ETC AM7943-1JC

Am7943
Subscriber Line Interface Circuit
DISTINCTIVE CHARACTERISTICS
Programmable constant-current feed
Current gain = 200
Programmable loop-detect threshold
Low power Standby state
Performs polarity reversal
Ground-key detector
Tip Open state for ground-start lines
–19 V to –58 V battery operation
Two-wire impedance set by single external
impedance
On-hook transmission
On-chip ring relay driver and relay snubber
circuit
On-chip Thermal Management (TMG) feature
Ideal for DLC and PABX applications
BLOCK DIAGRAM
TMG
Ring Relay
Driver
RINGOUT
C1
A(TIP)
C2
Input
Decoder
and Control
Ground-Key
Detector
HPA
HPB
C3
E0
E1
Two-Wire
Interface
DET
RSN
Signal
Transmission
VTX
Off-Hook
Detector
RD
B(RING)
DA
DB
VBAT
Power-Feed
Controller
RDC
CAS
Ring-Trip
Detector
BGND
VCC
VEE
AGND/DGND
Publication# 080136 Rev: D
Issue Date: October 1999
Amendment: /0
ORDERING INFORMATION
Standard Products
Legerity standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the elements below.
Am7943
–1
J
C
TEMPERATURE RANGE
C = Commercial (0°C to 70°C)*
PACKAGE TYPE
J = 32-pin Plastic Leaded Chip Carrier (PL 032)
PERFORMANCE GRADE
–1 = Performance Grading
–2 = Performance Grading
DEVICE NUMBER/DESCRIPTION
Am7943
Subscriber Line Interface Circuit
Valid Combinations
Valid Combinations
Am7943
–1
–2
JC
Valid Combinations list configurations planned to
be supported in volume for this device. Consult
the local Legerity sales office to confirm
availability of specific valid combinations, to check
on newly released combinations, and to obtain
additional data on Legerity’s standard military–
grade products.
Note:
* Functionality of the device from 0°C to +70°C is guaranteed by production testing. Performance from –40°C to +85°C
is guaranteed by characterization and periodic sampling of production units.
2
Am7943 Data Sheet
CONNECTION DIAGRAM
Top View
VCC
NC
BGND
B(RING)
A(TIP)
4
3
2
1
32
31 30
DB
NC
32-Pin PLCC
RINGOUT
6
28
DA
NC
7
27
RD
TMG
8
26
HPB
VBAT
9
25
NC
C3
10
24
HPA
E1
11
23
VTX
C2
12
22
VEE
DET
13
21
RSN
19 20
AGND/DGND
16 17 18
NC
15
CAS
14
RDC
TP
E0
29
NC
5
C1
TP
Notes:
1. Pin 1 is marked for orientation.
2. TP is a thermal conduction pin tied to substrate.
3. NC = No Connect
SLIC Products
3
PIN DESCRIPTIONS
Pin Names
4
Type
Description
AGND/DGND
Gnd
Analog and Digital ground
A(TIP)
Output
Output of A(TIP) power amplifier
BGND
Gnd
Battery (power) ground
B(RING)
Output
Output of B(RING) power amplifier
C3–C1
Input
Decoder. TTL compatible. C3 is MSB and C1 is LSB.
CAS
Capacitor
Anti-saturation pin for capacitor to filter reference voltage when operating in antisaturation region.
DA
Input
Ring-trip negative. Negative input to ring-trip comparator.
DB
Input
Ring-trip positive. Positive input to ring-trip comparator.
DET
Output
Switchhook detector. When enabled, a logic Low indicates the selected detector is
tripped. The detector is selected by the logic inputs (C3–C1, E1–E0). The output is opencollector with a built-in 15 kΩ pull-up resistor.
E0
Input
DET Enable. A logic High enables DET. A logic Low disables DET. (DET = Logic High).
(PLCC only)
E1
Input
Ground-Key Enable. E1 = Low connects the ground-key or ring-trip detector to DET.
E1 = High connects the off-hook or ring-trip detector to DET. (PLCC only)
HPA
Capacitor
High-Pass Filter Capacitor. A(TIP) side of high-pass filter capacitor.
