ETC MURA160T3/D

MURA160T3
Preferred Device
Surface Mount
Ultrafast Power Rectifier
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
•
•
•
•
Small Compact Surface Mountable Package with J–Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (1.05 Volts Max @ 1.0 A, TJ = 150°C)
Mechanical Characteristics:
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ULTRAFAST RECTIFIER
1 AMPERE
600 VOLTS
• Case: Epoxy, Molded
• Weight: 70 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Shipped in 12 mm Tape and Reel, 5000 units per reel
Polarity: Polarity Band Indicates Cathode Lead
ESD Protection: Human Body Model > 4000 V (Class 3)
ESD Protection: Machine Model > 400 V (Class C)
Marking: U4J
MARKING
DIAGRAM
U4J
SMA
CASE 403D
PLASTIC
U4J = Device Code
ORDERING INFORMATION
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
600
V
Average Rectified Forward Current
@ TL = 145°C
@ TL = 110°C
IF(AV)
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM
30
A
TJ
–65 to
+175
°C
Operating Junction Temperature Range
 Semiconductor Components Industries, LLC, 2001
January, 2001 – Rev. 1
A
Device
Package
Shipping
MURA160T3
SMA
5000/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
1.0
2.0
1
Publication Order Number:
MURA160T3/D
MURA160T3
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Lead (TL = 25°C) (Note 1.)
Thermal Resistance, Junction to Ambient (Note 1.)
Symbol
Max
Unit
PsiJL
(Note 2.)
RθJA
24
°C/W
216
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3.)
(iF = 1.0 A, TJ = 25°C)
(iF = 1.0 A, TJ = 150°C)
vF
Maximum Instantaneous Reverse Current (Note 3.)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 150°C)
iR
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/µs)
trr
Volts
1.25
1.05
µA
5.0
150
75
ns
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR–4.
2. In compliance with JEDEC 51, these values (historically represented by RθJL) are now referenced as PsiJL.
3. Pulse Test: Pulse Width = 300 µs, Duty Cycle 2.0%.
1000
TJ = 175°C
IR, REVERSE CURRENT (A)
IR, REVERSE CURRENT (A)
100
10
TJ = 100°C
1
0.1
TJ = 25°C
TJ = 175°C
100
TJ = 100°C
10
TJ = 25°C
0.01
100
200
300
400
500
1
600
100
200
300
400
500
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Reverse Current
Figure 2. Maximum Reverse Current
10
100°C
TC = 175°C
25°C
1
0.1
0.01
0.3
0
VR, REVERSE VOLTAGE (VOLTS)
IF, INSTANTANEOUS FORWARD CURRENT (A)
IF, INSTANTANEOUS FORWARD CURRENT (A)
0
0.5
0.7
0.9
1.1
1.3
1.5
1.7
10
TC = 175°C
100°C
25°C
1
0.1
0.01
0.3
VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.5
0.7
0.9
1.1
1.3
1.5
1.7
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 4. Maximum Forward Voltage
Figure 3. Typical Forward Voltage
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2
600
1.9
MURA160T3
30
NOTE: TYPICAL
CAPACITANCE AT
0 V = 24 pF
20
15
10
5
20
15
10
5
0
8
4
12
16
24
20
28
32
36
0
40
12
16
20
24
28
32
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
4
dc
3
SQUARE WAVE
2
1
0
80
8
VR, REVERSE VOLTAGE (VOLTS)
5
60
4
VR, REVERSE VOLTAGE (VOLTS)
IF(AV), AVERAGE FORWARD CURRENT (A)
0
100
120
140
160
180
160
180
0.8
0.7
0.6 SQUARE
WAVE
0.5
0.4
0.3
0.2
0.1
0
0
20
40
60
80
100
120
140
TA, AMBIENT TEMPERATURE (°C)
Figure 8. Current Derating, Ambient
(FR–4 Board with Minimum Pad)
4.5
4
dc
3.5
3
SQUARE WAVE
2.5
2
1.5
1
0.5
0
0.5
40
dc
Figure 7. Current Derating, Lead
0
36
1
0.9
TL, LEAD TEMPERATURE (°C)
PF, AVERAGE POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
0
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 27 pF
25
C, CAPACITANCE (pF)
C, CAPACITANCE (pF)
25
1
1.5
2
2.5
3
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Power Dissipation
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3
3.5
MURA160T3
PACKAGE DIMENSIONS
SMA
CASE 403D–01
ISSUE O
S
A
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
H
J
K
S
B
INCHES
MIN
MAX
0.160
0.180
0.090
0.115
0.075
0.105
0.050
0.064
0.004
0.008
0.006
0.016
0.030
0.060
0.190
0.220
MILLIMETERS
MIN
MAX
4.06
4.57
2.29
2.92
1.91
2.67
1.27
1.63
0.10
0.20
0.15
0.41
0.76
1.52
4.83
5.59
C
K
J
H
MINIMUM SOLDER PAD SIZE
0.157
4.0
0.0787
2.0
0.0787
2.0
inches
mm
ON Semiconductor and
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4
MURA160T3/D