ETC SUM85N03-08P

SUM85N03-08P
New Product
Vishay Siliconix
N-Channel Reduced Qg, Fast Switching MOSFET
FEATURES
rDS(on) (W)
ID (A)
0.0075 @ VGS = 10 V
85
D
D
D
D
0.0105 @ VGS = 4.5 V
72
APPLICATIONS
PRODUCT SUMMARY
V(BR)DSS (V)
30
TrenchFETr Power MOSFET
175_C Junction Temperature
PWM Optimized for High Efficiency
New Package with Low Thermal Resistance
D Buck Converter
– High Side
– Low Side
D Synchronous Rectifier
– Secondary Rectifier
D
TO-263
G
G
D S
Top View
S
SUM85N03-08P
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage
Gate-Source Voltage
TC = 25_C
Continuous Drain Current (TJ = 175_C)
_
TC = 100_C
Pulsed Drain Current
Symbol
Limit
VDS
30
VGS
"20
Repetitive Avalanche Energya
L = 0.1 mH
TC = 25_C
Maximum Power Dissipationa
TA = 25_Cc
Operating Junction and Storage Temperature Range
V
85
ID
IDM
Avalanche Current
Unit
60
200
IAR
50
EAR
125
A
mJ
100b
PD
3.75
W
TJ, Tstg
–55 to 175
_C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
PCB Mountc
Junction-to-Ambient
Junction-to-Case
Free Air
40
RthJA
RthJC
62.5
_C/W
C/W
1.5
Notes
a. Duty cycle v 1%.
b. See SOA curve for voltage derating.
c. When mounted on 1” square PCB (FR-4 material).
Document Number: 71816
S-20920—Rev. C, 01-Jul-02
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1
SUM85N03-08P
New Product
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VDS = 0 V, ID = 250 mA
30
VGS(th)
VDS = VGS, ID = 250 mA
1
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 24 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
ID(on)
V
VDS = 24 V, VGS = 0 V, TJ = 125_C
50
VDS = 24 V, VGS = 0 V, TJ = 175_C
250
VDS w 5 V, VGS = 10 V
120
VGS = 10 V, ID = 30 A
Drain-Source On-State Resistancea
rDS(on)
gfs
mA
m
0.0075
VGS = 10 V, ID = 30 A, TJ = 125_C
0.011
VGS = 10 V, ID = 30 A, TJ = 175_C
0.014
VDS = 15 V, ID = 30 A
nA
A
0.006
0.0085
VGS = 4.5 V, ID = 20 A
Forward Transconductancea
2
W
0.0105
20
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
120
Gate-Resistance
RG
1.9
Total Gate Chargeb
Qg
13
Gate-Source Chargeb
Qgs
Gate-Drain Chargeb
Qgd
4.0
Turn-On Delay Timeb
td(on)
10
15
160
240
30
45
55
85
Rise
Timeb
Turn-Off Delay Timeb
Fall Timeb
tr
td(off)
1725
VGS = 0 V, VDS = 25 V, f = 1 MHz
VDS = 15 V, VGS = 4.5 V, ID = 30 A
VDD = 15 V, RL = 0.5 W
ID ^ 30 A, VGEN = 10 V, RG = 2.5 W
tf
425
pF
W
18
4.5
nC
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)c
Continuous Current
IS
70
Pulsed Current
ISM
200
Forward Voltagea
VSD
IF = 30 A, VGS = 0 V
1.2
1.5
V
trr
IF = 85 A, di/dt = 100 A/ms
80
110
ns
Reverse Recovery Time
A
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Independent of operating temperature.
c. Guaranteed by design, not subject to production testing.
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Document Number: 71816
S-20920—Rev. C, 01-Jul-02
SUM85N03-08P
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
120
200
VGS = 10 thru 5 V
100
I D – Drain Current (A)
I D – Drain Current (A)
150
4V
100
50
3V
80
60
40
TC = 125_C
20
25_C
–55_C
2V
0
0
2
4
6
8
0
0.0
10
0.5
VDS – Drain-to-Source Voltage (V)
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VGS – Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
100
0.020
TC = –55_C
r DS(on) – On-Resistance ( W )
g fs – Transconductance (S)
80
25_C
60
125_C
40
20
0
0.015
VGS = 4.5 V
0.010
VGS = 10 V
0.005
0.000
0
20
40
60
80
0
100
20
40
ID – Drain Current (A)
80
100
ID – Drain Current (A)
Capacitance
Gate Charge
10
2000
V GS – Gate-to-Source Voltage (V)
2500
C – Capacitance (pF)
60
Ciss
1500
1000
Coss
500
Crss
0
VDS = 15 V
ID = 30 A
8
6
4
2
0
0
6
12
18
24
VDS – Drain-to-Source Voltage (V)
Document Number: 71816
S-20920—Rev. C, 01-Jul-02
30
0
5
10
15
20
25
30
35
40
Qg – Total Gate Charge (nC)
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3
SUM85N03-08P
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
2.00
VGS = 10 V
ID = 30 A
I S – Source Current (A)
r DS(on) – On-Resistance (W)
(Normalized)
1.75
50
1.50
1.25
1.00
TJ = 150_C
10
TJ = 25_C
0.75
0.50
–50
1
–25
0
25
50
75
100
125
150
175
0
TJ – Junction Temperature (_C)
0.3
0.6
0.9
1.2
1.5
VSD – Source-to-Drain Voltage (V)
THERMAL RATINGS
Safe Operating Area
100
1000
80
100
I D – Drain Current (A)
I D – Drain Current (A)
Maximum Avalanche Drain Current
vs. Ambient Temperature
60
40
20
10
1 ms
Limited
by rDS(on)
10 ms
100 ms
1
0.1
0
10 ms
100 ms
dc
TA = 25_C
Single Pulse
0.01
0
25
50
75
100
125
150
175
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
TA – Case Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
Square Wave Pulse Duration (sec)
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Document Number: 71816
S-20920—Rev. C, 01-Jul-02