ETC SUM85N03-06P

SUM85N03-06P
New Product
Vishay Siliconix
N-Channel 30-V (D-S) 175_C MOSFET
FEATURES
rDS(on) (W)
ID (A)
0.006 @ VGS = 10 V
85
D
D
D
D
0.009 @ VGS = 4.5 V
77
APPLICATIONS
PRODUCT SUMMARY
V(BR)DSS (V)
30
TrenchFETr Power MOSFET
175_C Junction Temperature
PWM Optimized for High Efficiency
New Package with Low Thermal Resistance
D Buck Converter
– High Side
– Low Side
D Synchronous Rectifier
– Secondary Rectifier
D
TO-263
G
G
D S
Top View
S
SUM85N03-06P
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
TC = 25_C
Continuous Drain Current (TJ = 175_C)
_
TC = 100_C
Pulsed Drain Current
Repetitive Avalanche Energya
L = 0.1 mH
TC = 25_C
Maximum Power Dissipationa
TA = 25_Cc
Operating Junction and Storage Temperature Range
V
85
ID
IDM
Avalanche Current
Unit
67
200
IAR
45
EAR
101
A
mJ
100b
PD
3.75
W
TJ, Tstg
–55 to 175
_C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
PCB Mountc
Junction-to-Ambient
Junction-to-Case
Free Air
40
RthJA
RthJC
62.5
_C/W
C/W
1.5
Notes
a. Duty cycle v 1%.
b. See SOA curve for voltage derating.
c. When mounted on 1” square PCB (FR-4 material).
Document Number: 71903
S-20921—Rev. A, 01-Jul-02
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1
SUM85N03-06P
New Product
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VDS = 0 V, ID = 250 mA
30
VGS(th)
VDS = VGS, ID = 250 mA
1
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 24 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
ID(on)
V
VDS = 24 V, VGS = 0 V, TJ = 125_C
50
VDS = 24 V, VGS = 0 V, TJ = 175_C
250
VDS w 5 V, VGS = 10 V
120
VGS = 10 V, ID = 20 A
Drain-Source On-State Resistancea
rDS(on)
gfs
0.0045
mA
m
0.006
0.0085
VGS = 10 V, ID = 20 A, TJ = 175_C
0.011
VDS = 15 V, ID = 20 A
nA
A
VGS = 10 V, ID = 20 A, TJ = 125_C
0.0072
VGS = 4.5 V, ID = 20 A
Forward Transconductancea
3.0
W
0.009
20
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
255
Gate-Resistance
RG
1.9
Total Gate Chargeb
Qg
48
Gate-Source Chargeb
Qgs
10
Gate-Drain Chargeb
Qgd
7.5
Turn-On Delay Timeb
td(on)
12
20
12
20
30
45
10
15
Rise
Timeb
Turn-Off Delay Timeb
Fall Timeb
tr
td(off)
3100
VGS = 0 V, VDS = 25 V, f = 1 MHz
VDS = 15 V, VGS = 10 V, ID = 50 A
VDD = 15 V, RL = 0.3 W
ID ^ 50 A, VGEN = 10 V, RG = 2.5 W
tf
565
pF
W
65
nC
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)c
Continuous Current
IS
100
Pulsed Current
ISM
200
Forward Voltagea
VSD
Reverse Recovery Time
trr
A
IF = 30 A, VGS = 0 V
1.2
1.5
V
IF = 50 A, di/dt = 100 A/ms
35
70
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Independent of operating temperature.
c. Guaranteed by design, not subject to production testing.
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Document Number: 71903
S-20921—Rev. A, 01-Jul-02
SUM85N03-06P
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
120
250
VGS = 10 thru 6 V
100
5V
I D – Drain Current (A)
I D – Drain Current (A)
200
150
100
4V
50
80
60
40
TC = 125_C
20
25_C
2, 3 V
–55_C
0
0
0
2
4
6
8
0
10
1
2
3
4
VDS – Drain-to-Source Voltage (V)
VGS – Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
5
120
TC = –55_C
r DS(on) – On-Resistance ( W )
100
g fs – Transconductance (S)
25_C
80
125_C
60
40
20
VGS = 4.5 V
VGS = 10 V
0
0
20
40
60
80
100
ID – Drain Current (A)
ID – Drain Current (A)
Capacitance
Gate Charge
10
4000
Ciss
V GS – Gate-to-Source Voltage (V)
C – Capacitance (pF)
3500
3000
2500
2000
1500
1000
Coss
Crss
500
0
VDS = 15 V
ID = 50 A
8
6
4
2
0
0
6
12
18
24
VDS – Drain-to-Source Voltage (V)
Document Number: 71903
S-20921—Rev. A, 01-Jul-02
30
0
10
20
30
40
50
Qg – Total Gate Charge (nC)
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SUM85N03-06P
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
2.0
100
1.6
I S – Source Current (A)
r DS(on) – On-Resistance (W)
(Normalized)
VGS = 10 V
ID = 20 A
1.2
0.8
TJ = 150_C
TJ = 25_C
10
0.4
0.0
–50
1
–25
0
25
50
75
100
125
150
175
0
0.3
TJ – Junction Temperature (_C)
0.6
0.9
1.2
1.5
VSD – Source-to-Drain Voltage (V)
Drain-Source Voltage Breakdown
vs. Junction Temperature
40
V (BR)DSS (V)
38
36
34
32
30
–50
–25
0
25
50
75
100
125
150
175
TJ – Junction Temperature (_C)
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Document Number: 71903
S-20921—Rev. A, 01-Jul-02
SUM85N03-06P
New Product
Vishay Siliconix
THERMAL RATINGS
Maximum Avalanche Drain Current
vs. Case Temperature
Safe Operating Area, Junction-to-Case
1000
100
10 ms
80
100 ms
I D – Drain Current (A)
I D – Drain Current (A)
100
60
40
20
0
1 ms
10
Limited
by rDS(on)
10 ms
100 ms
dc
1
TC = 25_C
Single Pulse
0.1
0
25
50
75
100
125
150
175
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
TC – Case Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Duty Cycle = 0.5
Normalized Effective Transient
Thermal Impedance
1
0.2
0.1
0.05
0.1
0.02
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
Square Wave Pulse Duration (sec)
Document Number: 71903
S-20921—Rev. A, 01-Jul-02
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