2.5V, 2GHz ANY DIFF. IN-TO-LVDS Precision Edge™ SY89832U 1:4 FANOUT BUFFER/TRANSLATOR FINAL W/ INTERNAL TERMINATION FEATURES ■ Accepts any differential input signal and provides four LVDS outputs ■ Guaranteed AC performance over temperature and voltage: • > 2.0GHz fMAX • < 20ps within-device skew • < 200ps rise/fall times ■ Low jitter design: • < 1ps (rms) cycle-to-cycle jitter • < 10ps (pk-pk) total jitter ■ 2.5V voltage supply operation ■ Unique input termination and VT pin accepts DC– coupled and AC–coupled inputs (CML, PECL, LVDS, and HSTL) ■ TTL/CMOS compatible enable input ■ High-speed LVDS outputs ■ Wide operating temperature range: –40°C to +85°C ■ Available in 16-pin (3mm × 3mm) MLF™ package Precision Edge™ DESCRIPTION The SY89832U is a 2.5V, high-speed, 2GHz differential LVDS (Low Voltage Differential Swing) 1:4 fanout buffer optimized for ultra-low skew applications. Within device skew is guaranteed to be less than 20ps over supply voltage and temperature. The differential input buffer has a unique internal termination design that allows access to the termination network through a VT pin. This feature allows the device to easily interface to different logic standards. A VREF–AC reference output is included for AC-coupled applications. The SY89832U is a part of Micrel's high-speed clock synchronization family. For 3.3V applications, see SY89833L. For applications that require a different I/O combination, consult Micrel's website at www.micrel.com, and choose from a comprehensive product line of high-speed, low-skew fanout buffers, translators and clock generators. APPLICATIONS ■ ■ ■ ■ Processor clock distribution SONET clock distribution Fibre Channel clock distribution Gigabit Ethernet clock distribution FUNCTIONAL BLOCK DIAGRAM TYPICAL PERFORMANCE 622MHz Output Q0 /Q0 VREF_AC 21.1mV Offset (75mV/div.) Q1 /Q1 IN VT Q2 /IN /Q2 Q EN D Q3 TIME (200ps/div.) /Q3 Precision Edge is a trademark of Micrel, Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc. Rev.: C 1 Amendment: /0 Issue Date: February 2003 Precision Edge™ SY89832U Micrel PACKAGE/ORDERING INFORMATION /Q0 Q0 VCC GND Ordering Information 16 15 14 13 Q1 1 12 IN /Q1 2 11 Q2 /Q2 3 4 10 9 VT VREF—AC /IN Part Number Package Type Operating Range Package Marking SY89832UMI MLF-16 Industrial 832U SY89832UMITR* MLF-16 Industrial 832U *Tape and Reel Q3 /Q3 VCC EN 5 6 7 8 16-Pin MLF™ PIN DESCRIPTION Pin Number Pin Name Pin Function 15, 16 1, 2, 3, 4, 5, 6 (Q0, /Q0) to (Q3, /Q3) LVDS Differential (Outputs): Normally terminated with 100Ω across the pair (Q, /Q). See “LVDS Outputs” section, Figure 2. Unused outputs should be terminated with a 100Ω resistor across each pair. 8 EN 9, 12 /IN, IN 10 VREF–AC 11 VT 13, Exposed Pad GND Ground. Exposed pad internally connected to GND and must be connected to a ground plane for proper thermal operation. 