Micrel 10.7Gbps 2 × 2 CROSSPOINT SWITCH w/CML OUTPUTS AND INTERNAL TERMINATION Precision Edge™ Precision Edge™ SY58023U SY58023U FEATURES ■ Guaranteed AC performance over temperature and voltage: • > 10.7Gbps data throughput • < 60ps tr/tf times • < 285ps tpd (IN-to-Q) • < 20ps max. skew ■ Low jitter: • < 10ps(pk-pk) total jitter (clock) • < 1ps(rms) random jitter (data) • < 10ps(pk-pk) deterministic jitter (data) ■ Crosstalk induced jitter: <1ps(rms) ■ Accepts an input signal as low as 100mV ■ Unique input termination and VT pin accepts DCcoupled and AC-coupled differential inputs: LVPECL, LVDS, and CML ■ 50Ω source terminated CML outputs ■ Fully differential inputs/outputs ■ Power supply 2.5V ±5% and 3.3V ±10% ■ Industrial –40°C to +85°C temperature range ■ Available in 16-pin (3mm × 3mm) MLF™ package Precision Edge™ DESCRIPTION The SY58023U is a 2.5V/3.3V precision, high-speed, fully differential CML 2 × 2 crosspoint switch. The SY58023U is optimized to provide two identical output copies with less than 20ps of skew and ultra-low jitter. It can route clock signals as fast as 6GHz or data up to 10.7Gbps. The differential input includes Micrel’s unique, 3-pin input termination architecture that allows the SY58023U to directly interface to LVPECL, LVDS, and CML differential signals (AC-coupled or DC-coupled) without any level-shifting or termination resistor networks in the signal path. The CML outputs features 400mV typical swing into 50Ω loads, and provide an extremely fast rise/fall time guaranteed to be less than 60ps. The SY58023U operates from a 2.5V ±5% supply or 3.3V ±10% supply and is guaranteed over the full industrial temperature range (–40°C to +85°C). For applications that require high speed dual CML switches, consider the SY58024U. The SY58023U is part of Micrel’s high-speed, Precision Edge™ product line. Data sheets and support documentation can be found on Micrel’s website at www.micrel.com. APPLICATIONS ■ ■ ■ ■ ■ FUNCTIONAL BLOCK DIAGRAM Gigabit Ethernet data/clock routing SONET data/clocking routing Switch fabric clock routing Redundant switchover Backplane redundancy SEL0 (TTL/CMOS) 0 IN0 Q0 50Ω VT0 50Ω /Q0 1 /IN0 SEL1 (TTL/CMOS) 0 IN1 Q1 50Ω VT1 50Ω /IN1 /Q1 1 Precision Edge is a trademark of Micrel , Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc. Rev.: A 1 Amendment: /0 Issue Date: June 2003 Precision Edge™ SY58023U Micrel PACKAGE/ORDERING INFORMATION VT0 SEL0 GND VCC Ordering Information(Note 1) 16 15 14 13 1 IN0 12 /IN0 2 11 Q0 /Q0 /IN1 IN1 3 4 10 9 /Q1 Q1 Package Type Operating Range Package Marking SY58023UMI MLF-16 Industrial 023U SY58023UMITR(Note 2) MLF-16 Industrial 023U Note 1. Contact factory for die availability. Die are guaranteed at TA = 25°C, DC electricals only. Note 2. Tape and Reel. VT1 SEL1 GND VCC 5 6 7 8 Part Number 16-Pin MLF™ PIN DESCRIPTION Pin Number Pin Name Pin Function 1, 2, 3, 4 IN0, /IN0, /IN1, IN1 Differential Signal Input: Each pin of this pair internally terminates with 50Ω to the VT pin. Note that this input will default to an indeterminate state if left open. See “Input Interface Applications” section. 