ETC CX77107

DATA SHEET
CX77107: PA Module for CDMA / PCS (1850–1910 MHz)
The CX77107 Power Amplifier Module (PAM) is a fully matched 10-pin surface mount
module developed for Personal Communications Service (PCS) and Wireless Local Loop
(WLL) applications. This small and efficient Power Amplifier packs full 1850–1910 MHz
bandwidth coverage into a single compact package. The CX77107 meets the stringent
spectral linearity requirements of Code Division Multiple Access (CDMA) PCS transmission,
with high power added efficiency for power output of up to 28 dBm. A low current (VCONT)
pin is provided to improve efficiency for the low RF power range of operation.
APPLICATIONS
• Personal Communications Services
(PCS)
• Wireless local loop (WLL)
DISTINGUISHING FEATU
FEATURES
RES
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains
all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as
input and interstage matching circuits. The output match is realized off-chip within the
module package to optimize efficiency and power performance into a 50 W load. This
device is manufactured with Skyworks’ GaAs Heterojunction Bipolar Transistor (HBT)
process that provides for all positive voltage DC supply operation while maintaining high
efficiency and good linearity. Primary bias to the CX77107 is supplied directly from a threecell nickel cadmium, a single-cell lithium ion, or other suitable battery with an output in the
3 to 4 volt range. Power down is accomplished by setting the voltage on the low current
reference pin to zero volts. No external supply side switch is needed as typical “off” leakage
is a few microamperes with full primary voltage supplied from the battery.
• Low voltage positive bias supply
•
•
•
•
•
•
•
•
•
(3.2 V to 4.2 V)
Good linearity
High efficiency
Large dynamic range
10-pin package
4 mm x 4 mm x 1.5 mm
Power down control
Low power-state control
InGaP
IS95/CDMA2000
Full U.S. PCS coverage
VREF
(5)
VCC1
(1)
Driver
Stage Bias
RF IN (2)
Input
Match
VCONT
(4)
VCC2
(10)
Power
Stage Bias
DA
Inter
Stage
Match
PA
Output
Match
(8) RF OUT
MMIC
MODULE
(3, 6, 7, 9)
GND
(3, 6, 7, 9)
GND
101782_001
Figure 1. Functional Block Diagram
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JULY 3, 2003
Data Sheet • CX77107
PA Module for CDMA / PCS (1850–1910 MHz)
Electrical Specifications
The following tables list the electrical characteristics of the
CX77107 Power Amplifier. Table 1 lists the absolute maximum
ratings, while Table 2 shows the recommended operating
conditions to achieve the performance characteristics listed in
Table 4. Table 3 presents a truth table for the power ranges.
Table 1. Absolute Maximum Ratings (1)
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
RF Input Power
PIN
—
0.0
7.0
dBm
Supply Voltage
VCC
—
3.4
6.0
Volts
Reference Voltage
VREF
—
3.0
3.1
Volts
Case Operating Temperature
TC
–30
25
+110
°C
Storage Temperature
TSTG
–55
—
+125
°C
(1)
No damage assuming only one parameter is set at limit at a time with all other parameters set at or below nominal value.
Table 2. Recommended Operating Conditions
Conditions
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
Supply Voltage
VCC
3.2
3.4
4.2
Volts
Reference Voltage
VREF
2.95
3.0
3.05
Volts
VCONT
2.5
—
3.0
Volts
Low Mode
Control voltage
0.0
—
0.5
Volts
Operating Frequency
FO
1850.0
1880.0
1910.0
MHz
Case Operating Temperature
TC
–30
+25
+85
°C
High Mode
VCONT
Table 3. Power Range Truth Table
Power Mode
2
JULY 3, 2003
V REF
V CONT
Range
High Power
3.0 V
0.0 V–0.5 V
16 dBm–28 dBm
Low Power
3.0 V
2.5 V–3.0 V
≤ 16 dBm
Shut Down
0.0 V
0.0 V
—
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101782A
PA Module for CDMA / PCS (1850–1910 MHz)
Data Sheet • CX77107
Table
Table 4. Electrical Specifications for CDMA Nominal Operating Conditions (1)
Characteristics
Gain conditions
Symbol
Quiescent current
Typical
Max.
