ETC HM51W16160LTT-6

HM51W16160 Series
HM51W18160 Series
16 M FP DRAM (1-Mword × 16-bit)
4 k Refresh/1 k Refresh
ADE-203-635E (Z)
Rev. 5.0
Nov. 1997
Description
The Hitachi HM51W16160 Series, HM51W18160 Series are CMOS dynamic RAMs organized as
1,048,576-word × 16-bit. They employ the most advanced CMOS technology for high performance and
low power. The HM51W16160 Series, HM51W18160 Series offer Fast Page Mode as a high speed access
mode. They have package variations of 42-pin plastic SOJ and 50-pin plastic TSOP II
Features
• Single 3.3 V (±0.3 V)
• Access time: 60 ns/70 ns (max)
• Power dissipation
 Active mode
: 360 mW/324 mW (max) (HM51W16160 Series)
:612 mW/540 mW (max) (HM51W18160 Series)
 Standby mode : 7.2 mW (max)
: 0.54 mW (max) (L-version)
• Fast page mode capability
• Refresh cycles
 4096 refresh cycles : 64 ms (HM51W16160 Series)
: 128 ms (L-version)
 1024 refresh cycles : 6 ms (HM51W18160 Series)
: 28 ms (L-version)
• 4 variations of refresh
 RAS-only refresh
 CAS-before-RAS refresh
 Hidden refresh
 Self refresh (L-version)
• 2 CAS-byte control
• Battery backup operation (L-version)
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HM51W16160 Series, HM51W18160 Series
Ordering Information
Type No.
Access time
Package
HM51W16160J-6
HM51W16160J-7
60 ns
70 ns
400-mil 42-pin plastic SOJ (CP-42D)
HM51W16160LJ-6
HM51W16160LJ-7
60 ns
70 ns
HM51W18160J-6
HM51W18160J-7
60 ns
70 ns
HM51W18160LJ-6
HM51W18160LJ-7
60 ns
70 ns
HM51W16160TT-6
HM51W16160TT-7
60 ns
70 ns
HM51W16160LTT-6
HM51W16160LTT-7
60 ns
70 ns
HM51W18160TT-6
HM51W18160TT-7
60 ns
70 ns
HM51W18160LTT-6
HM51W18160LTT-7
60 ns
70 ns
2
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400-mil 50-pin plastic TSOP II (TTP-50/44DC)
HM51W16160 Series, HM51W18160 Series
Pin Arrangement
HM51W16160TT/LTT Series
HM51W16160J/LJ Series
VCC
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
NC
NC
WE
RAS
A11
A10
A0
A1
A2
A3
VCC
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
VSS
I/O15
I/O14
I/O13
I/O12
VSS
I/O11
I/O10
I/O9
I/O8
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
VSS
VCC
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
NC
1
2
3
4
5
6
7
8
9
10
11
50
49
48
47
46
45
44
43
42
41
40
VSS
I/O15
I/O14
I/O13
I/O12
VSS
I/O11
I/O10
I/O9
I/O8
NC
NC
NC
WE
RAS
A11
A10
A0
A1
A2
A3
VCC
15
16
17
18
19
20
21
22
23
24
25
36
35
34
33
32
31
30
29
28
27
26
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
VSS
(Top view)
(Top view)
Pin Description
Pin name
Function
A0 to A11
Address input
•
Row/Refresh address
A0 to A11
•
Column address
A0 to A7
I/O0 to I/O15
Data input/Data output
RAS
Row address strobe
UCAS, LCAS
Column address strobe
WE
Read/Write enable
OE
Output enable
VCC
Power supply
VSS
Ground
NC
No connection
3
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HM51W16160 Series, HM51W18160 Series
Pin Arrangement
HM51W18160TT/LTT Series
HM51W18160J/LJ Series
VCC
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
VCC
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
VSS
I/O15
I/O14
I/O13
I/O12
VSS
I/O11
I/O10
I/O9
I/O8
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
V
SS
(Top view)
Function
A0 to A9
Address input
•
Row/Refresh address