16, 5 VT0, VT1 Input Termination Center-Tap: Each input terminates to this pin. The VT pin provides a center-tap for each input (IN, /IN) to a termination network for maximum interface flexibility. See “Input Interface Applications” section. 15, 6 SEL0, SEL1 Select Input: TTL/CMOS select input control that selects inputs IN0, or IN1. Note that this input is internally connected to a 25kΩ pull-up resistor and will default to a logic High state if left open. 7, 14 GND, (Exposed Pad) Ground. Exposed pad must be connected to a ground plane that is the same potential as the device ground pin. 8, 13 VCC 12, 11, 10, 9 Q0, /Q0, /Q1, Q1 Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors as close to the pins as possible. CML Differential Output Pairs: Differential buffered output copy of the selected input signal. The CML single-ended output swing is typically 400mV into 50Ω. Unused output pairs may be left floating with no impact on jitter. See “CML Output Termination” section. TRUTH TABLE SEL0 SEL1 Q0 Q1 L L IN0 IN0 L H IN0 IN1 H L IN1 IN0 H H IN1 IN1 2 Precision Edge™ SY58023U Micrel Absolute Maximum Ratings(Note 1) Operating Ratings(Note 2) Supply Voltage (VCC) .................................. –0.5V to +4.0V Input Voltage (VIN) ......................................... –0.5V to VCC CML Output Voltage (VOUT) ......... VCC –1.0V to VCC +0.5V Current (VT) Source or Sink Current on VT pin ................... ±100mA Input Current (VT) Source or Sink Current on IN, /IN ..................... ±50mA Lead Temperature (soldering, 10 sec.) ..................... 270°C Storage Temperature (TS) ........................... –65°C +150°C Supply Voltage (VCC) ............................ +2.375V to +3.60V Ambient Temperature (TA) ......................... –40°C to +85°C Package Thermal Resistance(Note 3) MLF™ (θJA) Still-Air ............................................................. 60°C/W 500lfpm ............................................................ 54°C/W MLF™ (ψJB) Junction-to-board resistance ........................... 33°C/W DC ELECTRICAL CHARACTERISTICS(Note 4) TA = –40°C to +85°C. Symbol Parameter Condition Min Typ Max Units VCC Power Supply Voltage 2.5V nominal 3.3V nominal 2.375 3.0 2.5 3.3 2.625 3.60 V V ICC Power Supply Current VCC = max., current through internal 50Ω source termination resistor included 100 130 mA VIH Input HIGH Voltage IN, /IN; Note 5 VCC –1.6 VCC V VIL Input LOW Voltage IN, /IN 0 VIH –0.1 V VIN Input Voltage Swing IN, /IN; see Figure 1a 0.1 1.7 V VDIFF_IN Differential Input Swing IN, /IN; see Figure 1b 0.2 3.4 V RIN IN-to-VT Resistance 60 Ω 1.28 V 40 50 IN to VT CML DC ELECTRICAL CHARACTERISTICS(Note 4) VCC = 3.3V ±10% or 2.5V ±5%; RL = 100Ω across each output pair, or equivalent; TA = –40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min VOH Output HIGH Voltage Q0, /Q0; Q1, /Q1 VOUT Output Voltage Swing Q0, /Q0; Q1, /Q1; see Figure 1a 325 VDIFF_OUT Differential Voltage Swing Q0, /Q0; Q1, /Q1; see Figure 1b ROUT Output Source Impedance Q0, /Q0; Q1, /Q1 3 Typ Max Units VCC V 400 500 mV 650 800 1000 mV 40 50 60 Ω VCC–0.020 