NSC DS91M040

DS91M040
125 MHz Quad M-LVDS Transceiver
General Description
Features
The DS91M040 is a quad M-LVDS transceiver designed for
driving / receiving clock or data signals to / from up to four
multipoint networks.
M-LVDS (Multipoint LVDS) is a new family of bus interface
devices based on LVDS technology specifically designed for
multipoint and multidrop cable and backplane applications. It
differs from standard LVDS in providing increased drive current to handle double terminations that are required in multipoint applications. Controlled transition times minimize reflections that are common in multipoint configurations due to
unterminated stubs. M-LVDS devices also have a very large
input common mode voltage range for additional noise margin
in heavily loaded and noisy backplane environments.
A single DS91M040 channel is a half-duplex transceiver that
accepts LVTTL/LVCMOS signals at the driver inputs and converts them to differential M-LVDS signal levels. The receiver
inputs accept low voltage differential signals (LVDS, BLVDS,
M-LVDS, LVPECL and CML) and convert them to 3V LVCMOS signals. The DS91M040 supports both M-LVDS type 1
and type 2 receiver inputs.
■ DC - 125 MHz / 250 Mbps low jitter, low skew, low power
operation
■ Wide Input Common Mode Voltage Range allows up to
±2V of GND noise
Conforms to TIA/EIA-899 M-LVDS Standard
Pin selectable M-LVDS receiver type (1 or 2)
Controlled transition times (2.0 ns typ) minimize reflections
8 kV ESD on M-LVDS I/O pins protects adjoining
components
■ Flow-through pinout simplifies PCB layout
■ Small 5 mm x 5 mm LLP-32 space saving package
■
■
■
■
Applications
■ Multidrop / Multipoint clock and data distribution
■ High-Speed, Low Power, Short-Reach alternative to TIA/
EIA-485/422
■ Clock distribution in AdvancedTCA (ATCA) and
MicroTCA (μTCA) backplanes
Typical Application
30042202
© 2008 National Semiconductor Corporation
300422
www.national.com
DS91M040 125 MHz Quad M-LVDS Transceiver
May 13, 2008
DS91M040
Ordering Information
Order Number
Receiver Input
Function
Package Type
DS91M040TSQ
Type 1 or 2
Quad M-LVDS Transciever
LLP-32
Connection Diagram
30042201
Logic Diagram
30042203
www.national.com
2
DS91M040
Pin Descriptions
Number
Name
I/O, Type
Description
1, 3, 5, 7
RO
O, LVCMOS
Receiver output pin.
26, 28, 13, 15
RE
I, LVCMOS
Receiver enable pin: When RE is high, the receiver is disabled.
When RE is low, the receiver is enabled. There is a 300 kΩ pullup
resistor on this pin.
25, 27, 14, 16
DE
I, LVCMOS
Driver enable pin: When DE is low, the driver is disabled. When
DE is high, the driver is enabled. There is a 300 kΩ pulldown
resistor on this pin.
2, 4, 6, 8
DI
I, LVCMOS
Driver input pin.
31, DAP
GND
Power
17, 19, 21, 23
A
I/O, M-LVDS
Ground pin and pad.
Non-inverting driver output pin/Non-inverting receiver input pin
18, 20, 22, 24
B
I/O, M-LVDS
Inverting driver output pin/Inverting receiver input pin
11, 12, 29, 30
VDD
Power
32
FSEN1
I, LVCMOS
Power supply pin, +3.3V ± 0.3V
Failsafe enable pin with a 300 kΩ pullup resistor. This pin
enables Type 2 receiver on inputs 0 and 2.
FSEN1 = L --> Type 1 receiver inputs
FSEN1 = H --> Type 2 receiver inputs
9
FSEN2
I, LVCMOS
Failsafe enable pin with a 300 kΩ pullup resistor. This pin
enables Type 2 receiver on inputs 1 and 3.
FSEN2 = L --> Type 1 receiver inputs
FSEN2 = H --> Type 2 receiver inputs
10
MDE
I, LVCMOS
Master enable pin. When MDE is H, the device is powered up.
When MDE is L, the device overrides all other control and powers
down.
