AGILENT APDS-9002

Agilent APDS-9002
Miniature Surface-Mount
Ambient Light Photo Sensor
Data Sheet
Features
• Excellent responsivity which
peaks in the human luminosity
curve
Close responsivity to the human eye
Description
The APDS-9002 is a low-cost
analog-output ambient light
photo sensor in lowest cost
miniature chipLED lead-free
surface mount package. It
consists of a spectrally suited
phototransistor, which peaks in
human luminosity curve. Hence,
it provides an excellent
responsivity that is close to the
response of human eyes, as
shown in Figure 2. It provides a
design-alternative to the
HSDL-9000 digital-output
ambient light photo sensor is
suitable for portable
applications with its ultra small
package design.
The APDS-9002 is ideal for
applications in which the
measurement of ambient light is
used to control display backlighting. Mobile appliances such
as the mobile phones and PDAs
that draw heavy current from
display backlighting will benefit
from incorporating these photo
sensor products in their designs
by reducing power consumption
significantly.
• Miniature chipLED lead-free
surface-mount package
Height – 0.80 mm
Width – 2.00 mm
Depth – 1.25 mm
• Good output linearity across wide
illumination range
• Low sensitivity variation across
various light sources
• Guaranteed temperature
performance
-40°C to 85°C
• VCC supply 2.4 to 5.5 V
• Lead-free package
Applications
• Detection of ambient light to
control display backlighting
Mobile devices – mobile phones,
PDAs
Computing devices – notebooks,
webpads
Consumer devices – TVs, video
cameras, digital still cameras
• Automatic residential and
commercial lighting management
• Electronic signs and signals
• Daylight and artificial light
exposed devices
Application Support Information
The Application Engineering
Group is available to assist you
with the application design
associated with APDS-9002
ambient light photo sensor
module. You can contact them
through your local sales
representatives for additional
details.
Ordering Information
Part Number
Packaging Type
Package
Quantity
APDS-9002-021
Tape and Reel
4-pins Chipled package
2500
Typical Application Circuit
PIN 2: VCC
PIN 3: VCC
PIN 1: IOUT
APDS-9002
RLOAD
PIN 4: NC
Figure 1. Typical application circuit for APDS-9002.
Figure 1 Table
Component
Recommended Application
Circuit Components
RLOAD
1 kW
I/O Pins Configuration Table
Pin
Symbol
Description
1
IOUT
IOUT
2
VCC
VCC
3
VCC
VCC
4
NC
No Connect
2
1.1
NORMALIZED RESPONSIVITY
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
APDS-9002
SILICON
EYE RESPONSE
0.2
0.1
0
350 450 550 650 750 850 950 1050 1150 1250
WAVELENGTH (nm)
Figure 2. Relative spectral response vs. wavelength.
CAUTIONS: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤ 50°C/W
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
-40
85
°C
Operating Temperature
TA
-40
85
°C
Supply Voltage
VCC
2.4
5.5
V
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Operating Temperature
TA
-40
85
°C
Supply Voltage
VCC
2.4
5.5
V
3
Conditions
Electrical & Optical Specifications (TA = 25°C)
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Photo Current (I)
I_PH1
10
20
33
µA
VCC = 3.0 V, Lux = 10[2]
Photo Current (II)
I_PH2
136
250
410
µA
VCC = 3.0 V, Lux = 100[2]
Photo Current (III)
I_PH3
-
300
-
µA
VCC = 3.0 V, Lux = 100[1]
Dark Current
I_DARK
-
50
160
nA
VCC = 3.0 V, Lux = 0
Light Current Ratio I_PH3 / I_PH2
-
1.2
-
-
-
Rise Time
T_RISE
-
0.95
2
ms
VCC = 3.0 V, Lux = 100, Rload = 1 kΩ[3]
Fall Time
T_FALL
-
0.8
2
ms
VCC = 3.0 V, Lux = 100, Rload = 1 kΩ[3]
Notes:
1. Illuminance by CIE standard light source (incandescent lamp).
2. Fluorescent light is used as light source. White LED is substituted in mass production.
3. White LED is used as light source.
Light Measurement Circuit and Waveforms
I_pulse
PIN 2: VCC
PIN 3: VCC
I_pulse
PIN 1: IOUT
VOUT
APDS-9002
RLOAD
PIN 4: NC
4
90%
10%
GND
tr
tf
0.001
0.0001
Fluorescent
Incandescent
0.00001
10
100
1000
0.5
Normalized
Photocurrent
0
0
50
0.8
0.6
0.4
0.2
Normalized
Photocurrent
0
100
-80 -60 -40 -20
20
40
60
80
Figure 5. Normalized photocurrent vs. angle
(VCC = 3 V, TA = 25°C).
