NSC LMZ23605TZ

LMZ23605
5A SIMPLE SWITCHER® Power Module with 36V Maximum
Input Voltage
Easy to use 7 pin package
Performance Benefits
■
■
■
■
■
High efficiency reduces system heat generation
Complies with EN55022 Class B (Note 5)
Low component count, only 5 external components
Low output voltage ripple
Uses PCB as heat sink, no airflow required
System Performance
30116986
■
■
■
■
■
30W maximum total output power
Up to 5A output current
Input voltage range 6V to 36V
Output voltage range 0.8V to 6V
Efficiency up to 92%
100
5
90
80
4
70
60
3
50
40
2
30
20
1
10
0
0
0
1
2
3
4
OUTPUT CURRENT (A)
5
Key Features
■
■
■
■
■
Integrated shielded inductor
Simple PCB layout
Frequency synchronization input (650 kHz to 950 kHz)
Flexible startup sequencing using external soft-start,
tracking and precision enable
Protection against inrush currents and faults such as input
UVLO and output short circuit
– 40°C to 125°C junction temperature range
Single exposed pad and standard pinout for easy
mounting and manufacturing
Fast transient response for powering FPGAs and ASICs
Fully enabled for Webench® Power Designer
Pin compatible with LMZ22005/LMZ23603/LMZ22003
5
4
3
2
1
θJA=12°C/W
0
30 40 50 60 70 80 90 100 110 120 130
AMBIENT TEMPERATURE (°C)
30116989
Radiated EMI (EN 55022)
of Demo Board (See AN–2125)
Applications
■
■
■
■
6
MAXIMUM OUTPUT CURRENT (A)
■
30116903
Thermal derating curve
VIN = 12V VOUT = 5.0V
Point of load conversions from 12V and 24V input rail
Time critical projects
Space constrained / high thermal requirement applications
Negative output voltage applications See AN-2027
50
45
AMPLITUDE (dBuV/m)
■
■
■
■
DISSIPATION (W)
Electrical Specifications
Efficiency VIN = 12V VOUT = 5.0V
EFFICIENCY (%)
TO-PMOD 7 Pin Package
10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in)
θJA = 12°C/W, θJC = 1.9°C/W (Note 6)
RoHS Compliant
40
35
30
25
20
15
Class A Limit
Class B Limit
Horiz Peak
Horiz Quasi-peak
10
5
0
0
200
400
600
800
FREQUENCY (MHz)
1000
30116995
© 2011 National Semiconductor Corporation
301169
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LMZ23605 5A SIMPLE SWITCHER® Power Module with 36V Maximum Input Voltage
April 5, 2011
LMZ23605
Simplified Application Schematic
30116901
Connection Diagram
30116902
Top View
7-Lead TO-PMOD
Ordering Information
Order Number
Package Type
NSC Package Drawing
Supplied As
LMZ23605TZ
TO-PMOD-7
TZA07A
45 Units in a Rail
LMZ23605TZE
TO-PMOD-7
TZA07A
250 Units on Tape and Reel
LMZ23605TZX
TO-PMOD-7
TZA07A
500 Units on Tape and Reel
Pin Descriptions
Pin
1
2
3
4
5
Name Description
VIN
Supply input — Nominal operating range is 6V to 36V . A small amount of internal capacitance is contained within
the package assembly. Additional external input capacitance is required between this pin and exposed pad (PGND).
SYNC Sync Input — Apply a CMOS logic level square wave whose frequency is between 650 kHz and 950 kHz to
synchronize the PWM operating frequency to an external frequency source. When not using synchronization connect
to ground. The module free running PWM frequency is 812 kHz (Typ).
EN
Enable — Input to the precision enable comparator. Rising threshold is 1.279V typical. Once the module is enabled,
a 21 uA source current is internally activated to facilitate programmable hysteresis.
AGND Analog Ground — Reference point for all stated voltages. Must be externally connected to PGND (EP).
FB
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Feedback — Internally connected to the regulation amplifier, over-voltage comparators. The regulation reference
point is 0.796V at this input pin. Connect the feedback resistor divider between the output and AGND to set the output
voltage.
2
6
Name Description
SS/
TRK
Soft-Start/Track — To extend the 1.6 mSec internal soft-start connect an external soft start capacitor. For tracking
connect to an external resistive divider connected to a higher priority supply rail. See applications section
7
VOUT Output Voltage — Output from the internal inductor. Connect the output capacitor between this pin and exposed pad.
EP
PGND Exposed Pad / Power Ground Electrical path for the power circuits within the module. — NOT Internally connected
to AGND / pin 4. Used to dissipate heat from the package during operation. Must be electrically connected to pin 4
external to the package.
