPACITORS
used in such equipment may require higher safety and/or
reliability considerations and should be clearly differentiated
from components used in general purpose applications.
Operating Voltage（Verification of Rated voltage）
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the
two peak voltages should be lower than the rated value of
the capacitor chosen. For a circuit where both an AC and a
pulse voltage may be present, the sum of their peak voltages
should also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high frequency AC voltage or a pulse voltage having rapid rise time
is present in the circuit.
2.PCB Design
Pattern configurations
（Design of Land-patterns）
1. When capacitors are mounted on a PCB, the amount of
solder used（size of fillet）can directly affect capacitor per-
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.（larger fillets which extend above the component
end terminations）
Examples of improper pattern designs are also shown.
formance. Therefore, the following items must be carefully
considered in the design of solder land patterns:
（1）Recommended land dimensions for a typical chip capacitor land patterns for PCBs
（1）The amount of solder applied can affect the ability of
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
Recommended land dimensions for wave-soldering （unit: mm）
（2）When more than one part is jointly soldered onto the
Type
107
212
316
L
1.6
2.0
3.2
3.2
W
0.8
51.25
1.6
2.5
same land or pad, the pad must be designed so that each
component's soldering point is separated by solder-resist.
Size
325
A
0.8∼1.0
1.0∼1.4
1.8∼2.5
1.8∼2.5
B
0.5∼0.8
0.8∼1.5
0.8∼1.7
0.8∼1.7
C
0.6∼0.8
0.9∼1.2
1.2∼1.6
1.8∼2.5
Recommended land dimensions for reflow-soldering （unit: mm）
Type
Size
042
063
105
107
212
316
325
L
0.4
0.6
1.0
1.6
2.0
3.2
3.2
432
4.5
W
0.2
0.3
0.5
0.8
51.25
1.6
2.5
3.2
A
0.15∼0.25 0.20∼0.30 0.45∼0.55 0.8∼1.0 0.8∼1.2 1.8∼2.5 1.8∼2.5 2.5∼3.5
B
0.10∼0.20 0.20∼0.30 0.40∼0.50 0.6∼0.8 0.8∼1.2 1.0∼1.5 1.0∼1.5 1.5∼1.8
C
0.15∼0.30 0.25∼0.40 0.45∼0.55 0.6∼0.8 0.9∼1.6 1.2∼2.0 1.8∼3.2 2.3∼3.5
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.
Size
Type
2.0
W
1.25
a
0.5∼0.6
b
0.5∼0.6
c
0.2∼0.3
d
0.5
Type
212（2 circuits） 110（2 circuits）096（2 circuits）
L
2.0
1.37
W
1.25
1.0
0.6
a
0.5∼0.6
0.35∼0.45
0.25∼0.35
b
0.5∼0.6
0.55∼0.65
0.15∼0.25
c
0.5∼0.6
0.3∼0.4
0.15∼0.25
d
1.0
0.64
0.45
Size
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L
0.9
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109
2/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
LWDC Recommended land dimensions for reflow-soldering
4
Size
L
107
212
50.8
1.25
1.0
1.6
2.0
W
A
0.18∼0.22 0.25∼0.3 0.5∼0.7
B
0.2∼0.25 0.3∼0.4
C
0.9∼1.1
1.5∼1.7
CAPACITORS
105
0.52
Type
0.4∼0.5
1.9∼2.1
（unit: mm）
（2）Examples of good and bad solder application
2.PCB Design
Not recommended
Items
Recommended
Mixed mounting
of SMD and
leaded components
Component
placement close
to the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Pattern configurations
（Capacitor layout on panelized [breakaway] PC boards）
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should
be located to minimize any possible mechanical stresses from board warp or deflection.
1. After capacitors have been mounted on the boards, chips
can be subjected to mechanical stresses in subsequent
Not recommended
Recommended
manufacturing processes（PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave
soldering the reflow soldered boards etc.） For this reason,
Deflection of
planning pattern configurations and the position of SMD ca-
the board
pacitors should be carefully performed to minimize stress.
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the
amount of mechanical stresses given will vary depending on capacitor layout. The
example below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress
on the capacitors can vary according to the method used.
The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving,
and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB
splitting procedure.
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3/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
3.Considerations for automatic placement
Precautions
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the capacitors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
Technical considerations
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
（1）The lower limit of the pick-up nozzle should be adjusted to the surface level of the
PC board after correcting for deflection of the board.
（2）The pick-up pressure should be adjusted between 1 and 3 N static loads.
nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Not recommended
Recommended
Single-sided
4
CAPACITORS
（3）To reduce the amount of deflection of the board caused by impact of the pick-up
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between
1. Mounting capacitors with adhesives in preliminary assembly,
the shrinkage percentage of the adhesive and that of the capacitors may result in
before the soldering stage, may lead to degraded capacitor
stresses on the capacitors and lead to cracking. Moreover, too little or too much
characteristics unless the following factors are appropriately
adhesive applied to the board may adversely affect component placement, so the fol-
checked; the size of land patterns, type of adhesive, amount
lowing precautions should be noted in the application of adhesives.
applied, hardening temperature and hardening period.
