STMICROELECTRONICS 1N5819

1N581x
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCTS CHARACTERISTICS
IF(AV)
1A
VRRM
40 V
Tj
150°C
VF (max)
0.45 V
FEATURES AND BENEFITS
n
n
n
n
n
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
LOW FORWARD VOLTAGE DROP
AVALANCHE CAPABILITY SPECIFIED
DO41
DESCRIPTION
Axial Power Schottky rectifier suited for Switch
Mode Power Supplies and high frequency DC to
DC converters. Packaged in DO41 these devices
are intended for use in low voltage, high frequency
inverters, free wheeling, polarity protection and
small battery chargers.
ABSOLUTE RATINGS (limiting values)
Symbol
Value
Parameter
VRRM
Repetitive peak reverse voltage
IF(RMS)
RMS forward current
1N5817 1N5818 1N5819
20
30
40
Unit
V
10
A
IF(AV)
Average forward current
TL = 125°C
δ = 0.5
1
A
IFSM
Surge non repetitive forward
current
tp = 10 ms
Sinusoidal
25
A
PARM
Repetitive peak avalanche
power
tp = 1µs
Tstg
Storage temperature range
Tj
dV/dt
* :
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
Tj = 25°C
1200
1200
900
W
- 65 to + 150
°C
150
°C
10000
V/µs
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
July 2003 - Ed: 4A
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1N581x
THERMAL RESISTANCES
Symbol
Parameter
Value
Unit
Rth (j-a)
Junction to ambient
Lead length = 10 mm
100
°C/W
Rth (j-l)
Junction to lead
Lead length = 10 mm
45
°C/W
1N5817 1N5818 1N5819
0.5
0.5
0.5
Unit
mA
STATIC ELECTRICAL CHARACTERISTICS
Symbol
IR *
Parameter
VF *
Tests Conditions
VR = VRRM
Reverse leakage
current
Tj = 25°C
Tj = 100°C
Forward voltage drop
Tj = 25°C
Tj = 25°C
10
10
10
mA
IF = 1 A
0.45
0.50
0.55
V
IF = 3 A
0.75
0.80
0.85
V
Pulse test : * tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equations :
P = 0.3 x IF(AV) + 0.090 IF2(RMS ) for 1N5817 / 1N5818
P = 0.3 x IF(AV) + 0.150 IF2(RMS ) for 1N5819
Fig. 1: Average forward power dissipation versus
average forward current (1N5817/1N5818).
Fig. 2: Average forward power dissipation versus
average forward current (1N5819).
PF(av)(W)
PF(av)(W)
0.6
0.7
δ = 0.2
δ = 0.1
0.5
δ = 0.5
δ = 0.1
0.6
δ = 0.05
δ = 0.2
δ = 0.5
δ = 0.05
0.5
0.4
δ=1
δ=1
0.4
0.3
0.3
0.2
0.2
T
0.1
T
0.1
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
tp
δ=tp/T
IF(av) (A)
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Fig. 2-1: Average forward current versus ambient
temperature (δ=0.5) (1N5817/1N5818).
Fig. 2-2: Average forward current versus ambient
temperature (δ=0.5) (1N5819).
δ=tp/T
IF(av) (A)
tp
IF(av)(A)
1.2
1.2
IF(av)(A)
Rth(j-a)=Rth(j-l)=45°C/W
Rth(j-a)=Rth(j-l)=45°C/W
1.0
1.0
0.8
0.8
Rth(j-a)=100°C/W
Rth(j-a)=100°C/W
0.6
0.6
0.4
0.4
T
T
0.2
0.2
δ=tp/T
0.0
2/5
0
25
δ=tp/T
Tamb(°C)
tp
50
75
100
125
150
0.0
0
Tamb(°C)
tp
25
50
75
100
125
150
1N581x
Fig. 3: Normalized avalanche power derating
versus pulse duration.
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.01
0.4
0.2
Tj(°C)
tp(µs)
0.001
0
0.01
0.1
1
10
100
Fig. 5-1: Non repetitive surge peak forward
current versus overload duration
(maximum values) (1N5817/1N5818).
10
8
50
75
100
125
150
IM(A)
7
8
6
7
6
5
Ta=25°C
5
Ta=25°C
Ta=75°C
4
Ta=75°C
4
3
3
Ta=100°C
Ta=100°C
2
IM
1
IM
t
1
t(s)
δ=0.5
0
1E-3
1E-2
1E-1
1E+0
Fig. 6: Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
printed circuit board, e(Cu)=35mm, recommended
pad layout).
1.0
25
Fig. 5-2: Non repetitive surge peak forward
current versus overload duration
(maximum values) (1N5819).
IM(A)
9
2
0
1000
t
t(s)
δ=0.5
0
1E-3
1E-2
1E-1
1E+0
Fig. 7: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
Zth(j-a)/Rth(j-a)
500
F=1MHz
Tj=25°C
0.8
200
1N5817
0.6
100
δ = 0.5
1N5818
50
0.4
δ = 0.2
0.2
T
δ = 0.1
0.0
1E-1
1N5819
20
Single pulse
1E+0
tp(s)
1E+1
δ=tp/T
1E+2
tp
1E+3
VR(V)
10
1
2
5
10
20
40
3/5
1N581x
Fig. 8-1: Reverse leakage current versus reverse
voltage applied (typical values) (1N5817/1N5818).
IR(mA)
1E+1
Fig. 8-2: Reverse leakage current versus reverse
voltage applied (typical values) (1N5819).
IR(mA)
1E+1
1N5818
Tj=125°C
Tj=125°C
1N5817
1E+0
1E+0
Tj=100°C
Tj=100°C
1E-1
1E-1
1E-2
1E-2
Tj=25°C
Tj=25°C
VR(V)
1E-3
0
5
10
VR(V)
15
20
25
30
Fig. 9-1: Forward voltage drop versus forward
current (typical values) (1N5817/1N5818).
10.00
IFM(A)
1E-3
0
5
40
Tj=100°C
Tj=25°C
0.10
VFM(V)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Fig. 10: Non repetitive surge peak forward current
versus number of cycles.
IFSM(A)
F=50Hz
Tj initial=25°C
25
20
15
10
5
Number of cycles
4/5
35
Tj=125°C
0.10
1
30
IFM(A)
Tj=100°C
0
20
1.00
Tj=125°C
30
15
Fig. 9-2: Forward voltage drop versus forward
current (typical values) (1N5819).
10.00
1.00
0.01
0.0
10
10
100
1000
Tj=25°C
VFM(V)
0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
1N581x
PACKAGE MECHANICAL DATA
DO41 plastic
DIMENSIONS
C
A
C
REF.
O
/D
O
/D
n
O
/ B
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.1
5.2
0.16
0.205
B
2
2.7
0.08
0.107
C
25.4
D
0.71
1
0.86
0.028
0.034
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
1N581x
Part number
cathode ring
DO41
0.34g
2000
Ammopack
1N581xRL
Part number
cathode ring
DO41
0.34g
5000
Tape & reel
Epoxy meets UL94,V0
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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