A0 to A9
•
Column address
A0 to A9
I/O0 to I/O15
Data input/Data output
RAS
Row address strobe
UCAS, LCAS
Column address strobe
WE
Read/Write enable
OE
Output enable
VCC
Power supply
VSS
Ground
NC
No connection
4
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1
2
3
4
5
6
7
8
9
10
11
50
49
48
47
46
45
44
43
42
41
40
VSS
I/O15
I/O14
I/O13
I/O12
VSS
I/O11
I/O10
I/O9
I/O8
NC
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
VCC
15
16
17
18
19
20
21
22
23
24
25
36
35
34
33
32
31
30
29
28
27
26
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
VSS
(Top view)
Pin Description
Pin name
VCC
I/O0
I/O1
I/O2
I/O3
VCC
I/O4
I/O5
I/O6
I/O7
NC
HM51W16160 Series, HM51W18160 Series
Block Diagram (HM51W16160 Series)
RAS
UCAS LCAS
WE
OE
Timing and control
A0
Column decoder
A1
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
Column
•
•
•
to
address
buffers
Row decoder
A7
•
•
•
Row
address
A8
A9
buffers
A10
A11
I/O buffers
I/O0
to
I/O15
Block Diagram (HM51W18160 Series)
RAS
UCAS LCAS
WE
OE
Timing and control
A0
Column decoder
A1
to
Column
•
•
•
address
buffers
•
•
•
Row
address
buffers
Row decoder
A9
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
1M array
I/O buffers
I/O0
to
I/O15
5
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HM51W16160 Series, HM51W18160 Series
Truth Table
RAS
LCAS
UCAS
WE
OE
Output
Operation
H
D
D
D
D
Open
Standby
L
L
H
H
L
Valid
Lower byte Read cycle
L
H
L
H
L
Valid
Upper byte
L
L
L
H
L
L
L
L
L
L
H
L
L
H
H
L
L
H
L
L
Valid
Word
L*
2
D
Open
Lower byte Early write cycle
L*
2
D
Open
Upper byte
L*
2
D
Open
Word
L*
2
H
Undefined
Lower byte Delayed write cycle
L*
2
H
Undefined
Upper byte
2
H
Undefined
Word
L
L
L
L*
L
L
H
H to L
L to H
Valid
Lower byte Read-modify-write cycle
L
H
L
H to L
L to H
Valid
Upper byte
L
L
L
H to L
L to H
Valid
Word
L
H
H
D
D
Open
Word
RAS-only refresh cycle
H to L
H
L
D
D
Open
Word
CAS-before-RAS refresh cycle or
H to L
L
H
D
D
Open
Word
Self refresh cycle (L-version)
H to L
L
L
D
D
Open
Word
L
L
L
H
H
Open
Read cycle (Output disabled)
Notes: 1. H: High (inactive) L: Low (active) D: H or L
2. t WCS ≥ 0 ns Early write cycle
t WCS < 0 ns Delayed write cycle
3. Mode is determined by the OR function of the UCAS and LCAS. (Mode is set by the earliest of
UCAS and LCAS active edge and reset by the latest of UCAS and LCAS inactive edge.)
However write OPERATION and output High-Z control are done independently by each UCAS,
LCAS.
ex. if RAS = H to L, UCAS = H, LCAS = L, then CAS-before-RAS refresh cycle is selected.
6
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HM51W16160 Series, HM51W18160 Series
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to V SS
VT
–0.5 to VCC + 0.5 (≤ +4.6 V (max))
V
Supply voltage relative to VSS
VCC
–0.5 to +4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
Recommended DC Operating Conditions (Ta = 0 to +70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Notes
Supply voltage
VCC
3.0
3.3
3.6
V
1, 2
Input high voltage
VIH
2.0
—
VCC + 0.3
V
1
Input low voltage
VIL
–0.3
—
0.8
V
1
Notes: 1. All voltage referred to VSS
2. The supply voltage with all VCC pins must be on the same level. The supply voltage with all VSS
pins must be on the same level.