3
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LMZ23605
Pin
LMZ23605
ESD Susceptibility (Note 2)
For soldering specifications:
see product folder at www.national.com and
www.national.com/ms/MS/MS-SOLDERING.pdf
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
VIN to PGND
EN, SYNC to AGND
SS/TRK, FB to AGND
AGND to PGND
Junction Temperature
Storage Temperature Range
Operating Ratings
-0.3V to 40V
-0.3V to 5.5V
-0.3V to 2.5V
-0.3V to 0.3V
150°C
-65°C to 150°C
± 2 kV
(Note 1)
VIN
EN, SYNC
Operation Junction Temperature
6V to 36V
0V to 5.0V
−40°C to 125°C
Electrical Characteristics
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the
junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are guaranteed through test, design or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
Unless otherwise stated the following conditions apply: VIN = 12V, Vout = 3.3V
Symbol
Parameter
Conditions
Min
(Note 3)
Typ
(Note 4)
Max
(Note 3)
1.10
1.279
1.458
Units
SYSTEM PARAMETERS
Enable Control
VEN
EN threshold trip point
VEN rising
EN input hysteresis current
VEN > 1.279V
ISS
SS source current
VSS = 0V
tSS
Internal soft-start interval
VEN-HYS
–21
V
µA
Soft-Start
40
50
60
1.6
µA
msec
Current Limit
ICL
Current limit threshold
d.c. average
5.4
Sync input connected to ground.
711
A
Internal Switching Oscillator
fosc
Free-running oscillator
frequency
fsync
Synchronization range
650
VIL-sync
Synchronization logic zero
amplitude
Relative to AGND
VIH-sync
Synchronization logic one
amplitude
Relative to AGND.
Sync d.c.
Synchronization duty cycle
range
Dmax
812
914
kHz
950
kHz
0.4
V
V
1.5
15
Maximum Duty Factor
50
85
83
%
%
Regulation and Over-Voltage Comparator
VFB
VFB-OV
In-regulation feedback voltage
VSS >+ 0.8V
IO = 5A
0.776
Feedback over-voltage
protection threshold
0.796
0.86
0.816
V
V
IFB
Feedback input bias current
5
nA
IQ
Non Switching Input Current
VFB= 0.86V
2.6
mA
ISD
Shut Down Quiescent Current
VEN= 0V
70
μA
Thermal Shutdown
Rising
165
°C
Thermal shutdown hysteresis
Falling
15
°C
Junction to Ambient(Note 6)
4 layer Evaluation Printed Circuit Board,
60 vias, No air flow
12.0
°C/W
2 layer JEDEC Printed Circuit Board, No
air flow
21.5
°C/W
No air flow
1.9
°C/W
Thermal Characteristics
TSD
TSD-HYST
θJA
θJC
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Junction to Case
4
Parameter
Min
(Note 3)
Conditions
Typ
(Note 4)
Max
(Note 3)
Units
PERFORMANCE PARAMETERS(Note 7)
ΔVO
Output voltage ripple
Cout = 220uF w/ 7 milliohm ESR +
100uF X7R + 2 x 0.047uF BW@ 20 MHz
9
mV PP
ΔVO/ΔVIN
Line regulation
VIN = 12V to 36V, IO= 0.001A
±0.02
%
ΔVO/ΔIOUT
Load regulation
η
Peak efficiency
VIN = 12V, IO= 0.001A to 5A
1
mV/A
VIN = 12V VO = 3.3V IO = 1A
86
%
η
Full load efficiency
VIN = 12V VO = 3.3V IO = 5A
81.5
%
η
Peak efficiency
VIN = 24V VO = 3.3V IO = 2A
80
%
η
Full load efficiency
VIN = 24V VO = 3.3V IO = 5A
76
%
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114.
Note 3: Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical
Quality Control (SQC) methods. Limits are used to calculate National’s Average Outgoing Quality Level (AOQL).
Note 4: Typical numbers are at 25°C and represent the most likely parametric norm.
Note 5: EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2125 and layout for information on device under test. Vin = 24V Vo = 3.3V Io = 5A
Note 6: Theta JA measured on a 3.5” x 3.5” four layer board, with three ounce copper on outer layers and two ounce copper on inner layers, sixty 10 mil thermal
vias, no air flow, and 1W power dissipation. Refer to application note layout diagrams.
Note 7: Refer to BOM in Table 1.
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LMZ23605
Symbol
Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty
Polymer + 10 uF Ceramic; Tambient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at
light loads resulting in slightly higher output ripple – See applications section.
