AN5569 Application Note AN5569 Standard Waveforms Application Note AN5569-1.0 November 2002 SINGLE PHASE Circuit and output voltage waveform across a – b (+) a (+) a (+) a (-) b (-) b (-) b EPK EPK EPK ERMS ERMS EDC ERMS EDC EDC a a b Fig. 1: Half wave b a Fig. 2: Full wave centre tap Fig. 3: Full wave bridge Current Ratios Fundamental Ripple Frequency IAV / IDC Half Wave 1f Half Wave Centre Tap Full Wave Bridge b Voltage Ratios IRMS / IDCA IPK / IDCB IPK / IDCC ERMS / EDCD ERMS / EDCE EPK / EDCF R L R L R L 1.0 1.57 - 3.14 - 1.57 - 2.22 1.57 3.14 2f 0.5 0.785 0.707 1.57 1.0 0.785 0.707 1.11 2.22 1.57 3f 0.5 0.785 0.707 1.57 1.0 1.11 1.0 1.11 1.11 1.57 NOTES R = Resistive load. L = Inductive load. A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current. B = Ratio of peak device current to DC output current. C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current. D = Ratio of no load RMS line to line voltage to no load DC voltage. E = Ratio of RMS phase voltage to DC voltage. F = Ratio of peak phase voltage to DC voltage. 1/4 www.dynexsemi.com AN5569 Application Note THREE PHASE Circuit and output voltage waveform across a – b (-) b (+) a (-) b (-) b (+) a (+) a EPK EPK ERMS EPK EDC EDC EDC ERMS a b a Fig. 4: Half wave ERMS b a Fig. 5: Bridge Fig. 6: Double star Current Ratios Fundamental Ripple Frequency IAV / IDC Half Wave 3f Bridge Double Star b Voltage Ratios IRMS / IDCA IPK / IDCB IPK / IDCC ERMS / EDCD ERMS / EDCE EPK / EDCF R L R L R L 0.33 0.588 0.577 1.21 1.0 0.588 0.577 1.48 0.855 2.1 6f 0.33 0.588 0.577 1.05 1.0 0.816 0.816 0.74 0.427 1.05 6f 0.167 0.293 0.289 1.05 0.5 0.293 0.289 1.48 0.855 2.42 NOTES R = Resistive load. L = Inductive load. A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current. B = Ratio of peak device current to DC output current. C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current. D = Ratio of no load RMS line to line voltage to no load DC voltage. E = Ratio of RMS phase voltage to DC voltage. F = Ratio of peak phase voltage to DC voltage. 2/4 www.dynexsemi.com AN5569 Application Note SIX PHASE Circuit and output voltage waveform across a – b (-) b (+) a a (+) a (+) a (-) b (-) b EPK EPK EPK EDC ERMS EDC ERMS EDC ERMS b a Fig. 7: 5 star limb core b a Fig. 8: Series bridges Fig. 9: Star delta with IPT Current Ratios Fundamental Ripple Frequency IAV / IDC 5 Star Limb Core 6f Series Bridges Star Delta with IPT b Voltage Ratios IRMS / IDCA IPK / IDCB IPK / IDCC ERMS / EDCD ERMS / EDCE EPK / EDCF R L R L R L 0.167 0.408 0.408 1.05 0.5 0.408 0.408 1.48 - 2.1 12f 0.33 0.588 0.577 1.05 1.0 0.816 0.816 0.74 - 1.05 12f 0.167 0.293 0.289 0.525 0.5 0.408 0.408 1.48 - 2.42 NOTES R = Resistive load. L = Inductive load. A = Ratio of RMS current to DC output current. Arm fuses are rated for this RMS current. B = Ratio of peak device current to DC output current. C = Ratio of secondary RMS line current from supply to DC output current. Line fuses are rated for this RMS current. D = Ratio of no load RMS line to line voltage to no load DC voltage. E = Ratio of RMS phase voltage to DC voltage. F = Ratio of peak phase voltage to DC voltage. 3/4 www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. 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