7
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HM51W16160 Series, HM51W18160 Series
DC Characteristics
(Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM51W16160 Series)
HM51W16160
-6
Parameter
-7
Symbol
Min
Max
Min
Max
Unit
Test conditions
I CC1
—
100
—
90
mA
t RC = min
I CC2
—
2
—
2
mA
TTL interface
RAS, UCAS, LCAS = VIH
Dout = High-Z
—
1
—
1
mA
CMOS interface
RAS, UCAS,
LCAS ≥ VCC – 0.2 V
Dout = High-Z
I CC2
—
150
—
150
µA
CMOS interface
RAS, UCAS,
LCAS ≥ VCC – 0.2 V
Dout = High-Z
I CC3
—
100
—
90
mA
t RC = min
I CC5
—
5
—
5
mA
RAS = VIH
UCAS, LCAS = VIL
Dout = enable
I CC6
—
100
—
90
mA
t RC = min
I CC7
—
95
—
85
mA
t PC = min
Battery backup current*
(Standby with CBR refresh) (Lversion)
I CC10
—
400
—
400
µA
CMOS interface
Dout = High-Z
CBR refresh: tRC = 31.3 µs
t RAS ≤ 0.3 µs
Self refresh mode current
(L-version)
I CC11
—
250
—
250
µA
CMOS interface
RAS, UCAS, LCAS ≤ 0.2 V
Dout = High-Z
Input leakage current
I LI
–10
10
–10
10
µA
0 V ≤ Vin ≤ 4.6 V
Output leakage current
I LO
–10
10
–10
10
µA
0 V ≤ Vout ≤ 4.6 V
Dout = disable
Output high voltage
VOH
2.4
VCC
2.4
VCC
V
High Iout = –2 mA
Output low voltage
VOL
0
0.4
0
0.4
V
Low Iout = 2 mA
1,
Operating current* *
2
Standby current
Standby current
(L-version)
RAS-only refresh current*2
1
Standby current*
CAS-before-RAS refresh current
1,
Fast page mode current* *
4
3
Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while RAS = VIL.
3. Address can be changed once or less while UCAS and LCAS = VIH.
4. VIH ≥ VCC – 0.2 V, 0 V ≤ VIL ≤ 0.2 V.
DC Characteristics
(Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM51W18160 Series)
8
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HM51W16160 Series, HM51W18160 Series
HM51W18160
-6
Parameter
-7
Symbol
Min
Max
Min
Max
Unit
Test conditions
I CC1
—
170
—
150
mA
t RC = min
I CC2
—
2
—
2
mA
TTL interface
RAS, UCAS, LCAS = VIH
Dout = High-Z
—
1
—
1
mA
CMOS interface
RAS, UCAS,
LCAS ≥ VCC – 0.2 V
Dout = High-Z
I CC2
—
150
—
150
µA
CMOS interface
RAS, UCAS,
LCAS ≥ VCC – 0.2 V
Dout = High-Z
I CC3
—
170
—
150
mA
t RC = min
I CC5
—
5
—
5
mA
RAS = VIH
UCAS, LCAS = VIL
Dout = enable
I CC6
—
170
—
150
mA
t RC = min
I CC7
—
165
—
145
mA
t PC = min
Battery backup current*
(Standby with CBR refresh) (Lversion)
I CC10
—
400
—
400
µA
CMOS interface
Dout = High-Z
CBR refresh: tRC = 125 µs
t RAS ≤ 0.3 µs
Self refresh mode current
(L-version)
I CC11
—
250
—
250
µA
CMOS interface
RAS, UCAS, LCAS ≤ 0.2 V
Dout = High-Z
Input leakage current
I LI
–10
10
–10
10
µA
0 V ≤ Vin ≤ 4.6 V
Output leakage current
I LO
–10
10
–10
10
µA
0 V ≤ Vout ≤ 4.6 V
Dout = disable
Output high voltage
VOH
2.4
VCC
2.4
VCC
V
High Iout = –2 mA
Output low voltage
VOL
0
0.4
0
0.4
V
Low Iout = 2 mA
1,
Operating current* *
2
Standby current
Standby current
(L-version)
RAS-only refresh current*2
1
Standby current*
CAS-before-RAS refresh current
1,
Fast page mode current* *
4
3
Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while RAS = VIL.