HPB
Capacitor
High-Pass Filter Capacitor. B(RING) side of high-pass filter capacitor.
RD
Resistor
Detector resistor. Threshold modification and filter point for the off-hook detector.
RDC
Resistor
DC feed resistor. Connection point for the DC feed current programming network. The
other end of the network connects to the receiver summing node (RSN). The sign of
VRDC is negative for normal polarity and positive for reverse polarity.
RINGOUT
Output
Ring Relay Driver. Open-collector driver with emitter internally connected to BGND.
RSN
Input
Receive Summing Node. The metallic current (AC and DC) between A(TIP) and B(RING)
is equal to 200 times the current into this pin. The networks that program receive gain,
two-wire impedance, and feed current all connect to this node.
TMG
—
Thermal management. A resistor connected from this pin to VBAT reduces the on-chip
power dissipation in the normal polarity, Active state only. Refer to Table 2.
TP
Thermal
Thermal pin. Connection for heat dissipation. Internally connected to substrate (VBAT).
Leave as open circuit or connected to VBAT. In both cases, the TP pins can connect to
an area of copper on the board to enhance heat dissipation.
VBAT
Battery
Battery supply
VCC
Power
+5 V power supply
VEE
Power
–5 V power supply
VTX
Output
Transmit Audio. This output is a unity gain version of the A(TIP) and B(RING) metallic
voltage. VTX also sources the two-wire input impedance programming network.
Am7943 Data Sheet
ABSOLUTE MAXIMUM RATINGS
OPERATING RANGES
Storage temperature . . . . . . . . . . . . –55°C to +150°C
Commercial (C) Devices
VCC with respect to AGND/DGND . . .–0.4 V to +7.0 V
Ambient temperature . . . . . . . . . . . . . . 0°C to +70°C*
VEE with respect to AGND/DGND . . .+0.4 V to –7.0 V
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . 4.75 V to 5.25 V
VBAT with respect to AGND/DGND:
Continuous . . . . . . . . . . . . . . . . . . +0.4 V to –70 V
10 ms . . . . . . . . . . . . . . . . . . . . . . +0.4 V to –75 V
VEE . . . . . . . . . . . . . . . . . . . . . . . . –4.75 V to –5.25 V
BGND with respect to AGND/DGND . . . .+3 V to –3 V
A(TIP) or B(RING) to BGND:
Continuous . . . . . . . . . . . . . . . . . . . .–70 V to +1 V
10 ms (f = 0.1 Hz) . . . . . . . . . . . . . . . –70 V to +5 V
1 ms (f = 0.1 Hz) . . . . . . . . . . . . . . . . –80 V to +8 V
10 µs (f = 0.1 Hz) . . . . . . . . . . . . . . –90 V to +12 V
Current from A(TIP) or B(RING) . . . . . . . . . . . .±150 mA
Current from TMG . . . . . . . . . . . . . . . . . . . . . 100 mA
Voltage on RINGOUT:
During transient . . . . . . . . . . . . . . BGND to +10 V
During steady state . . . . . . . . . . . . . BGND to +7 V
VBAT . . . . . . . . . . . . . . . . . . . . . . . . . –19 V to –56.5 V
AGND/DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V
BGND with respect to
AGND/DGND . . . . . . . . . . . . –100 mV to +100 mV
Load resistance on VTX to ground . . . . . . . 10 kΩ min
Operating Ranges define those limits between which device
functionality is guaranteed.
* Functionality of the device from 0°C to +70°C is guaranteed
by production testing. Performance from –40°C to +85°C is
guaranteed by characterization and periodic sampling of
production units.
