ETC CSPRC032A

CSPRC032A
4 Channel EMI Filter Network
Features
Product Description
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The CSPRC032A is a 4-channel low pass EMI filter (RC-R configuration) in a Chip Scale Package (CSP).
Many portable applications require the attenuation of
signals in the 800-3000 MHz band. California Micro
Devices’ unique thin film technology provides a minimum of –25dB of attenuation over this frequency band.
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4 EMI filter lines per device
Filters attenuate to –30dB at 3GHz
CSP package minimizes cross-talk
9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
0.30mm Eutectic solder bumps
Ultra small foot print suitable for portable devices
Silicon substrate
Lead-free version available
Applications
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•
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EMI filtering for RF sections of wireless devices
Cellular phones
Cordless phones
Internet appliances
PDAs
Laptop computers
The bump size and pitch of these filters are selected
such that the device can be placed directly on a FR4
printed circuit board using conventional assembly techniques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/
Ag/Cu for lead-free finish) and are 0.30 mm in diameter.
The CSPRC032A is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing.
Electrical Schematic
A1
50Ω
50Ω
R
A2
50Ω
C R
43pF
GND
R
50Ω
B2
C R
43pF
B3
GND
GND
A4
B1
50Ω
50Ω
B4
C R
43pF
R
GND
A5
50Ω
50Ω
R
B5
C R
43pF
GND
© 2003 California Micro Devices Corp. All rights reserved.
10/14/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
1
CSPRC032A
PACKAGE / PINOUT DIAGRAMS
Orientation
Marking
(see note 2)
1
A
2
TOP VIEW
BOTTOM VIEW
(Bumps Down View)
(Bumps Up View)
3
4
5
032A
B
A5
A4
B5
B4
B3
A2
A1
B2
B1
CSPRC032A
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish 2
Standard Finish
Ordering Part
Ordering Part
Bumps
Package
Number1
Part Marking
Number1
Part Marking
9
CSP
CSPRC032A
032A
CSPRC032AG
032A
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
RATING
UNITS
-55 to +150
°C
25
mW
RATING
UNITS
-40 to +85
°C
Power Rating per Resistor
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
10/14/03
CSPRC032A
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
ILEAK
PARAMETER
CONDITIONS
Leakage Current, An or Bn to GND
VIN=6.0V
MIN
TYP
MAX
UNITS
1
µA
R
Resistance
45
50
55
Ω
C
Capacitance
34
43
52
pF
TOLR
Resistor Absolute Tolerance
R = 50Ω
+10
%
TOLC
Capacitor Absolute Tolerance
C=43pF
+20
%
TCR
Temperature Coefficient of
Resistance
+150
ppm/°C
TCC
Temperature Coefficient of
Capacitance
+500
ppm/°C
FC
Filter Cutoff Frequency
ZSOURCE=0Ω, ZLOAD=∞
ZSOURCE=50Ω, ZLOAD=50Ω
R=50Ω, C=43pF;
74
82
MHz
MHz
Note 1: Electrical Operating Characteristics are guaranteed over the Operating Temperature Range unless otherwise specified.
Filter Performance
CSPRC032 Filter Typical Measured Frequency Response (S21) Measurement
The measurement is done with 50Ω-source and 50Ω-load impedance using a HP8753C Network Analyzer with a
HP85047A S-parameter Test Set.
CH1 S21
1og MAG
5 dB/ REF 0 dB
1
Cor
2
H1d
dB
1: –5.8017 dB
1.000 000 MHz
2: –8.8028 dB
82.026 MHz
3: –37.303 dB
1.82 GHz
4: –32.903 dB
3GHZ
4
3
START
.300 000 MHz
STOP 3 000.000 000 MHz
Frequency
© 2003 California Micro Devices Corp. All rights reserved.
10/14/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
3
CSPRC032A
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
10/14/03
CSPRC032A
Mechanical Details
The CSPRC032A devices are packaged in custom
Chip Scale Packages (CSP).
CSPRC032A 9-bump CSP Mechanical Specifications
The CSPRC032A devices are packaged in a 9-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Mechanical Package Diagrams
BOTTOM VIEW
PACKAGE DIMENSIONS
Package
Inches
Nom
5
Min
Nom
Max
A1
0.940
0.985
1.030
0.0370 0.0388 0.0406
A2
2.440
2.485
2.530
0.0961 0.0978 0.0996
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
2
B2
0.495
0.500
0.505
0.0195 0.0197 0.0199
1
C1
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
C2
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
D1
0.562
0.606
0.650
0.0221 0.0239 0.0256
D2
0.356
0.381
0.406
0.0140 0.0150 0.0160
Max
4
A2
3
B
A
B
A
C2
# per tape
and reel
Min
B2
B1
9
Millimeters
SIDE
VIEW
C1
Custom CSP
Bumps
Dim
A1
D1
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
3500 pieces
DIMENSIONS IN MILLIMETERS
Controlling dimension: millimeters
Package Dimensions for
CSPRC032A 9-bump Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
PKG. SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
CSPRC032A
2.485 X 0.985 X 0.606
2.62 X 1.12 X 0.762
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL
P0
P1
8mm
178mm (7")
3500
4mm
4mm
Po
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P1
Center Lines
of Cavity
User Direction of Feed
Figure 4. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
10/14/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
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