１．Package Outline Drawings a Package type : P622 Fuji Electric Co.,Ltd. DWG.NO. . Dimensions in mm MS6M0700 a 3/22 H04-004-03 ２．Pin Descriptions Main circuit Symbol Description P Positive input supply voltage. U Output (U). V Output (V). W Output (W). N Negative input supply voltage. B No contact. Control circuit № Symbol ① GNDU High side ground (U). ② ALMU Alarm signal output (U). ③ VinU Logic input for IGBT gate drive (U). ④ VccU High side supply voltage (U). ⑤ GNDV High side ground (V). ⑥ ALMV Alarm signal output (V). ⑦ VinV Logic input for IGBT gate drive (V). ⑧ VccV High side supply voltage (V). ⑨ GNDW High side ground (W). ⑩ ALMW Alarm signal output (W). ⑪ VinW Logic input for IGBT gate drive (W). ⑫ VccW High side supply voltage (W). ⑬ GND Low side ground. ⑭ Vcc Low side supply voltage. ⑮ VinDB ⑯ VinX Logic input for IGBT gate drive (X). ⑰ VinY Logic input for IGBT gate drive (Y). ⑱ VinZ Logic input for IGBT gate drive (Z). ⑲ ALM Low side alarm signal output. No contact. DWG.NO. . Fuji Electric Co.,Ltd. Description MS6M0700 a 4/22 H04-004-03 3．Block Diagram a P VccU ④ VinU ③ ALMU ② GNDU ① VccV ⑧ VinV ⑦ ALMV ⑥ GNDV ⑤ VccW ⑫ VinW ⑪ ALMW ⑩ GNDW ⑨ Vcc ⑭ VinX ⑯ Pre-Driver RALM 1.5k Vz U Pre-Driver RALM 1.5k Vz V Pre-Driver RALM 1.5k Vz W Pre-Driver Vz GND VinY ⑬ ⑰ Pre-Driver Vz VinZ ⑱ Pre-Driver Vz B ALM ⑮ ⑲ RALM 1.5k N Pre-drivers include following functions 1.Amplifier for driver 2.Short circuit protection 3.Under voltage lockout circuit 4.Over current protection 5.IGBT chip over heating protection Fuji Electric Co.,Ltd. DWG.NO. . VinDB MS6M0700 a 5/22 H04-004-03 ４．Absolute Maximum Ratings Tc＝25℃ unless otherwise specified. Items Symbol Min. Max. Units VDC 0 450 V VDC(surge) 0 500 V Vsc 200 400 V Vces 0 600 V DC Ic ― 50 A 1ms Icp ― 100 A Duty 76.1 % *2 -Ic ― 50 A *3 Pc ― 144 W Supply Voltage of Pre-Driver *4 Vcc -0.5 20 V Input Signal Voltage *5 Vin -0.5 Vcc+0.5 V Input Signal Current Iin ― 3 mA Alarm Signal Voltage *6 VALM -0.5 Vcc V Alarm Signal Current *7 ＩALM ― 20 mA Tj ― 150 ℃ Operating Case Temperature Topr -20 100 ℃ Storage Temperature Tstg -40 125 ℃ Solder Temperature *8 Tsol ― 260 ℃ Viso ― AC2500 V ― ― 3.5 Nm DC Bus Voltage (between terminal P and N) Surge Shortoperating Inverter Collector-Emitter Voltage *1 Collector Current Collector Power Dissipation One transistor Junction Temperature Isolating Voltage (Terminal to base, 50/60Hz sine wave 1min.) Screw Torque Mounting (M5) Fuji Electric Co.,Ltd. DWG.NO. . Ｎｏｔｅ *1 ：Vces shall be applied to the input voltage between terminal P and U or Ｖ or W, N and U or V or W *2 ： 125℃/FWD Rth(j-c)/(Ic×VF MAX)=125/1.263/(50×2.6)×100=76.1% *3 ： Pc=125℃/IGBT Rth(j-c)=125/0.87=144W [Inverter] *4 ： VCC shall be applied to the input voltage between terminal No.4 and 1, 8 and 5, 12 and 9, 14 and 13 *5 ： Vｉｎ shall be applied to the input voltage between terminal No.3 and 1, 7 and 5, 11 and 9, 16,17,18 and 13． *6 ： ＶＡＬＭ shall be applied to the voltage between terminal No.2 and 1, No6 and 5, No10 and 9, No.19 and 13． *7 ：ＩＡＬＭ shall be applied to the input current to terminal No.2,6,10 and 19． *8 ： Immersion time 10±1sec. a MS6M0700 6/22 H04-004-03 ５．