3. Address can be changed once or less while UCAS and LCAS = VIH.
4. VIH ≥ VCC – 0.2 V, 0 V ≤ VIL ≤ 0.2 V.
9
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HM51W16160 Series, HM51W18160 Series
Capacitance (Ta = 25°C, VCC = 3.3 V ± 0.3 V)
Parameter
Symbol
Typ
Max
Unit
Notes
Input capacitance (Address)
CI1
—
5
pF
1
Input capacitance (Clocks)
CI2
—
7
pF
1
Output capacitance (Data-in, Data-out)
CI/O
—
7
pF
1, 2
Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. UCAS and LCAS = VIH to disable Dout.
10
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HM51W16160 Series, HM51W18160 Series
AC Characteristics (Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) *1, *2, *18, *19, *20
Test Conditions
•
•
•
•
Input rise and fall time: 5 ns
Input timing reference levels: 0.8 V, 2.0 V
Output timing reference levels: 0.8 V, 2.0 V
Output load: 1 TTL gate + C L (100 pF) (Including scope and jig)
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)
HM51W16160/HM51W18160
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Random read or write cycle time
t RC
110
—
130
—
ns
RAS precharge time
t RP
40
—
50
—
ns
CAS precharge time
t CP
10
—
10
—
ns
RAS pulse width
t RAS
60
10000
70
10000
ns
CAS pulse width
t CAS
15
10000
18
10000
ns
Row address setup time
t ASR
0
—
0
—
ns
Row address hold time
t RAH
10
—
10
—
ns
Column address setup time
t ASC
0
—
0
—
ns
21
Column address hold time
t CAH
10
—
15
—
ns
21
RAS to CAS delay time
t RCD
20
45
20
52
ns
3
RAS to column address delay time
t RAD
15
30
15
35
ns
4
RAS hold time
t RSH
15
—
18
—
ns
CAS hold time
t CSH
60
—
70
—
ns
CAS to RAS precharge time
t CRP
5
—
5
—
ns
22
OE to Din delay time
t OED
15
—
18
—
ns
5
OE delay time from Din
t DZO
0
—
0
—
ns
6
CAS delay time from Din
t DZC
0
—
0
—
ns
6
Transition time (rise and fall)
tT
3
50
3
50
ns
7
11
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HM51W16160 Series, HM51W18160 Series
Read Cycle
HM51W16160/HM51W18160
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Access time from RAS
t RAC
—
60
—
70
ns
8, 9
Access time from CAS
t CAC
—
15
—
18
ns
9, 10, 17,
Access time from address
t AA
—
30
—
35
ns
9, 11, 17,
Access time from OE
t OEA
—
15
—
18
ns
9, 25
Read command setup time
t RCS
0
—
0
—
ns
Read command hold time to CAS
t RCH
0
—
0
—
ns
12, 22
Read command hold time to RAS
t RRH
0
—
0
—
ns
12
Column address to RAS lead time
t RAL
30
—
35
—
ns
Column address to CAS lead time
t CAL
30
—
35
—
ns
CAS to output in low-Z
t CLZ
0
—
0
—
ns
Output data hold time
t OH
3
—
3
—
ns
Output data hold time from OE
t OHO
3
—
3
—
ns
Output buffer turn-off time
t OFF
—
15
—
15
ns
13
Output buffer turn-off to OE
t OEZ
—
15
—
15
ns
13
CAS to Din delay time
t CDD
15
—
18
—
ns
5
Write Cycle
HM51W16160/HM51W18160
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Write command setup time
t WCS
0
—
0
—
ns
14, 21
Write command hold time
t WCH
10
—
15
—
ns
21
Write command pulse width
t WP
10
—
10
—
ns
Write command to RAS lead time
t RWL
15
—
18
—
ns
Write command to CAS lead time
t CWL
15
—
18
—
ns
23
Data-in setup time
t DS
0
—
0
—
ns
15, 23
Data-in hold time
t DH
10
—
15
—
ns
15, 23
12
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HM51W16160 Series, HM51W18160 Series
Read-Modify-Write Cycle
HM51W16160/HM51W18160
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Read-modify-write cycle time
t RWC
155
—
181
—
ns
RAS to WE delay time
t RWD
85
—
98
—
ns
14
CAS to WE delay time
t CWD
40
—
46
—
ns
14
Column address to WE delay time
t AWD
55
—
63
—
ns
14
OE hold time from WE
t OEH
15
—
18
—
ns
Refresh Cycle
HM51W16160/HM51W18160
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
CAS setup time (CBR refresh cycle)
t CSR
5
—
5
—
ns
21
CAS hold time (CBR refresh cycle)
t CHR
10
—
10
—
ns
22
RAS precharge to CAS hold time
t RPC
5
—
5
—
ns
21
Notes
Fast Page Mode Cycle
HM51W16160/HM51W18160
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Fast page mode cycle time
t PC
40
—
45
—
ns
