Agilent HFBR-2412TC and HFBR-2416TC Conductive Port Option for Low Cost Miniature Link Components Technical Data HFBR-2412TC HFBR-2416TC Features Applications • Significantly Decreases Effect of Electromagnetic Interference (EMI) on Receiver Sensitivity • Available with Threaded ST Styled Port Receivers • Allows the Designer to Separate the Signal and Conductive Port Grounds Agilent recommends that the designer use separate ground paths for the signal ground and the conductive port ground in order to minimize the effects of coupled noise on the receiver circuitry. If the designer notices that extreme noise is present on the system chassis, care should be taken to electrically isolate the conductive port from the chassis. Description The conductive port option for the Low Cost Miniature Link component family consists of a grounding path from the conductive port to four grounding pins as shown in the package outline drawing. Signal ground is separate from the four grounding pins to give the designer more flexibility. This option is available with all Threaded ST panel mount styled port receivers. Electrical/optical performance of the receivers is not affected by the conductive port. Refer to the HFBR-2412TC and HFBR-2416TC data sheets for more information. In the case of ESD, the conductive port option does not alleviate the need for system recovery procedures. A 15 kV ESD event Package Outline NON-CONDUCTIVE PLASTIC HOUSING 4 CONDUCTIVE PLASTIC PORT 5 3 6 2 7 1 8 PIN NO. 1 INDICATOR entering through the port will not cause catastrophic failure for any HFBR-2412TC and HFBR2416TC receivers, but may cause soft errors. The conductive port option can reduce the amount of soft errors due to ESD events, but does not guarantee error-free performance. Pin 1 2 3 4 5 6 7 8 Function Port Ground Pin Part Dependent Part Dependent Port Ground Pin Port Ground Pin Part Dependent Part Dependent Port Ground Pin Reliability Information Ordering Information Low Cost Miniature Link components with the Conductive Port Option are as reliable as standard HFBR-2412TC and HFBR-2416TC components. The following tests were performed to verify the mechanical reliability of this option. HFBR-2412TC-820 nm Receiver, ST housed, 5 MBd, TTL Output, Conductive Port. HFBR-2416TC-820 nm Receiver, ST housed, 125 MHz, Analog Output, Conductive Port. Mechanical and Environmental Tests [1] Test MIL-STD-883/ Other Reference Test Conditions Units Tested Total Failed Temperature Cycling 1010 Condition B -55°C to +125°C 15 min. dwell/5 min. transfer 100 cycles 70 0 Thermal Shock 1011 Condition B -55°C to +125°C 5 min. dwell/10 sec. transfer 500 cycles 45 0 High temp. Storage 1008 Condition B TA = 125°C 1000 hours 50 0 Mechanical Shock 2002 Condition B 1500 g/0.5 ms 5 impacts each axis 40 0 Seal Dye Penetrant (Zyglo) 1014 Condition D 45 psi, 10 hours No leakage into microelectronic cavity 15 0 Solderability 2003 245°C 10 0 Resistance to Solvents 2015 3 one min. immersion brush after solvent 13 0 Chemical Resistance – 5 minutes in Acetone, Methanol, Boiling Water 12 0 TemperatureHumidity – TA = 85°C, RH = 85% Biased, 500 hours 30 0 Lead Integrity 2004 Condition B2 8 oz. wt. to each lead tested for three 90° arcs of the case 16 0 IEC-801-2 Direct contact discharge to port, 0-15 kV [2] 16 0 Electrostatic Discharge (ESD) Notes: 1. Tests were performed on ST products with the conductive port option. 2. Agilent has previously used an air discharge method to measure ESD; results using this method vary with air temperature and humidity. The direct contact discharge method is perferred due to better repeatability and conformance with IEC procedures. ESD immunity measured with the air discharge method is generally higher than with the direct contact discharge method. www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies, Inc. June 22, 2001 Obsoletes 5980-1062E (10/00) 5988-2010EN