Electrical Characteristics Tj＝25℃，Vcc＝15V unless otherwise specified. 5.1 Main circuit Item Collector Symbol Current Collector-Emitter Forward voltage of Typ. Max. Units - - 1.0 mA Terminal - - 2.5 Ｖ Chip - 2.0 - V Terminal - - 2.6 Ｖ Chip - 1.6 - V Vin terminal open. VCE（ｓａ ｔ ） saturation voltage Min. ＶＣＥ＝600V ICES at off signal input Inverter Conditions Ｉ ｃ＝50A VF -Ｉｃ＝50A Turn-on time ton VDC＝300V、Tj=125℃ 1.2 - - Turn-off time toff Ic＝50A Fig.1，Fig.6 - - 3.6 FWD Reverse recovery time us VDC＝300V、Tj=25℃ trr - - 0.3 30 - - mJ Min. Typ. Max. Units - - 18 mA - - 65 mA ON 1.00 1.35 1.70 OFF 1.25 1.60 1.95 - 8.0 - V Tc＝-20℃ Fig.2 1.1 - - ms Tc＝25℃ Fig.2 - 2.0 - ms Tc＝125℃ Fig.2 - - 4.0 ms 1425 1500 1575 Ω IF＝50A Fig.1，Fig.6 internal wiring Maximum Avalanche Energy inductance＝50nH PAV Main circuit wiring (A non-repetition) inductance＝54nH 5.2 Control circuit Supply current Symbol of P-side Iccp pre-driver (one unit) Supply current of Iccn pre-driver Vin(th) Input Zener Voltage Vz Alarm Signal Hold Time tALM a Switching Frequency: 0∼15kHz Tc＝-20∼125℃ N-side Input signal threshold voltage Conditions Current Limit Resistor Fuji Electric Co.,Ltd. RALM Fig.7 Rin＝20kΩ Alarm terminal DWG.NO. . Item V a MS6M0700 7/22 H04-004-03 5.3 Protection Section （Vcc＝１５Ｖ） Item Symbol Over Current Protection Level of Conditions Min. Typ. Max. Units 75 - - A Ioc Tj=125℃ Over Current Protection Delay time tdoc Tj=125℃ - 5 - us SC Protection Delay time tsc Tj=125℃ Fig.4 - - 8 us 150 - - ℃ Inverter circuit IGBT Chips Over Heating TjOH Protection Temperature Level Surface of IGBT Chips Over Heating Protection Hysteresis TjH - 20 - ℃ Under Voltage Protection Level VUV 11.0 - 12.5 V VH 0.2 0.5 - Under Voltage Protection Hysteresis ６．Thermal Characteristics （Ｔｃ＝２５℃） Item Symbol Min. Typ. Max. IGBT Rth(j-c) - - 0.87 FWD Rth(j-c) - - 1.263 Rth(c-f) - 0.05 - Min. Typ. Max. Units ±2.0 - - kV ±5.0 - - kV Symbol Min. Typ. Max. Units DC Bus Voltage VDC - - 400 V Power Supply Voltage of Pre-Driver Vcc 13.5 15.0 16.5 V - 2.5 - 3.0 Nm Symbol Min. Typ. Max. Units Wt - 270 - g Junction to Case Inverter Thermal Resistance *10 Case to Fin Thermal Resistance with Compound ７．Noise Immunity Item Common mode rectangular noise Units ℃/W （Vdc=300V、Vcc=15V、Test Circuit Fig 5.） Conditions Pulse width 1us,polarity ±,10 minuｔｅs Judge：no over-current, no miss operating Rise time 1.2us, Fall time 50us Common mode Interval 20s, 10 times lightning surge Judge：no over-current, no miss operating ８．Recommended Operating Conditions Item Screw Torque (M5) ９．