ETC BUT11AF/D

ON Semiconductor
FULL PAK
High Voltage NPN Power Transistor
For Isolated Package Applications
The BUT11AF was designed for use in line operated switching
power supplies in a wide range of end use applications. This device
combines the latest state of the art bipolar fabrication techniques to
provide excellent switching, high voltage capability and low
saturation voltage.
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BUT11AF
POWER TRANSISTOR
5.0 AMPERES
450 VOLTS
40 WATTS
1000 Volt VCES Rating
Low Base Drive Requirements
Isolated Overmold Package
Improved System Efficiency
No Isolating Washers Required
Reduced System Cost
High Isolation Voltage Capability (4500 VRMS)
CASE 221D–02
TO–220 TYPE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector–Emitter Sustaining Voltage
VCEO(sus)
450
Vdc
Collector–Emitter Breakdown Voltage
VCES
1000
Vdc
Emitter–Base Voltage
VEBO
9.0
Vdc
RMS Isolation Voltage (For 1 sec,
Per Figure 7
VISOL1
4500
TA = 25°C, Rel. Humidity < 30%)
Per Figure 8
VISOL2
3500
Per Figure 9
VISOL3
2500
Collector Current — Continuous
Collector Current — Pulsed (1)
IC
ICM
5.0
10
Adc
Base Current — Continuous
Base Current — Pulsed (1)
IB
IBM
2.0
4.0
Adc
Total Power Dissipation @ TC = 25°C*
Derated above 25°C
PD
40
0.32
Watts
W/°C
TJ, Tstg
– 65 to +150
°C
RθJC
3.125
°C/W
TL
260
°C
Operating and Storage Temperature Range
V
THERMAL CHARACTERISTICS
Thermal Resistance — Junction to Case*
Maximum Lead Temperature for soldering purposes
1/8″ from case for 5 sec.
(1) Pulse Test: Pulse Width = 5.0 ms, Duty Cycle ≤ 10%.
*Measurement made with thermocouple contacting the bottom insulated mounting surface of the package (in a location beneath the die),
the device mounted on a heatsink, thermal grease applied, and a mounting torque of 6 to 8 in . lbs.
 Semiconductor Components Industries, LLC, 2001
March, 2001 – Rev. 4
1
Publication Order Number:
BUT11AF/D
BUT11AF
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
VCEO(sus)
450
–
–
Vdc
–
–
–
–
1.0
2.0
OFF CHARACTERISTICS (1)
Collector-Emitter Sustaining Voltage (Figures 1 & 2)
(IC = 100 mAdc, IB = 0, L = 25 µH)
Collector Cutoff Current
(VCE = 1000 Vdc, VBE = 0)
(VCE = 1000 Vdc, VBE = 0, TJ = 125°C)
ICES
mAdc
Emitter-Base Leakage
(VEB = 9.0 Vdc, IC = 0)
IEBO
–
–
10
mAdc
Collector-Emitter Saturation Voltage
(IC = 2.5 Adc, IB = 0.5 Adc)
VCE(sat)
–
–
1.5
Vdc
Base-Emitter Saturation Voltage
(IC = 2.5 Adc, IB = 0.5 Adc)
VBE(sat)
–
–
1.5
Vdc
DC Current Gain
(IC = 5.0 mAdc, VCE = 5.0 Vdc)
hFE
10
–
–
–
–
–
Cc-hs
–
15
–
pF
ts
–
1100
1400
ns
tfi
–
80
150
ts
–
1200
1500
tfi
–
140
300
ton
–
–
1000
ts
–
–
4000
tf
–
–
800
ON CHARACTERISTICS (1)
DYNAMIC CHARACTERISTICS
Insulation Capacitance (Collector to External Heatsink)
SWITCHING CHARACTERISTICS
Inductive Load (Figures 3 & 4)
Storage
TJ = 25°C
Fall Time
Storage
IC = 2.5
2 5 Adc,
Adc IB1 = 0.5
0 5 Adc
TJ = 100°C
Fall Time
Resistive Load (Figures 5 & 6)
Turn-On Time
Storage Time
IC = 2.5 Adc,, IB1 = IB2 = 0.5 Adc
Fall Time
ns
(1) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%.
+50 V
250
L
200
IC
(mA)
100-200 Ω
VERT.
OSCILLOSCOPE
VIN
0
100
T
0
MIN
VCEO(sus)
tp
HOR.
OSCILLOSCOPE
1 Ω
VCE (V)
Figure 2. Test Circuit for VCEO(sus)
Figure 1. Oscilloscope Display for Sustaining Voltage
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2
BUT11AF
tr
VCC
IB
IB on
90%
10%
t
RL
VIN
IB off
RB
0
tp
IC on
90%
T.U.T.
T
IC
VCC = 250 V
VIN = -6 to +8 V
tp = 20 µs
tp = 0.01
T
10%
td
ton
Figure 3. Test Circuit Resistive Load
tf
ts
toff
t
Figure 4. Switching Times Waveforms with
Resistive Load
VCC
tr
IB1
90%
IB
LC
10%
t
VCL
+IB1
LB
-VBE
IB2
T.U.T.
IC on
90%
IC
7Z89211.2
VCL = 300 V
VCC = 30 V
VEB = 5 V
LB = 1 µH
VCL = 200 µH
10%
ts
toff
Figure 5. Test Circuit Inductive Load
tf
Figure 6. Switching Times Waveforms
with Inductive Load
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3
BUT11AF
TEST CONDITIONS FOR ISOLATION TESTS*
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.107″ MIN
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
LEADS
HEATSINK
HEATSINK
0.107″ MIN
0.110″ MIN
Figure 7. Screw or Clip Mounting Position
for Isolation Test Number 1
Figure 8. Clip Mounting Position
for Isolation Test Number 2
Figure 9. Screw Mounting Position
for Isolation Test Number 3
*Measurement made between leads and heatsink with all leads shorted together.
MOUNTING INFORMATION
4-40 SCREW
CLIP
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
HEATSINK
NUT
Figure 10. Typical Mounting Techniques
for Isolated Package
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw
torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant
pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in . lbs will
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package.
However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend exceeding
10 in . lbs of mounting torque under any mounting conditions.
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BUT11AF
PACKAGE DIMENSIONS
TO–220 FULLPAK
CASE 221D–02
ISSUE D
–T–
–B–
F
SEATING
PLANE
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
S
Q
U
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
U
A
1 2 3
H
–Y–
K
G
N
L
D
J
R
3 PL
0.25 (0.010)
M
B
M
Y
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5
INCHES
MIN
MAX
0.621
0.629
0.394
0.402
0.181
0.189
0.026
0.034
0.121
0.129
0.100 BSC
0.123
0.129
0.018
0.025
0.500
0.562
0.045
0.060
0.200 BSC
0.126
0.134
0.107
0.111
0.096
0.104
0.259
0.267
MILLIMETERS
MIN
MAX
15.78
15.97
10.01
10.21
4.60
4.80
0.67
0.86
3.08
3.27
2.54 BSC
3.13
3.27
0.46
0.64
12.70
14.27
1.14
1.52
5.08 BSC
3.21
3.40
2.72
2.81
2.44
2.64
6.58
6.78
BUT11AF
Notes
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BUT11AF
Notes
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BUT11AF
SWITCHMODE a a registered trademark of Semiconductor Components INdustries, LLC (SCILLC)
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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8
BUT11AF/D