M-LVDS Receiver Types
The EIA/TIA-899 M-LVDS standard specifies two different
types of receiver input stages. A type 1 receiver has a conventional threshold that is centered at the midpoint of the input
amplitude, VID/2. A type 2 receiver has a built in offset that is
100mV greater then VID/2. The type 2 receiver offset acts as
a failsafe circuit where open or short circuits at the input will
always result in the output stage being driven to a low logic
state.
30042240
FIGURE 1. M-LVDS Receiver Input Thresholds
3
www.national.com
DS91M040
Absolute Maximum Ratings (Note 4)
ESD Susceptibility
HBM (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
CDM (Note 3)
Power Supply Voltage
−0.3V to +4V
LVCMOS Input Voltage
−0.3V to (VDD + 0.3V)
LVCMOS Output Voltage
−0.3V to (VDD + 0.3V)
M-LVDS I/O Voltage
−5.5V to +5.5V
M-LVDS Output Short Circuit
Current Duration
Continuous
Junction Temperature
+140°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature Range
Soldering (4 sec.)
+260°C
Maximum Package Power Dissipation @ +25°C
SQ Package
833 mW
Derate SQ Package
6.67 mW/°C above +25°C
Package Thermal Resistance
θJA
+150°C/W
θJC
+63.8°C/W
≥8 kV
≥250V
≥1250V
MM (Note 2)
Note 1: Human Body Model, applicable std. JESD22-A114C
Note 2: Machine Model, applicable std. JESD22-A115-A
Note 3: Field Induced Charge Device Model, applicable std.
JESD22-C101-C
Recommended Operating
Conditions
Supply Voltage, VDD
Voltage at Any Bus Terminal
Min Typ Max Units
3.0 3.3 3.6
V
−1.4
+3.8
V
(Separate or Common-Mode)
Differential Input Voltage VID
LVTTL Input Voltage High VIH
2.0
LVTTL Input Voltage Low VIL
0
Operating Free Air
Temperature TA
−40
+25
2.4
VDD
0.8
V
V
V
+85
°C
DC Electrical Characteristics
(Notes 5, 6, 7, 9)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
650
mV
M-LVDS Driver
|VAB|
Differential output voltage magnitude
RL = 50Ω, CL = 5 pF
ΔVAB
Change in differential output voltage magnitude
between logic states
Figures 2, 4
VOS(SS)
Steady-state common-mode output voltage
RL = 50Ω, CL = 5 pF
|ΔVOS(SS)| Change in steady-state common-mode output
voltage between logic states
Figures 2, 3
VA(OC)
Maximum steady-state open-circuit output voltage
Figure 5
VB(OC)
Maximum steady-state open-circuit output voltage
VP(H)
Voltage overshoot, low-to-high level output
(Note 12)
VP(L)
Voltage overshoot, high-to-low level output
(Note 12)
480
−50
0
+50
mV
0.3
1.6
2.1
V
0
+50
mV
0
2.4
V
0
2.4
V
1.2VSS
V
RL = 50Ω, CL = 5pF, CD = 0.5 pF
Figures 7, 8
−0.2VS
V
S
IIH
High-level input current (LVTTL inputs)
VIH = 2.0V
-15
15
μA
IIL
Low-level input current (LVTTL inputs)
VIL = 0.8V
-15
15
μA
VCL
Input Clamp Voltage (LVTTL inputs)
IIN = -18 mA
-1.5
IOS
Differential short-circuit output current (Note 8)
Figure 6
-43
43
mA
V
M-LVDS Receiver
VIT+
VIT−
Positive-going differential input voltage threshold
Negative-going differential input voltage threshold
See Function Tables
See Function Tables
VOH
High-level output voltage (LVTTL output)
IOH = −8mA
VOL
Low-level output voltage (LVTTL output)
IOL = 8mA
IOZ
TRI-STATE output current
VO = 0V or 3.6V
IOSR
Short-circuit receiver output current (LVTTL output) VO = 0V
www.national.com
4
Type 1
16
50
mV
Type 2
100
150
mV
Type 1
−50
20
mV
Type 2
50
94
mV
2.4
2.7
V
0.28
−10
-50
0.4
V
10
μA
-90
mA
Parameter