Weight Item Weight Fuji Electric Co.,Ltd. DWG.NO. . *10：( For 1device ，Case is under the device ) a MS6M0700 8/22 H04-004-03 ｎ（ ｔ ｈ） Ｖｉ ｎ Ｖｉ Ｏｎ Ｖｉ ｎ（ ｔ ｈ） ｔ ｒ ｒ ９０％ ５０％ Ｉ ｃ ９０％ 1０％ ｔ ｏff ｔ ｏｎ Figure 1. Switching Time Waveform Definitions off /Vin Vge (Inside IPM) Fault (Inside IPM) off on Gate On on Gate Off normal alarm /ALM tALM＞Max. tALM 2ms(typ.) ③ tALM＞Max. ① ② Fault：Over-current,Over-heat or Under-voltage Figure 2. Input/Output Timing Diagram Necessary conditions for alarm reset (refer to ① to ③ in figure2.) ① This represents the case when a failure-causing Fault lasts for a period more than tALM. The alarm resets when the input Vin is OFF and the Fault has disappeared. ② This represents the case when the ON condition of the input Vin lasts for a period more than tALM. The alarm resets when the Vin turns OFF under no Fault conditions. ③ This represents the case when the Fault disappears and the Vin turns OFF within tALM. The alarm resets after lasting for a period of the specified time tALM. /Vin Ic off on on Ioc /ALM ① ② ＜tdoc alarm tdoc Figure 3. Over-current Protection Timing Diagram Period ①: When a collector current over the OC level flows and the OFF command is input within a period less than the trip delay time tdoc, the current is hard-interrupted and no alarm is output. Period ②: When a collector current over the OC level flows for a period more than the trip delay time tdoc, the current is soft-interrupted. If this is detected at the lower Fuji Electric Co.,Ltd. DWG.NO. . arm IGBTs, an alarm is output. a MS6M0700 9/22 H04-004-03 t SC Ic Ic IALM Ic IALM IALM Figure.4 Definition of tsc P VccU 20k DC 15V VinU IPM CT U SW1 AC200V GNDU Vcc V VinX W + 20k DC 15V 4700p SW2 Noise N GND Earth Cooling Fin Figure 5. Noise Test Circuit Vcc P 20k DC 15V L IPM + Vin DC 300V HCPL4504 GND N Ic Figure 6. Switching Characteristics Test Circuit Icc A Vcc P IPM DC 15V P.G +8V fsw Vin U V W GND N Fuji Electric Co.,Ltd. DWG.NO. . Figure 7. Icc Test Circuit a MS6M0700 10/22 H04-004-03 １０． Truth table 10.1 IGBT Control The following table shows the IGBT ON/OFF status with respect to the input signal Vin. The IGBT turn-on when Vin is at “Low” level under no alarm condition. Input (Vin) Output (IGBT) Low ON High OFF 10.2 Fault Detection (1) When a fault is detected at the high side, only the detected arm stops its output. At that time the IPM outputs detected arm’s alarm. (2) When a fault is detected at the low side, all the lower arms stop their outputs and the IPM outputs an alarm of the low side. Fault High side U-phase High side V-phase High side W-phase Low side IGBT Alarm Output U-phase V-phase W-phase Low side ALM-U ALM-V ALM-W ALM OC OFF * * * L H H H UV OFF * * * L H H H TjOH OFF * * * L H H H OC * OFF * * H L H H UV * OFF * * H L H H TjOH * OFF * * H L H H OC * * OFF * H H L H UV * * OFF * H H L H TjOH * * OFF * H H L H OC * * * OFF H H H L UV * * * OFF H H H L TjOH * * * OFF H H H L Fuji Electric Co.,Ltd. DWG.NO. . *：Depend on input logic. MS6M0700 a 11/22 H04-004-03 １１. Cautions for design and application 1. Trace routing layout should be designed with particular attention to least stray capacity between the primary and secondary sides of optical isolators by minimizing the wiring length between the optical isolators and the IPM input terminals as possible. フォトカプラとＩＰＭの入力端子間の配線は極力短くし、フォトカプラの一次側と二次側の浮遊容量を小さくした パターンレイアウトにして下さい。 2. Mount a capacitor between Vcc and GND of each high-speed optical isolator as close to as possible. 高速フォトカプラの Vcc-GND 間に、コンデンサを出来るだけ近接して取り付けて下さい。 3. For the high-speed optical isolator, use high-CMR type one with tpHL, tpLH ≦ 0.8µs. 高速フォトカプラは、tpHL,tpLH≦0.8us、高 CMR タイプをご使用ください。 4. For the alarm output circuit, use low-speed type optical isolators with CTR ≧ 100%. アラーム出力回路は、低速フォトカプラ CTR≧100%のタイプをご使用ください。 5. For the control power Vcc, use four power supplies isolated each. And they should be designed to reduce the voltage variations. 制御電源 Vcc は、絶縁された４電源を使用してください。また、電圧変動を抑えた設計として下さい。 6. Suppress surge voltages as possible by reducing the inductance between the DC bus P and N, and connecting some capacitors between the P and N terminals P-N 間の直流母線は出来るだけ低インダクタンス化し、P-N 端子間にコンデンサを接続するなどしてサージ 電圧を低減して下さい。 7. To prevent noise intrusion from the AC lines, connect a capacitor of some 4700pF between the three-phase lines each and the ground. AC ラインからのノイズ侵入を防ぐために、３相各線−アース間に４７００ｐＦ程のコンデンサを接続して下さい 8. At the external circuit, never connect the control terminal ① GNDU to the main terminal U-phase, ⑤GNDV to V-phase, ⑨GNDW to W-phase, and ⑬GND to N-phase. Otherwise, malfunctions may be caused. 制御端子①ＧＮＤＵと主端子Ｕ相、制御端子⑤ＧＮＤVと主端子 V 相、制御端子⑨ＧＮＤWと主端子 W 相、 制御端子⑬ＧＮＤと主端子 N を外部回路で接続しないで下さい。誤動作の原因になります。 9. Take note that an optical isolator’s response to the primary input signal becomes slow if a capacitor is connected between the input terminal and GND. 入力端子-GND 間にコンデンサを接続すると、フォトカプラ一次側入力信号に対する応答時間が長くなりま Fuji Electric Co.,Ltd. DWG.NO. . すのでご注意ください。 a MS6M0700 12/22 H04-004-03 10. Taking the used isolator’s CTR into account, design with a sufficient allowance to decide the primary forward current of the optical isolator. フォトカプラの一次側電流は、お使いのフォトカプラの CTR を考慮し十分に余裕をもった設計にして下さい。 11. Apply thermal compound to the surfaces between the IPM and its heat sink to reduce the thermal contact resistance. 接触熱抵抗を小さくするために、 ＩＰＭとヒートシンクの間にサーマルコンパウンド塗布して下さい。 12. Finish the heat sink surface within roughness of 10µm and flatness (camber) between screw positions of 0 to +100µm. If the flatness is minus, the heat radiation becomes worse due to a gap between the heat sink and the IPM. And, if the flatness is over +100µm, there is a danger that the IPM copper +100μm 0 base may be deformed and this may cause a dielectric breakdown. Heat sink ヒートシンク表面の仕上げは、粗さ 10um 以下、ネジ位置間 での平坦度（反り）は、0∼100um として下さい。