STPS30L30CT/CG/CG-1 ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS A1 IF(AV) 2 x 15 A VRRM 30 V Tj (max) 150 °C VF (max) 0.37 V K A2 K FEATURES AND BENEFITS n n n n n VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE A2 A2 A1 K A1 D2PAK STPS30L30CG TO-220AB STPS30L30CT DESCRIPTION Dual center tap Schottky rectifiers suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in TO-220AB and D2PAK these devices are intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. A2 K A1 I2PAK STPS30L30CG-1 ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) Parameter Repetitive peak reverse voltage RMS forward current Value 30 Unit V 30 A 15 30 A 220 A IF(AV) Average forward current Tc = 140°C δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal IRRM Peak repetitive reverse current tp = 2 µs F = 1kHz square 1 A IRSM Non repetitive peak reverse current tp = 100µs square 3 A Tstg Storage temperature range - 65 to + 150 °C 150 °C 10000 V/µs Tj dV/dt * : Per diode Per device Maximum operating junction temperature * Critical rate of rise reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth(j − a) March 2000 - Ed: 4B 1/5 STPS30L30CT/CG/CG-1 THERMAL RESISTANCE Symbol Parameter Rth (j-c) Per diode Total Coupling Junction to case Rth (c) Value Unit 1.5 0.8 0.1 °C/W °C/W When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Parameter IR * Reverse leakage current Tj = 25°C Forward voltage drop Tj = 25°C IF = 15 A Tj = 125°C IF = 15 A Tj = 25°C IF = 30 A Tj = 125°C IF = 30 A VF * Tests Conditions Min. Typ. VR = VRRM 170 Tj = 125°C 0.33 Max. Unit 1.5 mA 350 mA 0.46 V 0.37 0.57 0.43 0.5 Pulse test : * tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.24x IF(AV) + 0.009 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current (per diode). 10 9 8 7 6 5 4 3 2 1 0 Fig. 2: Average current versus temperature (δ=0.5) (per diode). ambient IF(av)(A) PF(av)(W) 16 δ = 0.1 δ = 0.2 14 δ = 0.5 δ = 0.05 Rth(j-a)=Rth(j-c) 12 Rth(j-a)=15°C/W 10 δ=1 8 Rth(j-a)=50°C/W 6 T IF(av) (A) 0 2/5 2 4 6 8 10 12 δ=tp/T 14 16 2 tp 18 T 4 20 0 δ=tp/T 0 25 Tamb(°C) tp 50 75 100 125 150 STPS30L30CT/CG/CG-1 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values) (per diode). IM(A) 250 225 200 175 150 125 100 75 50 IM 25 0 1E-3 Fig. 4: Relative variation of thermal transient impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 Tc=25°C Tc=75°C δ = 0.5 0.4 δ = 0.2 Tc=110°C t t(s) δ=0.5 1E-2 1E-1 1E+0 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values) (per diode). T δ = 0.1 0.2 0.0 1E-4 δ=tp/T tp(s) Single pulse 1E-3 1E-2 tp 1E-1 1E+0 Fig. 6: Junction capacitance versus reverse voltage applied (typical values) (per diode). IR(mA) C(nF) 1E+3 5.0 Tj=150°C F=1MHz Tj=25°C 1E+2 Tj=125°C 1E+1 1.0 1E+0 Tj=25°C 1E-1 1E-2 VR(V) 0 5 10 15 0.1 20 25 VR(V) 1 2 5 10 20 50 30 Fig. 7: Forward voltage drop versus forward current (maximum values - per diode). Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, e(Cu) = 35 µm) (STPS30L30CG). Rth(j-a) (°C/W) IFM(A) 80 200 70 100 60 Tj=150°C (typical values) 50 40 Tj=125°C 30 10 20 Tj=25°C 10 0 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 S(Cu) (cm²) 0 4 8 12 16 20 24 28 32 36 40 1.6 3/5 STPS30L30CT/CG/CG-1 PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS Dia C L5 L7 L6 L2 F2 F1 D L9 L4 F M G1 E G n n n REF. Millimeters Inches A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. Min. Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 1.14 1.70 4.95 5.15 2.40 2.70 10 10.40 16.4 typ. 13 14 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.044 0.066 0.194 0.202 0.094 0.106 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 A H2 Cooling method: C Recommended torque value: 0.55 m.N Maximum torque value: 0.70 m.N PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF. A E c2 L2 D L1 A1 b2 L b1 b e 4/5 c Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 E 10.0 10.4 0.394 0.409 L 13.1 13.6 0.516 0.535 L1 3.48 3.78 0.137 0.149 L2 1.27 1.40 0.050 0.055 STPS30L30CT/CG/CG-1 PACKAGE MECHANICAL DATA D2PAK DIMENSIONS A E REF. Millimeters Inches A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Min. Max. 4.40 4.60 2.49 2.69 0.03 0.23 0.70 0.93 1.14 1.70 0.45 0.60 1.23 1.36 8.95 9.35 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0° 8° Min. Max. 0.173 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.045 0.067 0.017 0.024 0.048 0.054 0.352 0.368 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0° 8° C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm FOOT PRINT (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 Ordering type Marking Package Weight Base qty Delivery mode STPS30L30CT STPS30L30CT TO-220AB STPS30L30CG STPS30L30CG-TR STPS30L30CG-1 n STPS30L30CG STPS30L30CG STPS30L30CG-1 2g 50 Tube 2 1.8g 50 Tube 2 1.8g 1000 Tape & reel 2 1.49g 50 Tube D PAK D PAK I PAK Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. 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