Conditions
Min
Typ
Max
Units
32
µA
+20
µA
M-LVDS Bus (Input and Output) Pins
IA
Transceiver input/output current
IB
Transceiver input/output current
VA = 3.8V, VB = 1.2V
VA = 0V or 2.4V, VB = 1.2V
−20
VA = −1.4V, VB = 1.2V
−32
VB = 0V or 2.4V, VA = 1.2V
−20
VB = −1.4V, VA = 1.2V
−32
IAB
Transceiver input/output differential current (IA − IB) VA = VB, −1.4V ≤ V ≤ 3.8V
IA(OFF)
Transceiver input/output power-off current
IB(OFF)
Transceiver input/output power-off current
µA
VB = 3.8V, VA = 1.2V
VA = 3.8V, VB = 1.2V,
DE = VCC = 1.5V
−20
VA = −1.4V, VB = 1.2V,
DE = VCC = 1.5V
−32
−20
VB = −1.4V, VA = 1.2V,
DE = VCC = 1.5V
−32
−4
+20
µA
+4
µA
32
µA
+20
µA
µA
VB = 3.8V, VA = 1.2V,
DE = VCC = 1.5V
VB = 0V or 2.4V, VA = 1.2V,
DE = VCC = 1.5V
µA
µA
−4
VA = 0V or 2.4V, VB = 1.2V,
DE = VCC = 1.5V
32
32
µA
+20
µA
µA
IAB(OFF)
Transceiver input/output power-off differential
current (IA(OFF) − IB(OFF))
VA = VB, −1.4V ≤ V ≤ 3.8V,
VDD = 1.5V, DE = 1.5V
CA
Transceiver input/output capacitance
VDD = OPEN
CB
Transceiver input/output capacitance
CAB
Transceiver input/output differential capacitance
CA/B
Transceiver input/output capacitance balance (CA/
CB)
1
+4
µA
7.8
pF
7.8
pF
3
pF
SUPPLY CURRENT (VCC)
ICCD
Driver Supply Current
RL = 50Ω, DE = H, RE = H
67
75
mA
ICCZ
TRI-STATE Supply Current
DE = L, RE = H
22
26
mA
ICCR
Receiver Supply Current
DE = L, RE = L
32
38
mA
ICCPD
Power Down Supply Current
MDE = L
3
5
mA
Note 4: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions.
Note 5: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 6: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD and
ΔVOD.
Note 7: Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of
product characterization and are not guaranteed.
Note 8: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
Note 9: CL includes fixture capacitance and CD includes probe capacitance.
5
www.national.com
DS91M040
Symbol
DS91M040
Switching Characteristics
(Notes 10, 11, 17)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRIVER AC SPECIFICATIONS
tPLH
Differential Propagation Delay Low to High
RL = 50Ω, CL = 5 pF,
1.5
3.3
5.5
ns
tPHL
Differential Propagation Delay High to Low
CD = 0.5 pF
1.5
3.3
5.5
ns
tSKD1
Pulse Skew (Notes 12, 13)
Figures 7, 8
30
125
ps
tSKD2
Channel-to-Channel Skew (Notes 12, 14)
100
200
ps
tSKD3
Part-to-Part Skew (Notes 12, 15)
0.8
1.6
ns
tSKD4
Part-to-Part Skew (Notes 12, 16)
4
ns
tTLH
Rise Time (Note 12)
1.2
2.0
3.0
ns
tTHL
Fall Time (Note 12)
1.2
2.0
3.0
ns
tPZH
Enable Time (Z to Active High)
RL = 50Ω, CL = 5 pF,
7.5
11.5
ns
tPZL
Enable Time (Z to Active Low )
CD = 0.5 pF
8.0
11.5
ns
tPLZ
Disable Time (Active Low to Z)
Figures 9, 10
7.0
11.5
ns
tPHZ
Disable Time (Active High to Z)
7.0
11.5
ns
4.5
ns
RECEIVER AC SPECIFICATIONS
tPLH
Propagation Delay Low to High
CL = 15 pF
1.5
3.0
tPHL
Propagation Delay High to Low
Figures 11, 12, 13
1.5
3.1
4.5
ns
tSKD1A
Pulse Skew (Receiver Type 1)
(Notes 12, 13)
55
325
ps
tSKD1B
Pulse Skew (Receiver Type 2)
(Notes 12, 13)
475
800
ps
tSKD2
Channel-to-Channel Skew (Notes 12, 14)
60
300
ps
tSKD3
Part-to-Part Skew (Notes 12, 15)
0.6
1.2
ns
tSKD4
Part-to-Part Skew (Notes 12, 16)
3
ns
tTLH
Rise Time (Note 12)
0.3
1.1
1.6
ns
tTHL
Fall Time (Note 12)
0.3
0.65
1.6
ns
tPZH
Enable Time (Z to Active High)