平坦度がマ イナスの場合、ヒートシンクと IPM の間に隙間ができ放熱が 悪化します。また、平坦度が＋100um 以上の場合ＩＰＭの銅 Mounting holes ﾍﾞｰｽが変形し絶縁破壊を起こす危険性があります。 13. This product is designed on the assumption that it applies to a servo use. Sufficient examination is required when applying to a general purpose inverter or converter use. Please contact Fuji Electric Co.,Ltd if you would like to applying to general purpose inverter or converter use. 本製品は、サーボ用途への適用を前提に設計されております。汎用インバータやコンバータ用途へ適用される 場合は、十分な検討が必要です。もし、汎用インバータやコンバータへ適用される場合は御連絡ください。 14. Please see the 『Fuji IGBT-IPM R SERIES APPLICATION MANUAL』 and 『Fuji IGBT MODULES N SERIES APPLICATION MANUAL』. 『富士 IGBT-IPM R シリーズ アプリケーションマニュアル』及び『IGBT ﾓｼﾞｭｰﾙ N シリーズ アプリケーションマニュ アル』を御参照ください。 15. There is thermal interference between nearby power devices, because the Econo IPM is a compact package. Therefore you measure the case temperature just under the IGBT chips that showed in report MT6M04545, and estimate the chip temperature. Econo IPM はパッケージ小型化のため、パワー素子の熱干渉が考えられます。 その為、チップ温度推定は必ず MT6M04545 に示すチップ直下のケース温度を測定して行って下さい。 Fuji Electric Co.,Ltd. DWG.NO. . a MS6M0700 a 13/22 H04-004-03 a １２．Example of applied circuit 応用回路例 VccU +5V VccU HCPL4504 20kΩ 0.1uF “H“で U相IGBTｵﾝ +5V P ④ +10uF 20kΩ 0.1uF “H“で U相IGBTｵﾝ ③ GNDU HCPL4504 ③ GNDU ① U W ⑧ +10uF B ⑦ N U V Ｍ VccV “H“で V相IGBTｵﾝ GNDV ⑤ 20kΩ ⑫ 20kΩ 0.1uF “H“で V相IGBTｵﾝ ⑧ +10uF B ⑦ N AC200V C + Ｍ ⑤ 20kΩ ⑫ ⑥ VccW +10uF 0.1uF “H“で W相IGBTｵﾝ +10uF 0.1uF “H“で W相IGBTｵﾝ ⑪ GNDW ⑪ GNDW ⑨ ⑩ Vcc 20kΩ 0.1uF ⑭ GND Vcc +10uF 0.1uF 0.1uF ⑰ “H“で Y相IGBTｵﾝ ⑱ “H“で Z相IGBTｵﾝ ⑭ IPM +10uF ⑯ GND ⑬ ⑬ 20kΩ ⑰ 20kΩ “H“で Z相IGBTｵﾝ 20kΩ “H“で X相IGBTｵﾝ 20kΩ “H“で Y相IGBTｵﾝ ⑨ ⑩ IPM ⑯ “H“で X相IGBTｵﾝ 0.1uF 20kΩ ⑱ ⑮ ⑮ ⑲ ⑲ TLP521 TLP521 (a)In case of use of High side alarm (b) In case of no use of High side alarm 上ｱｰﾑｱﾗｰﾑ使用の場合 １３．Package and Marking 上ｱｰﾑｱﾗｰﾑ不使用の場合 梱包仕様 Please see the MT6M04140 which is packing specification of IPM． IPM 梱包仕様書 ＭＴ６Ｍ０４１４０ を御参照ください。 １４．Cautions for storage and transportation 保管、運搬上の注意 ・ Store the modules at the normal temperature and humidity (5 to 35°C, 45 to 75%). 常温常湿(5∼35℃、45∼75%)で保存して下さい。 ・ Avoid a sudden change in ambient temperature to prevent condensation on the module surfaces. モジュールの表面が結露しないよう、急激な温度変化を避けて下さい。 ・ Avoid places where corrosive gas generates or much dust exists. 腐食性ガスの発生場所、粉塵の多い場所は避けて下さい。 ・ Store the module terminals under unprocessed conditions モジュールの端子は未加工の状態で保管すること。 . ・ Avoid physical shock or falls during the transportation. 運搬時に衝撃を与えたり落下させないで下さい。 １５．Scope of application 適用範囲 This specification is applied to the IGBT-IPM (type: 6MBP50TEA060). 本仕様書は、IGBT-IPM (型式：6MBP50TEA060)に適用する 。 １６．Based safety standards 準拠安全規格 UL1557 Fuji Electric Co.,Ltd. DWG.NO. . This material and the information herein is the property of Fuji Electric Co.,Ltd.They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party,nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. W GNDV ⑥ VccW 0.1uF ② VccV 20kΩ 0.1uF 0.1uF ① AC200V C + V ② P ④ +10uF MS6M0700 a 14/23 H04-004-03 １８-１．