Dissipation 6.0V output @ 25°C ambient
100
7
90
6
DISSIPATION (W)
EFFICIENCY (%)
Efficiency 6.0V output @ 25°C ambient
80
70
10 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
60
50
40
0
1
2
3
4
OUTPUT CURRENT (A)
36 Vin
30 Vin
24 Vin
20 Vin
12 Vin
10 Vin
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
30116987
Dissipation 5.0V output @ 25°C ambient
7
90
6
DISSIPATION (W)
100
80
70
60
9 VIn
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
50
40
0
1
2
3
4
OUTPUT CURRENT (A)
36 Vin
30 Vin
24 Vin
20 Vin
12 Vin
9 Vin
5
4
3
2
1
0
5
0
30116952
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5
30116988
Efficiency 5.0V output @ 25°C ambient
EFFICIENCY (%)
LMZ23605
Typical Performance Characteristics
1
2
3
4
OUTPUT CURRENT (A)
5
30116953
6
7
90
6
DISSIPATION (W)
EFFICIENCY (%)
Dissipation 3.3V output @ 25°C ambient
100
80
70
60
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
50
40
0
1
2
3
4
OUTPUT CURRENT (A)
36 Vin
30 Vin
24 Vin
20 Vin
12 Vin
9 Vin
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
5
30116954
30116955
Dissipation 2.5V output @ 25°C ambient
90
7
80
6
DISSIPATION (W)
EFFICIENCY (%)
Efficiency 2.5V output @ 25°C ambient
70
60
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
50
40
30
0
1
2
3
4
OUTPUT CURRENT (A)
36 Vin
30 Vin
24 Vin
20 Vin
12 Vin
9 Vin
6 Vin
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
5
30116956
30116957
Dissipation 1.8V output @ 25°C ambient
90
7
80
6
DISSIPATION (W)
EFFICIENCY (%)
Efficiency 1.8V output @ 25°C ambient
70
60
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin*
50
40
30
0
1
2
3
4
OUTPUT CURRENT (A)
LMZ23605
Efficiency 3.3V output @ 25°C ambient
36 Vin*
30 Vin
24 Vin
20 Vin
12 Vin
9 Vin
6 Vin
5
4
3
2
1
0
5
0
30116958
1
2
3
4
OUTPUT CURRENT (A)
5
30116959
7
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Dissipation 1.5V output @ 25°C ambient
85
7
DISSIPATION (W)
EFFICIENCY (%)
65
55
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin*
36 Vin*
45
35
25
36 Vin*
30 Vin*
24 Vin
20 Vin
12 Vin
9 Vin
6 Vin
6
75
0
1
2
3
4
OUTPUT CURRENT (A)
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
30116960
7
70
6
DISSIPATION (W)
EFFICIENCY (%)
Dissipation 1.2V output @ 25°C ambient
80
60
50
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin*
36 Vin*
40
30
20
0
1
2
3
4
OUTPUT CURRENT (A)
36 Vin*
30 Vin*
24 Vin
20 Vin
12 Vin
9 Vin
6 Vin
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
30116962
Dissipation 1.0V output @ 25°C ambient
7
70
6
DISSIPATION (W)
80
60
50
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin*
30 Vin*
36 Vin*
30
20
0
1
2
3
4
OUTPUT CURRENT (A)
36 Vin*
30 Vin*
24 Vin*
20 Vin
12 Vin
9 VIn
6 Vin
5
4
3
2
1
0
5
0
30116964
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5
30116963
Efficiency 1.0V output @ 25°C ambient
40
5
30116961
Efficiency 1.2V output @ 25°C ambient
EFFICIENCY (%)
LMZ23605
Efficiency 1.5V output @ 25°C ambient
1
2
3
4
OUTPUT CURRENT (A)
5
30116965
8
7
60
6
DISSIPATION (W)
EFFICIENCY (%)
Dissipation 0.8V output @ 25°C ambient
70
50
40
6 Vin
9 Vin
12 Vin
20 Vin*
24 Vin*
30 Vin*
36 Vin*
30
20
10
0
36 Vin*
30 Vin*
24 Vin*
20 Vin*
12 Vin
9 Vin
6 Vin
5
4
3
2
1
0
1
2
3
4
OUTPUT CURRENT (A)
5
0
1
2
3
4
OUTPUT CURRENT (A)
5
30116990
30116991
Efficiency 6.0V output @ 85°C ambient
Dissipation 6.0V output @ 85°C ambient
100
8
DISSIPATION (W)
90
EFFICIENCY (%)
36 Vin
30 Vin
24 Vin
20 Vin
12 Vin
10 Vin
7
80
70
60
10 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
50
40
0
1
2
3
4
OUTPUT CURRENT (A)
6
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
5
30116926
30116927
Efficiency 5.0V output @ 85°C ambient
Dissipation 5.0V output @ 85°C ambient
100
8
DISSIPATION (W)
90
EFFICIENCY (%)
36 Vin
30 Vin
24 Vin
20 Vin
12 Vin
9 Vin
7
80
70
60
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
50
40
0
LMZ23605
Efficiency 0.8V output @ 25°C ambient
1
2
3
4
OUTPUT CURRENT (A)
6
5
4
3
2
1
0
5
0
30116928
1
2
3
4
OUTPUT CURRENT (A)
5
30116929
9
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Dissipation 3.3V output @ 85°C ambient
90
8
DISSIPATION (W)
EFFICIENCY (%)
36 Vin
30 Vin