Fast page mode RAS pulse width
t RASP
—
100000 —
100000 ns
16
Access time from CAS precharge
t CPA
—
35
—
40
ns
9, 17, 22
RAS hold time from CAS precharge
t CPRH
35
—
40
—
ns
13
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HM51W16160 Series, HM51W18160 Series
Fast Page Mode Read-Modify-Write Cycle
HM51W16160/HM51W18160
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Fast page mode read-modify-write cycle
time
t PRWC
85
—
96
—
ns
WE delay time from CAS precharge
t CPW
60
—
68
—
ns
Notes
14, 22
Refresh (HM51W16160 Series)
Parameter
Symbol
Max
Unit
Note
Refresh period
t REF
64
ms
4096 cycles
Refresh period (L-version)
t REF
128
ms
4096 cycles
Parameter
Symbol
Max
Unit
Note
Refresh period
t REF
16
ms
1024 cycles
Refresh period (L-version)
t REF
128
ms
1024 cycles
Refresh (HM51W18160 Series)
14
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HM51W16160 Series, HM51W18160 Series
Self Refresh Mode (L-version)
HM51W16160L/HM51W18160L
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
RAS pulse width (self refresh)
t RASS
100
—
100
—
µs
26, 27, 28,
29
RAS precharge time (self refresh)
t RPS
110
—
130
—
ns
CAS hold time (self refresh)
t CHS
–50
—
–50
—
ns
Notes: 1. AC measurements assume t T = 5 ns.
2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization
cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). If
the internal refresh counter is used, a minimum of eight CAS-before-RAS refresh cycles are
required.
3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a
reference point only; if t RCD is greater than the specified tRCD (max) limit, then access time is
controlled exclusively by tCAC .
4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a
reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is
controlled exclusively by tAA .
5. Either t OED or tCDD must be satisfied.
6. Either t DZO or tDZC must be satisfied.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition
times are measured between V IH (min) and VIL (max).
8. Assumes that tRCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum
recommended value shown in this table, t RAC exceeds the value shown.
9. Measured with a load circuit equivalent to 1 TTL loads and 100 pF. (VOH = 2.0 V, VOL = 0.8 V)
10. Assumes that t RCD ≥ tRCD (max) and tRCD + tCAC (max) ≥ tRAD + tAA (max).
11. Assumes that t RAD ≥ tRAD (max) and tRCD + tCAC (max) ≤ tRAD + tAA (max).
12. Either t RCH or tRRH must be satisfied for a read cycles.
13. t OFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition
and are not referred to output voltage levels.
14. t WCS , t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the
data sheet as electrical characteristics only; if t WCS ≥ tWCS (min), the cycle is an early write cycle
and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD
≥ tRWD (min), tCWD ≥ tCWD (min), and tAWD ≥ tAWD (min), or tCWD ≥ tCWD (min), tAWD ≥ tAWD (min) and tCPW ≥
t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the
selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out
(at access time) is indeterminate.
15. These parameters are referred to UCAS and LCAS leading edge in early write cycles and to WE
leading edge in delayed write or read-modify-write cycles.
16. t RASP defines RAS pulse width in fast page mode cycles.
17. Access time is determined by the longest among t AA , t CAC and t CPA.
18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data
to the device.
19. When both UCAS and LCAS go low at the same time, all 16-bit data are written into the device.
UCAS and LCAS cannot be staggered within the same write/read cycles.
20. All the V CC and VSS pins shall be supplied with the same voltages.
21. t ASC, tCAH , t RCS , t WCS , t WCH, t CSR and t RPC are determined by the earlier falling edge of UCAS or LCAS.
15
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HM51W16160 Series, HM51W18160 Series
22. t CRP , t CHR, t RCH, t CPA and tCPW are determined by the later rising edge of UCAS or LCAS.