Reliability Test Items Test items Mechanical Tests 1 Terminal strength 端子強度 (Pull test) 2 Mounting Strength 締付け強度 3 Vibration 振動 4 5 6 1 2 3 4 5 6 Reference norms EIAJ ED-4701 Test methods and conditions Pull force : 20 N (main terminal) 10 N (control terminal) Test time : 10 ±1 sec. Screw torque : 2.5 ~ 3.5 N･m (M5) Test time : 10 ±1 sec. Range of frequency : 10∼500 Hz Sweeping time : 15 min. Acceleration : 100 m/s2 Sweeping direction : Each X,Y,Z axis Test time : 6 hr. (2hr./direction) Shock Maximum acceleration : 5000 m/s2 Pulse width 1.0 ms 衝撃 Direction : Each X,Y,Z axis Test time : 3 times/direction Solderabitlity Solder temp. : 235 ±5 ℃ はんだ付け性 Immersion duration : 5.0 ±0.5 sec. Test time : 1 time Each terminal should be Immersed in solder within 1~1.5mm from the body. Resistance to Solder temp. : 260 ±5 ℃ soldering heat Immersion time : 10 ±1sec. はんだ耐熱性 Test time : 1 time Each terminal should be Immersed in solder within 1~1.5mm from the body. High temperature Storage temp. : 125 ±5 ℃ storage 高温保存 Test duration : 1000 hr. Low temperature Storage temp. : -40 ±5 ℃ storage 低温保存 Test duration : 1000 hr. Temperature Storage temp. : 85 ±2 ℃ humidity storage Relative humidity : 85 ±5% Test duration : 1000hr. 高温高湿保存 Unsaturated Test temp. : 120 ±2 ℃ pressure cooker Atmospheric pressure : 1.7x105 Pa : 85 ±5% プレッシャークッカー Test humidity Test duration : 96 hr. Temperature Test temp. : Minimum storage temp. -40 ±5℃ cycle Maximum storage temp. 125 ±5℃ Normal temp. 5 ~ 35℃ 温度サイクル Dwell time : Tmin ~ TN ~ Tmax ~ TN 1hr. 0.5hr. 1hr. 0.5hr. Number of cycles : 100 cycles +0 Thermal shock Test temp. : High temp. side 100 -5 ℃ 熱衝撃 +5 Fluid used Dipping time Transfer time Number of cycles Fuji Electric Co.,Ltd. : : : : Number Acceptance of sample number 5 (1:0) Test Method 402 methodⅡ Test Method 403 Condition code B 5 (1:0) 5 (1:0) Test Method 404 Condition code B 5 (1:0) Test Method 303 Condition code A 5 (1:0) Test Method 302 Condition code A 5 (1:0) Test Method 201 5 (1:0) Test Method 202 5 (1:0) Test Method 103 Test code C 5 (1:0) Test Method 103 Test code E 5 (1:0) Test Method 105 5 (1:0) Test Method 307 method Ⅰ Condition code A 5 (1:0) Test Method 401 MethodⅠ Low temp. side 0 -0 ℃ Pure water (running water) 5 min. par each temp. 10 sec. 10 cycles DWG.NO. . Test categories Environment Tests a MS6M0700 a 19/22 H04-004-03 a １８-２．