24 Vin
20 Vin
12 Vin
9 Vin
7
80
70
60
50
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
40
30
0
1
2
3
4
OUTPUT CURRENT (A)
6
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
30116930
Dissipation 2.5V output @ 85°C ambient
90
8
DISSIPATION (W)
80
EFFICIENCY (%)
36 Vin
30 Vin
24 Vin
20 Vin
12 Vin
9 Vin
6 Vin
7
70
60
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
50
40
6
5
4
3
2
1
30
0
0
1
2
3
4
OUTPUT CURRENT (A)
5
0
1
2
3
4
OUTPUT CURRENT (A)
30116932
Dissipation 1.8V output @ 85°C ambient
90
8
36 Vin*
30 Vin
24 Vin
20 Vin
12 Vin
9 Vin
6 Vin
7
DISSIPATION (W)
80
70
60
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin*
50
40
30
0
1
2
3
4
OUTPUT CURRENT (A)
5
30116933
Efficiency 1.8V output @ 85°C ambient
6
5
4
3
2
1
0
5
0
30116934
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5
30116931
Efficiency 2.5V output @ 85°C ambient
EFFICIENCY (%)
LMZ23605
Efficiency 3.3V output @ 85°C ambient
1
2
3
4
OUTPUT CURRENT (A)
5
30116935
10
Dissipation 1.5V output @ 85°C ambient
80
8
DISSIPATION (W)
70
EFFICIENCY (%)
36 Vin*
30 Vin*
24 Vin
20 Vin
12 Vin
9 Vin
6 Vin
7
60
50
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin*
36 Vin*
40
30
20
0
1
2
3
4
OUTPUT CURRENT (A)
6
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
5
30116936
30116937
Efficiency 1.2V output @ 85°C ambient
Dissipation 1.2V output @ 85°C ambient
80
8
DISSIPATION (W)
70
EFFICIENCY (%)
36 Vin*
30 Vin*
24 Vin
20 Vin
12 Vin
9 Vin
6 Vin
7
60
50
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin*
36 Vin*
40
30
20
0
1
2
3
4
OUTPUT CURRENT (A)
6
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
5
30116938
30116939
Efficiency 1.0V output @ 85°C ambient
Dissipation 1.0V output @ 85°C ambient
75
8
DISSIPATION (W)
EFFICIENCY (%)
65
55
45
6 Vin
9 Vin
12 Vin
20 Vin
24 Vin*
30 Vin*
36 Vin*
25
15
36 Vin*
30 Vin*
24 Vin*
20 Vin
12 Vin
9 Vin
6 Vin
7
35
0
1
2
3
4
OUTPUT CURRENT (A)
LMZ23605
Efficiency 1.5V output @ 85°C ambient
6
5
4
3
2
1
0
5
0
30116940
1
2
3
4
OUTPUT CURRENT (A)
5
30116941
11
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Dissipation 0.8V output @ 85°C ambient
70
8
DISSIPATION (W)
EFFICIENCY (%)
36 Vin*
30 Vin*
24 Vin*
20 Vin*
12 Vin
9 Vin
6 Vin
7
60
50
40
6 Vin
9 Vin
12 Vin
20 Vin*
24 Vin*
30 Vin*
36 Vin*
30
20
0
1
2
3
4
OUTPUT CURRENT (A)
6
5
4
3
2
1
0
5
0
1
2
3
4
OUTPUT CURRENT (A)
30116992
Thermal derating VIN= 12V, VOUT = 3.3V
6
MAXIMUM OUTPUT CURRENT (A)
MAXIMUM OUTPUT CURRENT (A)
6
5
4
3
2
1
0
θJA=12°C/W
5
4
3
2
1
0
30 40 50 60 70 80 90 100 110 120 130
AMBIENT TEMPERATURE (°C)
θJA = 12 °C/W
30 40 50 60 70 80 90 100 110 120 130
TEMPERATURE (°C)
30116989
30116994
Thermal derating VIN = 24V, VOUT = 5.0V
Thermal derating VIN = 24V, VOUT = 3.3V
MAXCIMUM OUTPUT CURRENT (A)
6
5
4
3
2
1
θJA=12°C/W
0
30 40 50 60 70 80 90 100 110 120 130
AMBIENT TEMPERATURE (°C)
6
5
4
3
2
1
0
θJA=12°C/W
30 40 50 60 70 80 90 100 110 120 130
AMBIENT TEMPERATURE (°C)
30116996
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5
30116993
Thermal derating VIN = 12V, VOUT = 5.0V
MAXIMUM OUTPUT CURRENT (A)
LMZ23605
Efficiency 0.8V output @ 85°C ambient
30116997
12
NORMALLIZED OUTPUT VOLTAGE (V/V)
LMZ23605
Normalized Line and load regulation VOUT = 3.3V
Output ripple
12VIN 3.3VO @ 5A, BW = 20 MHz
1.002
1.001
1.000
9 Vin
12 Vin
20 Vin
24 Vin
30 Vin
36 Vin
0.999
0.998
0
1
2
3
4
OUTPUT CURRENT (A)
5
30116905
30116942
Output ripple
12VIN 3.3VO@ 5A BW = 250 MHz
Transient response
12VIN 3.3VO0.5 to 5A Step
30116906
30116908
Short circuit current vs input voltage
9
8
CURRENT (A)
7
6
Output Current
5
4
3
2
Input Current
1
0
0
4
8 12 16 20 24 28 32 36
INPUT VOLTAGE (V)
30116918
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LMZ23605
Block Diagram
30116910
ENABLE DIVIDER, RENT, RENB AND RENHSELECTION
Internal to the module is a 2 mega ohm pull-up resistor connected from VIN to Enable. For applications not requiring
precision under voltage lock out (UVLO), the Enable input
may be left open circuit and the internal resistor will always
enable the module. In such case, the internal UVLO occurs
typically at 4.3V (VINrising).