Current through relay drivers . . . . . . . . . . . . . . 60 mA
DA and DB inputs
Voltage on ring-trip inputs . . . . . . . . . . .VBAT to 0 V
Current into ring-trip inputs . . . . . . . . . . . . . .±10 mA
C3–C1, E0, E1
to AGND/DGND . . . . . . . . . . –0.4 V to VCC +0.4 V
Maximum power dissipation, TA = 85°C
No heat sink (see note):
In 32-pin PLCC package. . . . . . . . . . . . . . . . 1.4 W
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .θJA
In 32-pin PLCC package. . . . . . . . . . . .43°C/W typ
Note: Thermal limiting circuitry on chip will shut down the circuit at a junction temperature of about 165°C. The device
should never be exposed to this temperature. Operation
above 145°C junction temperature may degrade device reliability. See the SLIC Packaging Considerations for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
SLIC Products
5
ELECTRICAL CHARACTERISTICS
Description
Test Conditions (See Note 1)
Min
Analog (VTX) output impedance
–35
–40
–40°C to +85°C
300 Hz to 3.4 kHz
1
Unit
Note
Ω
+35
+40
Longitudinal impedance
at A or B
Overload level
Max
3
Analog (VTX) output offset
Analog (RSN) input impedance
Typ
mV
20
—
4
4
35
Ω
+2.5
Vpk
2a
4-wire and 2-wire Active state
–2.5
On-hook, RLAC = 900 Ω,
Active or OHT state
0.95
Vrms
2b
26
dB
4, 8
Transmission Performance
2-wire return loss
(See Test Circuit D)
200 to 3400 Hz
Longitudinal Balance (2-Wire and 4-Wire, See Test Circuit C); RL = 740 Ω at VBAT = 48 V
Longitudinal to metallic L-T, L-4
0°C to +70°C
–40°C to +85°C
–1*
–2
–2
–2
52
63
58
58
1 kHz to 3.4 kHz
normal polarity
0°C to +70°C
normal polarity
–40°C to +85°C
reverse polarity
–1*
–2
–2
–2
52
58
54
54
200 Hz to 1 kHz
normal polarity
normal polarity
reverse polarity
Longitudinal signal
generation 4-L
300 Hz to 800 Hz
normal polarity
42
Longitudinal current per pin
Active state and OHT state
27
—
—
4
—
dB
35
—
—
4
—
mArms
Insertion Loss (2- to 4-Wire and 4- to 2-Wire, See Test Circuits A and B)
BAT = –48 V, RL = 900 Ω
Gain accuracy
Gain accuracy, OHT state
Variation with frequency
Gain tracking
0 dBm, 1 kHz
0°C to +70°C
–40°C to +85°C
–0.15
–0.20
+0.15
+0.20
–10 dBm, on-hook, RLAC = 900 Ω
–0.5
+0.5
300 to 3400 Hz
relative to 1 kHz
—
—
4
4
dB
0°C to +70°C
–40°C to +85°C
+7 dBm to –55 dBm
Reference: 0 dBm
—
—
4
–0.10
–0.15
+0.10
+0.15
–0.1
+0.1
–0.15
–0.20
+0.15
+0.20
—
3
4
–0.1
–0.15
+0.1
+0.15
—
3
4
4
—
Balance Return Signal (4- to 4-Wire, See Test Circuit B)
BAT = –48 V, RL = 900 Ω
Gain accuracy
Variation with frequency
Gain tracking
Group delay
0 dBm, 1 kHz
0°C to +70°C
–40°C to +85°C
300 to 3400 Hz
relative to 1 kHz
0°C to +70°C
–40°C to +85°C
+3 dBm to –55 dBm
Reference: 0 dBm
0°C to +70°C
–40°C to +85°C
f = 1 kHz
Am7943 Data Sheet
—
—
3, 4
4
+0.1
+0.15
4
Note:
* P.G. = Performance Grade
6
–0.1
–0.15
dB
µs
4, 8
ELECTRICAL CHARACTERISTICS (continued)
Description
Test Conditions (See Note 1)
Min
Typ
Max
Unit
–64
–55
–50
–40
dB
Note
Total Harmonic Distortion (2- to 4-Wire or 4- to 2-Wire) (See Test Circuits A and B)
BAT = –48 V, RL = 900 Ω
Harmonic distortion
300 Hz to 3400 Hz
