ETC 2SD1259AQ

Power Transistors
2SD1259, 2SD1259A
Silicon NPN triple diffusion planar type
1.5±0.1
10.0±0.3
1.0±0.1
1.5max.
1.1max.
2.0
●
High foward current transfer ratio hFE
Satisfactory linearity of foward current transfer ratio hFE
N type package enabling direct soldering of the radiating fin to
the printed circuit board, etc. of small electronic equipment.
10.5min.
●
Unit: mm
6.0±0.5
■ Features
●
3.4±0.3
8.5±0.2
For power amplification with high forward current transfer ratio
0.8±0.1
0.5max.
2.54±0.3
80
VEBO
6
V
Peak collector current
ICP
6
A
Collector current
IC
3
A
Base current
IB
1
A
dissipation
Ta=25°C
Storage temperature
Tstg
■ Electrical Characteristics
0.8±0.1
2SD1259
current
2SD1259A
40
150
˚C
–55 to +150
˚C
ICES
Conditions
max
Unit
100
100
µA
100
µA
VCB = 6V, IC = 0
VCEO
IC = 25mA, IB = 0
Forward current transfer ratio
hFE*
VCE = 4V, IC = 0.5A
Collector to emitter saturation voltage
VCE(sat)
IC = 2A, IB = 0.05A
Transition frequency
fT
VCE = 12V, IC = 0.2A, f = 10MHz
FE
typ
VCE = 100V, IE = 0
IEBO
*h
min
100
Emitter cutoff current
2SD1259A
1:Base
2:Collector
3:Emitter
N Type Package (DS)
3
VCE = 80V, IE = 0
VCE = 40V, IB = 0
voltage
2
(TC=25˚C)
ICEO
2SD1259
0 to 0.4
W
1.3
Collector cutoff current
Collector to emitter
R0.5
R0.5
5.08±0.5
Symbol
Parameter
Collector cutoff
1.0±0.1
2.54±0.3
1
Tj
6.0±0.3
1.1 max.
PC
Junction temperature
3.4±0.3
V
Emitter to base voltage
Collector power TC=25°C
Unit: mm
8.5±0.2
14.7±0.5
emitter voltage 2SD1259A
60
VCEO
V
+0.4
2SD1259
100
3.0–0.2
Collector to
80
VCBO
4.4±0.5
2SD1259A
Unit
+0
2SD1259
base voltage
1:Base
2:Collector
3:Emitter
N Type Package
3
1.5–0.4
Collector to
Ratings
2
10.0±0.3
Symbol
1
2.0
Parameter
5.08±0.5
(TC=25˚C)
4.4±0.5
■ Absolute Maximum Ratings
60
µA
V
80
500
2500
1
50
V
MHz
Rank classification
Rank
hFE
Q
P
O
500 to 1000 800 to 1500 1200 to 2500
Note: Ordering can be made by the common rank (PQ rank hFE = 500 to 1500) in the rank classification.
1
Power Transistors
2SD1259, 2SD1259A
PC — Ta
IC — VCE
IC — VBE
1.0
(1)
40
30
20
5
IB=1.2mA
TC=25˚C
1.0mA
10
0.8
Collector current IC (A)
(1) TC=Ta
(2) With a 50 × 50 × 2mm
Al heat sink
(3) Without heat sink
(PC=1.3W)
Collector current IC (A)
Collector power dissipation PC (W)
50
0.7mA
0.6mA
0.6
0.5mA
0.4mA
0.4
0.3mA
0.2mA
0.2
25˚C
4
–25˚C
TC=100˚C
3
2
1
(2)
0.1mA
(3)
0
0
0
20
40
60
80 100 120 140 160
0
0
Ambient temperature Ta (˚C)
2
4
8
10
3000
–25˚C
0.3
0.1
0.03
0.01
0.01 0.03
0.1
0.3
1
3
300
100
30
10
3
0.1
0.3
1
3
t=1ms
10ms
300ms
0.3
0.01
1
3
10
30
2SD1259A
2SD1259
0.1
0.03
100
300
Collector to emitter voltage VCE
10
1000
(V)
0.1
0.3
1
3
Collector current IC (A)
Rth(t) — t
Thermal resistance Rth(t) (˚C/W)
10 I
CP
IC
30
Collector current IC (A)
Non repetitive pulse
TC=25˚C
1
100
1
0.01 0.03
10
103
3
300
3
Area of safe operation (ASO)
30
1.2
1000
–25˚C
25˚C
1
0.01 0.03
10
1.0
VCE=12V
f=10MHz
TC=25˚C
3000
TC=100˚C
Transition frequency fT (MHz)
25˚C
1
0.8
fT — IC
1000
TC=100˚C
0.6
VCE=4V
Forward current transfer ratio hFE
10
0.4
10000
IC/IB=40
30
3
0.2
Base to emitter voltage VBE (V)
hFE — IC
100
Collector current IC (A)
0
10000
100
Collector current IC (A)
2
12
Collector to emitter voltage VCE (V)
VCE(sat) — IC
Collector to emitter saturation voltage VCE(sat) (V)
6
(1) Without heat sink
(2) With a 50 × 50 × 2mm Al heat sink
(1)
102
(2)
10
1
10–1
10–2
10–4
10–3
10–2
10–1
1
Time t (s)
10
102
103
104
10
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life
and after-unpacking standby time) agreed upon when specification sheets are individually exchanged.
(7) No part of this material may be reprinted or reproduced by any means without written permission
from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic
semiconductor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available
product types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information
before starting precise technical research and/or purchasing activities.
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but
there is always the possibility that further rectifications will be required in the future. Therefore,
Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material.
C. These materials are solely intended for a customer's individual use.
Therefore, without the prior written approval of Panasonic, any other use such as reproducing,
selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR