CX65001
160 – 700 MHz Linear Power Amplifier Driver
Skyworks’ CX65001 Microwave Monolithic Integrated Circuit (MMIC) power
amplifier driver offers a desirable combination of features that provide superb
performance and ease of use in a low-cost Surface-Mounted Technology (SMT)
package. The Gallium Arsenide (GaAs) Heterojunction Bipolar Transistor (HBT)
power amplifier driver was developed and optimized for extreme linear
performance in a variety of applications. It is ideal as a driver or output stage for
transceivers and repeaters for Trans-European Trunked Radio (TETRA), GSM400
and paging base stations, mobile radios, and many other applications.
Figure 1 shows a functional block diagram for the CX65001. The device package
and pinout are shown in Figure 2.
Vcc1
Vcc2
VB
RFIN
Features
•
•
•
•
•
5 V single supply operation
Linear Pout of 24 dBm
OIP3 of 45 dBm
Internal bias circuits
Surface mounted Small Outline Integrated Circuit
(SOIC) 8-pin package with downset ground paddle
Applications
• TETRA transceivers
• GSM400
• Wireless Local Loop (WLL) and Industrial,
Scientific, Medical (ISM) bands
• Repeaters
• Paging
• Mobile radios
• VHF/UHF TV broadcast
8
5
2
3
Driver Bias
4
Y
Input Bias
DA
6, 7
RFOUT
NC
1
8
Vcc1
VB
2
7
RFOUT
RFIN
3
6
RFOUT
Y
4
5
Vcc2
C1216
Figure 1. CX65001 Functional Block Diagram
Data Sheet
C1215
Figure 2. CX65001 Pinout – 8-Pin SOIC Package
(Top View)
Skyworks – Preliminary
Proprietary Information and Specifications Are Subject to Change
Doc. No. 101466C
September 20, 2002
CX65001
Power Amplifier Driver
Electrical and Mechanical Specifications
Typical performance characteristics of the CX65001 are
illustrated in Figures 3 through 11.
The signal pin assignments and functions are described in
Table 1. The absolute maximum ratings of the CX65001 are
provided in Table 2. The recommended operating conditions are
specified in Table 3 and electrical specifications are provided in
Table 4.
Table1. CX65001 Signal Descriptions
Pin #
Name
Description
1
NC
No connection
2
VB
Input bias for driver amplifier
3
RFIN
RF input
4
Y
5
Vcc2
Output of internal bias circuit
6
RFOUT
RF output
7
RFOUT
RF output
Supply voltage
8
Vcc1
Supply voltage
9
GND
Ground
Table 2. CX65001 Absolute Maximum Ratings
Max
Units
RF input power
Parameter
Symbol
PIN
Min
Typical
6
dBm
Supply voltage
Vcc
5.5
V
Supply current (lD + lBIAS)
ICC
240
mA
1.3
W
Power dissipation
Case operating temperature
TC
–40
+85
°C
Storage temperature
TST
–55
125
°C
Junction temperature
TJ
150
°C
Note: No damage to device if only one parameter is applied at a time with other parameters at nominal conditions.
Table 3. CX65001 Recommended Operating Conditions
Parameter
Supply voltage
Min
Typical
Vcc
Frequency range
F
Junction temperature
TJ
Maximum bias condition =
2
Symbol
Max
Units
700
MHz
140
°C
5
160
V
(Vcc × ID) < (TJ_RECOMMENDED – TC)/RTH,J-C
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101466C
September 20, 2002
Power Amplifier Driver
CX65001
Table 4. CX65001 Electrical Characteristics
(Vcc = 5 V, TC = 25 °C)
Parameter
Symbol
Test
Conditions
Min
Typical
Max
Units
120
130
mA
OIP3 match, Frequency = 450 MHz (Note 1)
Supply current (lD + lBIAS)
Small signal gain
ICC
RBIAS = 270 Ω
G
PIN = –15 dBm
21
22
dB
Linear output power (Note 2)
POUT
PIN = +3 dBm
23
24
dBm
Power Added Efficiency
PAE
PIN = +3 dBm
35
42
Noise Figure (NF)
NF
Output IP3
OIP3
Thermal resistance (junction – case)
RTH,J-C
%
4
Two CW tones
with 1 MHz
spacing
PIN = –16 dBm
per tone
42
5
dB
45
dBm
91
°C/W
Note 1: Device matched for optimum OIP3 according to circuit shown in Figure 12.