23. t CWL, t DH and tDS should be satisfied by both UCAS and LCAS.
24. t CP is determined by the time that both UCAS and LCAS are high.
25. When output buffers are enabled once, sustain the low impedance state until valid data is
obtained. When output buffer is turned on and off within a very short time, generally it causes
large V CC/V SS line noise, which causes to degrade V IH min/VIL max level.
26. Please do not use tRASS timing, 10 µs ≤ tRASS ≤ 100 µs. During this period, the device is in
transition state from normal operation mode to self refresh mode. If t RASS ≥ 100 µs, then RAS
precharge time should use tRPS instead of tRP.
27. If you use distributed CBR refresh mode with 15.6 µs interval in normal read/write cycle, CBR
refresh should be executed within 15.6 µs immediately after exiting from and before entering
into self refresh mode.
28. If you use RAS only refresh or CBR burst refresh mode in normal read/write cycle, 4096 or 1024
cycles (4096 cycles: HM51W16160 Series, 1024 cycles: HM51W18160 Series) of distributed
CBR refresh with 15.6 µs interval should be executed within 64 or 16 ms (64 ms: HM51W16160,
16 ms: HM51W18160) immediately after exiting from and before entering into the self refresh
mode.
29. Repetitive self refresh mode without refreshing all memory is not allowed. Once you exit from
self fresh mode, all memory cells need to be refreshed before re-entering the self refresh mode
again.
30. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max))
///////: Invalid Dout
When the address, clock and input pins are not described on timing waveforms, their pins must
be applied VIH or VIL.
16
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HM51W16160 Series, HM51W18160 Series
Notes concerning 2CAS control
Please do not separate the UCAS/LCAS operation timing intentionally. However skew between
UCAS/LCAS are allowed under the following conditions.
1. Each of the UCAS/LCAS should satisfy the timing specifications individually.
2. Different operation mode for upper/lower byte is not allowed; such as following.
RAS
Delayed write
UCAS
Early write
LCAS
WE
3. Closely separated upper/lower byte control is not allowed. However when the condition (tCP ≤ tUL) is
satisfied, fast page mode can be performed.
RAS
UCAS
LCAS
t UL
4. Byte control operation by remaining UCAS or LCAS high is guaranteed.
17
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HM51W16160 Series, HM51W18160 Series
Timing Waveforms*30
Read Cycle
t RC
t RAS
t RP
RAS
t CSH
t CRP
t RCD
t RSH
t CAS
tT
UCAS
LCAS
t RAD
t ASR
Address
t RAH
Row
t RAL
t ASC
t CAL
t CAH
Column
t RRH
t RCH
t RCS
WE
t DZC
t CDD
High-Z
Din
t DZO
t OEA
t OED
OE
t OEZ
t CAC
t OHO
t AA
t OFF
t RAC
t CLZ
Dout
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t OH
Dout
HM51W16160 Series, HM51W18160 Series
Early Write Cycle
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRCD
tRSH
tCAS
tT
UCAS
LCAS
tASR
Address
tRAH
Row
tASC
tCAH
Column
tWCS
tWCH
WE
tDS
Din
Dout
tDH
Din
High-Z*
* t WCS
t WCS (min)
19
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HM51W16160 Series, HM51W18160 Series
Delayed Write Cycle*18
t RC