Unit
VCONT ≥ 2.5 V
PO = 16 dBm
22.0
24.0
26.5
GHIGH
VCONT ≤ 0.5 V
PO = 28 dBm
26.5
28.0
30.0
PAELOW
VCONT ≥ 2.5 V
PO = 16 dBm
7.5
9.0
—
PAEHIGH
VCONT ≤ 0.5 V
PO = 28 dBm
37.0
39.0
—
ICC_LOW
PO = 16 dBm
—
125
150
ICC_HIGH
PO = 28 dBm
—
475
500
IQ_LOW
VCONT ≥ 2.5 V
—
50
—
IQ_HIGH
VCONT ≤ 0.5 V
—
90
—
—
—
6.0
—
mA
Digital Mode
Total Supply current
Min.
GLOW
Digital Mode
Power Added Efficiency
Condition
dB
%
mA
mA
Reference Current
IREF
Control Current
ICTRL
VCONT = 2.5 V
—
140
—
mA
IPD
VCC = 3.4V
VREF = 0 V
—
3.0
5.0
mA
ACP1LOW
VCONT ≥ 2.5 V
PO ≤ 16 dBm
—
–48.0
–45.0
ACP1HIGH
VCONT ≤ 0.5 V
PO ≤ 28 dBm
—
–50.0
–48.0
ACP3LOW
VCONT ≥ 2.5 V
PO ≤ 16 dBm
—
–73.0
–58.0
ACP3HIGH
VCONT ≤ 0.5 V
PO ≤ 28 dBm
—
–58.5
–56.5
Second
FO2
PO ≤ 28 dBm
—
–40.0
–35.0
Third
FO3
PO ≤ 28 dBm
—
–55.0
–40.0
RxBN
PO ≤ 28 dBm
—
–138.0
–137.0
Total Supply current in Power-down Mode
1.25 MHz offset
Adjacent Channel Power
(2) (3)
2.25 MHz offset
Harmonic Suppression
Noise Power in RX Band 1930-1990 MHz
dBc
dBc
dBm/Hz
Noise Figure
NF
—
—
4.0
5.0
dB
Input Voltage Standing Wave Ratio (VSWR)
VSWR
—
—
—
2.0:1
—
Stability (Spurious output)
S
5:1 VSWR All phases
—
—
–70.0
dBc
Ru
PO ≤ 28 dBm
10:1
—
—
VSWR
Ruggedness – No damage
(4)
(1)
VCC = +3.4 V, VREF = +3.0 V, Freq = 1880 MHz, TC = 25 °C, unless otherwise specified
(2)
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(3)
CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, 0.5 dB
back-off in output power is required.
(4)
All phases, time = 10 seconds.
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JULY 3, 2003
Data Sheet • CX77107
PA Module for CDMA / PCS (1850–1910 MHz)
Table 5. Electrical Specifications for CDMA Recommended Operating Conditions (1)
Characteristics
Symbol
Condition
Minimum
Maximum
Unit
GLOW
VCONT ≥ 2.5 V
PO = 16 dBm
21.0
29.5
GHIGH
VCONT ≤ 0.5 V
PO = 28 dBm
24.5
33.0
ACP1LOW
VCONT ≥ 2.5 V
PO ≤ 16 dBm
—
–44
ACP1HIGH
VCONT ≤ 0.5 V
PO ≤ 28 dBm
—
–44
ACP3LOW
VCONT ≥ 2.5 V
PO ≤ 16 dBm
—
–56
ACP3HIGH
VCONT ≤ 0.5 V
PO ≤ 28 dBm
—
–56
Second
FO2
PO ≤ 28 dBm
—
–30
Third
FO3
PO ≤ 28 dBm
—
–40
Noise Power in RX Band 1840-1895 MHz
RxBN
PO ≤ 28 dBm
—
–136.0
dBm/Hz
Noise Figure
NF
—
—
7.0
dB
Input Voltage Standing Wave Ratio (VSWR)
VSWR
—
—
2.5:1
—
Stability (Spurious output)
S
5:1 VSWR
All phases
—
–70.0
dBc
Ruggedness – No damage (5)
Ru
PO ≤ 28 dBm
10:1
—
VSWR
Gain conditions
Digital Mode
1.25 MHz offset
Adjacent Channel Power (2) (3) (4)
2.25 MHz offset
Harmonic Suppression
dB
dBc
dBc
(1)
Per Table 2, unless otherwise specified.
(2)
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(3)
CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, 0.5 dB
back-off in output power is required.
(4)
Worst case ACPR is –43dBc at +85 °C, VCC = 3.2 V.
(5)
All phases, time = 10 seconds.
4
JULY 3, 2003
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101782A
PA Module for CDMA / PCS (1850–1910 MHz)
Data Sheet • CX77107
Characterization Data
The graphs from Figure 2 through Figure 10 illustrate the
characteristics of a typical CX77107 power amplifier designed for
operation in the PCS frequency band (1850–1910 MHz). This
amplifier was selected by characterizing a group of devices and
choosing a part with average electrical performance for both
nominal and the full range of recommended operating conditions,
including worst case limits.
