NUP4104X6 4−Line Transient Voltage Suppressor Array This 4−line voltage transient suppressor array is designed for application requiring transient voltage protection capability. It is intended for use in over−transient voltage and ESD sensitive equipment such as wireless phones, printers, automotive electronics, networking communication and other applications. This device features a monolithic common anode design which protects five independent lines in a single SOT−563 package. Features • Protects Up to 4−Line in a Single SOT−563 Package • Peak Power Dissipation − 150 Watts (8x20 sec Waveform) • ESD Rating of Class 3B (Exceeding 8.0 KV) per Human Body http://onsemi.com 1 6 2 5 3 4 Model and Class C (Exceeding 400 V) per Machine Model MARKING DIAGRAM • Compliance with IEC 61000−4−2 (ESD) 15 KV (Air), 8.0 KV (Contact) 6 5 4 • UL Flammability Rating of 94 V−0 • 100% Lead−Free, MSL1 @ 260°C Reflow Temperature SOT−563 CASE 463A PLASTIC Applications • • • • • 1 2 3 Hand−Held Portable Applications Networking and Telecom Automotive Electronics Serial and Parallel Ports Notebooks, Desktops, Servers RR = Specific Device Code D = Date Code ORDERING INFORMATION Device MAXIMUM RATINGS (TJ = 25°C, unless otherwise noted) Rating Peak Power Dissipation 8x20 s Double Exponential Waveform, (Note 1) Operating Temperature Range Storage Temperature Range Lead Solder Temperature (10 s) Electro−Static Discharge Human Body Model (HBM) Machine Model (MM) IEC 61000−4−2 (Air) IEC 61000−4−2 (Contact) RR D NUP4104X6T1 Symbol Value Unit PPK 150 W TJ −40 to 125 °C TSTG −55 to 150 °C TL 260 °C ESD Package Shipping† SOT−563 4000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. V 8000 400 30000 15000 1. Non−repetitive current pulse per Figure 1. Semiconductor Components Industries, LLC, 2004 February, 2004 − Rev. 2 1 Publication Order Number: NUP4104X6/D NUP4104X6 ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise noted) Characteristic Test Condition Symbol Min Typ Max Unit (Note 2) VRWM − − 3.0 V IR = 1.0 mA VBR 6.1 − 7.2 V VRWM = 3.0 V IR − − 0.5 A IPP = 1.0 A (8x20 s Waveform) VC − − 8.0 V Reverse Working Voltage Breakdown Voltage Reverse Leakage Current Clamping Voltage IPP = 12 A (8x20 s Waveform) Peak Pulse Current Capacitance − − 13 8x20 s Waveform IPP − − 13 A VR = 0 V, f = 1.0 MHz (Line to GND) CJ − 70 − pF 2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC or continuous peak operating voltage. 3. VBR is measured at pulse test current IT. TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise noted) 110 110 WAVEFORM PARAMETERS tr = 8 s td = 20 s 80 70 c−t 60 td = IPP/2 50 40 30 20 10 0 0 5 10 15 20 25 90 80 70 60 50 40 30 20 10 0 30 0 25 50 75 100 125 t, TIME (s) TA, AMBIENT TEMPERATURE (°C) Figure 1. Pulse Waveform Figure 2. Power Derating Curve 16.00 VC, CLAMPING VOLTAGE (V) PERCENT OF IPP 90 100 % OF RATED POWER OR IPP 100 12.00 8.00 4.00 0.00 0 4 8 12 IPP, PEAK PULSE CURRENT (A) Figure 3. Clamping Voltage versus Peak Pulse Current http://onsemi.com 2 16 150 NUP4104X6 PACKAGE DIMENSIONS SOT−563, 6−LEAD CASE 463A−01 ISSUE O A −X− 5 6 1 2 C K 4 B −Y− 3 D G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. J 5 PL 6 0.08 (0.003) DIM A B C D G J K S S M X Y MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 3 INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 NUP4104X6 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 For additional information, please contact your local Sales Representative. NUP4104X6/D