Therefore, it is imperative to consult the manufacturer of the
adhesives on proper usage and amounts of adhesive to use.
（1）
Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2）
The recommended amount of adhesives is as follows;
Figure
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212/316 case sizes as examples
a
0.3mm min
b
100 ∼120 μm
c
Adhesives should not contact the pad
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4/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
4. Soldering
Precautions
Technical considerations
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate
Selection of Flux
1. Since flux may have a significant effect on the performance
the flux, or highly acidic flux is used, an excessive amount of residue after soldering
of capacitors, it is necessary to verify the following condi-
may lead to corrosion of the terminal electrodes or degradation of insulation resis-
tions prior to use;
tance on the surface of the capacitors.
（1）Flux used should be with less than or equal to 0.1 wt%
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a
（equivelent to chroline）of halogenated content. Flux
large amount of flux gas may be emitted and may detrimentally affect solderability. To
minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the
flux applied should be controlled at the optimum level.
air, the residue on the surface of capacitors in high humidity conditions may cause a
（3）When using water-soluble flux, special care should be
degradation of insulation resistance and therefore affect the reliability of the compo-
taken to properly clean the boards.
nents. The cleaning methods and the capability of the machines used should also be
considered carefully when selecting water-soluble flux.
Soldering
1-1. Preheating when soldering
Temperature, time, amount of solder, etc. are specified in ac-
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the
CAPACITORS
having a strong acidity content should not be applied.
（2）When soldering capacitors on the board, the amount of
4
soldering.
cordance with the following recommended conditions.
Cooling: The temperature difference between the components and cleaning process
should not be greater than 100℃.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
Sn-Zn solder paste can affect MLCC reliability performance.
[Reflow soldering]
Please contact us prior to usage.
温度
（℃）
300
Temperature profile
Peak 260℃ max
10 sec max
200
200
徐冷
Gradually
cooling
Preheating
100
100
0
予熱150℃
60秒以上
本加熱230℃以上
40秒迄
0
※チップとはんだ温度との差が100∼１３０℃以下になるよ
うに十分予熱を行ってください。
※回数は２回迄の保証となります。
温度
（℃）
300
Caution
150℃
60 sec min
Heating above 230℃
40 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
（Pb free soldering）
Temperature
（℃）
300
1. The
ideal condition is to have solder mass （fillet）
controlled
tomax
1/2 to 1/3 of the
Peak 260℃
ピーク260℃以下
10 sec max
10秒迄
thickness of the capacitor, as shown below:
200
（Pb free soldering）
Temperature
（℃）
300
ピーク260℃以下
10秒迄
予熱150℃
200
Gradually
cooling
Preheating
150℃
徐冷
100
（Pb free soldering）
Temperature
（℃）
300
Capacitor
120秒以上
Peak
260℃
ピーク260℃以下
120
sec
min max
10 sec max
10秒迄
0
0
Solder
200 ※Ceramic chip components should be preheated to
200 ※チップとはんだ温度との差が１００∼１３０℃以下になるよ
100
温度
（℃）
300
100
うに十分予熱を行ってください。
※回数は１回迄の保証となります。
※リフロー仕様アイテムは除きます。
徐冷
PC board
100
within 100 to 130℃ of the soldering. Gradually
※Assured to be wave soldering for 1 time.
cooling
※Except for reflow
soldering type.
Preheating
2. Because
dwell times can detrimentally affect solderability,
soldering
150℃
予熱150℃ excessive
Heating abovedu230℃
本加熱230℃以上
60 sec min （Pb free
60秒以上
40 sec
max
40秒迄
soldering）
Temperature
温度
（℃）
0 （℃）
0
ration should be kept as close to recommended
as possible.
400 times
400 ※チップとはんだ温度との差が100∼
※Ceramic chip components should be preheated to
１３０℃以下になるよ
350℃以下
3秒迄
うに十分予熱を行ってください。
[Wave soldering]
300 ※回数は２回迄の保証となります。
⊿Ｔ
Temperature
200
温度
（℃）
100
300
profile
徐冷
350℃ max
within 100 to 130℃ of the soldering. 3 sec max
※Assured to be reflow soldering for 2 times.
Gradually
⊿Ｔ
cooling
300
200
（Pb free soldering）
Temperature
（℃）
100
300
ピーク260℃以下
60秒以上
10秒迄
60 secmax
min
Peak 260℃
10 sec max
0
200（※⊿Ｔ≦190℃（3216タイプ以下）、⊿Ｔ≦130℃（3225以上）。）
0
200（※⊿Ｔ≦190℃（3216Type max）, ⊿Ｔ≦130℃（3225
100
100 ※The soldering iron should not directly touch the
0
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
予熱150℃
徐冷
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
常にこれを推奨するものではございません。
120秒以上
※チップとはんだ温度との差が１００∼１３０℃以下になるよ
うに十分予熱を行ってください。
※回数は１回迄の保証となります。
※リフロー仕様アイテムは除きます。
温度
（℃）
400
Caution
Gradually
Type min）
）
Preheating
cooling
※It is recommended
to use 20W soldering
iron and
150℃
the tip is 1φ or less.