Precision Edge™ SY58023U Micrel AC ELECTRICAL CHARACTERISTICS VCC = 2.5V ±5% or 3.3V ±10%; RL = 100Ω across each output pair, or equivalent; TA = –40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min fMAX Maximum Operating Frequency VIN ≥ 100mV; VOUT ≥ 200mV Clock NRZ Data tpd Propagation Delay Typ Max Units 6 GHz 10.7 Gbps IN-to-Q 135 285 ps SEL-to-Q 100 400 ps ps tCHAN Channel-to-Channel (Within Bank) Note 6 20 tSKEW Part-to-Part Skew Note 7 75 ps tJITTER Clock Cycle-to-Cycle Jitter Note 8 1 ps(rms) Total Jitter Note 9 10 ps(pk-pk) Random Jitter Note 10 2 ps(rms) Deterministic Jitter Note 11 10 ps(pk-pk) Crosstalk Induced Jitter Note 12 Data t r, t f Output Rise/Fall Time <1 20% to 80%, at full swing 25 ps(rms) 60 ps Note 1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. Note 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Note 3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential (GND) on the PCB. Note 4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Note 5. VIH (min.) not lower than 1.2V. Note 6. Skew is measured between outputs of the same bank under identical transitions. Note 7. Skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs. Note 8. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, Tn–Tn–1 where T is the time between rising edges of the output signal. Note 9. Total jitter definition: With an ideal clock input of frequency ≤ fMAX, no more than one output edge in 1012 output edges will deviate by more than the specified peak-to-peak jitter value. Note 10. Random jitter is measured with a K28.7 comma detect character pattern, measured at 2.5Gbps–3.2Gbps and 10.7Gbps. Note 11. Deterministic jitter is measured at 2.5Gbps–3.2Gbps and 10.7Gbps with both K28.5 and 223–1 PRBS pattern. Note 12. Crosstalk is measured at the output while applying two similar frequencies that are asynchronous with respect to each other at the inputs. SINGLE-ENDED AND DIFFERENTIAL SWINGS VIN, VOUT VDIFF_IN, VDIFF_OUT (Typ. 800mV) Typ. 400mV Figure 1b. Differential Voltage Swing Figure 1a. Single-Ended Voltage Swing 4 Precision Edge™ SY58023U Micrel TIMING DIAGRAM /IN VOUT = 400mV (typ.) (50Ω load) IN /Q tpd tpd VOUT = 400mV (typ.) (50Ω load) Q Figure 2a. AC Timing Diagram IN-to-Q VCC/2 VCC/2 SEL /Q tpd tpd VOUT = 400mV (typ.) (50Ω load) Q IN0, /IN1 = LOW, /IN0, IN1 = HIGH Figure 2b. AC Timing Diagram SEL-to-Q 5 Precision Edge™ SY58023U Micrel TYPICAL OPERATING CHARACTERISTICS VCC = 2.5V, VIN = 100mV, TA = 25°C, unless otherwise noted. 500 Frequency vs. Amplitude 205 PROPAGATION DELAY (ps) AMPLITUDE (mV) 450 400 350 300 250 200 150 100 50 0 0 2000 4000 6000 8000 10000 204 203 202 201 200 199 198 197 196 195 -60 -40 -20 0 FREQUENCY (MHz) Propagation Delay vs. Input Voltage Swing 3.5 210 Within Device Skew vs. Temperature 3 205 200 195 190 185 2.5 2 1.5 1 0.5 180 175 0 20 40 60 80 100 TEMPERATURE (°C) AMPLITUDE (mV) PROPAGATION DELAY (ps) 215 Propagation Delay vs. Temperature 0 -60 -40 -20 0 200 400 600 800 1000 1200 INPUT VOLTAGE SWING (mV) 20 40 60 80 100 TEMPERATURE (°C) 6 Precision Edge™ SY58023U Micrel FUNCTIONAL CHARACTERISTICS VCC = 2.5V, VIN = 100mV, TA = 25°C, unless otherwise noted. 