DATA SHEET GaAs INTEGRATED CIRCUIT µPG2126TB L-BAND PA DRIVER AMPLIFIER DESCRIPTION The µPG2126TB is a GaAs MMIC for PA driver amplifier which were developed for dual band mobile phone and another L-band application. The device can operate with 3.6 V TYP., having the high gain and low distortion. FEATURES ! • Supply voltage : VDD1, 2, 3 = 3.1 to 4.4 V (3.6 V TYP.) • Low operation current : IDD1 = 16 mA TYP. @ VDD1 = 3.6 V, f = 925 MHz, Pout = +8 dBm • High power gain : IDD2 = 28 mA TYP. @ VDD2, 3 = 3.6 V, f = 1 441 MHz, Pout = +8 dBm : GP1 = 16 dB TYP. @ VDD1 = 3.6 V, f = 925 MHz, Pin = −10 dBm • Low distortion : Padj1 = −60 dBc TYP. @ VDD1, 2, 3 = 3.6 V, f = 925 MHz, 1 441 MHz, Pout = +8 dBm, ! ! : GP2 = 26 dB TYP. @ VDD2, 3 = 3.6 V, f = 1 441 MHz, Pin = −22 dBm ! ∆f = ±50 kHz, 21 kHz Bandwidth. • High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) APPLICATION • Digital Cellular: dual band mobile phone etc. ORDERING INFORMATION Part Number µPG2126TB-E3 Package Marking 6-pin super minimold G2K Supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2126TB Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10019EJ02V0DS (2nd edition) Date Published January 2002 CP(K) Printed in Japan The mark ! shows major revised points. NEC Compound Semiconductor Devices 2001, 2002 µPG2126TB PIN CONNECTIONS, MARKING AND INTERNAL BLOCK DIAGRAM 3 2 1 G2K (Top View) (Top View) (Bottom View) 1 VDD1/OUTPUT1 3 4 4 3 2 GND 5 2 5 5 2 3 INPUT1 6 1 6 6 1 4 INPUT2 5 VDD2 6 VDD3/OUTPUT2 Parameter Symbol Ratings Unit VDD1, 2, 3 6.0 V Input Power 1 (INPUT1) Pin1 +4 dBm Input Power 2 (INPUT2) Pin2 −4 dBm Supply Voltage1, 2, 3 140 Note Power Dissipation PD Operating Ambient Temperature TA −30 to +90 °C Storage Temperature Tstg −35 to +150 °C mW Note Mounted on double copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RENGE (TA = +25°°C) Parameter Symbol MIN. TYP. MAX. Unit VDD1, 2, 3 3.1 3.6 4.4 V Input Power 1 (INPUT1) Pin1 − − −10 dBm Input Power 2 (INPUT2) Pin2 − − −20 dBm ! Operating Frequency 1 fopt1 893 − 960 MHz ! Operating Frequency 2 fopt2 1 429 − 1 453 MHz Supply Voltage1, 2, 3 2 Pin Name 4 ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, TA = +25°°C) ! Pin No. Data Sheet PG10019EJ02V0DS µPG2126TB ELECTRICAL CHARACTERISTICS -INPUT1-OUTPUT1(Unless otherwise specified, TA = +25°°C, VDD1 = 3.6 V, π/4DQPSK modulated signal input, External input and output matching) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit 893 925 960 MHz Operating Frequency 1 fopt1 Power Gain 1 GP1 Pin = −10 dBm 14 16 18 dB Circuit Current 1 IDD1 Pout = +8 dBm − 16 20 mA Adjacent Channel Power Leakage 1 Padj1 Pout = +8 dBm, ∆f = ±50 kHz, 21 kHz Bandwidth − −60 −55 dBc Adjacent Channel Power Leakage 2 Padj2 Pout = +8 dBm, ∆f = ±100 kHz, 21 kHz Bandwidth − −70 −65 dBc ELECTRICAL CHARACTERISTICS -INPUT2-OUTPUT2(Unless otherwise specified, TA = +25°°C, VDD2 = VDD3 = 3.6 V, π/4DQPSK modulated signal input, External input and output matching) Parameter ! Symbol Test Conditions MIN. TYP. MAX. Unit 1 429 1 441 1 453 MHz Operating Frequency 2 fopt2 Power Gain 2 GP2 Pin = −22 dBm 24 26 28 dB Circuit Current 2 IDD2 Pout = +8 dBm − 28 32 mA Adjacent Channel Power Leakage 3 Padj3 Pout = +8 dBm, ∆f = ±50 kHz, 21 kHz Bandwidth − −60 −55 dBc Adjacent Channel Power Leakage 4 Padj4 Pout = +8 dBm, ∆f = ±100 kHz, 21 kHz Bandwidth − −70 −65 dBc Data Sheet PG10019EJ02V0DS 3 µPG2126TB EVALUATION CIRCUIT (VDD1, 2, 3 = 3.6 V, f = 925 MHz (INPUT1-OUTPUT1), f = 1 441 MHz (INPUT2OUTPUT2)) VDD1 100 pF 8.2 nH 8.2 nH 2 pF 1.5 pF OUT1 IN1 1 2 3 G2K 6 5 4 3 pF 8.2 nH OUT2 IN2 12 nH 2.2 nH 100 pF 1.5 pF 100 pF VDD3 VDD2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10019EJ02V0DS µPG2126TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD VDD1 SW AGC 800 MHz AMP. OUT 800 MHz AMP. IN L2 C 3 1 C C2 L1 C C 7 L4 4 L3 L5 C6 C5 1.5 GHz AMP. OUT 1.5 GHz AMP. IN VDD3 VDD2 COMPONENT LIST Symbol Rating Part Number Munufacturer L1, L2, L3 8.2 nH TFL0816-8N2 Susumu L4 2.2 nH TFL0816-2N2 Susumu L5 12 nH TFL0816-12N Susumu C1, C4 1.5 pF GRM39CK1R5C50 muRata C2, C5, C6 100 pF GRM39CH101J50 muRata C3 2 pF GRM39CK020C50 muRata C7 3 pF GRM39CJ030C50 muRata Data Sheet PG10019EJ02V0DS 5 µPG2126TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0±0.2 1.25±0.1 6 Data Sheet PG10019EJ02V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.9±0.1 0.1 MIN. µPG2126TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow VPS Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C : 10 seconds or less : 60 seconds or less : 120±30 seconds Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 3 times : 0.2%(Wt.) or below Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C : 215°C or below : 25 to 40 seconds : 30 to 60 seconds Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 3 times : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below IR260 VP215 WS260 Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 1 time : 0.2%(Wt.) or below Peak temperature (pin temperature) : 350°C or below Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10019EJ02V0DS 7 µPG2126TB • The information in this document is current as of January, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. 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(Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 8 Data Sheet PG10019EJ02V0DS µPG2126TB SAFETY INFORMATION ON THIS PRODUCT Caution GaAs Products The product contains gallium arsenide, GaAs. GaAs vapor and powder are hazardous to human health if inhaled or ingested. • Do not destroy or burn the product. • Do not cut or cleave off any part of the product. • Do not crush or chemically dissolve the product. • Do not put the product in the mouth. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage. 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