RL = 500Ω, CL = 15 pF
3
5.5
ns
tPZL
Enable Time (Z to Active Low)
Figures 14, 15
3
5.5
ns
tPLZ
Disable Time (Active Low to Z)
3.5
5.5
ns
tPHZ
Disable Time (Active High to Z)
3.5
5.5
ns
500
ms
GENERIC AC SPECIFICATIONS
tWKUP
Wake Up Time (Note 12)
(Master Device Enable (MDE) time)
fMAX
Maximum Operating Frequency (Note 12)
125
MHz
Note 10: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 11: Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of
product characterization and are not guaranteed.
Note 12: Specification is guaranteed by characterization and is not tested in production.
Note 13: tSKD1, |tPLHD − tPHLD|, Pulse Skew, is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
Note 14: tSKD2, Channel-to-Channel Skew, is the difference in propagation delay (tPLHD or tPHLD) among all output channels.
Note 15: tSKD3, Part-to-Part Skew, is defined as the difference between the minimum and maximum differential propagation delays. This specification applies to
devices at the same VDD and within 5°C of each other within the operating temperature range.
Note 16: tSKD4, Part-to-Part Skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over
recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay.
Note 17: CL includes fixture capacitance and CD includes probe capacitance.
Note 18: Measured on a clock edge with a histogram and an acummulation of 1500 histogram hits. Input stimulus jitter is subracted geometrically.
www.national.com
6
DS91M040
Test Circuits and Waveforms
30042214
FIGURE 2. Differential Driver Test Circuit
30042224
FIGURE 3. Differential Driver Waveforms
30042222
FIGURE 4. Differential Driver Full Load Test Circuit
30042212
FIGURE 5. Differential Driver DC Open Test Circuit
7
www.national.com
DS91M040
30042225
FIGURE 6. Differential Driver Short-Circuit Test Circuit
30042216
FIGURE 7. Driver Propagation Delay and Transition Time Test Circuit
30042218
FIGURE 8. Driver Propagation Delays and Transition Time Waveforms
www.national.com
8
DS91M040
30042219
FIGURE 9. Driver TRI-STATE Delay Test Circuit
30042221
FIGURE 10. Driver TRI-STATE Delay Waveforms
30042215
FIGURE 11. Receiver Propagation Delay and Transition Time Test Circuit
9
www.national.com
DS91M040
30042217
FIGURE 12. Type 1 Receiver Propagation Delay and Transition Time Waveforms
30042223
FIGURE 13. Type 2 Receiver Propagation Delay and Transition Time Waveforms
30042213
FIGURE 14. Receiver TRI-STATE Delay Test Circuit
www.national.com
10
DS91M040
30042220
FIGURE 15. Receiver TRI-STATE Delay Waveforms
11
www.national.com
DS91M040
Truth Tables
DS91M040 Transmitting
Inputs
Outputs
RE
DE
DI
B
A
X
X
X
H
H
L
H
L
X
L
H
Z
H
L
Z
X — Don't care condition
Z — High impedance state
DS91M040 as Type 2 Receiving
DS91M040 as Type 1 Receiving
Inputs
Output
Inputs
Output
FSEN
RE
DE
A−B
RO
FSEN
RE
DE
A−B
R
L
L
L
H
L
L
L
L
L
H
L
L
≥ +0.15V
≤ +0.05V
H
L
≥ +0.05V
≤ −0.05V
H
L
L
L
H
L
L
0V
X
X
Z
H
H
L
H
L
L
0V
X
L
Z
X — Don't care condition
Z — High impedance state
L
X — Don't care condition
Z — High impedance state
DS91M040 Type 1 Receiver Input Threshold Test Voltages
Applied Voltages
Resulting Differential Input
Voltage
Resulting Common-Mode
Input Voltage
Receiver
Output
VIA
VIB
VID
VICM
R
2.400V
0.000V
3.800V
3.750V
−1.350V
−1.400V
0.000V
2.400V
3.750V
3.800V