In applications with separate supervisory circuits Enable can
be directly interfaced to a logic source. In the case of sequencing supplies, the divider is connected to a rail that
becomes active earlier in the power-up cycle than the
LMZ23605 output rail.
Enable provides a precise 1.279V threshold to allow direct
logic drive or connection to a voltage divider from a higher
enable voltage such as VIN. Additionally there is 21 μA(typ) of
switched offset current allowing programmable hysteresis.
See Figure 1.
The function of the enable divider is to allow the designer to
choose an input voltage below which the circuit will be disabled. This implements the feature of programmable UVLO.
The two resistors should be chosen based on the following
ratio:
RENT / RENB = (VIN UVLO / 1.279V) – 1 (1)
General Description
The LMZ23605 SIMPLE SWITCHER© power module is an
easy-to-use step-down DC-DC solution capable of driving up
to 5A load. The LMZ23605 is available in an innovative package that enhances thermal performance and allows for hand
or machine soldering.
The LMZ23605 can accept an input voltage rail between 6V
and 36V and deliver an adjustable and highly accurate output
voltage as low as 0.8V. The LMZ23605 only requires two external resistors and three external capacitors to complete the
power solution. The LMZ23605 is a reliable and robust design
with the following protection features: thermal shutdown, programmable input under-voltage lockout, output over-voltage
protection, short-circuit protection, output current limit, and
allows startup into a pre-biased output. The sync input allows
synchronization over the 650 to 950 kHz switching frequency
range.
Design Steps for the LMZ23605
Application
The LMZ23605 is fully supported by Webench® which offers:
component selection, electrical and thermal simulations. Additionally there are both evaluation and demonstration boards
that may be used as a starting point for design. The following
list of steps can be used to manually design the LMZ23605
application.
All references to values refer to the typical applications
schematic figure 4.
• Select minimum operating VIN with enable divider resistors
• Program VO with resistor divider selection
• Select CO
• Select CIN
• Determine module power dissipation
• Layout PCB for required thermal performance
The LMZ23605 typical application shows 12.7kΩ for RENB and
42.2kΩ for RENT resulting in a rising UVLO of 5.46V. Note that
this divider presents 8.33V to the input when the divider is
raised to 36V which would exceed the recommended 5.5V
limit for Enable. A midpoint 5.1V Zener clamp is applied to
allow the application to cover the full 6V to 36V range of operation. The zener clamp is not required if the target application prohibits the maximum Enable input voltage from being
exceeded.
Additional enable voltage hysteresis can be added with the
inclusion of RENH. It is possible to select values for RENT and
RENB such that RENH is a value of zero allowing it to be omitted
from the design.
Rising threshold can be calculated as follows:
VEN(rising) = 1.279 ( 1 + (RENT|| 2 meg)/ RENB)
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14
LMZ23605
Whereas the falling threshold level can be calculated using:
VEN(falling) = VEN(rising) – 21 µA ( RENT|| 2 meg || RENTB +
RENH )
Enable input detail
30116909
FIGURE 1.
Using a 0.22μF capacitor results in 3.5 msec typical soft-start
duration; and 0.47μF results in 7.5 msec typical. 0.47 μF is a
recommended initial value.
As the soft-start input exceeds 0.796V the output of the power
stage will be in regulation and the 50 μA current is deactivated. Note that the following conditions will reset the soft-start
capacitor by discharging the SS input to ground with an internal current sink.
• The Enable input being pulled low
• Thermal shutdown condition
• Internal Vcc UVLO (Approx 4.3V input to VIN)
OUTPUT VOLTAGE SELECTION
Output voltage is determined by a divider of two resistors
connected between VO and ground. The midpoint of the divider is connected to the FB input.
The regulated output voltage determined by the external divider resistors RFBT and RFBB is:
VO = 0.796V * (1 + RFBT / RFBB) (2)
Rearranging terms; the ratio of the feedback resistors for a
desired output voltage is:
RFBT / RFBB = (VO / 0.796V) - 1 (3)
These resistors should generally be chosen from values in the
range of 1.0 kΩ to 10.0 kΩ.
TRACKING SUPPLY DIVIDER OPTION
The tracking function allows the module to be connected as
a slave supply to a primary voltage rail (often the 3.3V system
rail) where the slave module output voltage is lower than that
of the master. Proper configuration allows the slave rail to
power up coincident with the master rail such that the voltage
difference between the rails during ramp-up is small (i.e.
<0.15V typ). The values for the tracking resistive divider
should be selected such that the effect of the internal 50uA
current source is minimized. In most cases the ratio of the
tracking divider resistors is the same as the ratio of the output
voltage setting divider. Proper operation in tracking mode dictates the soft-start time of the slave rail be shorter than the
master rail; a condition that is easy satisfy since the CSS cap
is replaced by RTKB. The tracking function is only supported
for the power up interval of the master supply; once the SS/
TRK rises past 0.8V the input is no longer enabled and the 50
uA internal current source is switched off.
