CSPEMI200A 4 Channel Headset EMI Filter with ESD Protection Features Product Description • • The CSPEMI200A is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains 3 different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. • • • • • • • • Four channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Includes 1 channel of ESD-only protection Greater than 30dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports bipolar signals—ideal for audio applications 11-bump, 2.045mm X 1.437mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available Applications • • • • • • • EMI filtering and ESD protection for audio ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs In addition, the CSPEMI200A provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CSPEMI200A can safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. The CSPEMI200A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI200A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Electrical Schematic 10Ω 100Ω B1 C1 SPKR_IN1 MIC_OUT2 SPKR_IN2 47pF C2 GND SPKR_OUT1 47pF C4 A4 SPKR_OUT2 100pF 47pF A2 100pF GND A3 10Ω 68Ω MIC_IN2 C3 100pF MIC_OUT1 100pF 47pF MIC_IN1 B3 B2 ESD Channel B4 © 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 CSPEMI200A PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 2 3 BOTTOM VIEW (Bumps Up View) 4 MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2 A 200A B Orientation Marking C C1 C2 C3 C4 MIC_IN1 ESD1 GND GND B1 B2 B3 B4 MIC_IN2 SPKR_OUT1 SPKR_OUT2 A1 A2 A3 A4 CSPEMI200A Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 N.B. A2 MIC_IN2 No Bump – used for orientation / alignment A3 SPKR_OUT1 Speaker Output 1 (to speaker) A4 SPKR_OUT2 Speaker Output 2 (to speaker) B1 MIC_IN1 B2 ESD1 ESD Protection Input. Provides a channel specifically for ESD protection purposes. B3 GND Device Ground B4 GND Device Ground C1 MIC_OUT1 Microphone Output 1 (to audio circuitry) C2 MIC_OUT2 Microphone Output 2 (to audio circuitry) C3 SPKR_IN1 Speaker Input 1 (from audio circuitry) C4 SPKR_IN2 Speaker Input 2 (from audio circuitry) Microphone Input 2 (from microphone) Microphone Input 1 (from microphone) Ordering Information PART NUMBERING INFORMATION Lead-free Finish 2 Standard Finish Ordering Part Ordering Part Bumps Package Number1 Part Marking Number1 Part Marking 11 CSP CSPEMI200A 200A CSPEMI200AG 200A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/09/03 CSPEMI200A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 400 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER R1 CONDITIONS MIN TYP MAX UNITS Resistance 1 90 100 110 Ω R2 Resistance 2 61 68 75 Ω R3 Resistance 3 9 10 11 Ω C1 Capacitance 1 38 47 57 pF C2 Capacitance 2 80 100 120 pF 1.0 µA 15 -15 V V ILEAK Diode Leakage Current VIN=5.0V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 fC1 Cut-off frequency 1; Note 6 fC2 fC3 VESD VCL 5 -5 7 -10 ±15 kV ±8 kV +15 -19 V V R = 100Ω, C = 47pF 53 MHz Cut-off frequency 2; Note 6 R = 68Ω, C = 47pF 61 MHz Cut-off frequency 3; Note 6 R = 10Ω, C = 100pF 33 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design and characterization. Note 6: ZSOURCE=50Ω, ZLOAD =50Ω. © 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 CSPEMI200A Performance Information Typical Filter Performance (nominal conditions unless specified otherwise) Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance © 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/09/03 CSPEMI200A Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise) Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance © 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 CSPEMI200A Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 6. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 7. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/09/03 CSPEMI200A Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CSPEMI200A devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW A1 SIDE VIEW C1 PACKAGE DIMENSIONS C B Bumps 11 A Millimeters Inches Nom Max A1 2.001 2.046 2.091 0.0788 0.0806 0.0823 A2 1.391 1.436 1.481 0.0548 0.0565 0.0583 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.223 0.273 0.323 0.0088 0.0107 0.0127 C2 0.168 0.218 0.268 0.0066 0.0086 0.0106 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 # per tape and reel Min Nom 1 Min A2 Custom CSP C2 Package Dim B2 B1 2 3 4 Max D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI200A Chip Scale Package 0.0140 0.0150 0.0159 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CSPEMI200A 2.04 X 1.44 X 0.6 2.29 X 1.60 X 0.81 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 8. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7