1.4E-3
TA = 25°C
VCC = 3 V
LIGHT SOURCE: WHITE LED
0
ANGLE
Figure 4. Normalized photocurrent vs.
temperature (VCC = 3 V, 100 LUX).
1.8E-3
1.6E-3
1.2E-3
1.4E-3
0.1
10
100
Figure 6. Output voltage vs. luminance at
different load resistor.
1.2E-3
800.0E-6
600.0E-6
200.0E-6
000.0E+0
800.0E-6
AVERAGE
400.0E-6
AVERAGE
1000
1.0E-3
600.0E-6
400.0E-6
R = 1 kW
R = 5.1 kW
R = 11 kW
R = 51 kW
0.01
1.0E-3
Trise (sec)
1
FALL TIME (sec)
OUTPUT VOLTAGE, VOUT (V)
1.0
TEMPERATURE (°C)
LUMINANCE, Ev (LUX)
5
2.0
1.0
-50
Figure 3. Photocurrent vs. luminence
(VCC = 3 V, TA = 25°C).
0.001
1.2
1.5
LUX
10
2.5
NORMALIZED PHOTOCURRENT
NORMALIZED PHOTOCURRENT
PHOTOCURRENT (A)
0.01
200.0E-6
0
500
1000
1500
RLOAD (W)
Figure 7. Fall time vs. RLOAD.
2000
2500
000.0E+0
0
500
1000
1500
RLOAD (W)
Figure 8. Rise time vs. RLOAD.
2000
2500
APDS-9002 Package Outline
1.25
0.35
R0.20
P1
P2
MOLDING BODY (LENS)
0.45
1.40
2.00
0.45
P3
P4
P.C. BOARD
0.45
0.20
UNITS: in mm
PIN 1: IOUT
TOLERANCE: ±0.2 mm
PIN 2: VCC
PIN 3: VCC
0.80
PIN 4: NC (NO CONNECT)
0.30
0.14
6
APDS-9002 Tape and Reel Dimensions
2.00 ± 0.05
1.25
4.00 ± 0.1
P1
P2
P3
P4
4.00 ± 0.1
0.20
∅1.56 ± 0.1
1.75 ± 0.1
3.50 ± 0.05
8 ± 0.1
2.00
ORIENTATION OF UNIT
IN TAPE AND REEL POCKETS
IN PROGRESSIVE DIRECTION
∅1.00 ± 0.1
1.96 ± 0.1
1.04 ± 0.1
0.20
1.04 ± 0.1
PROGRESSIVE DIRECTION
MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE
MATERIAL OF COVER TAPE: PVC
METHOD OF COVER: HEAT SENSITIVE ADHESIVE
EMPTY
PARTS MOUNTED
(40 mm MIN.)
LEADER
(400 mm MIN.)
EMPTY
"B"
"C"
(40 mm MIN.)
178
75
UNIT: mm
18.4 (MAX.)
DETAIL A
2.0 ± 0.50
C
B
DIA. 13.0 ± 0.50
LABEL
R1.0
20.2 (MIN.)
DETAIL A
7
15.4 (MAX.)
Moisture Proof Packaging
All APDS-9002 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
This part is compliant to JEDEC
Level 4.
Package
Temp.
Time
In Reels
60°C
20 hours
In Bulk
125°C
5 hours
Baking should only be done
once.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Recommended Storage Conditions
PACKAGE IS
OPENED (UNSEALED)
YES
YES
PACKAGE IS
OPENED LESS
THAN 72 HOURS
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
8
10°C to 30°C
Relative Humidity
Below
60% RH
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the
recommended storage
conditions. If times longer than
three days are needed, the parts
must be stored in a dry box.
