DATA SHEET LASER DIODE NX8504BE-CC,NX8504CE-CC 1 550 nm InGaAsP MQW-DFB LASER DIODE COAXIAL MODULE FOR 622 Gb/s DESCRIPTION The NX8504BE-CC and NX8504CE-CC are 1 550 nm Multiple Quantum Well (MQW) structured Distributed FeedBack (DFB) laser diode coaxial modules with an internal optical isolator. These modules are ideal as a light source for Synchronous Digital Hierarchy (SDH) system, STM-4, long-haul L4.2, L-4.3 ITU-T recommendations. FEATURES • Internal optical isolator • Peak emission wavelength λp = 1 550 nm • Optical output power Pf = 2.0 mW • Wide operating temperature range TC = −10 to +85°C • InGaAs monitor PIN-PD • With SC-UPC connector • Based on Telcordia reliability The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PL10177EJ01V0DS (1st edition) (Previous No. P15233EJ2V0DS00) Date Published July 2002 CP(K) Printed in Japan The mark • shows major revised points. NEC Corporation 2001 NEC Compound Semiconductor Devices 2002 NX8504BE-CC,NX8504CE-CC PACKAGE DIMENSIONS (UNIT : mm) NX8504BE-CC φ 6.0±1.0 12.7±0.2 17.0±0.2 2 2 1 1 3 4 LD 12.0±0.15 16.0 Case 7.0±0.2 3 4 7.2±0.3 3.7±0.3 1 2 0.3 P.C.D. = φ 2.0 2–φ 2.5 PD 6.0 PD 1.0±0.1 4 3 4– φ 0.45 ±0.05 PIN CONNECTIONS φ1 PIN CONNECTIONS P.C.D. = φ 2.0 29.3±1.0 8.0 2.5±1.0 0.5±0.2 29.0±1.0 20.0±1.0 4.0±0.2 φ 0.45 ±0.05 φ 0.9 15.0 φ 7.0±0.2 15.0 2.0±0.2 8.0 2– φ 2.2 φ 3.2±0.25 19.5±1.0 φ 0.9 φ 3.2±0.25 φ 7.0±0.2 NX8504CE-CC Optical Fiber (SMF) Length: 0.5 m With SC Connector 0.3 Optical Fiber (SMF) Length: 0.5 m With SC Connector 2 1 3 4 LD Case OPTICAL FIBER CHARACTERISTICS Parameter Specification Unit Mode Field Diameter 9.5±1 µm Cladding Diameter 125±2 µm 2 % 1.6 % 0.9±0.1 mm 1 100 to 1 270 nm 30 mm 500±50 mm Maximum Cladding Noncircularity Maximum Core/Cladding Concentricity Outer Diameter Cut-off Wavelength Minimum Fiber Bending Radius Fiber Length Flammability UL1581 VW-1 SC-UPC Connector Fiber Length: 500±50 mm 2 Data Sheet PL10177EJ01V0DS 8.99±0.5 mm 35±2 mm NX8504BE-CC,NX8504CE-CC ORDERING INFORMATION Part Number Flange Type NX8504BE-CC Flat Mount Flange NX8504CE-CC Vertical Mount Flange Available Connector With SC-UPC Connector ABSOLUTE MAXIMUM RATINGS Parameter Symbol Ratings Unit Optical Output Power from Fiber Pf 5 mW Forward Current of LD IF 150 mA Reverse Voltage of LD VR 2.0 V Forward Current of PD IF 2.0 mA Reverse Voltage of PD VR 15 V Operating Case Temperature TC −10 to +85 °C Storage Temperature Tstg −40 to +85 °C Lead Soldering Temperature Tsld 260 (10 sec.) °C Relative Humidity (noncondensing) RH 85 % Data Sheet PL10177EJ01V0DS 3 NX8504BE-CC,NX8504CE-CC ELECTRO-OPTICAL CHARACTERISTICS (TC = −10 to +85°°C, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit Optical Output Power from Fiber Pf CW 2.0 Operating Voltage Vop Pf = 2.0 mW 1.1 1.6 V Threshold Current Ith TC = 25°C 15 25 mA 2 Threshold Output Power Pth IF = Ith Modulation Current Imod Pf = 2.0 mW, TC = 25°C 11 Pf = 2.0 mW 9 Differential Efficiency ηd Temperature Dependence of Differential Efficiency ∆ηd Kink (Refer to DEFINITIONS) kink Peak Emission Wavelength Temperature Dependence of Peak Emission Wavelength Spectral Width Side Mode Suppression Ratio λp Pf = 2.0 mW, TC = 25°C 0.060 Pf = 2.0 mW 0.036 ∆ηd = 10 log ηd (@ TC °C) −3 SMSR 50 20 100 µW 35 mA 55 0.100 0.150 W/A 0.200 −1.6 dB ηd (@ 25°C) ±20 % 1 550 1 570 nm 0.10 0.12 nm/°C 0.3 1.0 nm Pf = Up to 2.4 mW Pf = 2.0 mW 1 530 ∆λ/∆T ∆λ mW Pf = 2.0 mW, −20 dB down width Pf = 2.0 mW 30 40 dB Rise Time tr 