For VO = 0.8V the FB pin can be connected to the output directly and RFBB can be set to 8.06kΩ to provide minimum
output load.
A table of values for RFBT , and RFBB, is included in the simplified applications schematic on page 2.
SOFT-START CAPACITOR SELECTION
Programmable soft-start permits the regulator to slowly ramp
to its steady state operating point after being enabled, thereby
reducing current inrush from the input supply and slowing the
output voltage rise-time.
Upon turn-on, after all UVLO conditions have been passed,
an internal 1.6mSec circuit slowly ramps the SS/TRK input to
implement internal soft start. If 2 mSec is an adequate turn–
on time then the Css capacitor can be left unpopulated.
Longer soft-start periods are achieved by adding an external
capacitor to this input.
Soft start duration is given by the formula:
tSS = VREF * CSS / Iss = 0.796V * CSS / 50uA (4)
This equation can be rearranged as follows:
CSS = tSS * 50μA / 0.796V (5)
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LMZ23605
Tracking option input detail
(As a point of reference, the worst case ripple current will occur when the module is presented with full load current and
when VIN = 2 * VO).
Recommended minimum input capacitance is 22uF X7R (or
X5R) ceramic with a voltage rating at least 25% higher than
the maximum applied input voltage for the application. It is
also recommended that attention be paid to the voltage and
temperature derating of the capacitor selected. It should be
noted that ripple current rating of ceramic capacitors may be
missing from the capacitor data sheet and you may have to
contact the capacitor manufacturer for this parameter.
If the system design requires a certain minimum value of
peak-to-peak input ripple voltage (ΔVIN) be maintained then
the following equation may be used.
CIN ≥ IO * D * (1–D) / fSW-CCM * ΔVIN(9)
If ΔVIN is 1% of VIN for a 12V input to 3.3V output application
this equals 120 mV and fSW = 812 kHz.
30116915
CIN≥ 5A * 3.3V/12V * (1– 3.3V/12V) / (812000 * 0.12 V)
≥ 10.2μF
FIGURE 2.
CO SELECTION
None of the required CO output capacitance is contained within the module. A minimum value of 200 μF is required based
on the values of internal compensation in the error amplifier.
Low ESR tantalum, organic semiconductor or specialty polymer capacitor types are recommended for obtaining lowest
ripple. The output capacitor CO may consist of several capacitors in parallel placed in close proximity to the module.
The output capacitor assembly must also meet the worst case
minimum ripple current rating of 0.5 * ILR P-P, as calculated in
equation (14) below. Beyond that, additional capacitance will
reduce output ripple so long as the ESR is low enough to permit it. Loop response verification is also valuable to confirm
closed loop behavior.
For applications with dynamic load steps; the following equation provides a good first pass approximation of CO for load
transient requirements. Where VO-Tran is 100mV on a 3.3V
output design.
Additional bulk capacitance with higher ESR may be required
to damp any resonant effects of the input capacitance and
parasitic inductance of the incoming supply lines. The
LMZ23605 typical applications schematic and evaluation
board include a 150 μF 50V aluminum capacitor for this function. There are many situations where this capacitor is not
necessary.
POWER DISSIPATION AND BOARD THERMAL
REQUIREMENTS
When calculating module dissipation use the maximum input
voltage and the average output current for the application.
Many common operating conditions are provided in the characteristic curves such that less common applications can be
derived through interpolation. In all designs, the junction temperature must be kept below the rated maximum of 125°C.
CO≥IO-Tran*/((VO-Tran – ESR * IO-Tran)*(Fsw / VO)(6)
For the design case of VIN = 24V, VO = 3.3V, IO = 5A, and
TAMB(MAX) = 85°C, the module must see a thermal resistance
from case to ambient of less than:
Solving:
θCA< (TJ-MAX – TA-MAX) / PIC-LOSS - θJC (10)
CO≥ 4.5A / ((0.1V – .007*4.5) * ( 800000 / 3.3) ≥ 271μF (7)
Given the typical thermal resistance from junction to case to
be 1.9 °C/W. Use the 85°C power dissipation curves in the
Typical Performance Characteristics section to estimate the
PIC-LOSS for the application being designed. In this application
it is 5.5W. (Note that for package dissipations above 5W air
flow or external heat sinking may be required.)
Note that the stability requirement for 200 µF minimum output
capacitance will take precedence.
One recommended output capacitor combination is a 220uF,
7 milliohm ESR specialty polymer cap in parallel with a 100
uF 6.3V X5R ceramic. This combination provides excellent
performance that may exceed the requirements of certain applications. Additionally some small ceramic capacitors can be
used for high frequency EMI suppression.