2-wire level = 0 dBm
2-wire level = +7 dBm
Idle Channel Noise (2-wire and 4-wire)
C-message weighted noise
0°C to +85°C
–40°C to 0°C
+7
+7
+10
+12
dBrnC
—
4
Psophometric
weighted noise
0°C to +85°C
–40°C to 0°C
–83
–80
–78
dBmp
—
4
29.0
Line Characteristics, Active State (See Figure 1)
Short loops, Active state
BAT = –43 V, RLDC = 600 Ω
BAT = –48 V, RLDC = 600 Ω
25.0
27.0
Long loops, Active state
BAT = –43 V, RLDC = 1.4 kΩ
BAT = –48 V, RLDC = 1.9 kΩ
20.0
18.0
23.8
20.4
OHT state
BAT = –48 V, RLDC = 600 Ω
16.0
18.0
20.0
Standby state
V BAT – 3 V
I L = -----------------------------R L + 1800
0.7IL
IL
1.3IL
15.0
17.4
TA = 25°C
RL = 600 Ω, BAT = –48 V
TA = 70oC
Loop current
Tip Open, RL = 0
Disconnect, RL = 0
Tip Open, Bwire to GND
Tip Open, Bwire = VBAT + 6 V
ILLIM (Itip + Iring)
Tip and ring shorted to GND
Ground-start signaling
(tip voltage)
Active state
RTIP to –48 V = 7.0 kΩ
RRING to GND = 100 Ω
–7.5
Active and OHT
BAT = –48 V
40.5
Open circuit voltage
mA
—
—
30
30
100
100
—
—
µA
µA
mA
mA
100
130
mA
–5.0
V
4
—
—
42.0
Power Dissipation, Normal Loop Polarity, BAT = –48 V
On hook, Open Circuit state
On hook, OHT state
On hook, Active state
RTMG = Open
RTMG = 1700 Ω
On hook, Standby state
25
70
120
210
160
195
260
280
35
85
Off hook, OHT state
RL = 300 Ω, RTMG = ∞
BAT = –48 V
735
1050
Off hook, Active state
RL = 300 Ω, RTMG = ∞
BAT = –48 V
1.25
1.45
RL = 300 Ω, RTMG = ∞
0.57
0.85
RL = 600 Ω, TA = 25°C
0.68
1.0
Off hook, Standby state
SLIC Products
mW
W
7
ELECTRICAL CHARACTERISTICS (continued)
Description
Test Conditions (See Note 1)
Min
Typ
Max
VCC on-hook supply current
Open Circuit state
OHT state
Standby state
Active state
1.7
4.9
2.2
6.3
2.5
7.5
3.0
8.5
VEE on-hook supply current
Open Circuit state
OHT state
Standby state
Active state
0.7
2.0
0.77
2.1
2.0
3.5
2.0
5.0
VBAT on-hook supply current
Open Circuit state
OHT state
Standby state
Active state
0.18
1.9
0.45
4.2
1.0
4.7
1.5
5.7
Unit
Note
Supply Currents, BAT = –48 V
mA
Power Supply Rejection Ratio (VRIPPLE = 50 mVrms), Active Normal State
VCC
50 Hz to 3400 Hz
33
40
VEE
50 Hz to 3400 Hz
29
35
VBAT
50 Hz to 3400 Hz
30
50
Effective internal resistance
CAS pin to GND
85
170
RFI rejection
100 kHz to 30 MHz
(See Figure E)
dB
5
255
kΩ
4
1.0
mVrms
4
+10
%
Off-Hook Detector
Current threshold
375I DET = -------RD
–10
Ground-Key Detector Thresholds, Active State, BAT = –48 V
Ground-key resistance threshold
B(RING) to GND
Ground-key current threshold
B(RING) to GND
2.0
5.0
10.0
kΩ
9
mA
–0.5
–0.05
µA
–50
0
Ring-Trip Detector Input
Bias current
Offset voltage
Source resistance = 2 MΩ
+50
mV
Logic Inputs (C3–C1, E0, E1)
Input High voltage
2.0
Input Low voltage
Input High current
0.8
All inputs except C3 and E1
Input C3
Input E1
Input Low current
–75
–75
–75
40
200
45
–0.4
V
µA
mA
Logic Output (DET)
Output Low voltage
IOUT = 0.8 mA
0.4
Output High voltage
IOUT = –0.1 mA
V
2.4
Relay Driver Output (RINGOUT)
On voltage
35 mA sink
Off leakage
VOH = +5 V
Zener breakover
100 µA
Zener on voltage
30 mA
8
+0.25
6
+0.4
V
100
µA
7.2
V
10
Am7943 Data Sheet