Reliability Test Items Endurance Endurance Tests Tests Test categories Test items 1 High temperature reverse bias 高温逆ﾊﾞｲｱｽ 2 Temperature humidity bias 高温高湿ﾊﾞｲｱｽ 3 Intermitted operating life (Power cycle) 断続動作 Reference norms Number AcceptEIAJ of ance ED-4701 sample number Test methods and conditions Test temp. Bias Voltage Bias Method Test duration Test temp. Relative humidity Bias Voltage Bias Method Test duration ON time OFF time Test temp. Number of cycles : Ta = 125 ±5℃ (Tj ≦ 150 ℃) : VC = 0.8×VCES : Applied DC voltage to C-E Vcc = 15V : 1000 hr. : 85 ±2 ℃ : 85 ±5 % : VC = 0.8×VCES Vcc = 15V : Applied DC voltage to C-E : 1000 hr. : 2 sec. : 18 sec. : ∆ Tj=100 ±5deg Tj ≦ 150 ℃, Ta=25 ±5℃ : 15000 cycles Test Method 101 5 (1:0) Test Method 102 Condition code C 5 (1:0) Test Method 106 5 (1:0) １９．Failure Criteria Item Characteristic Electrical characteristic Visual inspection Leakage current Saturation voltage Forward voltage Thermal IGBT resistance FWD Over Current Protection Alarm signal hold time Isolation voltage Visual inspection Peeling Plating and the others Symbol Failure criteria Lower limit Upper limit Unit ICES VCE(sat) VF Ｒth(j-c) Ｒth(j-c) Ioc tALM Viso USL×2 USL×1.2 USL×1.2 USL×1.2 USL×1.2 LSL×0.8 USL×1.2 LSL×0.8 USL×1.2 Broken insulation mA V V ℃/W ℃/W Ａ ms - - The visual sample - Note LSL : Lower specified limit. USL : Upper specified limit. Fuji Electric Co.,Ltd. DWG.NO. . Note : Each parameter measurement read-outs shall be made after stabilizing the components at room ambient for 2 hours minimum, 24 hours maximum after removal from the tests. And in case of the wetting tests, for example, moisture resistance tests, each component shall be made wipe or dry completely before the measurement. MS6M0700 a 20/22 H04-004-03 Warnings 1. This product shall be used within its absolute maximum rating (voltage, current, and temperature). This product may be broken in case of using beyond the ratings. 製品の絶対最大定格（電圧，電流，温度等）の範囲内で御使用下さい。絶対最大定格を超えて使用すると、素 子が破壊する場合があります。 2. Connect adequate fuse or protector of circuit between three-phase line and this product to prevent the equipment from causing secondary destruction. 万一の不慮の事故で素子が破壊した場合を考慮し、商用電 源と本製品の間に適切な容量のヒューズ 又はブレーカーを必ず付けて２次破壊を防いでください。 3. When studying the device at a normal turn-off action, make sure that working paths of the turn-off voltage and current are within the RBSOA specification. And, when studying the device duty at a short-circuit current non-repetitive interruption, make sure that the paths are also within the avalanche proof (PAV) specification which is calculated from the snubber inductance, the IPM inner inductance and the turn-off current. In case of use of IGBT-IPM over these specifications, it might be possible to be broken. 通 常 のターンオフ動作における素子責務の検討の際には、ターンオフ電圧・電流の動作軌跡が RBSOA 仕様内にあることを確認して下さい。また、非繰返しの短絡電流遮断における素子責務の検討に際して は、スナバーインダクタンスとＩＰＭ内部インダクタンス及びターンオフ電流から算出されるアバランシェ耐 量 (PAV)仕 様 内である事を確認して下さい。これらの仕様を越えて使用すると、素子が破壊する場合が あります。 4. Use this product after realizing enough working on environment and considering of product's reliability life. This product may be broken before target life of the system in case of using beyond the product's reliability life. 