25
50
21
40
PAE (%)
Pout (dBm)
Note 2: For reliable operation, do not violate the maximum input drive level specified in Table 2.
17
13
30
20
-40C
-40C
9
10
25C
25C
85C
85C
0
5
-15
-11
-7
-3
1
-15
5
-11
-7
-3
1
5
Pin (dBm)
Pin (dBm)
Figure 3. Typical Pout vs Pin @ 450 MHz Over Temperature
(Circuit Match for Optimum OIP3)
Figure 4. Typical PAE vs Pin @ 450 MHz Over Temperature
(Circuit Match for Optimum OIP3)
23
Small Signal Gain (dB)
Small Signal Gain (dB)
25
23
21
19
-40C
25C
17
85C
15
160
22.5
22
21.5
21
-40C
25C
20.5
85C
20
195
230
265
300
375
400
425
450
475
Freq (MHz)
Freq (MHz)
Figure 5. Typical Small Signal Gain From 160 to 300 MHz Over
Temperature (Circuit Match for Optimum Gain)
Figure 6. Typical Small Signal Gain From 375 to 475 MHz Over
Temperature (Circuit Match for Optimum OIP3)
101466C
September 20, 2002
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Proprietary Information and Specifications Are Subject to Change
3
CX65001
Power Amplifier Driver
6
21
5
20
NF (dB)
Small Signal Gain (dB)
22
19
-40C
18
4
3
2
-40C
25C
1
25C
85C
85C
0
17
500
550
600
650
160
700
195
Figure 7. Typical Small Signal Gain From 500 to 700 MHz Over
Temperature (Circuit Match for Optimum Gain)
265
300
Figure 8. Typical Noise Figure From 160 to 300 MHz Over
Temperature (Circuit Match for Optimum Gain)
7
7
6
6
5
5
NF (dB)
NF (dB)
230
Freq (MHz)
Freq (MHz)
4
3
-40C
2
4
3
2
-40C
25C
1
25C
1
85C
0
85C
0
375
400
425
450
475
500
550
Freq (MHz)
600
650
700
Freq (MHz)
Figure 9. Typical Noise Figure From 375 to 475 MHz Over
Temperature (Circuit Match for Optimum OIP3)
Figure 10. Typical Noise Figure From 500 to 700 MHz Over
Temperature (Circuit Match for Optimum Gain)
OIP3 (dBm)
50
45
40
-40C
35
25C
85C
30
375
400
425
450
475
Freq (MHz)
Figure 11. Typical OIP3 From 375 to 475 MHz Over Temperature
(Circuit Match for Optimum OIP3)
4
Skyworks – Preliminary
Proprietary Information and Specifications Are Subject to Change
101466C
September 20, 2002
Power Amplifier Driver
CX65001
Evaluation Board Description
The CX65001 Evaluation Board is used to test the CX65001
power amplifier’s performance. The CX65001 Evaluation Board
schematic diagram is shown in Figure 12. The schematic shows
the basic design of the board for the 375 to 475 MHz range. The
Evaluation Board assembly diagram is shown in Figure 13 and
the Evaluation Board layer detail is shown in Figure 14.
Figure 15 provides the mounting footprint for the CX65001.
between the RF output transmission line and Vcc supply
voltage line.
5.
Inductor L2 (27 nH) is placed between pin 4 (bias circuit
output) and pin 2 (base of RF transistor) for bias circuit and
RF transistor connection.
6.
