Marconi Optical Components P35-4304-000-200 6 Bit Digital Attenuator, 0.5 - 16GHz Features · · · · · Broadband 0.5 - 16GHz Low insertion loss; 4dB typ at 8GHz Attenuation 0.5dB steps to 31.5dB Fast switching speed Through GaAs vias for improved performance Description The P35-4304-000-200 is a high performance Gallium Arsenide monolithic 6 bit digital attenuator offering an attenuation range of 31.5dB in 0.5dB steps. It is suitable for use in broadband communications, instrumentation and electronic warfare applications. The attenuator is controlled by the application of complimentary 0V/-5V or 0/-8V signals to the control lines in accordance with the truth table below. The full attenuation range is achieved by modifying the control lines in combination. The die is fabricated using MOC's 0.5µm gate length MESFET process (S20). It is fully protected using Silicon Nitride passivation for excellent performance and reliability. Electrical Performance Ambient temperature = 22±3°C , ZO = 50Ω, Control voltages = 0V/-5V unless otherwise stated Parameter Insertion Loss1 (reference state) Attenuation Range Step Size Attenuation Accuracy Input Return Loss Output Return Loss Input Power @ P-1dB Point Switching Speed Notes Insertion Loss measured in low loss state. Conditions Min Typ Max Units 0.5 - 8GHz 8GHz - 16GHz 0.5 - 16GHz 0.5 - 16GHz 0.5 - 8GHz 8 - 12GHz 12 - 16GHz 0.5 - 16GHz 0.5 - 16GHz 0.5 - 16GHz 50% Control to 10%90%RF 10 10 - 4 5 31.5 0.5 20 20 18 5 5 6 ±0.3 ±3% ±0.5 ±10% ±0.5 ±15% 10 dB dB dB dB dB dB dB dB dB dBm nS Typical Performance at 22°C Attenuation - all states Attenuation - cardinal states Absolute Maximum Ratings Nominal Attenuation Max control voltage Max I/P power Operating temperature Storage temperature -8V +25 dBm -60°C to +125°C -65°C to +150°C Attenuator Schematic RF IN A1 A1 A3 A4 A5 A6 0/0.5dB attenuation 0/1dB attenuation 0/2dB attenuation 0/4dB attenuation 0/8dB attenuation 0/16dB attenuation B1 B2 B3 B4 B5 B6 RF OUT P35-4304-000-200 Marconi Optical Components Chip Outline Pad Details Die size: Bond pad size Die thickness: 3.45 x 1.42mm 120µm x 120µm 200µm Pad Function 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 RF Input B5 A5 A2* B2* A4 B4 B6* A6* B1 A1 A3* B3* RF Output B3* A3* A6* B6* B2* A2* * Note option of alternative bond pads on opposite side of die Switching Truth Table Control Line Attenuation 0.5dB bit A1 B1 1dB bit A2 B2 2dB bit A3 B3 4dB bit A4 B4 8dB bit A5 B5 16dB bit A6 B6 0V -5V 0V 0V 0V 0V 0V 0V 0V -5V 0V 0V 0V 0V 0V 0V 0V -5V 0V 0V 0V 0V 0V 0V 0V -5V 0V 0V 0V 0V 0V 0V 0V -5V 0V 0V 0V 0V 0V 0V 0V -5V -5V 0V -5V -5V -5V -5V -5V -5V -5V 0V -5V -5V -5V -5V -5V -5V -5V 0V -5V -5V -5V -5V -5V -5V -5V 0V -5V -5V -5V -5V -5V -5V -5V 0V -5V -5V -5V -5V -5V -5V -5V 0V Reference +0.5dB +1dB +2dB +4dB +8dB +16dB Handling, Mounting and Bonding Instructions The back of the die is gold metallized and can be die-attached manually onto gold, eutectically with Au-Sn (80:20) or with low temperature conductive epoxy. The maximum allowable die temperature is 310°C for 2 minutes. Bonds should be made onto the exposed gold pads with 17 or 25 microns pure gold or half-hard gold wire. Bonding should be achieved with the die face at 225°C to 275°C with a heated thermosonic wedge (approx. 125°C) and a maximum force of 60 grams. Ball bonds may be used but care must be taken to ensure the ball size is compatible with the bonding pads shown. The length of the bond wires should be minimised to reduce parasitic inductance, particularly those to the RF and ground pads. Ordering Information: P35-4304-000-200 462/SM/02427/200 Issue 1/1 The data and product specifications are subject to change without notice. These devices should not be used for device qualification and production without prior notice. © Marconi Optical Components Ltd 2001 MOC, Caswell, Towcester, Northants, NN12 8EQ, Tel:+44 1327 356468 Fax +44 1327 356698 www.moc.marconi.com