−1.400V
−1.350V
2.400V
−2.400V
0.050V
−0.050V
0.050V
−0.050V
1.200V
1.200V
3.775V
3.775V
−1.375V
−1.375V
H
L
H
L
H
L
H — High Level
L — Low Level
Output state assumes that the receiver is enabled (RE = L)
DS91M040 Type 2 Receiver Input Threshold Test Voltages
Applied Voltages
Resulting Differential Input
Voltage
Resulting Common-Mode
Input Voltage
Receiver
Output
VIA
VIB
VID
VIC
R
2.400V
0.000V
3.800V
3.800V
−1.250V
−1.350V
0.000V
2.400V
3.650V
3.750V
−1.400V
−1.400V
2.400V
−2.400V
0.150V
0.050V
0.150V
0.050V
1.200V
1.200V
3.725V
3.775V
−1.325V
−1.375V
H
L
H
L
H
L
H — High Level
L — Low Level
Output state assumes that the receiver is enabled (RE = L)
www.national.com
12
DS91M040
Typical Performance
30042250
30042252
Driver Rise Time as a Function of Temperature
Driver Propagation Delay (tPLHD) as a Function of
Temperature
30042251
Driver Fall Time as a Function of Temperature
30042253
Driver Propagation Delay (tPHLD) as a Function of
Temperature
30042258
Driver Output Signal Amplitude as a Function of
Resistive Load
13
www.national.com
DS91M040
30042254
30042256
Driver Power Supply Current as a Function of Frequency
Receiver Propagation Delay (tPLHD) as a Function of
Input Common Mode Voltage
30042255
Receiver Power Supply Current as a Function of
Frequency
www.national.com
30042257
Receiver Propagation Delay (tPHLD) as a Function of
Input Common Mode Voltage
14
DS91M040
Physical Dimensions inches (millimeters) unless otherwise noted
Order Number DS91M040TSQ
See NS package Number SQA32A
(See AN-1187 for PCB Design and Assembly Recommendations)
15
www.national.com
DS91M040 125 MHz Quad M-LVDS Transceiver
Notes
For more National Semiconductor product information and proven design tools, visit the following Web sites at:
Products
Design Support
Amplifiers
www.national.com/amplifiers
WEBENCH
www.national.com/webench
Audio
www.national.com/audio
Analog University
www.national.com/AU
Clock Conditioners
www.national.com/timing
App Notes
www.national.com/appnotes
Data Converters
www.national.com/adc
Distributors
www.national.com/contacts
Displays
www.national.com/displays
Green Compliance
www.national.com/quality/green
Ethernet
www.national.com/ethernet
Packaging
www.national.com/packaging
Interface
www.national.com/interface
Quality and Reliability
www.national.com/quality
LVDS
www.national.com/lvds
Reference Designs
www.national.com/refdesigns
Power Management
www.national.com/power
Feedback
www.national.com/feedback
Switching Regulators
www.national.com/switchers
LDOs
www.national.com/ldo
LED Lighting
www.national.com/led
PowerWise
www.national.com/powerwise
Serial Digital Interface (SDI)
www.national.com/sdi
Temperature Sensors
www.national.com/tempsensors
Wireless (PLL/VCO)
www.national.com/wireless
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2008 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor
Americas Technical
Support Center
Email: [email protected]
Tel: 1-800-272-9959
www.national.com
National Semiconductor Europe
Technical Support Center
Email: [email protected]
German Tel: +49 (0) 180 5010 771
English Tel: +44 (0) 870 850 4288
National Semiconductor Asia
Pacific Technical Support Center
Email: [email protected]
National Semiconductor Japan
Technical Support Center
Email: [email protected]