製 品 の 使 用 環 境を十分に把握し、製品の信頼性寿命が満足できるか検討の上、本製品を適用して下さ い。製品の信頼性寿命を超えて使用した場合、装置の目標寿命より前に素子が破壊する場 合がありま す。 5. If the product had been used in the environment with acid, organic matter, and corrosive gas (For example : hydrogen sulfide, sulfurous acid gas), the product's performance and appearance can not be ensured easily. 酸・有機物・腐食性ガス（硫化水 素，亜硫酸ガス等）を含む環 境 下で使用された場合、製品 機 能・外観 などの保証は致しかねます。 6. Use the product within the power cycle curve (Technical Rep.No. : MT6M4057) Fuji Electric Co.,Ltd. DWG.NO. . 本 製 品 は、パワーサイクル寿命カーブ以下で使用下さい(技 術 資 料 No.: MT6M4057) a MS6M0700 21/22 H04-004-03 7. Never add mechanical stress to deform the main or control terminal. The deformed terminal may cause poor contact problem. 主端子及び制御端子に応力を与えて変形させないで下さい。 端子の変形により、接触不良などを引き起こす 場合があります。 8. If excessive static electricity is applied to the control terminals, the devices can be broken. Implement some countermeasures against static electricity. 制 御 端 子に過大な静電気が印加された場合、素子が破壊する場合があります。取り扱い時は静電気対 策を実施して下さい。 Caution 1. Fuji Electric is constantly making every endeavor to improve the product quality and reliability. However, semiconductor products may rarely happen to fail or malfunction. To prevent accidents causing injury or death, damage to property like by fire, and other social damage resulted from a failure or malfunction of the Fuji Electric semiconductor products, take some measures to keep safety such as redundant design, spread-fire-preventive design, and malfunction-protective design. 富士電機は耐えず製品の品質と信頼性の向上に努めています。しかし、半導体製品は故障が発生したり、誤 動作する場合があります。富士電機製半導体製品の故障または誤動作が、結果として人身事故・火災等によ る財産に対する損害や社会的な損害を起こさないように冗長設計・延焼防止設計・誤動作防止設計など安全 確保のための手段を講じて下さい。 2. The application examples described in this specification only explain typical ones that used the Fuji Electric products. This specification never ensure to enforce the industrial property and other rights, nor license the enforcement rights. 本仕様書に記載してある応用例は、富士電機製品を使用した代表的な応用例を説明するものであり、本仕書 によって工業所有権、その他権利の実施に対する保障または実施権の許諾を行うものではありません。 The product described in this specification is not designed nor made for being applied to the equipment or systems used under life-threatening situations. When you consider applying the product of this specification to particular used, such as vehicle-mounted units, shipboard equipment, aerospace equipment, medical devices, atomic control systems and submarine relaying equipment or systems, please apply after confirmation of this product to be satisfied about system construction and required reliability. 本仕様書に記載された製品は、人命にかかわるような状況下で使用される機器あるいはシステムに用いられ ることを目的として設計・製造されたものではありません。本仕様書の製品を車両機器、船舶、航空宇宙、医 療機器、原子力制御、海底中継機器あるいはシステムなど、特殊用途へのご利用をご検討の際は、システム 構成及び要求品質に満足することをご確認の上、ご利用下さい。 If there is any unclear matter in this specification, please contact Fuji Electric Co.,Ltd. Fuji Electric Co.,Ltd. DWG.NO. . 3. a MS6M0700 22/22 H04-004-03