Information Voltage Regulator of SMD SOT-89 (Power mini mold) MP-3Z (SC-63) Document No. G11872EJ3V0IF00 (3rd edition) Date Published March 2000 N CP(K) © Printed in Japan 2000 [MEMO] 2 Information G11872EJ3V0IF00 • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. 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To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8 Information G11872EJ3V0IF00 3 Regional Information Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify: • Device availability • Ordering information • Product release schedule • Availability of related technical literature • Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) • Network requirements In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. NEC Electronics Inc. (U.S.) NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd. Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580 Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 NEC Electronics (France) S.A. Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411 NEC Electronics (France) S.A. NEC Electronics Singapore Pte. Ltd. Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860 United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583 NEC Electronics Italiana s.r.l. NEC Electronics (Germany) GmbH Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99 Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388 NEC Electronics (Germany) GmbH Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490 NEC Electronics (UK) Ltd. NEC Electronics Hong Kong Ltd. NEC Electronics Taiwan Ltd. Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951 NEC do Brasil S.A. Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829 J99.1 4 Information G11872EJ3V0IF00 1. INTRODUCTION In recent years electronic devices such as camcorders, notebook PCs, and cellular telephones, have been increasingly miniaturized. In response, the need for smaller and lighter semiconductor devices and electronic components employed for these systems to increase the mounting density on PC boards has intensified. NEC offers SOT-89 and MP-3Z surface-mount packages for power supply ICs. This document explains the characteristics and taping specifications of the SOT-89 and MP-3Z packages. 2. DIMENSIONS Figure 1 shows the dimensions of the SOT-89 package, and Figure 2 shows the dimensions of the MP-3Z package. Figure 1. SOT-89 Dimensions (unit: mm) 0.42 ±0.06 4.0±0.25 1.5±0.1 2.5±0.1 0.8 MIN. 4.5±0.1 1.6±0.2 0.42±0.06 0.47 1.5 ±0.06 3.0 0.41+0.03 −0.05 Figure 2. MP-3Z Dimensions (unit: mm) 2.3±0.2 +0.2 1.5 −0.1 6.5±0.2 5.0±0.2 0.5±0.1 3 1.0 MIN. 1.5 TYP. 2 1.1±0.2 0.9 MAX. 2.3 2.3 0.5 0.8 2.0 MIN. 1 10.0 MAX. 5.5±0.2 4.3 MAX. 4 0.8 MAX. 0.8 Information G11872EJ3V0IF00 5 3. CHARACTERISTICS Because of the construction, the SOT-89 and MP-3Z packages change their thermal characteristics, i.e., total power dissipation, depending on the material and area of the PC board on which the packages are to be mounted. The Data Sheet for a power IC housed in the SOT-89 package shows the total power dissipation when the package is mounted on a ceramic PC board. Figure 3 shows the total power dissipation when the package is mounted on a glass epoxy board. Figures 4 and 5 show the typical mounting pad dimensions. The recommended soldering conditions are described in the Data Sheet of each product. Be sure to read this description. Figure 3. Size of Glass Epoxy Board and Total Power Dissipation of SOT-89 Total power dissipation PT (W) 10 Board with Cu electrode on total surface (electrode thickness: 35 µ m) 1 Board without Cu electrode 0.1 100 1000 10000 100000 Glass epoxy board area S (mm2) 10 Board size 50 mm × 50 mm × 1.6 mm Total power dissipation PT (W) 50 mm Cu electrode area: A Collector electrode of transistor is connected to Cu electrode of the board (35 µ m thick). 50 mm Collector electrode of transistor is connected to Cu electrode of the board (18 µ m thick). 