t RAS
t RP
RAS
t CSH
t CRP
t RCD
t RSH
t CAS
tT
UCAS
LCAS
t ASR
Address
t RAH
t ASC
Row
t CAH
Column
t CWL
t RWL
t WP
t RCS
WE
t DZC
t DS
High-Z
Din
t DH
Din
t DZO
t OEH
t OED
OE
t OEZ
t CLZ
High-Z
Dout
Invalid Dout
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HM51W16160 Series, HM51W18160 Series
Read-Modify-Write Cycle*18
t RWC
t RAS
t RP
RAS
tT
t RCD
t CAS
t CRP
UCAS
LCAS
t RAD
t ASR
Address
t RAH
t ASC
Row
t CAH
Column
t RCS
t CWD
tCWL
t AWD
t RWL
t RWD
t WP
WE
t DZC
t DH
t DS
High-Z
Din
Din
t OED
t DZO
t OEH
t OEA
OE
t CAC
t OEZ
t AA
t RAC
t OHO
Dout
Dout
High-Z
t CLZ
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HM51W16160 Series, HM51W18160 Series
RAS-Only Refresh Cycle
t RC
t RAS
t RP
RAS
tT
t RPC
t CRP
t CRP
UCAS
LCAS
t ASR
t RAH
Row
Address
t OFF
Dout
22
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High-Z
HM51W16160 Series, HM51W18160 Series
CAS-Before-RAS Refresh Cycle
t RC
t RP
t RAS
t RC
t RP
t RAS
t RP
RAS
tT
t RPC
t CP
t CSR
t CHR
t RPC
t CP
t CRP
t CSR
t CHR
UCAS
LCAS
Address
t OFF
Dout
High-Z
23
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HM51W16160 Series, HM51W18160 Series
Hidden Refresh Cycle
t RC
t RAS
t RP
t RC
t RAS
t RC
t RP
t RAS
t RP
RAS
tT
t RSH
t CHR
t CRP
t RCD
UCAS
LCAS
t RAD
t ASR t RAH
Address
t RAL
t ASC
Row
t CAH
Column
t RRH
t RCS
WE
t DZC
t CDD
High-Z
Din
t DZO
t OED
t OEA
OE
t CAC
t OEZ
t OHO
t AA
t RAC
t OFF
t OH
t CLZ
Dout
24
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Dout
HM51W16160 Series, HM51W18160 Series
Fast Page Mode Read Cycle
t RASP
t CPRH
t RP
RAS
tT
t CSH
t RCD
t PC
t CAS
t CP
t RSH
t CAS
t CP
t CRP
t CAS
UCAS
LCAS
t RAL
t RAD
t ASR t RAH
Address
Row
t CAL
t ASC t CAH
t CAL
t ASC t CAH
t CAL
t ASC t CAH
Column 1
Column 2
Column N
t RCS
t RCS
t RCH
t RCS
t RRH
t RCH
t RCH
WE
t DZC
Din
t DZO
t DZC
t DZC
t CDD
t CDD
High-Z
High-Z
t OED
t DZO t OED
t CDD
High-Z
t DZO
t OED
OE
t RAC
t AA
t OH
t OEA
t OHO
t OH
t OEA
t OFF t CAC
t OEZ t CLZ
t CAC
t CLZ
Dout
t CPA
t AA
Dout 1
t CPA
t AA
t OHO
t OFF
t OEZ
Dout 2
t OH
t OHO
t OEA
t CAC
t CLZ
t OFF
t OEZ
Dout N
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HM51W16160 Series, HM51W18160 Series
Fast Page Mode Early Write Cycle
t RP
t RASP
RAS
tT
t CSH
t RCD
t CAS
t PC
t CP
t CAS
t CP
t RSH
t CAS
t CRP
UCAS
LCAS
t ASR t RAH
Address
Row
t ASC t CAH
t ASC t CAH
t ASC t CAH
Column 1
Column 2
Column N
t WCS
t WCH
t WCS
t WCH
t WCS
t WCH
WE
t DS
Din
t DH
Din 1
Dout
t DS
t DH
Din 2
t DS
t DH
Din N
High-Z*
* t WCS
26
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t WCS (min)
HM51W16160 Series, HM51W18160 Series
Fast Page Mode Delayed Write Cycle*18
t RASP
t RP
RAS
tT
t CP
t CSH
t RCD
t CRP
t CP
t PC
t CAS
t RSH
t CAS
t CAS
UCAS
LCAS
t RAD
t ASR
t ASC
t RAH
Address
t ASC
t CAH
Row
t ASC
t CAH
Column 1
t CAH
Column 2
t CWL
Column N
t CWL
t CWL
t RWL
t RCS
t RCS
t RCS
WE
t WP
t WP
t WP
t DZC t DS
t DZC t DS
t DZC t DS
t DH
t DH
Din
1
Din
Din
2
t DZO
Din
N
t DZO
t DZO
t DH
t OED
t OED
t OED
t OEH
t OEH
t OEH
OE
t CLZ
t CLZ
t OEZ
t CLZ
t OEZ
t OEZ
High-Z
Dout
Invalid Dout
Invalid Dout
Invalid Dout
