Information TAPING SPECIFICATIONS OF SUPER MINI MOLD SEMICONDUCTORS FOR HIGH FREQUENCY USE Document No. P10687EJ4V0IF00 (4th edition) Date Published March 1998 N CP(K) © 1997 Printed in Japan This document is subject to change according to improving the specifications. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or of others. M4A 96. 10 2 CONTENTS 1. DESCRIPTION.................................................................................................................................. 5 2. SPECIFICATIONS ............................................................................................................................ 2.1 TAPE DIMENSIONS............................................................................................................... 2.2 REEL DIMENSIONS AND MARKING.................................................................................. 2.3 TAPING INFORMATION ........................................................................................................ 6 6 7 8 2.3.1 LEADER AND TRAILER .......................................................................................................... 8 2.3.2 QUANTITY ................................................................................................................................. 9 2.3.3 MISSING DEVICE ..................................................................................................................... 9 2.3.4 SPLICING................................................................................................................................... 9 2.3.5 TAKING PACKAGED DEVICE OUT OF THE TAPE ............................................................ 9 2.3.6 STORAGE ENVIRONMENT...................................................................................................... 9 PACKAGED DEVICE ORIENTATION .................................................................................. DIMENSIONS OF SUPER MINI MOLD PACKAGES ........................................................ 10 11 3. MECHANICAL DATA ...................................................................................................................... 12 4. PACKING.......................................................................................................................................... 12 5. ORDERING INFORMATION ............................................................................................................ 12 2.4 2.5 3 [MEMO] 4 1. DESCRIPTION This information sheet is intended to cover standards on tape packaging for NEC subminiature high frequency semiconductors “SUPER MINI MOLD”. All the dimensions and taping method are specified in accordance with the standard specification “RC-1009” issued by EIAJ (Electronic Industries Association - Japan). NEC subminiature high frequency semiconductors in ‘super minimold’ are available in following parts; Discrete transistors 2SC×××× (EIAJ number) NE××××× (World wide number) Silicon bipolar discrete transistor µPA8××T or µPA8××TB Silicon bipolar twin transistor NE×××18 GaAs FET, HJ-FET NE×××M01 GaAs FET, HJ-FET ICs µPC××××TB Silicon bipolar analog IC µPG×××TB GaAs IC 5 2. 2.1 SPECIFICATIONS TAPE DIMENSIONS t H δ A E δ J K0 K1 K C W B θ θ D D1 G F Length Unit: mm, Angle Unit: deg. ITEM Pocket Perforation Distance Between Center-line Cover Tape Carrier Tape Super Mini Mold Device Overall Thickness 6 SYMBOL SIZE Length A 2.2±0.1 Width B 2.6±0.1 Depth K0 1.1±0.1 Pitch F 4.0±0.1 Diameter J φ1.5 Pitch H 4.0±0.1 Position E 1.75±0.1 Length Direction G 2.0±0.05 Width Direction D 3.5±0.05 Width W 5.5 Width C 8.0±0.2 Thickness t 0.2±0.05 Diameter D1 0.8±0.1 Depth K1 1.3±0.1 Outline Tilt REMARKS Accumulated Tolerance +0.1 MAX./10 Pitch –0.3 Accumulated Tolerance +0.1 MAX./10 Pitch –0.3 +0.1 –0.05 +0.3 –0 Dimentions of super Mini Mold package θ 20° MAX. K 1.35±0.1 Thickness: 0.1 Max. Bend: δ 0.3 Max. See the product specification Cover tape + Carrier tape 2.2 REEL DIMENSIONS AND MARKING 1 θ A C B θ2 TYPE CLASS label W Length Unit: mm, Angle Unit: deg. ITEM SYMBOL SIZE Diameter A φ178 ± 2 Space Between Flanges W 9 ± 0.5 Outer Diameter B φ60 ± 1 Slit Location θ1 90° Spindle Hole Diameter C φ13 ± 0.5 Key Slit Location θ2 120° Flange Hub Marking REMARKS Type no., quantity and lot code are marked or labeled. Note There are the case of delivery old figure outline on reel, for NEC stock. 