NUF4105FC, NUF4115FC 4 Channel EMI Pi−Filter Array with ESD Protection +4 ESD Diodes This device is a 4 channel EMI filter array for data lines. Greater than −40 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection − clamping transients from static discharges to protect delicate data line circuitry. It is offered in 300 m and 350 m solder spheres. http://onsemi.com CIRCUIT DESCRIPTION A1 D1 Features • • • • • • • EMI Filtering and ESD Protection for Data Lines Integration of 26 Discretes Offers Cost and Space Savings Exceeds IEC61000−4−2 (Level 4) Specifications Low Profile Flip−Chip Packaging MSL 1 300 m Solder Spheres (NUF4105), Case 499D 350 m Solder Spheres (NUF4115), Case 499F C2 D2 C4 D4 R2 C2 D3 C3 B1 R3 A3 C3 D5 C5 C6 D6 C8 D8 R4 A4 C4 D7 EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook Computers MP3 Players C7 B2 R5 A5 C5 D9 C9 C10 D10 A6 C6 D11 MAXIMUM RATINGS (TA = 25°C) Rating C1 A2 Typical Applications • • • • • C1 C11 C12 D12 B3 Symbol Value Unit ESD Discharge IEC61000−4−2, − Air Discharge − Contact Discharge Human Body Model VPP kV DC Power per Resistor PR 100 mW DC Power per Package PT 400 mW Junction Temperature TJ 150 °C Operating Temperature Range Top −40 to +85 °C Storage Temperature Range Tstg −55 to +150 °C 30 30 16 FLIP−CHIP CASE 499D 300 m Bumps FLIP−CHIP CASE 499F 350 m Bumps A1 A1 DEVICE MARKING ON NUF41xxYYWW xx = 05 or 15 YY = Year WW = Work Week ORDERING INFORMATION Semiconductor Components Industries, LLC, 2003 August, 2003 − Rev. 0 1 Device Package Shipping NUF4105FCT1 Flip−Chip 3000/Tape & Reel NUF4115FCT1 Flip−Chip 3000/Tape & Reel Publication Order Number: NUF4105FC/D NUF4105FC, NUF4115FC ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Min Typ Max Unit 6.0 7.0 8.0 V VRM = 3.3 V per line − − 0.1 A RI/O IR = 20 mA 80 100 120 Cline VR = 2.5 V, f = 1.0 MHz (Note 1) − 53 − pF VBR Characteristic IZ = 10 mA IR 1. Measured from input/output pins to ground. TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise specified) 0 0 −5 −10 −10 −20 S41 (dB) −20 −25 Channel 2 or Channel 5 −30 −30 −40 Channel 3 to Channel 4 −50 −35 −60 −40 −70 −45 Channel 3 or Channel 4 −50 10 100 1000 10000 −80 10 100 FREQUENCY (MHz) Figure 2. Analog Crosstalk Curve (S41 Measurement) 105 104 103 102 101 100 99 98 97 96 95 −40 1000 FREQUENCY (MHz) Figure 1. Insertion Loss Curve (S21 Measurement) RESISTANCE () S21 (dB) −15 −15 10 35 60 TEMPERATURE (°C) Figure 3. Resistance Over Temperature http://onsemi.com 2 85 10000 NUF4105FC, NUF4115FC 2 V/div Figure 4. ESD Response for Human Body Model (+8.0 kV) 500 mV/div Figure 5. ESD Response for Human Body Model (−8.0 kV) http://onsemi.com 3 NUF4105FC, NUF4115FC Printed Circuit Board Recommendations 500 m Pitch 300 or 350 m Solder Ball Parameter 250 m +25 250 m −0 PCB Pad Size Pad Shape Round Pad Type NSMD 350 m ±25 Solder Mask Opening 125 m Solder Stencil Thickness Stencil Aperture 250 x 250 m sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 m Max Copper Solder Mask NSMD SMD Figure 6. Solder Mask versus Non−Solder Mask Definition Controlled Atmosphere 250 225°C Min 235°C Max TEMPERATURE (°C) 200 183 °C 2 to 5 °C/s 150 140 to 160 °C 100 50 1 to 5 °C/s 0 0 1 2 3 4 1 to 2 min 30−100 sec TIME (minutes) Figure 7. Solder Reflow Profile http://onsemi.com 4 5 NUF4105FC, NUF4115FC PACKAGE DIMENSIONS 15 PIN FLIP−CHIP CSP CASE 499D−01 ISSUE O 4X 0.10 C TERMINAL A1 LOCATOR ÈÈ ÈÈ D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E A1 0.10 C A2 A C 0.05 C SEATING PLANE D1 e /2 e C 15 X b 0.05 C A B 0.03 C E1 B A 1 2 3 4 5 6 e1 http://onsemi.com 5 DIM A A1 A2 D E b e e1 D1 E1 MILLIMETERS MIN MAX −−− 0.700 0.210 0.270 0.380 0.430 2.960 BSC 1.330 BSC 0.290 0.340 0.500 BSC 0.435 BSC 2.500 BSC 0.870 BSC NUF4105FC, NUF4115FC PACKAGE DIMENSIONS 15 PIN FLIP−CHIP CSP CASE 499F ISSUE PRELIMINARY ÈÈ ÈÈ 4X 0.10 C TERMINAL A1 LOCATOR D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E A1 0.10 C A2 A C DIM A A1 A2 D E b e e1 D1 E1 MILLIMETERS MIN MAX −−− 0.700 0.210 0.270 0.380 0.430 2.960 BSC 1.330 BSC 0.300 0.350 0.500 BSC 0.435 BSC 2.500 BSC 0.870 BSC 0.05 C SEATING PLANE D1 e /2 e C 15 X b 0.05 C A B 0.03 C E1 B A 1 2 3 4 5 6 e1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800−282−9855 Toll Free USA/Canada http://onsemi.com 6 NUF4105FC/D