θCA = (125 – 85) / 5.5W – 1.9 = 5.37 (11)
To reach θCA = 5.37., the PCB is required to dissipate heat
effectively. With no airflow and no external heat-sink, a good
estimate of the required board area covered by 2 oz. copper
on both the top and bottom metal layers is:
CIN SELECTION
The LMZ23605 module contains a small amount of internal
ceramic input capacitors. Additional input capacitance is required external to the module to handle the input ripple current
of the application. The input capacitor can be several capacitors in parallel. This input capacitance should be located in
very close proximity to the module. Input capacitor selection
is generally directed to satisfy the input ripple current requirements rather than by capacitance value. Input ripple current
rating is dictated by the equation:
Board_Area_cm2 = 500°C x cm2/W / θCA (12)
As a result, approximately 93 square cm of 2 oz copper on
top and bottom layers is required for the PCB design. The
PCB copper heat sink must be connected to the exposed pad.
Approximately sixty, 10mil (254 μm) thermal vias spaced 39
mils (1.0 mm) apart connect the top copper to the bottom
copper. For an example of a high thermal performance PCB
layout for SIMPLE SWITCHER© power modules, refer to
AN-2085, AN-2125, AN-2020 and AN-2026.
I(CIN(RMS)) ≊ 1 /2 * IO * SQRT (D / 1-D) (8)
where D ≊ VO / VIN
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16
Additional Features
SYNCHRONIZATION INPUT
The PWM switching frequency can be synchronized to an external frequency source. If this feature is not used, connect
this input either directly to ground, or connect to ground
through a resistor of 1.5 kΩ ohm or less. The allowed synchronization frequency range is 650kHz to 950 kHz. The
typical input threshold is 1.4V transition level. Ideally the input
clock should overdrive the threshold by a factor of 2, so direct
drive from 3.3V logic via a 1.5kΩ Thevenin source resistance
is recommended. Note that applying a sustained “logic 1” corresponds to zero hertz PWM frequency and will cause the
module to stop switching.
OUTPUT OVER-VOLTAGE PROTECTION
If the voltage at FB is greater than a 0.86V internal reference,
the output of the error amplifier is pulled toward ground, causing VO to fall.
30116911
FIGURE 3.
CURRENT LIMIT
The LMZ23605 is protected by both low side (LS) and high
side (HS) current limit circuitry. The LS current limit detection
is carried out during the off-time by monitoring the current
through the LS synchronous MOSFET. Referring to the Functional Block Diagram, when the top MOSFET is turned off, the
inductor current flows through the load, the PGND pin and the
internal synchronous MOSFET. If this current exceeds 5.4A
(typical) the current limit comparator disables the start of the
next switching period. Switching cycles are prohibited until
current drops below the limit. It should also be noted that d.c.
current limit is dependent on both duty cycle as illustrated in
the graph in the typical performance section. The HS current
limit monitors the current of top side MOSFET. Once HS current limit is detected (7A typical) , the HS MOSFET is shut off
immediately, until the next cycle. Exceeding HS current limit
causes VO to fall. Typical behavior of exceeding LS current
limit is that fSW drops to 1/2 of the operating frequency.
1. Minimize area of switched current loops.
From an EMI reduction standpoint, it is imperative to minimize
the high di/dt paths during PC board layout as shown in the
figure above. The high current loops that do not overlap have
high di/dt content that will cause observable high frequency
noise on the output pin if the input capacitor (Cin1) is placed
at a distance away from the LMZ23605. Therefore place
CIN1 as close as possible to the LMZ23605 VIN and PGND
exposed pad. This will minimize the high di/dt area and reduce
radiated EMI. Additionally, grounding for both the input and
output capacitor should consist of a localized top side plane
that connects to the PGND exposed pad (EP).
2. Have a single point ground.
The ground connections for the feedback, soft-start, and enable components should be routed to the AGND pin of the
device. This prevents any switched or load currents from
flowing in the analog ground traces. If not properly handled,
poor grounding can result in degraded load regulation or erratic output voltage ripple behavior. Additionally provide the
single point ground connection from pin 4 (AGND) to EP/
PGND.
3. Minimize trace length to the FB pin.
Both feedback resistors, RFBT and RFBB should be located
close to the FB pin. Since the FB node is high impedance,
maintain the copper area as small as possible. The traces
from RFBT, RFBB should be routed away from the body of the
LMZ23605 to minimize possible noise pickup.
4. Make input and output bus connections as wide as
possible.
This reduces any voltage drops on the input or output of the
converter and maximizes efficiency. To optimize voltage accuracy at the load, ensure that a separate feedback voltage
sense trace is made to the load. Doing so will correct for voltage drops and provide optimum output accuracy.
5. Provide adequate device heat-sinking.
Use an array of heat-sinking vias to connect the exposed pad
to the ground plane on the bottom PCB layer. If the PCB has
a plurality of copper layers, these thermal vias can also be
employed to make connection to inner layer heat-spreading
THERMAL PROTECTION
The junction temperature of the LMZ23605 should not be allowed to exceed its maximum ratings. Thermal protection is
implemented by an internal Thermal Shutdown circuit which
activates at 165 °C (typ) causing the device to enter a low
power standby state. In this state the main MOSFET remains
off causing VO to fall, and additionally the CSS capacitor is
discharged to ground. Thermal protection helps prevent
catastrophic failures for accidental device overheating. When
the junction temperature falls back below 150 °C (typ Hyst =
15°C) the SS pin is released, VO rises smoothly, and normal
operation resumes.
