Transistor 2SD0968, 2SD0968A (2SD968, 2SD968A) Silicon NPN epitaxial planer type For low-frequency driver amplification Complementary to 2SB0789 (2SB789) and 2SB0789A (2SB789A) Unit: mm ■ Absolute Maximum Ratings Parameter 2SD0968 base voltage 2SD0968A Collector to 2SD0968 * Ratings 100 120 100 VCEO 120 2.5±0.1 +0.25 0.4max. 4.0–0.20 0.4±0.04 3.0±0.15 (Ta=25˚C) VCBO emitter voltage 2SD0968A 0.4±0.08 0.5±0.08 1.5±0.1 Symbol Collector to 45° +0.1 ● High collector to emitter voltage VCEO. Large collector power dissipation PC. Mini Power type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing. 1.0–0.2 ● 2.6±0.1 ● 1.5±0.1 4.5±0.1 1.6±0.2 ■ Features 3 Unit V 2 1 marking V Emitter to base voltage VEBO 5 V Peak collector current Collector current ICP 1 A IC 0.5 Collector power dissipation PC* A 1 W Junction temperature Tj 150 ˚C Storage temperature Tstg –55 ~ +150 ˚C 1:Base 2:Collector 3:Emitter EIAJ:SC–62 Mini Power Type Package Marking symbol : W(2SD0968) V(2SD0968A) Printed circuit board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion ■ Electrical Characteristics (Ta=25˚C) Parameter Symbol Collector to emitter 2SD0968 voltage 2SD0968A Conditions min typ max 100 VCEO IC = 100µA, IB = 0 VEBO IE = 10µA, IC = 0 5 hFE1*1 VCE = 10V, IC = 150mA*2 90 hFE2 VCE = 5V, IC = 500mA*2 50 VCE(sat) IC = 500mA, IB = 50mA*2 0.2 0.6 Base to emitter saturation voltage VBE(sat) IC = 500mA, IB = 50mA*2 0.85 1.2 Transition frequency fT VCB = 10V, IE = –50mA, f = 200MHz 120 Collector output capacitance Cob VCB = 10V, IE = 0, f = 1MHz 11 Emitter to base voltage Forward current transfer ratio Collector to emitter saturation voltage *1h FE1 Marking Symbol V 120 V 220 100 Rank Q R hFE1 90 ~ 155 130 ~ 220 2SD0968 WQ WR 2SD0968A VQ VR V V MHz 20 *2 Rank classification Unit pF Pulse measurement Note.) The Part numbers in the Parenthesis show conventional part number. 1 2SD0968, 2SD0968A Transistor 1.0 0.8 0.6 0.4 8mA 6mA 4mA 0.6 0.4 2mA 40 60 80 100 120 140 160 2 4 6 8 10 12 3 1 Ta=75˚C 25˚C –25˚C 0.03 0.01 0.003 30 10 3 25˚C 1 Ta=–25˚C 75˚C 0.3 30 100 300 0.1 0.03 1000 3 10 fT — I E 100 300 1000 80 40 50 Collector output capacitance Cob (pF) 120 IE=0 f=1MHz Ta=25˚C 40 30 20 10 0 –3 –10 –30 Emitter current IE (mA) –100 12 15 VCE=10V 250 Ta=75˚C 200 25˚C –25˚C 150 100 50 1 3 10 30 1 3 10 30 100 300 Collector current IC (mA) Cob — VCB 160 0 –1 30 Collector current IC (mA) VCB=10V Ta=25˚C 9 0 1 Collector current IC (mA) 200 6 300 IC/IB=10 0.01 10 3 Base current IB (mA) hFE — IC 100 0.001 3 0 Collector to emitter voltage VCE (V) Base to emitter saturation voltage VBE(sat) (V) IC/IB=10 1 0.4 VBE(sat) — IC 10 0.1 0.6 0 0 VCE(sat) — IC 0.3 0.8 0.2 Forward current transfer ratio hFE 20 Ambient temperature Ta (˚C) Collector to emitter saturation voltage VCE(sat) (V) 1.0 12mA 10mA 0.8 VCE=10V Ta=25˚C 0 0 Transition frequency fT (MHz) Ta=25˚C 0.2 0.2 0 2 IC — IB 1.2 Collector current IC (A) 1.0 IB=20mA Printed circut board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion. 1.2 Collector current IC (A) Collector power dissipation PC (W) IC — VCE 1.2 18mA 16mA 14mA PC — Ta 1.4 100 Collector to base voltage VCB (V) 1000 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR