Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined upgrade path and may be user configured as 8, 16 or 32 bits wide. The PUMA68F16006X is a 512Kx32 FLASH module housed in a 68 Jleaded package which complies with the JEDEC 68 PLCC standard. Access times of 70, 90 or 120ns are available. The 5V device is available to commercial and industrial temperature grade. 1M x 32, and 2Mx32 FLASH PUMA68 devices are available in the same footprint to offer a defined upgrade path. Features • Access times of 70, 90 and 120ns. • 5V + 10%. • Commercial and Industrial temperature grades • JEDEC Standard 68 PLCC footprint. • Industry standard pinout. • May be organised as 512Kx32, 1Mx16 or 2Mx8 • User configurable as 8 / 16 / 32 bits wide. • 10 Year Data Retention • Write Erase Cycle Endurance 100,000 (min) • Automatic Write/Erase by Embedded Algorithm • Uniform Sector Device. Package Details Plastic ‘J’ Leaded JEDEC PLCC Max. Dimensions (mm) - 25.27 x 25.27 x 5.08 Block Diagram A0~A18 /OE /WE 512K x 8 FLASH 512K x 8 FLASH 512K x 8 512K x 8 FLASH FLASH /CS1 /CS2 /CS3 /CS4 D0~7 D8~15 D16~23 D24~31 Pin Definition See page 2. Pin Functions Description Signal Address Input Data Input/Output Chip Select Write Enable Output Enable No Connect Power Ground A0~A18 D0~D31 /CS1~4 /WE /OE NC VCC VSS 11403 West Bernardo Court, Suite 100, San Diego, CA92127. TEL (001) 858 674 2233, Fax No. (001) 858 674 2230 E-mail: [email protected] 512 K x 32 FLASH Module PUMA68F16006X - 70/90/12 Pin Definition - PUMA68F16006X PAGE 2 Pin Signal Pin Signal 1 VCC 35 VCC 2 NC 36 A13 3 /CS1 37 A12 4 /CS2 38 A11 5 /CS3 39 A10 6 /CS4 40 A9 7 A17 41 A8 8 A18 42 A7 9 D16 43 D0 10 D17 44 D1 11 D18 45 D2 12 D19 46 D3 13 VSS 47 VSS 14 D20 48 D4 15 D21 49 D5 16 D22 50 D6 17 D23 51 D7 18 VCC 52 VCC 19 D24 53 D8 20 D25 54 D9 21 D26 55 D10 22 D27 56 D11 23 VSS 57 VSS 24 D28 58 D12 25 D29 59 D13 26 D30 60 D14 27 D31 61 D15 28 A6 62 A14 29 A5 63 A15 30 A4 64 A16 31 A3 65 /WE 32 A2 66 /OE 33 A1 67 NC 34 A0 68 NC Issue 5.0 December 1999 Package Details PUMA 68 pin JEDEC Surface Mounted PLCC Pin 1 Pin 68 25.27 (0.995) 25.02 (0.985) 5.08 (0.200) max 0.46 (0.018) 1.27 (0.050) 0.90 (0.035) typ 23.11 (0.910) 24.13 (0.950) PAGE 3 Issue 5.0 December 1999 Ordering Information Speed Temp. Range/Screening 70 90 12 Blank I = = = = = 70ns 90ns 12ns Commercial Industrial Pinout Configuration X = Industry Standard Pinout Memory Organisation 16006 = configurable as 512K x 32, 1M x 16 or 2M x 8 Technology Package F = FLASH PUMA 68 = 68 pin ‘J’ Leaded PLCC Note : Although this data is believed to be accurate the information contained herein is not intended to and does not create any warranty of merchantibility or fitness for a particular purpose. Our products are subject to a constant process of development. Data may be changed without notice. Products are not authorised for use as critical components in life support devices without the express written approval of a company director. PAGE 4 http://www.mosaicsemi.com/ Issue 5.0 December 1999 Ordering Information PUMA 68F16006XI - 70 Specified as +/- 2 thou max. Visual Inspection Standard All devices inspected to ANSI/J-STD-001B Class 2 standard Moisture Sensitivity Devices are moisture sensitive. Shelf Life in Sealed Bag 12 months at <40OC and <90% relative humidity (RH). After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or equivalent processing (peak package body temp 220OC) must be : A : Mounted within 72 Hours at factory conditions of <30OC/60% RH OR B : Stored at <20% RH If these conditions are not met or indicator card is >20% when read at 23OC +/-5% devices require baking as specified below. If baking is required, devices may be baked for :A : 24 hours at 125OC +/-5% for high temperature device containers OR B : 192 hours at 40OC +5OC/-0OC and <5% RH for low temperature device containers. Packaging Standard Devices packaged in dry nitrogen, JED-STD-020. Packaged in trays as standard. Tape and reel available for shipment quantities exceeding 200pcs upon request. Soldering Recomendations IR/Convection - Ramp Rate Temp. exceeding 183OC Peak Temperature Time within 5OC of peak Ramp down 6OC/sec max. 150 secs. max. 225OC 20 secs max. 6OC/sec max. Vapour Phase - Ramp up rate Peak Temperature Time within 5OC of peak Ramp down 6OC/sec max. 215 - 219OC 60 secs max. 6OC/sec max. The above conditions must not be exceeded. Note : The above recommendations are based on standard industry practice. Failure to comply with the above recommendations invalidates product warranty. PAGE 5 Issue 5.0 December 1999 Customer Guidelines Co Planarity