ZETEX ZXMN2A04DN8

ZXMN2A04DN8
DUAL 20V N-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY
V(BR)DSS=20V; RDS(ON)=0.030⍀ ID=6.8A
DESCRIPTION
This new generation of TRENCH MOSFETs from Zetex utilizes a unique
structure that combines the benefits of low on-resistance with fast switching
speed. This makes them ideal for high efficiency, low voltage, power
management applications.
SO8
FEATURES
• Low on-resistance
• Fast switching speed
• Low threshold
• Low gate drive
• Low profile SOIC package
APPLICATIONS
• DC - DC Converters
• Power Management Functions
• Disconnect switches
• Motor control
ORDERING INFORMATION
DEVICE
REEL SIZE
TAPE WIDTH
QUANTITY
PER REEL
ZXMN2A04DN8TA
7”
12mm
500 units
ZXMN2A04DN8TC
13”
12mm
2500 units
DEVICE MARKING
• ZXMN
2A04D
PROVISIONAL ISSUE A - AUGUST 2001
1
Top View
ZXMN2A04DN8
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
SYMBOL
Drain-Source Voltage
V D SS
LIMIT
20
UNIT
V
Gate Source Voltage
VGS
⫾12
V
Continuous Drain Current (V GS =10V; T A =25°C)(b)(d) I D
(V GS =10V; T A =70°C)(b)(d)
(V GS =10V; T A =25°C)(a)(d)
6.8
5.4
5.2
A
Pulsed Drain Current (c)
I DM
23
A
Continuous Source Current (Body Diode) (b)
IS
12
A
Pulsed Source Current (Body Diode)(c)
I SM
23
A
Power Dissipation at T A =25°C (a)(d)
Linear Derating Factor
PD
1.25
10
W
mW/°C
Power Dissipation at T A =25°C (a)(e)
Linear Derating Factor
PD
1.8
14
W
mW/°C
Power Dissipation at T A =25°C (b)(d)
Linear Derating Factor
PD
2.1
17
W
mW/°C
Operating and Storage Temperature Range
T j :T stg
-55 to +150
°C
VALUE
UNIT
THERMAL RESISTANCE
PARAMETER
SYMBOL
Junction to Ambient (a)(d)
R θJA
100
°C/W
Junction to Ambient (a)(e)
R θJA
70
°C/W
Junction to Ambient (b)(d)
R θJA
60
°C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐10 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10µs - pulse width limited by maximum
junction temperature. Refer to Transcient Thermal Inpedance graph.
(d) For device with one active die
(e) For device with two active die running at equal power.
PROVISIONAL ISSUE A - AUGUST 2001
2
ZXMN2A04DN8
ELECTRICAL CHARACTERISTICS (at TA = 25°C unless otherwise stated).
PARAMETER
SYMBOL MIN.
TYP.
MAX.
UNIT CONDITIONS.
STATIC
Drain-Source Breakdown Voltage
V (BR)D SS
Zero Gate Voltage Drain Current
I D SS
Gate-Body Leakage
I G SS
Gate-Source Threshold Voltage
V GS(th)
Static Drain-Source On-State Resistance (1)
R DS(on)
Forward Transconductance (3)
g fs
Input Capacitance
20
V
I D =250µA, V G S =0V
0.5
µA
V D S =20V, V G S =0V
100
nA
0.7
V G S =±12V, V DS =0V
V
I =250µA, V DS = V G S
Ω
Ω
V G S =4.5V, I D =11A
V G S =2.5V, I D =5A
40
S
V D S =10V,I D =6A
C i ss
2300
pF
Output Capacitance
C o ss
450
pF
Reverse Transfer Capacitance
C rss
260
pF
Turn-On Delay Time
t d (o n )
6.3
ns
Rise Time
tr
8.5
ns
Turn-Off Delay Time
t d(off)
25
ns
Fall Time
tf
5
ns
Gate Charge
Qg
19.4
nC
Total Gate Charge
Qg
24
nC
Gate-Source Charge
Qgs
5
nC
Gate-Drain Charge
Qgd
4
nC
Diode Forward Voltage (1)
V SD
TBA?
Reverse Recovery Time (3)
t rr
Reverse Recovery Charge (3)
Q rr
0.030
0.045
D
DYNAMIC (3)
V D S =15V, V G S =0V,
f=1MHz
SWITCHING(2) (3)
V D D =10V, I D =6A
R G =6.0Ω, V G S =5V
V D S =15V,V G S =5V,
I D =3.5A
V D S =10V,V G S =4.5V,
I D =6A
SOURCE-DRAIN DIODE
V
T J =25°C, I S =5.1A,
V G S =0V
15
ns
T J =25°C, I F =6A,
di/dt= 100A/µs
5
nC
NOTES
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤ 2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
PROVISIONAL ISSUE A - AUGUST 2001
3
0.95
ZXMN2A04DN8
PACKAGE DIMENSIONS
DIM
Millimetres
Inches
Min
Max
Min
Max
A
4.80
4.98
0.189
0.196
B
1.27 BSC
0.05 BSC
C
0.53 REF
0.02 REF
D
0.36
0.46
0.014
0.018
E
3.81
3.99
0.15
0.157
F
1.35
1.75
0.05
0.07
G
0.10
0.25
0.004
0.010
J
5.80
6.20
0.23
0.24
K
0°
8°
0°
8°
L
0.41
1.27
0.016
0.050
Zetex plc.
Fields New Road, Chadderton, Oldham, OL9-8NP, United Kingdom.
Telephone: (44)161 622 4422 (Sales), (44)161 622 4444 (General Enquiries)
Fax: (44)161 622 4420
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
Zetex Inc.
Suite 315
700 Veterans Memorial Highway
Hauppauge
USA
Telephone: (631) 360-2222
Fax: (631) 360-8222
Zetex (Asia) Ltd.
3701-04 Metroplaza, Tower 1
Hing Fong Road,
Kwai Fong
Hong Kong
Telephone:(852) 26100 611
Fax: (852) 24250 494
These are supported by
agents and distributors in
major countries world-wide
© Zetex plc 2001
www.zetex.com
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for
any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves
the right to alter without notice the specification, design, price or conditions of supply of any product or service.
PROVISIONAL ISSUE A - AUGUST 2001
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