31
VREF = 3.0 V
The graphs illustrate the digital signal characteristics of the
CX77107. Shown are power sweep characteristics for key
performance parameters over temperature and frequency, up to
28.5 dBm output power. The data was taken up to and including
16 dBm output power with the bias mode control pin setting of
VCONT = 2.5 volts. Beyond 16 dBm output power, the VCONT was set
to 0 volts.
VCC = 3.4 V
–30 ˚C
30
29
Gain (dB)
28
+25 ˚C
27
26
+85 ˚C
25
24
23
VCONT > 2.5 V
22
VCONT < 0.5 V
21
0
5
10
15
20
Output Power (dBm)
25
30
28.5 dBm
101782_010
Figure 2. Digital Mode Gain vs. Output Power
Legend
1850 @ –30 ˚C
1880 @ –30 ˚C
1910 @ –30 ˚C
1850 @ +25 ˚C
1880 @ +25 ˚C
1910 @ +25 ˚C
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1850 @ +85 ˚C
1880 @ +85 ˚C
1910 @ +85 ˚C
5
JULY 3, 2003
Data Sheet • CX77107
PA Module for CDMA / PCS (1850–1910 MHz)
VREF = 3.0 V
VCC = 3.4 V
600
500
ICC (mA)
400
VCONT > 2.5 V
300
VCONT < 0.5 V
200
100
0
0
5
10
15
20
25
Output Power (dBm)
30
28.5 dBm
101782_011
Figure 3. Primary Bias Current vs. Output Power
VREF = 3.0 V
VCC = 3.4 V
45
Power Added Efficiency (%)
40
35
30
25
VCONT > 2.5 V
VCONT < 0.5 V
20
15
10
5
0
0
5
10
15
20
Output Power (dBm)
25
30
28.5 dBm
101782_012
Figure 4. Power Added Efficiency vs. Output Power
Legend
6
JULY 3, 2003
1850 @ –30 ˚C
1880 @ –30 ˚C
1910 @ –30 ˚C
1850 @ +25 ˚C
1880 @ +25 ˚C
1910 @ +25 ˚C
1850 @ +85 ˚C
1880 @ +85 ˚C
1910 @ +85 ˚C
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101782A
PA Module for CDMA / PCS (1850–1910 MHz)
VREF = 3.0 V
Data Sheet • CX77107
VCC = 3.4 V
80
Adjacent Channel Power Ratio (–dBc)
75
70
65
VCONT > 2.5 V
60
+85
VCONT < 0.5 V
˚C
55
–30
˚C
50
+25
˚C
45
40
0
5
10
15
Output Power (dBm)
20
25
30
28.5 dBm
101782_013
Figure 5. ACP for 1.25 MHz Offset vs. Output Power
VREF = 3.0 V
VCC = 3.4 V
Adjacent Channel Power Ratio (–dBc)
90
85
80
75
70
65
VCONT > 2.5 V
VCONT < 0.5 V
60
55
50
0
5
10
15
20
Output Power (dBm)
25
30
28.5 dBm
101782_015
Figure 6. ACP for 2.25 MHz Offset vs. Output Power
Legend
1850 @ –30 ˚C
1880 @ –30 ˚C
1910 @ –30 ˚C
1850 @ +25 ˚C
1880 @ +25 ˚C
1910 @ +25 ˚C
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1850 @ +85 ˚C
1880 @ +85 ˚C
1910 @ +85 ˚C
7
JULY 3, 2003
Data Sheet • CX77107
2nd Harmonic Rejection (–dBc)
60
PA Module for CDMA / PCS (1850–1910 MHz)
VREF = 3.0 V
VCC = 3.4 V
55
50
45
VCONT > 2.5 V
VCONT < 0.5 V
40
35
30
0
5
10
15
20
25
Output Power (dBm)
30
28.5 dBm
101782_016
Figure 7. Second Harmonic Rejection vs. Output Power
3rd Harmonic Rejection (–dBc)
70
VREF = 3.0 V
VCC = 3.4 V
65
60
VCONT > 2.5 V
VCONT < 0.5 V
55
50
0
5
10
15
20
Output Power (dBm)
25
30
28.5 dBm
101782_017
Figure 8. Third Harmonic Rejection vs. Output Power
Legend
8
JULY 3, 2003
1850 @ –30 ˚C
1880 @ –30 ˚C
1910 @ –30 ˚C
1850 @ +25 ˚C
1880 @ +25 ˚C
1910 @ +25 ˚C
1850 @ +85 ˚C
1880 @ +85 ˚C
1910 @ +85 ˚C
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101782A
PA Module for CDMA / PCS (1850–1910 MHz)