6
RELAY DRIVER SCHEMATIC
RINGOUT
BGND
SWITCHING CHARACTERISTICS
(32-pin PLCC only)
Symbol
tgkde
Parameter
Test Conditions
E1 Low to DET High (E0 = 1)
E1 Low to DET Low (E0 = 1)
Ground-Key Detect state
RL open, RG connected
(See Figure G)
Temperature
Range
Min
Typ
Max
0°C to 70°C
–40° to +85°C
3.8
4.0
0°C to 70°C
–40° to +85°C
1.1
1.6
0°C to 70°C
–40° to +85°C
1.1
1.6
tgkdd
E0 High to DET Low (E1 = 0)
tgkd0
E0 Low to DET High (E1 = 0)
0°C to 70°C
–40° to +85°C
3.8
4.0
tshde
E1 High to DET Low (E0 = 1)
0°C to 70°C
–40° to +85°C
1.2
1.7
0°C to 70°C
–40° to +85°C
3.8
4.0
0°C to 70°C
–40° to +85°C
1.1
1.6
0°C to 70°C
–40° to +85°C
3.8
4.0
E1 High to DET High (E0 = 1)
tshdd
E0 High to DET Low (E1 = 1)
tshd0
E0 Low to DET High (E1 = 1)
Switchhook Detect state
RL = 600 Ω, RG open
(See Figure F)
SLIC Products
Unit
Note
µs
4
9
SWITCHING WAVEFORMS
E1 to DET
E1
DET
tgkde
tshde
tgkde
tshde
E0 to DET
E1
E0
DET
tshdd
tgkdd
tshd0
Note:
All delays measured at 1.4 V level.
10
Am7943 Data Sheet
tgkd0
Notes:
1. Unless otherwise noted, test conditions are VCC = +5 V, VEE = –5 V, CHP = 0.33 µF, RDC1 = RDC2 = 9.26 kΩ, CDC = 0.33 µF,
Rd = 35.4 kΩ, CCAS = 0.33 µF, no fuse resistors, BAT = –48 V, RL = 900 Ω, and RTMG = 1700 Ω.
2. a. Overload level is defined when THD = 1%.
b. Overload level is defined when THD = 1.5%.
3. Balance return signal is the signal generated at VTX by VRX. This specification assumes the two-wire AC load impedance
matches the programmed impedance.
4. Not tested in production. This parameter is guaranteed by characterization or correlation to other tests.
5. This parameter is tested at 1 kHz with a termination impedance of 900 Ω and an RL of 600 Ω in production. Performance at
other frequencies is guaranteed by characterization.
6. Tested with 0 Ω source impedance. 2 MΩ is specified for system design only.
7. Assumes the following ZT networks:
(900 Ω):
VTX
RSN
90 kΩ
90 kΩ
150 pF
(600 Ω):
VTX
RSN
60 kΩ
60 kΩ
150 pF
8. Group delay can be considerably reduced by using a ZT network such as that shown in Note 7 above. The network reduces
the group delay to less than 2 µs. The effect of group delay on the linecard performance may be compensated for by using
the QSLAC™ or DSLAC™ device.
Table 1.
SLIC Decoding
DET Output
State
C3 C2 C1
Two-wire Status
E1 = 1
E1 = 0
0
0
0
0
Open Circuit
Ring trip
Ring trip
1
0
0
1
Ringing
Ring trip
Ring trip
2
0
1
0
Active
Loop detector
Ground key
3
0
1
1
On-hook TX (OHT)
Loop detector
Ground key
4
1
0
0
Tip Open
Loop detector
Ground key
5
1
0
1
Standby
Loop detector
Ground key
6
1
1
0
Active Polarity Reversal Loop detector
Ground key
7
1
1
1
OHT Polarity Reversal
Ground key
Loop detector
Note:
E0 High enables the DET pin.
SLIC Products
11
Table 2. User-Programmable Components
Z T = 200 ( Z 2WIN – 2R F )
ZT is connected between the VTX and RSN pins. The fuse resistors
are RF and Z2WIN is the desired 2-wire AC input impedance. When
computing ZT, the internal current amplifier pole and any external
stray capacitance between VTX and RSN must be taken into
account.