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
NO BAKING
IS NECESSARY
Storage Temperature
NO
Recommended Reflow Profile
MAX. 260°C
T – TEMPERATURE – (°C)
255
R3
230
220
200
180
R4
R2
60 sec.
MAX.
ABOVE
220°C
160
R1
120
R5
80
25
0
50
100
150
200
250
300
t-TIME (SECONDS)
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
Process Zone
Symbol
DT
Maximum DT/DTime
Heat Up
P1, R1
25°C to 160°C
4°C/s
Solder Paste Dry
P2, R2
160°C to 200°C
0.5°C/s
P3, R3
200°C to 255°C (260°C at 10 seconds max.)
4°C/s
P3, R4
255°C to 200°C
-6°C/s
P4, R5
200°C to 25°C
-6°C/s
Solder Reflow
Cool Down
The reflow profile is a straightline representation of a nominal
temperature profile for a
convective reflow solder process.
The temperature profile is divided
into four process zones, each with
different DT/Dtime temperature
change rates. The DT/Dtime rates
are detailed in the above table.
The temperatures are measured
at the component to printed
circuit board connections.
In process zone P1, the PC board
and APDS-9002 castellation pins
are heated to a temperature of
160°C to activate the flux in the
solder paste. The temperature
ramp up rate, R1, is limited to 4°C
per second to allow for even
heating of both the PC board and
APDS-9002 castellations.
9
Process zone P2 should be of
sufficient time duration (60 to 120
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 200°C
(392°F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 255°C (491°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 20 and 60 seconds. It
usually takes about 20 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 60 seconds, the intermetallic
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 200°C (392°F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool down
after solder freeze. The cool down
rate, R5, from the liquidus point
of the solder to 25°C (77°F)
should not exceed 6°C per second
maximum. This limitation is
necessary to allow the PC board
and APDS-9002 castellations to
change dimensions evenly,
putting minimal stresses on the
APDS-9002.
Appendix A: SMT Assembly Application Note
Agilent APDS-9002: Miniature Surface-Mount Ambient Light Sensor
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL APERTURE
LAND PATTERN
SOLDER MASK
PCBA
Figure 9. Stencil and PCBA.
1.1 Recommended Land Pattern
0.55
0.55
0.45
0.55
1
0.55
10
1.2 Recommended Metal Solder
Stencil Aperture
APERTURE OPENING
0.1
It is recommended that a
0.10 mm (0.004 inches) thick
stencil be used for solder paste
printing. Aperture opening for
shield pad is 0.6 mm x 0.6 mm.
This is to ensure adequate
printed solder paste volume and
no shorting.
1.65
2.2
UNIT: mm
Figure 10. Solder stencil aperture.
2.65
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
MOUNTING
CENTER
3.2
Note: Wet/Liquid PhotoImageable solder resist/mask is
recommended.
UNIT: mm
0.2 MIN.
Figure 11. Adjacent land keepout and solder mask areas.
11
Appendix B: Optical Window Design
for APDS-9002
2.0 Optical Window Dimensions
To ensure that the performance of
the APDS-9002 will not be affected
by improper window design, there
are some constraints on the
dimensions and design of the
window. There is a constraint on
the minimum size of the window,
which is placed in front of the
photo light sensor, so that it will
not affect the angular response of
the APDS-9002. This minimum
dimension that is recommended
will ensure at least a ±35° light
reception cone.
If a smaller window is required, a
light pipe or light guide can be
used. A light pipe or light guide is
a cylindrical piece of transparent
plastic, which makes use of total
internal reflection to focus the light.
FLAT
PHOTO LIGHT SENSOR
Figure 12(a). Window size determination for flat window.
Figure 12(b). Window design of flat window with light guide.
12
The thickness of the window
should be kept as minimum as
possible because there is a loss of
power in every optical window of
about 8% due to reflection (4% on
each side) and an additional loss
of energy in the plastic material.
Figures 12(a) and 12(b) illustrate
the two types of windows that we
have recommended which could
either be a flat window or a flat
window with light guide.