1 Emitter electrode of transistor is connected to Cu electrode of the board Transistor electrode are not connected to Cu electrodes. Ratio of Cu electrode area to board area 1% 5% 10 % 50 % 100 % 0.1 0 10 100 Board Cu electrode area A (mm2) 6 Information G11872EJ3V0IF00 1000 10000 Figure 4. SOT-89 Typical Mounting Pad Dimensions (unit: mm) 1.5 45° 0.9 2.2 45° 0.9 2.2 1.0 1.0 1.5 1.0 1.5 Figure 5. MP-3Z Typical Mounting Pad Dimensions (unit: mm) 2.0 2.0 7.0 7.0 1.5 1.5 2.3 2.3 Information G11872EJ3V0IF00 7 4. TAPING SPECIFICATIONS The SOT-89 and MP-3Z packages can be delivered on a tape like other ICs. Figures 6 and 7 show the tape shape and dimensions. Figures 8 and 9 show the reel shape. Figure 6. SOT-89 Tape Dimensions (12 mm embossed-type carrier tape) t δ H δ J G θ W B θ C D E A K0 K1 K F Unit: mm Item Recessed hole for component insertion Feeding hole Distance between center lines Symbol +0.1 5.0−0.1 +0.1 4.6−0.1 Remark Height A Width B Depth K0 1.8±0.1 Internal space Pitch F 8.0±0.1 Total error: +0.1 MAX./10 −0.3 pitch Diameter J +0.1 φ1.5−0.05 Pitch H 4.0±0.1 Total error: +0.1 −0.3 MAX./10 pitch Position E 1.5±0.1 Distance between edge of tape and center of hole Vertical G 2.0±0.05 Center line of recessed hole and feeding hole Horizontal D 5.65±0.05 Center line of recessed hole and feeding hole Thickness: 0.1 MAX. Warp δ 0.3 MAX. Cover tape Width W +0.3 9.5 −0 Carrier tape Width C 12±0.2 Thickness t 0.3±0.05 Hole depth K1 2.1±0.1 Inclination θ 30° MAX. K 2.15±0.1 Device Total thickness 8 Dimensions, Angle Inner side of edge on surface 0.5 mm above inner bottom Inner side of edge on surface 0.5 mm above inner bottom Total of cover tape and carrier tape Information G11872EJ3V0IF00 Figure 7 (A). MP-3Z Tape Dimensions (16 mm embossed-type taping) Unit: mm P0 D0 Standard A 7.1 MAX. B 10.7 MAX. T B F W E P2 Symbol D1 P1 A T2 T +0.1 D0 φ1.5−0 D1 φ1.5 MIN. E 1.75±0.1 F 7.5±0.1 P0 4.0±0.1 P1 8.0±0.1 P2 2.0±0.1 T 0.2 T2 2.7±0.1 W 16.0±0.3 Figure 7 (B). MP-3Z Tape Dimensions (32 mm adhesive-type taping) Unit: mm D (12 Pitch) C I G B A 2-H d d J E t2t1 F MP-3Z Information G11872EJ3V0IF00 Symbol Standard A 32 −0.4 B 26±0.1 C 4.0±0.1 D 48±0.3 E 12±0.1 +0 +0.1 F φ1.0 −0 G 6.0±0.2 H R2.0 I 8.0 J 4.0 t2 0.15 t1 0.18 d 0±0.5 9 Figure 8. SOT-89 Reel Dimensions Unit: mm θ Symbol Dimensions, Angle A φ178±2 W 13±0.5 B φ60±1 θ1 90° C φ13±0.5 θ2 120° 1 B A C θ2 W Figure 9 (A). MP-3Z Reel Dimensions (embossed-type taping) Unit: mm θ1 θ1 F V C 3-r E θ2 W1 10 W1 W W2 Information G11872EJ3V0IF00 Standard A 329 B 100 C 13±0.5 D 21±0.8 E 2.0±0.5 F 2 V 8 A K B D Symbol +2.0 W 16.4 −0 W1 (2.5) W2 22.4 MAX. K 260 r 1.0 θ1 120 θ2 60 Figure 9 (B). MP-3Z Reel Dimensions (adhesive-type taping) t Symbol Dimensions, Angle A φ300 B φ80 C φ15.5 W 34 t 2 F 38±1 A B C Unit: mm t W F Information G11872EJ3V0IF00 11 The direction of a taped product is as shown in Figures 10 and 11. The part number of a taped product, including the symbol indicating the direction, is as follows: Note The part number of the taped product of the SOT-89 package differs from those of discrete devices such as transistors and diodes. Figure 10. SOT-89 Taping Direction “-E1” “-E2” Draw-out direction Figure 11. MP-3Z Taping Direction (A) Embossed-type taping “-E1” “-E2” Draw-out direction (B) Adhesive-type taping “-T1” “-T2” Draw-out direction µ PC×××××T Part number on Data Sheet 12 − Type and direction of taping Information G11872EJ3V0IF00 Table 1 shows the number of packages on a tape. Table 1. Number of Packages per Tape Package Quantity (units/reel) SOT-89 1000 MP-3Z (embossed taping) 2000 MP-3Z (adhesive taping) 1500 Information G11872EJ3V0IF00 13 [MEMO] 14 Information G11872EJ3V0IF00 Facsimile Message From: Name Company Tel. Although NEC has taken all possible steps to ensure that the documentation supplied to our customers is complete, bug free and up-to-date, we readily accept that errors may occur. Despite all the care and precautions we've taken, you may encounter problems in the documentation. Please complete this form whenever you'd like to report errors or suggest improvements to us. FAX Address Thank you for your kind support. 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