Data Sheet • CX77107
6
1850
COLD
1880
1910
HOT
ROOM TEMPERATURE
Noise Figure (dB)
5
4
3
2
1
0
3.2 V
3.4 V
4.2 V
3.2 V
3.4 V
4.2 V
3.2 V
3.4 V
4.2 V
–30 ˚C
–30 ˚C
–30 ˚C
+25 ˚C
+25 ˚C
+25 ˚C
+85 ˚C
+85 ˚C
+85 ˚C
Collector Voltage / Case Temperature
101782_018
Figure 9. Noise Figure as Function of Operating Conditions
2.0
1850
1.9
COLD
1880
1910
ROOM TEMPERATURE
HOT
1.8
1.7
VSWR
1.6
1.5
1.4
1.3
1.2
1.1
1.0
3.2 V
3.4 V
4.2 V
3.2 V
–30 ˚C
–30 ˚C
–30 ˚C
+25 ˚C
3.4 V
+25 ˚C
4.2 V
+25 ˚C
3.2 V
+85 ˚C
3.4 V
+85 ˚C
4.2 V
+85 ˚C
Collector Voltage / Case Temperature
101782_019
Figure 10.
10. Input VSWR as Function of Operating Conditions
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Data Sheet • CX77107
PA Module for CDMA / PCS (1850–1910 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
CX77107, the evaluation board schematic and diagrams are
VCC1
1
included for preliminary analysis and design. Figure 11 is the
basic schematic of the board for the 1850 MHz to 1910 MHz
range and Figure 12 is a diagram of the board assembly.
VCC1
VCC2
A C7
C4 A
330pF
330pF
RFIN
VCC2
10
2
RFIN
GND
C5
1000 pF
C6
10 µF
9
RFOUT
3
VCONT
GND
4
5
RFOUT
VCONT
GND
VREF
GND
8
7
6
C9
1000 pF
VREF
A
Place caps at closest proximity to PA module with the capacitor grounds directly connected to the PAM grounds.
101782_002
Figure 11.
11. Evaluation Board Schematic
P1
RF IN
PCS 4X4
J1
II
C7
GND
VCC1
VCONT
GND
U1
GND
J2
C6
VCC2
C5
C9
VREF
GND
C4
EN14-D1225-002
12/11/01
RF OUT
P2
101782_004
Figure 12.
12. Evaluation Board Assembly Diagram
10
JULY 3, 2003
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101782A
PA Module for CDMA / PCS (1850–1910 MHz)
Data Sheet • CX77107
Package Dimensions and Pin Descriptions
The CX77107 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount
solder attachment to a printed circuit board. Figure 13 is a
mechanical drawing of the pad layout for this package and Figure
14 illustrates typical case markings. The pin numbering
convention, as shown in Figure 15, starts with pin 1 in the upper
left and increments counter-clockwise around the package. Table
6 lists each pin function and description.
PIN 1 INDICATOR
4
(0.465)
B
C
MOLD
MCM SUBSTRATE
2x 0.575
4
0.1
METAL PAD EDGES
0.05 A B C
0.1
2x 0.4
A
SOLDER MASK EDGES
0.1 A B C
DETAIL
1.5 ±0.1
A
0.025
PAD
SCALE: 2x
1x THIS ROTATION
1x ROTATED 90˚ CW
1x ROTATED 90˚ CCW
1x ROTATED 180˚
0.1
0.08
A
A
B
C
TOP VIEW
SIDE VIEW
o 0.3)
(/
SOLDER MASK OPENING
(1.225)
2x 0.4
o 0.15)
(/
METAL PAD – PIN 1
2x 0.925
METAL PAD EDGES
0.55
0.05 A B C
4x 0.85
4x 1.7
0.1
(1.275)
0.575
SOLDER MASK EDGES
B
0.1 A B C
DETAIL
B
2x 1.825
PAD
SCALE: 2x
3x THIS ROTATION
3x ROTATED 180˚
A
1.
2.
3.
4.
SOLDER MASK OPENING
4x R0.2
NOTES: unless otherwise specified
0.15
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING IN ACCORDANCE WITH ASME Y14.5M–1994.
SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT.
PADS ARE METAL DEFINED; THE CENTER PAD IS SOLDER MASK DEFINED.