Inductor L1 (15 nH), and capacitors C1 (12 pF) and C2
(15 pF) are the input matching components and capacitor
C10 (56 pF) is the output matching component. Use a short
transmission line (about 100 mils) between the RF input pin
(pin 3) and RF input matching components (C1, C2, and
L1). Also use a short output transmission line (about
100 mils) between the RF output pins (pin 6 and pin 7) and
the RF output matching component (C10).
Circuit Design Configurations ________________________
The following design considerations need to be followed
regardless of final use or configuration:
1.
Paths to ground should be made as short as possible.
2.
The ground pad of the CX65001 power amplifier has
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since
the circuit board acts as the heat sink, it must shunt as
much heat as possible from the amplifier. As such, design
the connection to the ground pad to dissipate the maximum
wattage produced to the circuit board. Multiple vias to the
grounding layer are required (see Figures 14 and 15).
Note: Junction temperature (TJ) of the device increases with a
poor connection to the slug and ground. This reduces
the lifetime of the device.
3.
4.
Five external bypass capacitors, a 1 µF and four 100 pF
capacitors, are required on the Vcc line and on pin 4, pin 5,
and pin 8. Capacitors C7 (100 pF) and C8 (1 µF) are
placed in parallel between the supply line and ground, C4
(100 pF) is placed between pin 4 and ground, C5 (100 pF)
is placed between pin 8 and ground, and C6 (100 pF) is
placed between pin 5 and ground.
Testing Procedure ___________________________________
Use the following procedure to set up the CX65001 Evaluation
Board for testing, Refer to Figure 16 for guidance:
1.
Connect a 5.0 V supply to Vcc. If available, enable the
current limiting function of the power supply to 240 mA.
2.
Connect a signal generator to the RF signal input port. Set
it to the desired RF frequency at a power level of –15 dBm
or less to the Evaluation Board but do NOT enable the RF
signal.
3.
Connect a spectrum analyzer to the RF signal output port.
4.
Enable the power supply.
5.
Enable the RF signal and take measurements.
Caution: If any of the input signals exceed the rated maximum
values, the CX65001 Evaluation Board can be
permanently damaged.
A bias resistor, R1 (270 Ω), is used to control Vcc1
(reference voltage of the bias circuit) at pin 8. The nominal
total current with a 270 Ω bias resistor is 125 mA with Vcc1
and Vcc2 equal to 5 V. Inductor L3 (39 nH) is placed
101466C
September 20, 2002
Skyworks – Preliminary
Proprietary Information and Specifications Are Subject to Change
5
CX65001
Power Amplifier Driver
Power Supply
1
2
+5 V
C5
100 pF
C8
1 F
x
CX65001
1
8
R1
270
L3
39 nH
L2
27 nH
2
7
3
6
4
5
C7
100 pF
T_LINE
C10
56 pF
C1
12 pF
SMA
C2
15 pF
L1
15 nH
SMA
C4
100 pF
C6
100 pF
C1238
Figure 12. Application Schematic Optimized for OIP3 @ 450 MHz
GND
Vcc
GND
GND
J3
JP1
C8
C7
L3
R1
C5
J1 (RF In)
L1
C10
C1
C2
L2
C4
J2 (RF Out)
C6
C1437
Figure 13. Evaluation Board Assembly Diagram
(Top View)
6
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Proprietary Information and Specifications Are Subject to Change
101466C
September 20, 2002
Power Amplifier Driver
CX65001
Layer 1: Top Metal
Layer 2: Ground
Layer 3: Inner Traces
Layer 4: Ground
C1438
Figure 14. Evaluation Board Layer Detail
101466C
September 20, 2002
Skyworks – Preliminary
Proprietary Information and Specifications Are Subject to Change
7
CX65001
Power Amplifier Driver
6.985
0.381
1.524
Minimum
1.800
1.270
2.710
0.635
Minimum
0.381 diameter plated-through via
(minimum 20 recommended)
Dimensions are in millimeters
C1218
Figure 15. PCB Mounting Footprint
Power Supply
Signal Generator
Input
CX65001
Evaluation Board
Output
Power Meter
or
Spectrum Analyzer
C1240e
Figure 16. CX65001 Evaluation Board Testing Configuration
Package Dimensions
Figure 17 shows the package dimensions for the 8-pin SOIC
and Figure 18 provides the tape and reel dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it
is baked and vacuum packed before shipping. Instructions on
the shipping container label regarding exposure to moisture
after the container seal is broken must be followed. Otherwise,
problems related to moisture absorption may occur when the
part is subjected to high temperature during solder assembly.