200 • Z T
ZL
Z RX = ----------- • ------------------------------------------------G 42L Z T + 200 ( Z L + 2R F )
ZRX is connected from VRX to RSN. ZT is defined above and G42L
is the desired receive gain.
500 R DC1 + R DC2 = ------------I LOOP
RDC1, RDC2, and CDC form the network connected to the RDC pin.
RDC1 and RDC2 are approximately equal. ILOOP is the desired loop
current in the constant-current region.
R DC1 + R DC2
C DC = 1.5 ms • -------------------------------R DC1 • R DC2
375
0.5 ms
R D = --------- , C D = ----------------IT
RD
RD and CD form the network connected from RD to –5 V and IT is
the threshold current between on hook and off hook.
500 V • 0.66I OHT = ------------------------------R DC1 + R DC2
OHT loop current (constant-current region)
1
C CAS = ----------------------------5
3.4 • 10 π f c
CCAS is the regulator filter capacitor and fc is the desired filter cut-off
frequency.
Thermal Management Equations (Normal Active and Tip Open states)
RTMG is connected from TMG to VBAT and is used to limit power
dissipation within the SLIC in Normal Active and Tip Open states
only.
V BAT – 6 V
R TMG = ---------------------------I LOOP
2
( V BAT – 6 V – ( IL • R L ) )
P RTMG = --------------------------------------------------------------R TMG
Power dissipated in the thermal management resistor, RTMG,
during Active and Tip Open states
2
P SLIC = V BAT • I L – P RTMG – R L ( I L ) + 0.12 W
Power dissipated in the SLIC while in Active and Tip Open states
Thermal Management Equations (Polarity Reverse State)
Note: SLIC die temperature should not exceed 140oC.
2
P SLIC = V BAT • I L – R L ( I L ) + 0.12 W
Power dissipated in the SLIC while in the Polarity Reverse state
T SLIC = P SLIC • θ JA + T Ambient
Total die temperature
Theta JA ( θ JA ) PLCC = 43 ° C ⁄ watt
Thermal impedance of the 32-pin plastic leaded chip carrier
package
12
Am7943 Data Sheet
DC FEED CHARACTERISTICS
3
4
VBAT = 51.3 V
3
2
VBAT = 47.3 V
1
Active state
RDC1 + RDC2 = RDC = 18.52 kΩ
Notes:
1. Constant-current region:
Active state,
OHT state
500I L = --------R DC
2 500
I L = --- • ---------3 R DC
OHT state,
2. Anti-sat (battery tracking) turn-on:
V AB = 1.017 V BAT – 10.7
3. Open circuit voltage:
V AB = 1.017 V BAT – 6.3
4. Anti-sat (battery tracking) region:
R DC
V AB = 1.017 V BAT – 6.3 – IL --------120
a. VA–VB (VAB) Voltage vs. Loop Current (Typical)
SLIC Products
13
DC FEED CHARACTERISTICS (continued)
RDC1 + RDC2 = RDC = 18.52 kΩ
VBAT = 47.3 V
b. Loop Current vs. Load Resistance (Typical)
A
a
RL
RSN
IL
SLIC
RDC1
b
RDC2
B
RDC
Feed current programmed by RDC1 and RDC2
c. Feed Programming
Figure 1.
14
DC Feed Characteristics
Am7943 Data Sheet
CDC
TEST CIRCUITS
RL
2
RT
SLIC
RL
2
VTX
SLIC
AGND
VAB
VL
A(TIP)
VTX
A(TIP)
VAB
RT
AGND
RL
RRX
B(RING)
RRX
RSN
B(RING)
RSN
VRX
IL4-2 = –20 log (VAB / VRX)
IL2-4 = –20 log (VTX / VAB)
BRS = 20 log (VTX / VRX)
B. Four- to Two-Wire Insertion Loss and Balance Return Signal
A. Two- to Four-Wire Insertion Loss
ZD
1
-------<< RL
ωC
S1
A(TIP)
A(TIP) VTX
RL
2
VTX
SLIC
R
C
VL
RT
VAB
VM
VS
VL
SLIC
RT1
AGND
R
RL
2
ZIN
S2
RT2
RRX
RSN
B(RING)
VRX
B(RING)
RSN
RRX
S2 Open, S1 Closed
L-T Long. Bal. = 20 log (VAB / VL)
L-4 Long. Bal. = 20 log (VTX / VL)
Note:
ZD is the desired impedance (e.g., the characteristic
impedance of the line).