A
B
C
BOTTOM VIEW
101782_003
Figure
Figure 13.
13. CX77107 Package Drawing
Mark Pin 1
Identifier
Lot Number
Year of Manufacture
Manufacturing Part Number
CX77107-NN
EXXXXX.XX
YYWW MEX
Revision Number
Country Code
Week Package Sealed
101782_006
Figure 14 Typical Case Markings (Top View)
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Data Sheet • CX77107
PA Module for CDMA / PCS (1850–1910 MHz)
Table 6. Pin Names and Descriptions
PIN Number
Function
Description
1 (1)
VCC1
Connect to battery or DC supply
2
RF IN
RF Input
3
GND
Ground
4
VCONT
Control voltage
5
VREF
Reference voltage
6
GND
Ground
7
GND
Ground
8
RF OUT
RF Output
GND
Ground
9
10
(1)
GND PAD (2)
VCC2
Connect to battery or DC supply
GND
Ground pad on underside of package
(1)
All supply pins may be connected together at the supply.
(2)
Package underside is GND PAD.
1
10
2
9
3
8
4
7
Solder mask pattern
pad layout as seen
from top looking
through package
GROUND PAD
5
6
101782_005
Figure 15.
in Configuration
15. PPin
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77107 is capable of withstanding an MSL 3/240 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature
12
JULY 3, 2003
should not exceed 240 °C. If the part is manually attached,
precaution should be taken to insure that the part is not
subjected to temperatures exceeding 240 °C for more than 10
seconds. For details on both attachment techniques, precautions,
and handling procedures recommended by Skyworks, please
refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752. Additional
information on standard SMT reflow profiles can also be found in
the JEDEC Standard J–STD–020B.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Application
Note: Tape and Reel, Document Number 101568.
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101782A
PA Module for CDMA / PCS (1850–1910 MHz)
Data Sheet • CX77107
Electrostatic Discharge Sensitivity
The CX77107 is a Class I device. lists the Electrostatic Discharge
(ESD) immunity level for each pin of the CX77107 product. The
numbers in specify the ESD threshold level for each pin where
the I-V curve between the pin and ground starts to show
degradation.
damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
The ESD testing was performed in compliance with MIL-STD883E Method 3015.7 using the Human Body Model. If ESD
> + 2000 V
VCC1
< – 2000 V
1
10
VCC2
> + 2000 V
RF IN
< – 2000 V
2
9
GND
GND
3
8
RF OUT
> + 2000 V
VCONT
< – 2000 V
4
7
GND
> + 2000 V
VREF
< – 2000 V
5
6
GND
> + 2000 V
< – 2000 V
> + 2000 V
< – 2000 V
GROUND PAD
101782_007
Figure 16.
16. ESD Sensitivity Areas (Top View)
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely nonfunctional”. Skyworks employs most stringent criteria; fails
devices as soon as the pin begins to show any degradation on a
curve tracer. To avoid ESD damage, both latent and visible, it is
very important that the product assembly and test areas follow
the Class-1 ESD handling precautions listed in Table 7.
Table 7. Precautions for Handling GaAs ICIC-based Products to Avoid Induced Damage
Personnel Grounding
Wrist Straps
Conductive Smocks, Gloves and Finger Cots
Antistatic ID Badges
Protective Workstation
Dissipative Table Tops
Protective Test Equipment (Properly Grounded)
Grounded Tip Soldering Irons
Conductive Solder Suckers
Static Sensors
Facility
Relative Humidity Control and Air Ionizers
Dissipative Floors (less than 109 Ω to GND)
Protective Packaging & Transportation
Bags and Pouches (Faraday Shield)
Protective Tote Boxes (Conductive Static Shielding)
Protective Trays
Grounded Carts
Protective Work Order Holders
Skyworks Solutions, Inc., Proprietary Information
101782A
781] 376-7000 • FAX [781] 376-3100 • SALES@SKYWORKSINC.COM • WWW.SKYWORKSINC.COM
13
JULY 3, 2003
Ordering Information
Model Number
Manufacturing Part
Number
CX77107
CX77107
Package
Operating
Temperature
4x4LM–10
–30 °C to +85 °C
Product Revision
Revision History
Revision
Level
A
Date
Description
July 3, 2003
Initial Release
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Application Note: Tape and Reel, Document Number 101568
Standard SMT Reflow Profiles: JEDEC Standard J–STD–020B.
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Skyworks Solutions, Inc.
20 Sylvan Rd.
Woburn, MA 01801
www.skyworksinc.com