7 2.3 2.3.1 TAPING INFORMATION LEADER AND TRAILER LEADER TRAILER COVER TAPE Label ITEM SPECIFICATION REMARKS Cover Tape Cover tape without carrier 200 mm MIN. Tip taped to rool Carrier Tape Empty pocket 10 MIN. Take up direction as the above Carrier Tape Empty pocket 10 MIN. Leader Trailer 8 2.3.2 QUANTITY 3 000 pcs/reel 2.3.3 MISSING DEVICE ITEM SPEC REMARKS Consective None Within 40 mm to carrier except leader and trailer Sporadic 0.2 % max/reel Except leader and trailer Others Taping with wrong orientation, up side down and wrong device are not allowed 2.3.4 SPLICING No carrier or cover tape should be spliced. 2.3.5 2.3.6 TAKING PACKAGED DEVICE OUT OF THE TAPE 1) Packaged devices should not adhere to the cover tape. 2) Excess Epoxy mold should not affect on taking the device out. STORAGE ENVIRONMENT Taping products should be stored with the following conditions. • Ambient Temperature ; TA = −10 to +40 °C • Humidity 80 % MAX. ; 9 PACKAGED DEVICE ORIENTATION In the part number of 2SC, NE, µPA (Discrete Transistor) 24 24 24 24 “–T1” • 24 • 24 2.4 “–T2” Reading the marking, Reading the markings, upside faces perforations. downside faces perforations. In the part number of µPC, µPG (ICs) 1 PIN C2H C2H C2H C2H C2H C2H 1 PIN “–E3” “–E4” Two taping orientations are specified as -E3 and -E4 in above drawing. In the drawing, markings and number of pins are examples and show the orientation of packaged devices. Either -E3 or -E4 must be included in the part number. (see page 10.) Some products have only one orientation therefore you should refer the markings and order number to the data sheet of each product. 10 0.65 0.3 0.3 +0.1 –0.05 3 2 0.3 +0.1 –0.05 0.65 1.25±0.1 0.3 +0.1 –0.05 (1.3) 0.65 2.1±0.1 4 2.0±0.2 (1.25) 0.3 +0.1 –0 0.4 +0.1 –0.05 1 0.65 0.65 0.3 +0.1 –0 3 PIN 0.15 +0.1 –0.05 0.9±0.1 0.15 +0.1 –0.05 0.3 2.0±0.2 3 0 to 0.1 0 to 0.1 0.9±0.1 1 0.2 +0.1 –0 0.65 1.3 2 0.15 +0.1 –0 0 to 0.1 0.7 0.9±0.1 2.0±0.2 2.5 DIMENSIONS OF SUPER MINI MOLD PACKAGES 4 PIN 2.1±0.2 1.25±0.1 Marking 6 PIN 2.1±0.1 1.25±0.1 Device weight : approx. 7 mg (for reference) 11 3. MECHANICAL DATA ITEM DATA REMARKS F 10° Cover tape adhesion 20 to 70 gf carrier tape direction of tape. Tape bend strength 4. (30 mm/minute) When the tape is bent with 15.0 mm radius, no device should pop out PACKING 10 reels are packed in corrugated cardbord box. The part number including orientation symbol, rank, quantity, lot code and company are indicated on the box. 5. ORDERING INFORMATION In the case of order placement, please order with the following procedure. <1> Part Number of packaged device <2> Orientation <3> Rank Note1 Note1 Note2 <4> Quantity Note3 <Examples> In the discrete transistors 2SC5006 T1 FB µ PC2745TB E3 KB 30,000 pcs 30,000 pcs Quantity (3,000 pcs × N) Rank Orientation Part Number of packaged deviceNote 4 Notes 12 1. The taping part numbers consists of <1> + <2> (eg.µPC2745TB-E3). 2. One reel has only one rank. When you order many ranks, please order some reels. 3. Order reels the quantity multipled by 3000 because one reel has 3000 pcs of packaged devices. 4. In ICs, ‘TB’ means super mini mold package. [MEMO] 13 [MEMO] 14 Facsimile Message From: Name Company Tel. Although NEC has taken all possible steps to ensure that the documentation supplied to our customers is complete, bug free and up-to-date, we readily accept that errors may occur. Despite all the care and precautions we've taken, you may encounter problems in the documentation. Please complete this form whenever you'd like to report errors or suggest improvements to us. FAX Address Thank you for your kind support. North America Hong Kong, Philippines, Oceania NEC Electronics Inc. NEC Electronics Hong Kong Ltd. Corporate Communications Dept. Fax: +852-2886-9022/9044 Fax: 1-800-729-9288 1-408-588-6130 Korea Europe NEC Electronics Hong Kong Ltd. NEC Electronics (Europe) GmbH Seoul Branch Technical Documentation Dept. Fax: 02-528-4411 Fax: +49-211-6503-274 South America NEC do Brasil S.A. Fax: +55-11-6465-6829 Asian Nations except Philippines NEC Electronics Singapore Pte. Ltd. Fax: +65-250-3583 Japan NEC Semiconductor Technical Hotline Fax: 044-548-7900 Taiwan NEC Electronics Taiwan Ltd. Fax: 02-719-5951 I would like to report the following error/make the following suggestion: Document title: Document number: Page number: If possible, please fax the referenced page or drawing. Document Rating Excellent Good Acceptable Poor Clarity Technical Accuracy Organization CS 98.2