S2 Closed, S1 Open
4-L Long. Sig. Gen. = 20 log (VL / VRX)
C. Longitudinal Balance
CT1
RL = –20 log (2 VM / VS )
D. Two-Wire Return Loss Test Circuit
SLIC Products
15
TEST CIRCUITS (continued)
L1
200 Ω
RF1
50 Ω
C1
A(TIP)
CAX
33 nF
RF2
50 Ω
200 Ω
B(RING)
HF
GEN
L2
50 Ω
CBX
33 nF
C2
VTX
SLIC
under test
1.5 Vrms
80% Amplitude
Modulated
100 kHz to 30 MHz
E. RFI Test Circuit
VCC
6.2 kΩ
A(TIP)
A(TIP)
DET
15 pF
RL = 600 Ω
B(RING)
E1
F. Loop-Detector Switching
16
Am7943 Data Sheet
B(RING)
RG
RG: 2 kΩ at VBAT = –48 V
G. Ground-Key Switching
TEST CIRCUITS (continued)
+5 V
–5 V
VEE
VCC
DA
RD
DB
RD
2.2 nF
VTX
VTX
A(TIP)
A(TIP)
HPA
RT
CHP
RSN
HPB
B(RING)
B(RING)
2.2 nF
RRX
VRX
RDC1
RDC2
RDC
CDC
RINGOUT
AGND/
DGND
BGND
E1
C3
C2
C1
VBAT
BAT
D6
DET
TMG
RTMG
1700 Ω
CAS
BATTERY
GROUND
CCAS
ANALOG
GROUND
DIGITAL
GROUND
H. Am7943 Test Circuit
SLIC Products
17
PHYSICAL DIMENSION
PL032
.447
.453
.485
.495
.009
.015
.585
.595
.042
.056
.125
.140
Pin 1 I.D.
.080
.095
.547
.553
SEATING
PLANE
.400
REF.
.490
.530
.013
.021
.050 REF.
.026
.032
TOP VIEW
SIDE VIEW
16-038FPO-5
PL 032
DA79
6-28-94 ae
REVISION SUMMARY
Revision A to B
•
Minor changes were made to the data sheet style and format to conform to Legerity standards.
Revision B to Revision C
•
In Pin Description table, inserted/changed TP pin description to: “Thermal pin. Connection for heat dissipation.
Internally connected to substrate (VBAT). Leave as open circuit or connected to VBAT. In both cases, the TP
pins can connect to an area of copper on the board to enhance heat dissipation.”
•
Minor changes were made to the data sheet style and format to conform to Legerity standards.
Revision C to Revision D
•
The physical dimension (PL032) was added to the Physical Dimension section.
•
Deleted the Ceramic DIP and Plastic DIP packages and references to them.
•
Updated the Pin Description table to correct inconsistencies.
18
Am7943 Data Sheet
The contents of this document are provided in connection with Legerity, Inc. products. Legerity makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product
descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights
is granted by this publication. Except as set forth in Legerity's Standard Terms and Conditions of Sale, Legerity assumes no liability whatsoever,
and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness
for a particular purpose, or infringement of any intellectual property right.
Legerity's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the
body, or in other applications intended to support or sustain life, or in any other application in which the failure of Legerity's product could create
a situation where personal injury, death, or severe property or environmental damage may occur. Legerity reserves the right to discontinue or
make changes to its products at any time without notice.
© 1999 Legerity, Inc.
All rights reserved.
Trademarks
Legerity, the Legerity logo and combinations thereof, DSLAC and QSLAC are trademarks of Legerity, Inc.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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Telephone: (512) 228-5400
Fax: (512) 228-5510
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or to download or order product literature, visit
our website at www.legerity.com.
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or email:
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