ETC 2SC3356(NE85633)

DATA SHEET
NPN SILICON RF TRANSISTOR
2SC3356
NPN EPITAXIAL SILICON RF TRANSISTOR
FOR MICROWAVE LOW-NOISE AMPLIFICATION
3-PIN MINIMOLD
FEATURES
• Low noise and high gain : NF = 1.1 dB TYP., Ga = 11 dB TYP. @ VCE = 10 V, IC = 7 mA, f = 1 GHz
• High power gain : MAG = 13 dB TYP. @ VCE = 10 V, IC = 20 mA, f = 1 GHz
ORDERING INFORMATION
Part Number
Quantity
Supplying Form
2SC3356
50 pcs (Non reel)
• 8 mm wide embossed taping
2SC3356-T1
3 kpcs/reel
• Pin 3 (Collector) face the perforation side of the tape
Remark To order evaluation samples, contact your nearby sales office.
The unit sample quantity is 50 pcs.
ABSOLUTE MAXIMUM RATINGS (TA = +25°°C)
Parameter
Symbol
Ratings
Unit
Collector to Base Voltage
VCBO
20
V
Collector to Emitter Voltage
VCEO
12
V
Emitter to Base Voltage
VEBO
3.0
V
IC
100
mA
200
mW
Collector Current
Total Power Dissipation
Ptot
Note
Junction Temperature
Tj
150
°C
Storage Temperature
Tstg
−65 to +150
°C
Note Free air
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PU10209EJ01V0DS (1st edition)
(Previous No. P10356EJ5V1DS00)
Date Published January 2003 CP(K)
Printed in Japan
The mark • shows major revised points.
 NEC Compound Semiconductor Devices 1985, 2003
2SC3356
ELECTRICAL CHARACTERISTICS (TA = +25°°C)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
DC Characteristics
Collector Cut-off Current
ICBO
VCB = 10 V, IE = 0 mA
–
–
1.0
µA
Emitter Cut-off Current
IEBO
VEB = 1.0 V, IC = 0 mA
–
–
1.0
µA
VCE = 10 V, IC = 20 mA
50
120
250
–
VCE = 10 V, IC = 20 mA
–
7
–
GHz
S21e
VCE = 10 V, IC = 20 mA, f = 1 GHz
–
11.5
–
dB
NF
VCE = 10 V, IC = 7 mA, f = 1 GHz
–
1.1
2.0
dB
VCB = 10 V, IE = 0 mA, f = 1 MHz
−
0.55
1.0
pF
hFE
DC Current Gain
Note 1
RF Characteristics
Gain Bandwidth Product
fT
2
Insertion Power Gain
Noise Figure
Cre
Reverse Transfer Capacitance
Note 2
Notes 1. Pulse measurement: PW ≤ 350 µs, Duty Cycle ≤ 2%
2. Collector to base capacitance when the emitter grounded
hFE CLASSIFICATION
Rank
R23/Q
Note
R24/R
Note
R25/S
Note
Marking
R23
R24
R25
hFE Value
50 to 100
80 to 160
125 to 250
Note Old Specification/New Specification
2
Data Sheet PU10209EJ01V0DS
2SC3356
TYPICAL CHARACTERISTICS (TA = +25°°C, unless otherwise specified)
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
REVERSE TRANSFER CAPACITANCE
vs. COLLECTOR TO BASE VOLTAGE
Reverse Transfer Capacitance Cre (pF)
Total Power Dissipation Ptot (mW)
250
Free air
200
150
100
50
0
25
50
75
100
125
150
1
0.5
0.3
0.2
0.5
1
2
5
10
20 30
Collector to Base Voltage VCB (V)
DC CURRENT GAIN vs.
COLLECTOR CURRENT
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
10
Gain Bandwidth Product fT (GHz)
VCE = 10 V
100
50
20
10
0.5
1
5
10
VCE = 10 V
5
2
1
0.5
0.2
0.1
0.1
50
0.5
1
5
10
50 100
Collector Current IC (mA)
Collector Current IC (mA)
INSERTION POWER GAIN, MAG
vs. FREQUENCY
INSERTION POWER GAIN
vs. COLLECTOR CURRENT
25
15
Insertion Power Gain |S21e|2 (dB)
DC Current Gain hFE
f = 1 MHz
Ambient Temperature TA (˚C)
200
Insertion Power Gain |S21e|2 (dB)
Maximum Available Power Gain MAG (dB)
2
MAG
20
|S21e|2
15
10
5
VCE = 10 V
IC = 20 mA
0
0.05
0.1
0.2
0.5
1
VCE = 10 V
f = 1 GHz
10
2
Frequency f (GHz)
5
0
0.5
1
5
10
50 70
Collector Current IC (mA)
Data Sheet PU10209EJ01V0DS
3
2SC3356
NOISE FIGURE vs.
COLLECTOR CURRENT
f = 1 GHz
IC = 20 mA
Noise Figure NF (dB)
Noise Figure NF (dB)
6
5
4
3
2
15
5
VCE = 10 V
f = 1 GHz
4
12
|S21e|2
3
9
2
6
NF
1
3
1
0
0.5
1
5
10
50 70
0
2
4
6
8
0
10
Collector to Emitter Voltage VCE (V)
Collector Current IC (mA)
Remark The graphs indicate nominal characteristics.