7, 14 VCC Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors. TTL/CMOS Compatible Synchronous Enable: When EN goes LOW, Q outputs will go LOW and /Q outputs will go HIGH on the next LOW transition at IN inputs. Input threshold is VCC/2V. A 25kΩ pull-up resistor is included. The default state is HIGH when left floating. The internal latch is clocked on the falling edge of the input signal (IN, /IN). Differential Clock Inputs: Internal 50Ω termination resistors to the VT pin. See “Input Interface Applications” section. Reference Voltage equals VCC–1.4V, and is used for AC-coupled applications. The maximum sink/source current is 0.5mA. See “Input Interface Applications” section. When using VREF–AC, bypass with 0.01µF capacitor to VCC. Termination Center-Tap. See “Input Interface Applications” section, and Figure 1a. TRUTH TABLE IN /IN EN Q /Q 0 1 1 0 1 1 0 1 1 0 0 0(1) 1(1) X Note 1. X On next negative transition of the input signal (IN). 2 Precision Edge™ SY89832U Micrel Absolute Maximum Ratings(Note 1) Operating Ratings(Note 2) Supply Voltage (VCC) .................................. –0.5V to +4.0V Input Voltage (VIN) ............................... –0.5V to VCC +0.3V Output Current (IOUT) ............................................... ±10mA Input Current (IN, /IN) ............................................... ±50mA VT Current (IVT) ...................................................... ±100mA Input Sink/Source Current (VREF–AC), Note 3 ............ ±2mA Lead Temperature (Soldering, 10sec.), ................... 220°C Storage Temperature (TS) ....................... –65°C to +150°C Supply Voltage Range .......................... +2.375V to 2.625V Ambient Temperature (TA) ......................... –40°C to +85°C Package Thermal Resistance MLF™ (θJA) Still-Air ............................................................. 60°C/W 500lfpm ............................................................ 54°C/W MLF™ (ψJB) , Note 4 .......................................... 32°C/W Note 1. Note 2. Note 3. Note 4. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Due to the limited drive capability use for input of the same package only. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. DC ELECTRICAL CHARACTERISTICS(Note 1, 2) TA = –40°C to +85°C Symbol Parameter Min Typ Max Units VCC Power Supply Voltage Range 2.375 2.5 2.625 V ICC Power Supply Current 75 100 mA RIN Differential Input Resistance (IN, /IN) 100 120 Ω VIH Input HIGH Voltage (IN, /IN) Note 3 0.1 VCC+0.3 V VIL Input LOW Voltage (IN, /IN) Note 3 –0.3 VCC+0.2 V VIN Input Voltage Swing Note 3, see Figure 2c, and 2d VIN (max.), fT = floating. 0.1 3.6 V VDIFF_IN Differential Input Voltage Swing Note 3, see Figure 2c, and 2d 0.2 |IIN| Input Current (IN, /IN) Note 3 VREF_AC Reference Voltage Note 3 Note 1. Note 2. Note 3. Condition No Load, Maximum Supply Voltage 80 V 45 VCC–1.525 VCC–1.425 VCC–1.325 mA V The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board with airflow greater than 500lfpm. Specification for packaged product only. Due to the internal termination (see “Differential Input”) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply a combination of voltages that causes the input current to exceed the maximum limit. 