5Gbps Output 2.5GHz Output Amplitude (100mV/div.) Amplitude (100mV/div.) 223—1 PRBS TIME (50ps/div.) 1.25GHz Output 200MHz Output Amplitude (100mV/div.) Amplitude (100mV/div.) TIME (50ps/div.) TIME (100ps/div.) TIME (600ps/div.) 7 Precision Edge™ SY58023U Micrel INPUT STAGE VCC IN 50Ω VT GND 50Ω /IN Figure 3. Simplified Differential Input Buffer INPUT INTERFACE APPLICATIONS VCC VCC VCC VCC VCC VCC IN LVPECL IN IN /IN CML CML SY58023U /IN /IN SY58023U SY58023U VT NC VT NC VREF-AC Figure 4a. DC-Coupled CML Input Interface (Option: may connect VT to VCC) For VCC = 2.5V, Rpd = 19Ω For VCC = 3.3V, Rpd = 50Ω Figure 4b. AC-Coupled CML Input Interface VCC IN VCC VCC LVPECL /IN IN SY58023U Rpd LVDS VT 0.01µF NC 0.01µF VCC Rpd VREF-AC Rpd VREF-AC VCC VT 0.01µF /IN VREF-AC VCC SY58023U NC VT NC VREF-AC For VCC = 2.5V, Rpd = 50Ω For VCC = 3.3V, Rpd = 100Ω Figure 4d. AC-Coupled LVPECL Input Interface Figure 4e. LVDS Input Interface 8 Figure 4c. DC-Coupled LVPECL Input Interface Precision Edge™ SY58023U Micrel CML OUTPUT TERMINATION Figures 5 and Figure 6 illustrates how to terminate a CML output using both the AC-coupled and DC-coupled configuration. All outputs of the SY58023U are 50Ω with a 16mA current source. VCC VCC 50Ω 50Ω 50Ω 50Ω DC-bias per application Q Q 50Ω 100Ω 50Ω /Q /Q 16mA 16mA GND GND Figure 6. CML AC-Coupled Termination Figure 5. CML DC-Coupled Termination RELATED PRODUCT AND SUPPORT DOCUMENTATION Part Number Function Data Sheet Link SY58023U 6GHz (10.7Gbps) 2×2 Crosspoint Switch w/CML Outputs http://www.micrel.com/product-info/products/sy58023u.shtml SY58024U 5.5GHz (10.7Gbps) Dual 2×2 Crosspoint Switch w/CML Outputs http://www.micrel.com/product-info/products/sy58024u.shtml 16-MLF™ Manufactering Guidelines Exposed Pad Application Note www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf HBW Solutions http://www.micrel.com/product-info/as/solutions.shtml 9 Precision Edge™ SY58023U Micrel 16 LEAD MicroLeadFrame™ (MLF-16) 0.85 0.42 +0.18 –0.18 0.23 +0.07 –0.05 +0.15 –0.65 0.01 +0.04 –0.01 3.00BSC 1.60 +0.10 –0.10 0.65 +0.15 –0.65 0.42 0.20 REF. 2.75BSC PIN 1 ID +0.18 –0.18 N 16 1 1 0.50 DIA 2 2 2.75BSC 3.00BSC 3 3 1.60 +0.10 –0.10 4 4 12° max 0.5 BSC 0.42 +0.18 –0.18 SEATING PLANE 1.5 REF BOTTOM VIEW TOP VIEW CC 0.23 +0.07 –0.05 CL 4 0.01 +0.04 –0.01 SECTION "C-C" SCALE: NONE 0.5BSC 0.40 +0.05 –0.05 1. 2. 3. 4. DIMENSIONS ARE IN mm. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. PACKAGE WARPAGE MAX 0.05mm. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS Package Rev. 02 EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 16-Pin MLF™ Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: Note 1. Package meets Level 2 qualification. Note 2. All parts are dry-packaged before shipment. Note 3. Exposed pads must be soldered to a ground for proper thermal management. MICREL, INC. TEL 1849 FORTUNE DRIVE SAN JOSE, CA 95131 + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB USA http://www.micrel.com The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2003 Micrel, Incorporated. 10