S-PARAMETERS
S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form
(S2P) that enables direct import to a microwave circuit simulator without keyboard input.
Click here to download S-parameters.
[RF and Microwave] → [Device Parameters]
URL http://www.csd-nec.com/
4
Data Sheet PU10209EJ01V0DS
Insertion Power Gain |S21e|2 (dB)
7
NOISE FIGURE, INSERTION POWER GAIN
vs. COLLECTOR TO EMITTER VOLTAGE
2SC3356
SMITH CHART
S11e, S22e-FREQUENCY
CONDITION : VCE = 10 V, 200 MHz Step
1.4
1.2
1.0
0.9
1.6
0.6
0.
18
32
1.8
0.
50
2.0
5
0.
T
EN
0.4
4
0.
0
3.
30
C
0.6
O
0.8
1
0 .2
9
0.2
( –Z–+–J–XTANCE CO
) MPO
N
0.1
0.3 7
3
0
0.2 0
0.3
0
1.
8
20
6.0
0.6
0.4
0.1
20
10
4.0
3.0
1.8
2.0
1.6
1.4
0.7
0.8
0.6
0.5
0.4
0.3
5.0
50
0.2
1.2
0.2 GHz IC = 20 mA
10
IC = 5 mA
0.2 GHz
8
0.
0
IC = 20 mA
1.
5.0
1.0
(
0.8
0.2 GHz
0.6
E
IV
AT
0
3.
−4
0
IC = 5 mA
NE
G
0.4
5
0.
0. 31
19
2.0
1.8
1.6
1.4
−70
0.35
0.15
1.2
4
0.3
6
0.1
0.36
0.14
−80
1.0
0
0.8
3
0.3 7
0.2
−6
0.9
0.1
0.38
0.39
0.12
0.11
−100
−90
0.37
0.13
0.40
0.10
−11
0
0.
4
0. 3
07
30
−1
0.6
32
18
0.
0.
0
0.7
−5
0.
0.3
0.2 0
0
E
NC
TA X
AC −J––O–
RE
–Z
)
4.0
30
4
0.
0.27
0.2
0
.2
8
3
0
0.2
.2
2
9
−20
0.2
1
−
S22e
0.6
0.2
−10
0.4
0.26
0.24
20
0.9
1.0
)
0
(
50
0.25
0.25
REACTANCE COMPONENT
R
––––
0.2
ZO
0.24
0.26
20
0.2
0.3
0.2
0.8
0.23
0.27
10
10
S11e
2
1.
2.0 GHz
0.2
4.0
0
0.2
WAVELE
60
40
NGTH
0
S
0.01
0.49
0.02 TOWARD
0.48
0
0.49
0.0 GENE
0.01
7
0.48
3
RA
0.4
0.0W2ARD LOADLECTION COEF
FCIENT
0.4
0.0TOR
3 HS TO LE OF REF
6
I
7
N
.0
DEG
0NGT ANG
4
0.4
R
0
E
E
0.4
ES
6
L
0
.0W4AVE −1
0.0
6
0
5
15
0
0.4 5
0.4 5
0
15
0
−
.
5
0
0.
4
0
4
POS
T
0.1
14 0.4 6
0. 06
ITIV
NEN
40
0
ER
4
PO
M
0. −1
E
A
CO
0.1
6
0.3
4
70
0.2
0.1
0.4
1
0.0
0.4
9
0 2
−1 .08
20
0.3
0.15
0.35
19
0. 31
0.
07
43
0. 0
13
0.
0.14
0.36
80
90
0.7
8
0.0 2
0.4 20
1
0.13
0.37
0.12
0.38
0.11
0.39
100
0.10
0.40
110
0.8
9
0.0
1
0.4
S21e-FREQUENCY
S12e-FREQUENCY
CONDITION : VCE = 10 V, IC = 20 mA
CONDITION : VCE = 10 V, IC = 20 mA
90˚
90˚
120˚
2.0 GHz
60˚
120˚
60˚
0.2 GHz
S12e
150˚
30˚
S21e
150˚
30˚
0.2 GHz
180˚
2.0 GHz 5
10
15
–150˚
20
0˚ 180˚
–30˚
–60˚
–120˚
0.05
0.1
0.15
–150˚
0.2 0.25
0˚
–30˚
–60˚
–120˚
–90˚
–90˚
Data Sheet PU10209EJ01V0DS
5
2SC3356
PACKAGE DIMENSIONS
3-PIN MINIMOLD (UNIT: mm)
0.65+0.1
–0.15
1
3
0.4+0.1
–0.05
0.95
2
0.95
1.5
Marking
0 to 0.1
1.1 to 1.4
0.16+0.1
–0.05
0.3
2.9±0.2
0.4+0.1
–0.05
2.8±0.2
PIN CONNECTIONS
1. Emitter
2. Base
3. Collector
6
Data Sheet PU10209EJ01V0DS
2SC3356
• The information in this document is current as of January, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
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redundancy, fire-containment, and anti-failure features.
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(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4 - 0110
Data Sheet PU10209EJ01V0DS
7
2SC3356
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Technical issue
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E-mail: [email protected] FAX: +81-44-435-1918
0209