The window should be placed
directly on top of the photo light
sensor to achieve better
performance and if a flat
Table 1 and Figure 13 below show
the recommended dimensions of
the window. These dimension
values are based on a window
thickness of 1.0 mm with a
refractive index 1.585.
window with a light pipe is used,
dimension D2 should be 1.5 mm
to optimize the performance of
APDS-9002.
D1
TOP VIEW
T
D1
L
Z
PHOTO LIGHT SENSOR
D1
T
L
Z
WINDOW DIAMETER
THICKNESS
LENGTH OF LIGHT PIPE
DISTANCE BETWEEN WINDOW REAR PANEL
AND APDS-9002
Figure 13. Recommended window dimensions.
Table 1: Recommended Dimension for Optical Window
All dimensions are in mm
Flat Window
Flat Window
with Light Pipe
(L = 0.0)
(D2 = 1.5; Z = 0.5)
WD
(T+L+Z)
Z
D1
D1
L
1.5
0.5
2.25
2.0
1.0
3.25
2.5
1.5
4.25
3.0
2.0
5.00
2.5
1.5
2.1 Optical Window Material
The material of the window is
recommended to be polycarbonate.
The surface finish of the plastic
should be smooth, without any
texture.
Table 2: Recommended Plastic Materials
The recommended plastic material
for use as a window is available
from Bayer AG and Bayer Antwerp
N. V. (Europe), Bayer Corp. (USA)
and Bayer Polymers Co., Ltd.
(Thailand), as shown in Table 2.
13
Material Number
Visible Light Transmission
Refractive Index
Makrolon LQ2647
87%
1.587
Makrolon LQ3147
87%
1.587
Makrolon LQ3187
85%
1.587
Appendix C: General Application
Guide for APDS-9002
The APDS-9002 is a low cost
analog-output ambient light photo
sensor which spectral response
closely emulates the human eyes.
APDS-9002 consists of a
phototransistor that enables the
photo sensor to produce a high
gain photo current to a sufficient
level that can be converted to
voltage with a standard value of
external resistor. APDS-9002 is
then easily integrated into
systems that use ADC input which
is available for sampling of the
external source, as shown in
Figure 14 below.
The amount of converted voltage,
VOUT, is mainly dependant
proportionally on the photo
current which is generated by the
brightness of the light shone on
the photo sensor and the load
resistor used, RL. Increasing the
brightness of the light and/or the
load resistor will increase the
output voltage.
Brightness is measured as “LUX”
unit, which describes how intense
a light source that our eyes
perceive. LUX meter is the
equipment for “LUX”
measurement. Light sources with
the same LUX level appear at the
same brightness to the human
eyes.
VCC
VCC
2
3
LIGHT
SOURCE
APDS-9002
VOUT
1
C
4
A/D
RL
MICROCONTROLLER
NC
Figure 14. Configuration of APDS-9002 being used directly.
Light source, e.g., fluorescent
light, consists of ac noise about
100 Hz frequency. A capacitor of
10 µF, which acts as a low-pass
filter, is recommended to add in
parallel with resistor to by-pass
the ripples.
14
10
OUTPUT VOLTAGE, VOUT (V)
Selection of the load resistor RL
will determine the amount of
current-to-voltage conversion in
the circuit. Based on Figure 14
and using white LED as the light
source, measurement has been
carried out by using different
load resistors to examine the
variation of the output voltage
towards the intense of LUX. The
result is shown in Graph 1.
APDS-9002 allows output
voltage hits around 2.3 V, after
this it saturates.
TA = 25°C
VCC = 3 V
LIGHT SOURCE: WHITE LED
1
0.1
R = 1 kW
R = 5.1 kW
R = 11 kW
R = 51 kW
0.01
0.001
10
100
1000
LUMINANCE, Ev (LUX)
Graph 1. Output voltage vs. luminance at different load resistor.
Agilent has fabricated an
evaluation board based on the
configuration shown in Figure 14
for the designer to test the
ambient light sensor under
different lighting conditions. A
reference layout of a 2-layout
Agilent evaluation board for
APDS-9002 is shown in Figure 15
below.
Figure 15. Evaluation board layout.
15
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For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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(916) 788-6763
Europe: +49 (0) 6441 92460
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Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
May 10, 2005
5989-3051EN