10-90%, Ppk = 2.0 mW, IF = Ith 0.5 ns Fall Time tf 90-10%, Ppk = 2.0 mW, IF = Ith 0.5 ns Monitor Current Im VR = 5 V, Pf = 2.0 mW 1 000 2 000 µA Monitor Dark Current ID VR = 5 V, TC = 25°C 1.0 50 nA VR = 5 V 10 500 VR = 5 V, f = 1 MHz 1.0 20 pF 10 % 1.0 dB Monitor PD Terminal Capacitance Ct Linearity (Refer to DEFINITIONS) LINm Tracking Error (Refer to DEFINITIONS) γ 4 200 VR = 5 V, Pf = 0.2 to 2.0 mW Im = const. Data Sheet PL10177EJ01V0DS 0.5 NX8504BE-CC,NX8504CE-CC PARAMETER DEFINITIONS Kink : kink Pf kink = IF - P f (mW) 2.4 dPK × 100 [%] PK dPK = dPo MAX. dPo PK ≤ 2.4 (mW) dPK PK IF - η d IF 0 (mA) Linearity : LINm Pf LINm = (mW) dPL × 100 [%] PL 2.0 dPL = dPo MAX. 0.2 < PL < 2.0 (mW) PL dPL dPo 0.2 0 Im (mA) Tracking Error : γ Pf γ = 10 log (mW) Pf 2.0 [dB] TC = 25˚C 2.0 TC = –10 to +85˚C Pf 0 Im Im (mA) Data Sheet PL10177EJ01V0DS 5 NX8504BE-CC,NX8504CE-CC OPTICAL OUTPUT POWER FROM FIBER vs. MONITOR CURRENT 4.0 4.0 =– +8 40˚ C +2 5 ˚C 5˚C Optical Output Power from Fiber Pf (mW) OPTICAL OUTPUT POWER FROM FIBER vs. FORWARD CURRENT TC Optical Output Power from Fiber Pf (mW) TYPICAL CHARACTERISTICS (TC = 25°°C, unless otherwise specified) 3.0 2.0 1.0 20 0 40 60 80 100 +85˚C 2.0 1.0 0.8 1.2 1.6 Monitor Current Im (mA) OPERATING CURRENT AND THRESHOLD CURRENT vs. CASE TEMPERATURE FORWARD CURRENT vs. FORWARD VOLTAGE 2.0 50 Iop@Pf = 2 mW Ith 10 1 –40 –20 0 20 40 60 80 100 40 30 20 10 0.5 0 1.0 1.5 2.0 2.5 Case Temperature TC (˚C) Forward Voltage VF (V) TEMPERATURE DEPENEDENCE OF DIFFERENTIAL EFFICIENCY TEMPERATURE DEPENDENCE OF PEAK EMISSION WAVELENGTH 0.18 Peak Emission Wavelength λp (nm) 1 560 0.12 0.06 0.00 –40 –20 0 20 40 60 80 100 1 555 1 550 1 545 1 540 –40 Case Temperature TC (˚C) 6 0.4 Forward Current IF (mA) Forward Current IF (mA) Operating Current Iop (mA), Threshold Current Ith (mA) 3.0 0.0 100 Differential Efficiency η d (W/A) TC = –40˚C +25˚C –20 0 20 40 60 Case Temperature TC (˚C) Data Sheet PL10177EJ01V0DS 80 100 NX8504BE-CC,NX8504CE-CC EYE DIAGRAM SPECTRUM 10 –10 Relative Intensity Relative Intensity (dB) 0 –20 –30 –40 –50 –60 –70 1 540.4 622 Mb/s-NRZ, Ref = –14 dB, 2 Vp-p (6 dB ATT), Ib = Ith × 0.9 1 550.4 1 560.4 Wavelength λ (nm) Time Base (500 ps/div.) ERROR RATE CHARACTERISTICS –6 10 TC = –40˚C, Ref = –14 dB, 622 Mbps-NRZ, 2 Vp-p, Ib = Ith × 0.9 Bit Error Rate 10–7 10–6 TC = 25˚C, Ref = –14 dB, 622 Mbps-NRZ, 2 Vp-p, Ib = Ith × 0.9 10–7 10–6 10–7 10–8 10–8 10–8 10–9 10–9 10–9 10–10 10–10 10–10 10–11 back to back 10–11 back to back TC = 85˚C, Ref = –14 dB, 622 Mbps-NRZ, 2 Vp-p, Ib = Ith × 0.9 10–11 back to back after 200 km after 200 km after 200 km 10–12 10–12 10–12 –40 –39 –38 –37 –36 –35 –34 –33 –40 –39 –38 –37 –36 –35 –34 –33 –40 –39 –38 –37 –36 –35 –34 –33 Average Received Power P (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PL10177EJ01V0DS 7 NX8504BE-CC,NX8504CE-CC DFB-LD FAMILY Absolute Maximum Ratings Part Number TC (°C) Tstg (°C) Electro-Optical Characteristics (TC = 25°C) Ith (mA) Pf (mW) λp (nm) TYP. MIN. TYP. Application Package NX8300BE-CC NX8300CE-CC 0 to +75 −40 to +85 15 2 *1 NX8303BG-CC NX8303CG-CC −10 to +85 −40 to +85 15 2 *1 1 310 622 Mb/s: STM-4 (L-4.1) Coaxial NX8304BE-CC NX8304CE-CC −40 to +85 −40 to +85 15 2 *1 1 310 For fiberoptic communications Coaxial NX8503BG-CC NX8503CG-CC −10 to +85 −40 to +85 15 2 *1 1 550 156 Mb/s: STM-1 (L-1.2, L-1.3) Coaxial 1 310 2.5 Gb/s: STM-16 (S-16.1, L-16.1) Coaxial 622 Mb/s: STM-4 (L-4.2, L-4.3) NX8504BE-CC NX8504CE-CC −10 to +85 −40 to +85 15 2 NX8560LJ-CC −20 to +70 −40 to +85 6 −1 dBm 1 550 NX8562LB −20 to +65 −40 to +85 20 20 NX8563LB −20 to +65 −40 to +85 20 10 NX8564LE-CC −20 to +70 −40 to +85 7 NX8565LE-CC −20 to +70 −40 to +85 7 NX8566LE-CC −20 to +70 −40 to +85 7 0 dBm 1 550 NX8570 Series −20 to +70 −40 to +85 20 20 NX8571 Series −20 to +70 −40 to +85 20 10 *1 1 550 622 Mb/s: STM-4 (L-4.2, L-4.3) Coaxial *2 ≤ 10 Gb/s: STM-64 BFY with GPO 1 550 *2 CW Light Source for external modulator BFY 1 550 *2 CW Light Source for external modulator BFY −2 dBm *1 1 550 *2 2.5 Gb/s: STM-16, 360 km EA modulator integrated BFY −2 dBm *1 1 550 *2 2.5 Gb/s: STM-16, 600 km EA modulator integrated BFY *2 2.5 Gb/s: STM-16, 240 km EA modulator integrated BFY 1 550 *2 CW Light Source with λ monitoring PD BFY 1 550 *2 CW Light Source with λ monitoring PD BFY *1 TYP. *2 Available for DWDM Wavelengths based on ITU-T recommendations 8 Data Sheet PL10177EJ01V0DS TM NX8504BE-CC,NX8504CE-CC REFERENCE Document Name Document No. Optical semiconducrtor devices for fiberoptic communications Selection Guide P12480E Opto-Electronics Devices Pamphlet P13623E Opto-Electronics Devices (CD-ROM) P12944X NEC semiconductor device reliability/quality control system Quality grades on NEC semiconductor devices *1 C11159E *1 C11531E SEMICONDUCTOR SELECTION GUIDE −Products and Packages− *1 X13769E *1 Published by NEC Corporation Data Sheet PL10177EJ01V0DS 9 NX8504BE-CC,NX8504CE-CC GPO is a trademark of Gilbert Engineering Co., Inc. • The information in this document is current as of July, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 10 Data Sheet PL10177EJ01V0DS NX8504BE-CC,NX8504CE-CC SAFETY INFORMATION ON THIS PRODUCT DANGER SEMICONDUCTOR LASER INVISIBLE LASER RADIATION AVOID DIRECT EXPOSURE TO BEAM OUTPUT POWER mW MAX WAVELENGTH nm CLASS lllb LASER PRODUCT Warning Laser Beam AVOID EXPOSURE-Invisible Laser Radiation is emitted from this aperture A laser beam is emitted from this diode during operation. The laser beam, visible or invisible, directly or indirectly, may cause injury to the eye or loss of eyesight. • Do not look directly into the laser beam. • Avoid exposure to the laser beam, any reflected or collimated beam. Caution GaAs Products The product contains gallium arsenide, GaAs. GaAs vapor and powder are hazardous to human health if inhaled or ingested. • Do not destroy or burn the product. • Do not cut or cleave off any part of the product. • Do not crush or chemically dissolve the product. • Do not put the product in the mouth. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage. Caution Optical Fiber A glass-fiber is attached on the product. Handle with care. • When the fiber is broken or damaged, handle carefully to avoid injury from the damaged part or fragments. Business issue NEC Compound Semiconductor Devices, Ltd. 5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: [email protected] NEC Compound Semiconductor Devices Hong Kong Limited Hong Kong Head Office FAX: +852-3107-7309 TEL: +852-3107-7303 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office FAX: +82-2-528-0302 TEL: +82-2-528-0301 NEC Electron Devices European Operations http://www.nec.de/ TEL: +49-211-6503-101 FAX: +49-211-6503-487 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Technical issue NEC Compound Semiconductor Devices, Ltd. http://www.csd-nec.com/ Sales Engineering Group, Sales Division E-mail: [email protected] FAX: +81-44-435-1918 0110