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HM51W16160 Series, HM51W18160 Series
Fast Page Mode Read-Modify-Write Cycle*18
t RASP
t RP
RAS
tT
t PRWC
t CP
t RCD
t RSH
t CP
t CAS
t CAS
t CRP
t CAS
UCAS
LCAS
t RAD
t ASR
Address
t ASC
t RAH
Row
t ASC
t CAH
t CAH
Column 1
t ASC
t CAH
Column 2
t RWD
t CWL
Column N
t CPW
t AWD
t CWL
t AWD
t CWD
t RCS
t CPW
t AWD
t RCS
t CWD
t CWL
t RWL
t CWD
WE
t RCS
t WP
t
t DZC DS
t WP
t
t DZC DS
t WP
t
t DZC DS
t DH
t DH
Din
1
Din
t DZO
t OED
t DH
Din
2
t OED
t DZO
t OED
t DZO
t OEH
t OEH
t OEH
Din
N
OE
t OHO
t OEA
t CAC
t OHO
t OEA
t CAC
t AA
t AA
t CPA
t RAC
t OEZ
t CLZ
t OHO
t OEA
t CAC
t AA
t CPA
t OEZ
t CLZ
t OEZ
t CLZ
High-Z
Dout
Dout 1
28
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Dout 2
Dout N
HM51W16160 Series, HM51W18160 Series
Self Refresh Cycle (L-version)* 26, 27, 28, 29
t RPS
t RASS
t RP
RAS
tT
t RPC
t CP
t CRP
t CSR
t CHS
UCAS
LCAS
t OFF
Dout
High-Z
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HM51W16160 Series, HM51W18160 Series
Package Dimensions
HM51W16160J/LJ Series
HM51W18160J/LJ Series (CP-42D)
Unit: mm
27.06
27.43 Max
0.43 ± 0.10
0.41 ± 0.08
1.27
0.10
Dimension including the plating thickness
Base material dimension
30
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2.50 ± 0.12
1.30 Max
0.80 +0.25
–0.17
10.16 ± 0.13
21
0.74
3.50 ± 0.26
1
11.18 ± 0.13
22
42
9.40 ± 0.25
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
CP-42D
Conforms
—
1.75 g
HM51W16160 Series, HM51W18160 Series
HM51W16160TT/LTT Series
HM51W18160TT/LTT Series (TTP-50/44DC)
Unit: mm
26
10.16
50
20.95
21.35 Max
40 36
11 15
25
0.80
0.80
0.27 ± 0.07
0.13 M
0.25 ± 0.05
1.15 Max
11.76 ± 0.20
0.10
Dimension including the plating thickness
Base material dimension
0.13 ± 0.05
3.20
0.145 ± 0.05
0.125 ± 0.04
1.20 Max
0° – 5°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
0.68
1
TTP-50/44DC
Conforms
—
0.50 g
31
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HM51W16160 Series, HM51W18160 Series
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi Semiconductor
(America) Inc.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1897
USA
Tel: 800-285-1601
Fax:303-297-0447
Hitachi Europe GmbH
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30-00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 01628-585000
Fax: 01628-585160
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.
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HM51W16160 Series, HM51W18160 Series
Revision Record
Rev.
Date
Contents of Modification
Drawn by
Approved by
1.0
Sep. 30, 1996
Initial issue
Y. Kasama
M. Mishima
2.0
Dec. 5, 1996
Addition of HM51W16160/HM51W18160-5 Series
Y. Kasama
M. Mishima
DC Characteristics (HM51W16160 Series)
I CC7 max: 105/95 mA to 105/95/85 mA
DC Characteristics (HM51W18160 Series)
I CC7 max: 170/150 mA to 185/165/145 mA
AC Characteristics
t RRH min: 0/0 ns to 5/5/5 ns
t RPC min: 0/0 ns to 5/5/5 ns
3.0
Feb. 21, 1997
AC Characteristics
t RRH min: 5/5/5 ns to 0/0/0 ns
Y. Kasama
Y. Matsuno
4.0
Jun. 26, 1997
Deletion of HM51W16160/HM51W18160-5 Series
Y. Kasama
Y. Matsuno
5.0
Nov. 1997
Change of Subtitle
33
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