If the part is attached in a reflow oven, the temperature ramp
rate should not exceed 5 °C per second. Maximum temperature
should not exceed 225 °C and the time spent at a temperature
that exceeds 210 °C should be limited to less than 10 seconds.
If the part is manually attached, precaution should be taken to
ensure that the part is not subjected to a temperature that
exceeds 300 °C for more than 10 seconds.
8
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment. For
additional details on both attachment techniques, precautions,
and recommended handling procedures, refer to the Skyworks
document Solder Reflow Application Note, document number
101536.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the
Skyworks document Tape and Reel Information Application
Note, document number 101568.
Electro-Static Discharge (ESD) Sensitivity
The CX65001 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper
ESD precautions.
Skyworks – Preliminary
Proprietary Information and Specifications Are Subject to Change
101466C
September 20, 2002
Power Amplifier Driver
CX65001
3
2
1
2.007 ± .203
1.956 ± .051
5.994 ± .178
2.464 ± .051
Top View
2.921 ± .203
Bottom View
1.270 BSC
0.406 ± .076
0.330 ± .076 x 45
1.524 ± .127
o
1.473 ± .076
0.203 ± .038
Side View
0.051 ± .051
4.928 ± .102
Seating
Plane
3.912 ± .102
Detail A
End View
Parting Line
Gauge Plane
Seating Plane
0.254
o
4 ±4
o
0.635 ± .254
Detail A
All dimensions are in millimeters
C1444
Figure 17. CX65001 8-Pin SOIC Package Dimension Drawing
101466C
September 20, 2002
Skyworks – Preliminary
Proprietary Information and Specifications Are Subject to Change
9
CX65001
Power Amplifier Driver
1.55 ± 0.05
4.00 ± 0.10
2.00 ± 0.05
A
12.00 + 0.30/–0.10
B
A
1.75 ± 0.10
5.50 ± 0.05
8.00 ± 0.10
B
1.50 ± 0.25
0.292 ± 0.13
8o Max
6.88 ± 0.10
5o Max
1.68 ± 0.10
A
5.49 ± 0.10
B
1. Carrier tape: black conductive polycarbonate.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 9.3 mm wide.
4. All dimensions are in millimeters.
C1242
Figure 18. CX65001 8-Pin SOIC Tape and Reel Dimensions
10
Skyworks – Preliminary
Proprietary Information and Specifications Are Subject to Change
101466C
September 20, 2002
Power Amplifier Driver
CX65001
Ordering Information
Model Name
Ordering Part Number
Evaluation Kit Part
Number
CX65001-12
TW10-D282 (tuned for
optimum OIP3 @ 450 MHz)
CX65001 160-700 MHz Linear Power
Amplifier Driver
© 2002, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its
customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to
its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility
whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks’ Terms and
Conditions of Sale for such products, Skyworks assumes no liability whatsoever.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF
SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY
OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE
ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL
NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST
PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS.
Skyworks™ products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks’ customers using or selling Skyworks™ products for use in such
applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.
The following are trademarks of Skyworks Solutions, Inc.: Skyworks™, the Skyworks symbol, and “Breakthrough Simplicity”™. Product names or services listed in this
publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners.
Additional information, posted at www.skyworksinc.com, is incorporated by reference.
101466C
September 20, 2002
Skyworks – Preliminary
Proprietary Information and Specifications Are Subject to Change
11
General Information:
Skyworks Solutions, Inc.
4311 Jamboree Rd.
Newport Beach, CA 92660-3007
www.skyworksinc.com