REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET REV STATUS REV OF SHEETS SHEET PMIC N/A PREPARED BY Gary Zahn STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A 1 2 3 4 5 7 8 9 10 11 DEFENSE SUPPLY CENTER COLUMBUS POST OFFICE BOX 3990 COLUMBUS, OHIO 43216-5000 http://www.dscc.dla.mil CHECKED BY Michael C. Jones APPROVED BY Raymond Monnin 6 MICROCIRCUIT, LINEAR, HIGH SPEED PULSE WIDTH MODULATOR CONTROLLER, MONOLITHIC SILICON DRAWING APPROVAL DATE 02-01-31 REVISION LEVEL SIZE A CAGE CODE 5962-02505 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 11 5962-E163-02 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 02505 01 Device type (see 1.2.2) / H Device class designator (see 1.2.3) X Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 1/ Generic number 02 03 Circuit function 52445 52446 High speed PWM controller High speed PWM controller 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class 1/ Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Device types may be similar to the device types on Standard Microcircuit Drawing (SMD) 5962-87681. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator X Terminals CQCC1-N28B Package style 28 Square leadless chip carrier with thermal pads 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC)................................................................. DC output current, source or sink............................................. Pulse output current, source or sink (0.5 µs)............................ Analog input voltage: NONINVERTING, INVERTING, and RAMP pins .................. SOFT START and CURRENT LIMIT / SD pins ..................... Clock output current ................................................................. Error amplifier output current.................................................... Soft start sink current ............................................................... Oscillator charging current ....................................................... Power dissipation (PD) ............................................................. Storage temperature range ...................................................... Lead temperature (soldering, 10 seconds)............................... Junction temperature (TJ)......................................................... Thermal resistance, junction-to-case (θJC) .............................. 22 V dc 0.5 A 2.0 A -0.3 V dc to 7.0 V dc -0.3 V dc to 6.0 V dc -5.0 mA 5.0 mA 20 mA -5.0 mA 1.0 W 2/ 3/ -65°C to +150°C +300°C +150°C See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) ......................................................... Ambient operating temperature range (TA)................................ 12 V dc to 22 V dc -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. 1/ 2/ 3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. For case outline X, derate linearly above TA = 40°C at 9 mW/°C. Must withstand the added PD due to short circuit test, e.g., ISC. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 3 HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram(s). The block diagram(s) shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked in MIL-HDBK-103 and QML-38534. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max 5.05 5.15 V Reference section Output voltage VREF TJ = +25C, IO = 1.0 mA 1 All Line regulation VRLINE 12 V < VCC < 20 V 1,2,3 All ±15 mV Load regulation VRLOAD 1.0 mA < IO < 10 mA 1,2,3 All ±20 mV Long term stability 2/ ∆VREF / TJ = +125°C, t = 1000 hrs. 2 All ±25 mV VOM1 IO = -1.0 mA, VCC = 10 V 1,2,3 All 5.00 5.20 V VOM2 IO = -1.0 mA, VCC = 30 V VOM3 IO = -10 mA, VCC = 10 V VOM4 IO = -10 mA, VCC = 30 V ISC VREF = 0 V 1,2,3 All 30 90 mA Initial accuracy fo TJ = +25°C 4 All 375 425 kHz Voltage stability ∆fo / ∆V 12 V < VCC < 20 V 4,5,6 All ±1.0 % Total variation fOM1 VCC = 10 V 4,5,6 All 340 460 kHz fOM2 VCC = 30 V 3.7 ∆t Total output variation Short-circuit current Oscillator section Clock out high VCLK(H) 1,2,3 All Clock out low VCLK(L) 1,2,3 All Ramp voltage, peak 2/ Vim 1,2,3 All Ramp voltage, valley 2/ Viv 1,2,3 Ramp voltage, valley 2/ to peak Functional tests Vivp Functional tests See 4.3.1b V 0.2 V 2.6 3.0 V All 0.6 1.25 V 1,2,3 All 1.6 2.1 V 7,8 All Pass/ Fail See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max -15 15 mV Error amplifier section Input offset voltage VOS VCM = 3.0 V, VO = 3.0 V 1,2,3 All Input bias current IIB VCM = 3.0 V, VO = 3.0 V 1,2,3 All 3.0 µA Input offset current IOS VCM = 3.0 V, VO = 3.0 V 1,2,3 All ±1.0 µA Open loop gain AVOL 1.0 V < VO < 4.0 V 4,5,6 All 60 dB Common-mode rejection ratio CMRR 1.5 V < VCM < 5.5 V 4,5,6 All 75 dB 4,5,6 All 85 dB VOUT = 3.0 V Power supply rejection ration PSRR 10 V < VCC < 30 V VOUT = 3.0 V Output sink current IO(SINK) E/A OUT voltage = 1.0 V 1,2,3 All 1.0 mA Output source current IO(SOURCE) E/A OUT voltage = 4.0 V 1,2,3 All -0.5 mA Output high voltage VOH1 E/A OUT current = -0.5 V 1,2,3 All 4.0 5.0 V Output low voltage VOL1 E/A OUT current = 1.0 mA 1,2,3 All 0 1.0 V Gain bandwidth 2/ product Slew rate 2/ GBWP F = 200 kHz 4,5,6 All 6.0 MHz 4,5,6 All 6.0 V/µs 1,2,3 All 1,2,3 All 0 1,2,3 All 1.1 9,10,11 All SR PWM comparator section. RAMP bias current IBRAMP Duty cycle range DC(range) E/A OUT zero dc threshold voltage Delay to output 2/ VTH RAMP voltage = 0 V RAMP voltage = 0 V tD1 -8.0 µA 80 % V 80 ns Soft-start/duty cycle clamp section Charge current ICHG SOFT START voltage = 2.5 V 1,2,3 All 8.0 20 µA Discharge current IDCHG SOFT START voltage = 2.5 V 1,2,3 All 0.10 0.35 mA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Current limit / start sequence / fault section Restart threshold VRS 1,2,3 All 0.5 V I LIM bias current IBLIM 1,2,3 All 15 µA Current limit threshold VLIMIT 1,2,3 All 0.95 1.05 V Over current threshold VOVER 1,2,3 All 1.14 1.26 V I LIM delay to output tD3 1,2,3 All 80 ns 1,2,3 All 0.4 V 0 V < V I LIM < 2 V Output section. Output low level VOL2 IOUT = 20 mA 2.2 IOUT = 200 mA Output high level VOH2 1,2,3 IOUT = -20 mA All V 12.0 IOUT = -200 mA UVLO output low saturation Rise / fall time 2/ 13.0 VOLS IO = 20 mA 1,2,3 All 1.2 V tr CL = 1.0 nF 9,10,11 All 45 ns 1,2,3 02 9.6 V Under-voltage lockout section Start threshold VSTART 8.4 03 17.0 Stop threshold VSTOP 1,2,3 03 9 V UVLO hysteresis VHYS 1,2,3 02 0.4 1.2 03 5.0 7.0 V Supply current Start up current ISTART VC = VCC = VTH (start) – 0.5 V 1,2,3 All 0.3 mA Supply current ICC voltage = 0 V, NONINVERTING INPUT voltage = 1.0 V 1,2,3 All 36 mA 1/ Unless otherwise specified, characteristics apply at RT = 3.65 kΩ, CT = 1.0 nF. VCC = 12 V. 2/ Guaranteed, if not tested, to the specified limits. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 7 Device types 02 and 03 Case outline X Terminal number Terminal symbol 1 NC 2 INVERTING INPUT 3 NONINVERTING INPUT 4 NC 5 NC 6 E / A OUT 7 CLK / LEB 8 NC 9 RT 10 CT 11 NC 12 NC 13 RAMP 14 SOFT START 15 NC 16 CURRENT LIMIT / SD 17 GROUND 18 NC 19 NC 20 OUT A 21 POWER GROUND 22 NC 23 VC 24 OUT B 25 NC 26 NC 27 VCC 28 VREF NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 8 Device types 02 and 03. NOTE: 1. "A" is for device type 02. "B" is for device type 03. FIGURE 2. Block diagram(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 9 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) 1 Interim electrical parameters Final electrical parameters 1*,2,3,4 Group A test requirements 1,2,3,4,5,6,7,8,9**,10**,11** Group C end-point electrical parameters 1,2,3 Group D end-point electrical parameters 1,2,3 Not applicable End-point electrical parameters for radiation hardness assurance (RHA) devices * PDA applies to subgroup 1. ** Subgroups 9, 10, and 11 are guaranteed if not tested. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534 and conducted on all devices prior to Conformance inspection (CI). The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 10 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Sample size shall be 116(0) for all tests. b. Tests shall be as specified in table II herein. c. Subgroups 7 and 8 shall consist of verifying the functionality of the device. It forms a part of the vendors test tape and shall be maintained and available from the approved source of supply. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Sample size for bond strength is 22(0), resistance to solvents and die sheer is 3(0) for each test. 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. Sample size is 45(0). c. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA = +125°C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Subgroup 1 shall consist of the following: (1) Temperature cycle and thermal shock. (2) Mechanical shock, constant acceleration, and PIND. (3) Physical dimensions 15(0). 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. Sample size is 15(0) 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 432165000, or telephone (614) 692-0536. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-02505 A REVISION LEVEL SHEET 11 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-01-31 Approved sources of supply for SMD 5962-02505 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. 1/ 2/ 3/ Standard microcircuit drawing PIN 1/ 2/ Vendor CAGE number Vendor similar PIN 3/ 5962-0250502HXA 31757 52445 5962-0250502HXC 31757 52445 5962-0250503HXA 31757 52446 5962-0250503HXC 31757 52446 The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Device types may be similar to the device types on Standard Microcircuit Drawing (SMD) 5962-87681. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 31757 Vendor name and address Micropac Industries, Incorporated 905 E. Walnut Street Garland, TX 75040 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.