0
components.
secsoldering
min
※Assured120
to be
iron for 1 time.
※Ceramic
chip components
should
be preheated
to
Note:
The above
profiles are the
maximum
allowable
within
100 to condition,
130℃ of the
soldering.
soldering
therefore
these profiles are
※Assured
to be wave
soldering for 1 time.
not always
recommended.
※Except for reflow soldering type.
（Pb free soldering）
Temperature
（℃）
400
350℃以下
1. Make sure the capacitors
are preheated sufficiently.
350℃ max
3 sec max
3秒迄
300 and melted solder should not be
2. The temperature difference between the capacitor
Gradually
300
⊿Ｔ
200
100
徐冷
greater than 100 to 130℃
⊿Ｔ
200
cooling
3. Cooling after soldering should be as gradual as
100possible.
60 sec min
0
4. Wave60秒以上
soldering must not be applied to the capacitors designated as for reflow sol0
イプ以下）
、
⊿Ｔ≦130℃
（3225以上）
。）
（※⊿Ｔ≦190℃
（3216タ
dering
only.
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
常にこれを推奨するものではございません。
, ⊿Ｔ≦130℃（3225
（※⊿Ｔ≦190℃（3216Type max）
Type min）
）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
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※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※チップとはんだ温度との差が100∼１３０℃以下になるよ
うに十分予熱を行ってください。
※回数は２回迄の保証となります。
温度
（℃）
300
PRECAUTIONS
Peak 260℃ max
10 sec max
200
200
Precautions on the use of Multilayer Ceramic Capacitors
Stages
予熱150℃
100
120秒以上
0
4. Soldering
5/6
Gradually
cooling
Preheating
150℃
徐冷
100
Precautions
（Pb free soldering）
Temperature
（℃）
300
ピーク260℃以下
10秒迄
Technical considerations
0
※チップとはんだ温度との差が１００∼１３０℃以下になるよ
うに十分予熱を行ってください。
なります。
※回数は
１回迄の保証と
[Hand
soldering]
※リフロー仕様アイテムは除きます。
Temperature profile
温度
（℃）
400
⊿Ｔ
300
徐冷
200
（Pb free soldering）
Temperature
（℃）
400
350℃以下
3秒迄
300
120 sec min
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
350℃ max
3 sec max
⊿Ｔ
200
Gradually
cooling
60 sec min
60秒以上
0
0
、
⊿Ｔ≦130℃
（3225以上）
。）
（※⊿Ｔ≦190℃
（3216タイプ以下）
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
常にこれを推奨するものではございません。
, ⊿Ｔ≦130℃（3225
（※⊿Ｔ≦190℃（3216Type max）
Type min）
）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
CAPACITORS
100
100
4
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
5.Cleaning
Cleaning conditions
1. When cleaning the PC board after the capacitors are all
1. The use of inappropriate solutions can cause foreign substances such as flux residue
to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a
mounted, select the appropriate cleaning solution according
degradation of the capacitor's electrical properties（especially insulation resistance）
.
to the type of flux used and purpose of the cleaning（e.g.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimen-
to remove soldering flux or other materials from the produc-
tally affect the performance of the capacitors.
tion process.）
2. Cleaning conditions should be determined after verifying,
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
（1）
Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the capacitor or the soldered
portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output
Below 20 W/ℓ
Ultrasonic frequency
Below 40 kHz
Ultrasonic washing period 5 min. or less
6.Post cleaning processes
1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions
resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recommended.
7.Handling
Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto the floor or a
hard surface, they should not be used.
（2）When handling the mounted boards, be careful that the
mounted components do not come in contact with or
bump against other boards or components.
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PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
8.Storage conditions
Precautions
Technical considerations
1. If the parts are stored in a high temperature and humidity environment, problems
Storage
1. To maintain the solderability of terminal electrodes and to
such as reduced solderability caused by oxidation of terminal electrodes and dete-
keep the packaging material in good condition, care must
rioration of taping/packaging materials may take place. For this reason, components
be taken to control temperature and humidity in the storage
should be used within 6 months from the time of delivery. If exceeding the above
area. Humidity should especially be kept as low as possible.
period, please check solderability before using the capacitors.
・Recommended conditions
Below 30℃
Humidity
Below 70% RH
4
CAPACITORS
Ambient temperature
The ambient temperature must be kept below 40℃. Even
under ideal storage conditions capacitor electrode solderability decreases as time passes, so should be used within
6 months from the time of delivery.
・Ceramic chip capacitors should be kept where no chlorine or
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
（type 2 &3）will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150℃ for 1hour will return the capacitance to its initial level.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
119