Applications requiring maximum output current especially
those at high input voltage may require additional derating at
elevated temperatures.
PRE-BIASED STARTUP
The LMZ23605 will properly start up into a pre-biased output.
This startup situation is common in multiple rail logic applications where current paths may exist between different power
rails during the startup sequence. The following scope capture shows proper behavior in this mode. Trace one is Enable
17
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LMZ23605
ground planes. For best results use a 6 x 10 via array with
minimum via diameter of 10mils (254 μm) thermal vias spaced
39mils (1.0 mm). Ensure enough copper area is used for heatsinking to keep the junction temperature below 125°C.
PC BOARD LAYOUT GUIDELINES
PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance of a DCDC converter and surrounding circuitry by contributing to EMI,
ground bounce and resistive voltage drop in the traces. These
can send erroneous signals to the DC-DC converter resulting
in poor regulation or instability. Good layout can be implemented by following a few simple design rules. A good example layout is shown in Figure 5.
LMZ23605
CCM and DCM Operating Modes
VIN = 12V, VO = 3.3V, IO = 3A/0.3A 2 μsec/div
going high. Trace two is 1.5V pre-bias rising to 3.3V. Risetime
determined by CSS, trace three.
Pre-Biased Startup
30116912
The approximate formula for determining the DCM/CCM
boundary is as follows:
30116925
IDCB≊VO*(VIN–VO)/(2*3.3 μH*fSW(CCM)*VIN) (13)
DISCONTINUOUS CONDUCTION AND CONTINUOUS
CONDUCTION MODES
At light load the regulator will operate in discontinuous conduction mode (DCM). With load currents above the critical
conduction point, it will operate in continuous conduction
mode (CCM). In CCM, current flows through the inductor
through the entire switching cycle and never falls to zero during the off-time. When operating in DCM, inductor current is
maintained to an average value equaling Iout. Inductor current exhibits normal behavior for the emulated current mode
control method used. Output voltage ripple typically increases
during this mode of operation.
Following is a comparison pair of waveforms of the showing
both CCM (upper) and DCM operating modes.
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The inductor internal to the module is 3.3 μH. This value was
chosen as a good balance between low and high input voltage
applications. The main parameter affected by the inductor is
the amplitude of the inductor ripple current (ILR). ILR can be
calculated with:
ILR P-P=VO*(VIN- VO)/(3.3µH*fSW*VIN) (14)
Where V IN is the maximum input voltage and fSW is typically
812 kHz.
If the output current IO is determined by assuming that IO =
IL, the higher and lower peak of ILR can be determined.
18
LMZ23605
Typical Application Schematic Diagram
30116907
FIGURE 4.
TABLE 1. Typical Application Bill of Materials
Ref Des
Description
Case Size
Manufacturer
U1
SIMPLE SWITCHER ®
TO-PMOD-7
National Semiconductor
Manufacturer P/N
LMZ23605TZ
Cin1,5
0.047 µF, 50V, X7R
1206
Yageo America
CC1206KRX7R9BB473
Cin2,3
10 µF, 50V, X7R
1210
Taiyo Yuden
UMK325BJ106MM-T
Cin6 (OPT)
CAP, AL, 150µF, 50V
Radial G
Panasonic
EEE-FK1H151P
CO1,6
0.047 µF, 50V, X7R
1206
Yageo America
CC1206KRX7R9BB473
CO2 (OPT)
100 µF, 6.3V, X7R
1210
TDK
C3225X5R0J107M
CO5
220 μF, 6.3V, SP-Cap
(7343)
Panasonic
EEF-UE0J221LR
RFBT
3.32 kΩ
0805
Panasonic
ERJ-6ENF3321V
RFBB
1.07 kΩ
0805
Panasonic
ERJ-6ENF1071V
RSN (OPT)
1.50 kΩ
0805
Vishay Dale
CRCW08051K50FKEA
RENT
42.2 kΩ
0805
Panasonic
ERJ-6ENF4222V
RENB
12.7 kΩ
0805
Panasonic
ERJ-6ENF1272V
RFRA(OPT)
23.7Ω
0805
Vishay Dale
CRCW080523R7FKEA
RENH (OPT)
100 Ω
0805
Vishay Dale
CRCW0805100RFKEA
CSS
0.47 μF, ±10%, X7R, 16V
0805
AVX
0805YC474KAT2A
D1(OPT)
5.1V, 0.5W
SOD-123
Diodes Inc.
MMSZ5231BS-7-F
Table 1
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LMZ23605
30116916
FIGURE 5. Top View Evaluation Board – See AN–2085
30116917
FIGURE 6. Top View Demonstration Board – See AN–2125
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20
LMZ23605
Physical Dimensions inches (millimeters) unless otherwise noted
7-Lead TZA Package
NS Package Number TZA07A
21
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LMZ23605 5A SIMPLE SWITCHER® Power Module with 36V Maximum Input Voltage
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