3 Precision Edge™ SY89832U Micrel LVDS OUTPUTS DC ELECTRICAL CHARACTERISTICS(Note 1, 2) VCC = 2.5V ±5%, TA = –40°C to +85°C Symbol Parameter Condition Min Typ Max Units VOUT Output Voltage Swing see Figures 2c, and 2d. 250 350 400 mV VDIFF_OUT Differential Output Voltage Swing see Figures 2c, and 2d. 500 700 800 mV VOH Output HIGH Voltage see Figures 2a–2b. 1.475 V VOL Output LOW Voltage see Figures 2a–2b. 0.925 VOCM Output Common Mode Voltage see Figures 2a–2b. 1.125 1.275 V ∆VOCM Change in Common Mode Voltage see Figures 2a–2b. –50 50 mV Max Units Note 1. Note 2. V The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Specification for packaged product only. LVTTL/CMOS INPUTS DC ELECTRICAL CHARACTERISTICS(Note 1, 2) VCC = 2.5V ±5%, TA = –40°C to +85°C Symbol Parameter VIH Input HIGH Voltage 2.0 VCC V VIL Input LOW Voltage 0 0.8 V IIH Input HIGH Current –125 20 µA IIL Input LOW Current –300 µA Note 1. Note 2. Condition Min Typ The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Specification for packaged product only. 4 Precision Edge™ SY89832U Micrel AC ELECTRICAL CHARACTERISTICS(Notes 1, 2) VCC = 2.5V ±5%, TA = –40°C to +85°C Symbol Parameter Condition Min Typ Max Units fMAX Maximum Frequency ≥200mVpp Output Swing 2.0 tPLH tPHL Differential Propagation Delay (IN-to-Q) Input Swing: <400mV 370 470 570 ps Input Swing: ≥400mV 300 410 500 ps tSKEW Within-Device Skew (Differential) Note 3 5 20 ps 200 ps GHz Part-to-Part Skew (Differential) tS Set-Up Time (EN to IN, /IN) Note 4 and Note 5 300 ps tH Hold Time (EN to IN, /IN) Note 4 and Note 5 500 ps tJITTER Cycle-to-Cycle Jitter (rms) Note 6 1 ps(rms) Total Jitter Note 7 10 ps(pk-pk) 200 ps t r, t f Output Rise/Fall Times (20% to 80%) 70 120 Note 1. Measured with a 400mV input signal, 50% duty cycle. All outputs are loaded with 100Ω between Q and /Q. 50Ω to VCC–2V. Output swing is ≥ 200mV. Note 2. Specification for packaged product only. Note 3. Skew is measured between outputs under identical transitions. Note 4. Set-up and hold times apply to synchronous applications that intend to enable/disable before the next clock cycle. For asynchronous applications set-up and hold times do not apply. Note 5. See “Timing Diagram.” Note 6. Cycle-to-cycle jitter definition: The variation period between adjacent cycles over a random sample of adjacent cycle pairs. TJITTER_CC = Tn –Tn+1, where T is the time between rising edges of the output signal. Note 7. Total jitter definition: with an ideal clock input frequency of ≤ fMAX (device), no more than one output edge in 1012 output edges will deviate by more than the specified peak-to-peak jitter value. TIMING DIAGRAM EN VCC/2 tS VCC/2 tH /IN IN VIN tPLH, tPHL /Q VOUT Swing Q 5 Precision Edge™ SY89832U Micrel TYPICAL OPERATING CHARACTERISTICS VCC = 2.5V, TA = 25°C, VIN = 400mV, unless otherwise stated. Output Swing vs. Frequency 350 350 AMPLITUDE (mV) OUTPUT SWING (mV) 400 300 250 200 150 100 300 250 200 150 100 50 50 0 0 PROPAGATION DELAY (ps) 525 0.5 1 1.5 2 2.5 FREQUENCY (MHz) 3 0.5 1 1.5 2 2.5 FREQUENCY (MHz) 3 14 500 475 450 425 400 375 350 325 100 0 Within-Device Skew vs. Temperature Propagation Delay vs. Input Voltage Swing WITHIN-DEVICE SKEW (ps) 0 Amplitude vs. Frequency 400 12 10 8 6 4 2 0 -40 -20 0 20 40 60 80 100 TEMPERATURE (°C) 300 500 700 900 INPUT VOLTAGE SWING (V) 6 Precision Edge™ SY89832U Micrel FUNCTIONAL CHARACTERISTICS VCC = 2.5V, VIN = 400mV, TA = 25°C, unless otherwise stated. 622MHz Output 21.1mV Offset (75mV/div.) 21.1mV Offset (75mV/div.) 155MHz Output TIME (200ps/div.) TIME (1.291ns/div.) 21mV Offset (75mV/div.) 1GHz Output TIME (200ps/div.) 7 Precision Edge™ SY89832U Micrel INPUT STAGE VCC VCC 1.86k½ 25kΩ 1.86k½ R EN 1.86k½ 1.86k½ R IN 50 VT 50 W W GND GND /IN Figure 1a. Simplified Differential Input Buffer Figure 1b. Simplified TTL/CMOS Input Buffer LVDS OUTPUTS LVDS specifies a small swing of 350mV typical, on a nominal 1.25V common mode above ground. The common mode voltage has tight limits to permit large variations in ground noise between an LVDS driver and receive 50Ω vOUT 100Ω vOH, vOL vOCM, ∆vOCM 50Ω vOH, vOL GND GND Figure 2b. LVDS Common Mode Measurement Figure 2a. LVDS Differential Measurement DEFINITION OF SINGLE-ENDED AND DIFFERENTIAL SWING QOUT QOUT 700mV (typical) QOUT – /QOUT VIN, VOUT 350mV (typical) VDIFF_IN , V DIFF_OUT /QOUT /QOUT Figure 2c. Single-Ended Swing Figure 2d. Differential Swing (QOUT–/QOUT) 8 Precision Edge™ SY89832U Micrel INPUT INTERFACE APPLICATIONS VCC = 2.5V VCC = 2.5V VCC = 2.5V VCC = 2.5V VCC = 2.5V VCC = 2.5V IN IN IN CML LVPECL CML /IN /IN /IN SY89832U SY89832U SY89832U NC VCC—2V* VT NC VT VCC VREF_AC 50Ω VREF_AC 0.01µF VT VREF_AC NC 0.01µF Figure 3a. DC-Coupled CML Input Interface Figure 3b. AC-Coupled CML Input Interface Figure 3c. DC-Coupled PECL Input Interface (*Bypass with 0.01µF to GND) VCC = 2.5V VCC = 2.5V VCC = 2.5V VCC = 2.5V VCC = 1.8V to 2.5V VCC = 2.5V IN IN LVPECL HSTL /IN SY89832U Rpd 50Ω IN LVDS /IN /IN SY89832U Rpd 50Ω VT NC VT NC VREF_AC SY89832U VT VREF_AC 0.01µF NC VREF_AC VCC = 2.5V Figure 3d. AC-Coupled PECL Input Interface Figure 3e. LVDS Input Interface Figure 3f. HSTL Input Interface RELATED PRODUCT AND SUPPORT DOCUMENTATION Part Number Function Data Sheet Link SY89830U 2.5V/3.3/5V 2.5GHz 1:4 PECL/ECL Clock Driver with 2:1 Differential Input Mux http://www.micrel.com/product-info/products/sy89830u.shtml SY89831U 2GHz Ultra Low-Jitter and Skew 1:4 LVPECL Fanout Buffer/Translator w/ Internal Termination http://www.micrel.com/product-info/products/sy89831u.shtml SY89833L 2GHz ANY DIFFERENTIAL INPUT-to-LVDS Out 1:4 Fanout Buffer Translator w/Internal Termination http://www.micrel.com/product-info/products/sy89833l.shtml 16-MLF™ Manufacturing Guidelines Exposed Pad Application Note http://www.amkor.com/products/notes_papers/MLF_appnote_0301.pdf New Products and Applications http://www.micrel.com/product-info/as/solutions.shtml HBW Solutions 9 Precision Edge™ SY89832U Micrel 16 LEAD EPAD MicroLeadFrame™ (MLF-16) 0.42 +0.18 –0.18 0.23 +0.07 –0.05 0.85 +0.15 –0.65 0.01 +0.04 –0.01 3.00BSC 1.60 +0.10 –0.10 0.65 +0.15 –0.65 0.20 REF. 2.75BSC 0.42 PIN 1 ID +0.18 –0.18 N 16 1 1 0.50 DIA 2 2 2.75BSC 3.00BSC 3 3 1.60 +0.10 –0.10 4 4 12° max 0.5 BSC 0.42 +0.18 –0.18 SEATING PLANE 0.40 +0.05 –0.05 1.5 REF BOTTOM VIEW TOP VIEW CC 0.23 +0.07 –0.05 CL 4 0.01 +0.04 –0.01 SECTION "C-C" SCALE: NONE 0.5BSC 1. 2. 3. 4. DIMENSIONS ARE IN mm. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. PACKAGE WARPAGE MAX 0.05mm. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS FOR EVEN TERMINAL/SIDE Rev. 02 Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 16-Pin MLF™ Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: Note 1. Note 2. MICREL, INC. TEL Package meets Level 2 moisture sensitivity classification, and are shipped in dry-pack form. Exposed pads must be soldered to a ground for proper thermal management. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB http://www.micrel.com The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2003 Micrel, Incorporated. 10